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eTEC Series HV14,18,F0,0102,GG Thin Film Thermoelectric Module The eTEC Series is a thin film thermoelectric module (TEM) with high heat flux density. Due to its size, input power requirements and heat pumping capacity this device is suited for use in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries. The eTEC HV14 can produce 1.3 Watts of cooling capacity at 25°C ambient in a 4 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies. FEATURES APPLICATIONS • • • • • • • • • • • • Micro Footprint High Heat Pumping Density Precise Temperature Control Reliable Solid State Operation <2 ms Response Time RoHS Compliant Laser Diodes Photodiodes Infrared (IR) Sensors Pump Lasers Crystal Oscillators Optical Transceivers PERFORMANCE SPECIFICATIONS Hot Side Temperature (°C) 25°C 50°C Qmax (Watts) 1.3 1.3 Delta Tmax (°C) 45 45 Imax (Amps) 1.0 0.9 2.3 2.5 Qmax / area (W/cm ) 64 64 Electrical Resistance (Ohms) 2.0 2.3 Thermal Resistance (K/W) 46 46 Vmax (Volts) 2 PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C 60 sec Peak Assembly Temperature 325°C TEMPERATURE CONDITIONS Max Operating Temperature 150°C OPERATING CONDITIONS Max rate of change of current Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com 1.75 Amps/sec eTEC Series HV14,18,F0,0102,GG Thin Film Thermoelectric Module PERFORMANCE CURVES COEFFICIENT OF PERFORMANCE 2.31 1.20 0.34 0.03 0.68 1.02 3.57 Tolerance for all dimensions +/- 0.02 mm 2.36 2.04 3.54 ISOMETRIC DRAWING 0.06 0.45 0.95 0.52 0.06 3.54 0.06 0.40 0.27 0.01 mm 0.60 0.02 mm 0.01 0.27 1.89 Standard UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MM TOLERANCES: TWO PLACE DECIMAL 0.02 THREE PLACE DECIMAL 0.02 NAME TITLE: CHECKED ENG APPR. Paul Crocco 10/3/2013 MFG APPR. INTERPRET GEOMETRIC TOLERANCING PER: PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF LAIRD ENGINEERED THERMAL SYSTEMS. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF LAIRD ENGINEERED THERMAL SYSTEMS IS PROHIBITED. OPERATING TIPS 5 MATERIAL USED ON NEXT ASSY Laird Engineered Thermal Systems 4 1.15 DATE Paul Crocco 10/3/2013 Au metallization on exterior ceramic substrate surfaces Au wire bondable pads on hot side ceramic for lead attachment DRAWN A601 Q.A. COMMENTS: SIZE DWG. NO. A FINISH REV 2.04 1 1 SHEET 1 OF 1 SCALE: 20:1 WEIGHT: DO NOT SCALE DRAWING 2 3 1 UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MM TOLERANCES: TWO PLACE DECIMAL 0.02 THREE PLACE DECIMAL 0.02 NAME DRAWN DATE Paul Crocco 10/4/2013 • Maintain good surface contact on heat dissipation mechanism prior to operation TITLE: CHECKED ENG APPR. A608 Paul Crocco 10/4/2013 MFG APPR. • Do not exceed Vmax or Imax values to maintain peak performance PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF LAIRD ENGINEERED THERMAL SYSTEMS. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF LAIRD ENGINEERED THERMAL SYSTEMS IS PROHIBITED. USED ON NEXT ASSY Laird Engineered Thermal Systems 5 4 INTERPRET GEOMETRIC TOLERANCING PER: MATERIAL Q.A. COMMENTS: SIZE DWG. NO. A FINISH 3 1 SHEET 1 SCALE: 50:1 WEIGHT: DO NOT SCALE DRAWING 2 THR-DS-eTEC-HV14 1113 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. 1 eTEC Series HV37,48,F2,0202,GG Thin Film Thermoelectric Module The eTEC Series is a thin film thermoelectric module (TEM) with high heat flux density. Due to its size, input power requirements and heat pumping capacity this device is suited for use in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries. The eTEC HV37 can produce 3.7 Watts of cooling capacity at 25°C ambient in a 9 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies. FEATURES APPLICATIONS • • • • • • • • • • • • Micro Footprint High Heat Pumping Density Precise Temperature Control Reliable Solid State Operation <2 ms Response Time RoHS Compliant Laser Diodes Photodiodes Infrared (IR) Sensors Pump Lasers Crystal Oscillators Optical Transceivers PERFORMANCE SPECIFICATIONS Hot Side Temperature (°C) 25°C 50°C Qmax (Watts) 3.7 3.7 Delta Tmax (°C) 45 45 Imax (Amps) 1.1 1.0 6.0 6.4 Qmax / area (W/cm ) 66 66 Electrical Resistance (Ohms) 4.8 5.5 Thermal Resistance (K/W) 16.5 15.5 Vmax (Volts) 2 PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C 60 sec Peak Assembly Temperature 325°C TEMPERATURE CONDITIONS Max Operating Temperature 150°C OPERATING CONDITIONS Max rate of change of current Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com 1.75 Amps/sec eTEC Series HV37,48,F2,0202,GG Thin Film Thermoelectric Module PERFORMANCE CURVES COEFFICIENT OF PERFORMANCE 0.04 1.26 0.04 0.75 1.10 0.75 0.03 3.39 2.07 2 2.05 0.06 0.06 0.25 ISOMETRIC DRAWING 0.62 0.27 1 1 0.06 0.75 0.25 0.01 Standard 3.77 Au metallization on exterior ceramic substrate surfaces Au wire bondable pads on hot side ceramic for lead attachment DIMENSIONS ARE IN INCHES TOLERANCES: FRACTIONAL ANGULAR: MACH BEND TWO PLACE DECIMAL THREE PLACE DECIMAL PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF <INSERT COMPANY NAME HERE>. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF <INSERT COMPANY NAME HERE> IS PROHIBITED. OPERATING TIPS MATERIAL NAME 0.01 2.36 DATE DRAWN CHECKED ENG APPR. MFG APPR. Q.A. COMMENTS: NEXT ASSY USED ON APPLICATION FINISH SIZE DWG. NO. A HV37_01_DraftSource DO NOT SCALE DRAWING SCALE:20:1 WEIGHT: 2.36 2.38 REV. SHEET 1 OF 1 UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MM TOLERANCES: TWO PLACE DECIMAL 0.02 THREE PLACE DECIMAL 0.02 • Maintain good surface contact on heat dissipation mechanism prior to operation NAME DRAWN DATE Paul Crocco 10/4/2013 TITLE: CHECKED ENG APPR. A604 Paul Crocco 10/4/2013 MFG APPR. • Do not exceed Vmax or Imax values to maintain peak performance INTERPRET GEOMETRIC TOLERANCING PER: PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF LAIRD ENGINEERED THERMAL SYSTEMS. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF LAIRD ENGINEERED THERMAL SYSTEMS IS PROHIBITED. MATERIAL USED ON NEXT ASSY Laird Engineered Thermal Systems 5 4 Q.A. COMMENTS: SIZE DWG. NO. A FINISH SCALE: 30:1 WEIGHT DO NOT SCALE DRAWING 3 THR-DS-eTEC-HV37 1113 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. 2 eTEC Series HV56,72,F2,0203,GG Thin Film Thermoelectric Module The eTEC Series is a thin film thermoelectric module (TEM) with high heat flux density. Due to its size, input power requirements and heat pumping capacity this device is suited for use in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries. The eTEC HV56 can produce 6.5 Watts of cooling capacity at 25°C ambient in a 13 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies. FEATURES APPLICATIONS • • • • • • • • • • • • Micro Footprint High Heat Pumping Density Precise Temperature Control Reliable Solid State Operation <2 ms Response Time RoHS Compliant Laser Diodes Photodiodes Infrared (IR) Sensors Pump Lasers Crystal Oscillators Optical Transceivers PERFORMANCE SPECIFICATIONS Hot Side Temperature (°C) 25°C 50°C Qmax (Watts) 6.5 6.8 Delta Tmax (°C) 47 50 Imax (Amps) 1.1 1.1 9.6 10.4 Qmax / area (W/cm ) 78 81 Electrical Resistance (Ohms) 7.0 8.0 Thermal Resistance (K/W) 10 10 Vmax (Volts) 2 PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C 60 sec Peak Assembly Temperature 325°C TEMPERATURE CONDITIONS Max Operating Temperature 150°C OPERATING CONDITIONS Max rate of change of current Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com 1.75 Amps/sec eTEC Series HV56,72,F2,0203,GG Thin Film Thermoelectric Module PERFORMANCE CURVES COEFFICIENT OF PERFORMANCE 2.31 1.20 0.34 0.03 0.68 1.02 3.57 Tolerance for all dimensions +/- 0.02 mm 2.36 3.54 3.54 ISOMETRIC DRAWING 0.27 0.01 mm UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MM TOLERANCES: TWO PLACE DECIMAL 0.02 THREE PLACE DECIMAL 0.02 Standard 2.31 1.20 0.34 0.60 0.02 mm NAME DRAWN 0.68 1.02 DATE Paul Crocco 10/3/2013 TITLE: CHECKED ENG APPR. Paul Crocco 10/3/2013 MFG APPR. INTERPRET GEOMETRIC TOLERANCING PER: PROPRIETARY AND CONFIDENTIAL MATERIAL USED ON NEXT ASSY Laird Engineered Thermal Systems 5 4 3.57 SIZE DWG. COMMENTS: A FINISH NO. REV 1 2.361 2 To +/- SHEET 1 OF 1 SCALE: 20:1 WEIGHT: DO NOT SCALE DRAWING 3 A601 Q.A. Au metallization on exterior ceramic substrate surfaces Au wire bondable pads on hot side ceramic for lead attachment THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF LAIRD ENGINEERED THERMAL SYSTEMS. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF LAIRD ENGINEERED THERMAL SYSTEMS IS PROHIBITED. 0.03 1 3.54 3.54 OPERATING TIPS • Maintain good surface contact on heat dissipation mechanism prior to operation 0.27 0.01 mm • Do not exceed Vmax or Imax values to maintain peak performance UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MM TOLERANCES: TWO PLACE DECIMAL 0.02 THREE PLACE DECIMAL 0.02 INTERPRET GEOMETRIC TOLERANCING PER: PROPRIETARY AND CONFIDENTIAL THR-DS-eTEC-HV56 1113 THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF LAIRD ENGINEERED THERMAL SYSTEMS. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF LAIRD ENGINEERED THERMAL SYSTEMS IS PROHIBITED. MATERIAL NEXT ASSY USED ON FINISH Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use Laird Engineered Thermal Systems and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird 4 Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential5 damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. DO NOT SCALE DRAWING 3 eTEG Series PG09,14,F0,0102,GG Thin Film Energy Harvester Innovative Technology for a Connected World The eTEG Series is a micro thermoelectric power generator that harvests waste heat and converts it to usable output DC power. Due to its size, output power generation and heat conversion to power ratio this device is suitable for use in applications to power wireless sensors and wireless sensor networks. One eTEG PG09 can produce 33 milliWatts of output power and 0.6 volts in an open circuit at a temperature differential of 100°C all within a 1 mm2 footprint. This unit is assembled with thin film semiconductor material, thermally conductive aluminum nitride ceramics and gold plated wire bondable pads. The eTEG Series is designed for low power output applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies. FEATURES APPLICATIONS • • • • • • Wireless Sensors • LED Lighting • Battery Charging Micro Footprint High Output Power Density High Waste Heat Conversion Ratio Reliable Solid State Operation RoHS Compliant ΔT PERFORMANCE SPECIFICATIONS 50°C 100°C Power Output (mW) 8.6 33 Voltage Output (V) 0.15 0.3 Current Output (mA) 58 111 Voltage Open Circuit (V) 0.3 0.6 Current, Short Circuit (mA) 115 222 THERMAL PARAMETERS Thermal Resistance Thermal Conductance 46 K/W 0.022 W/K PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C 60 sec Peak Assembly Temperature 325°C TEMPERATURE CONDITIONS Max Operating Temperature 150°C Performance maximized with matched electrical load global solutions: local support Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com TM eTEG Series PG09,14,F0,0102,GG Thin Film Energy Harvester Innovative Technology for a Connected World PERFORMANCE CURVES ISOMETRIC DRAWING Standard Au metallization on exterior ceramic substrate surfaces Au wire bondable pads on hot side ceramic for lead attachment OPERATING TIPS • Maintain good surface contact on heat dissipation mechanism prior to operation THR-DS-eTEG-PG09 0812 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. eTEG Series PG24,48,F2,0202,GG Thin Film Energy Harvester Innovative Technology for a Connected World The eTEG Series is a micro thermoelectric power generator that harvests waste heat and converts it to usable output DC power. Due to its size, output power generation and heat conversion to power ratio this device is suitable for use in applications to power wireless sensors and wireless sensor networks. One eTEG PG24 can produce 90 milliWatts of output power and 1.7 volts in an open circuit at a temperature differential of 100°C all within a 6.9 mm2 footprint. This unit is assembled with thin film semiconductor material, thermally conductive aluminum nitride ceramics and gold plated wire bondable pads. The eTEG Series is designed for low power output applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies. FEATURES APPLICATIONS • • • • • • Wireless Sensors • LED Lighting • Battery Charging Micro Footprint High Output Power Density High Waste Heat Conversion Ratio Reliable Solid State Operation RoHS Compliant ΔT PERFORMANCE SPECIFICATIONS 10°C 50°C 100°C Power Output (mW) 1 24 90 Voltage Output (V) 0.09 0.4 0.85 Current Output (mA) 12 60 105 Voltage Open Circuit (V) 0.18 0.8 1.7 Current, Short Circuit (mA) 24 115 210 THERMAL PARAMETERS Thermal Resistance 21 K/W Thermal Conductance 0.048 W/K PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C 60 sec Peak Assembly Temperature 325°C TEMPERATURE CONDITIONS Max Operating Temperature 150°C Performance maximized with matched electrical load global solutions: local support Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com TM eTEG Series PG24,48,F2,0202,GG Thin Film Energy Harvester Innovative Technology for a Connected World PERFORMANCE CURVES ISOMETRIC DRAWING Standard Au metallization on exterior ceramic substrate surfaces Au wire bondable pads on hot side ceramic for lead attachment Optional Bare solder wires, 2.0 inches in length DEFINITIONS Pmax ∆T The maximum amount of power created from the thermoelectric generator’s Seebeck effect. This point occurs when the load resistance matches the device resistance resulting in an output voltage of ½ Voc, where Voc is the open circuit voltage. Delta T is the temperature difference across the thermoelectric generator. THR-DS-eTEG-PG24 0812 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. eTEG Series PG37,72,F2,0203,GG Thin Film Energy Harvester Innovative Technology for a Connected World The eTEG Series is a micro thermoelectric power generator that harvests waste heat and converts it to usable output DC power. Due to its size, output power generation and heat conversion to power ratio this device is suitable for use in applications to power wireless sensors and wireless sensor networks. One eTEG PG37 can produce 130 milliWatts of output power and 2.5 volts in an open circuit at a temperature differential of 100°C all within a 10.3 mm2 footprint. This unit is assembled with thin film semiconductor material, thermally conductive aluminum nitride ceramics and gold plated wire bondable pads. The eTEG Series is designed for low power output applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies. FEATURES APPLICATIONS • • • • • • Wireless Sensors • LED Lighting • Battery Charging Micro Footprint High Output Power Density High Waste Heat Conversion Ratio Reliable Solid State Operation RoHS Compliant ΔT PERFORMANCE SPECIFICATIONS 10°C 50°C 100°C Power Output (mW) 1.5 36 130 Voltage Output (V) 0.13 0.6 1.25 Current Output (mA) 12 60 105 Voltage Open Circuit (V) 0.26 1.2 2.5 Current, Short Circuit (mA) 24 115 210 THERMAL PARAMETERS Thermal Resistance 13.1 K/W Thermal Conductance 0.076 W/K PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C 60 sec Peak Assembly Temperature 325°C TEMPERATURE CONDITIONS Max Operating Temperature 150°C Performance maximized with matched electrical load global solutions: local support Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com TM eTEG Series PG37,72,F2,0203,GG Thin Film Energy Harvester Innovative Technology for a Connected World PERFORMANCE CURVES ISOMETRIC DRAWING Standard Au metallization on exterior ceramic substrate surfaces Au wire bondable pads on hot side ceramic for lead attachment Optional Bare solder wires, 2.0 inches in length DEFINITIONS Pmax ∆T The maximum amount of power created from the thermoelectric generator’s Seebeck effect. This point occurs when the load resistance matches the device resistance resulting in an output voltage of ½ Voc, where Voc is the open circuit voltage. Delta T is the temperature difference across the thermoelectric generator. THR-DS-eTEG-PG37 0812 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Thermobility WPG-1 Wireless Power Generator The WPG-1 is a self-contained thin-film thermoelectric power generator that harvests waste heat and converts it to usable output DC power. Due to its compact size, output power generation and ability to regulate voltage this device is suitable for use in applications to power wireless sensors and wireless sensor networks. One WPG-1 can produce up to 1.5 mW of usable output power and can handle a wide range of load resistances. An ultra-low voltage step-up converter is incorporated to provide usable output power at low temperature differentials, < 20°K. The output power can be regulated to accommodate three voltage set points: 3.3V, 4.1V or 5.0V. Custom design services are available to accommodate alternate heat absorption and heat dissipation mechanisms or output power requirements, however MOQ applies. FEATURES APPLICATIONS • Compact form factor • Regulated output voltage • High waste heat conversion ratio • Ultra-low voltage converter • Reliable solid state operation • Wireless sensors and transmitters • LED lighting • Battery charger Heat is absorbed through a flat heat exchanger plate, energy is harvested by the thin-film thermoelectric and heat is exhausted into ambient environment by the pin fin heat sink. Note: Unit of measure is in mm’s Americas: +1.888.246.9050 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com/thermal Thermobility WPG-1 Wireless Power Generator OUTPUT POWER CURVES OPERATING RANGE Max Heat Source Temp 100°C Ambient Temp 24°C Temp Differential 15 to 76°C REGULATOR SETTINGS SW-1 - VOLTAGE SELECTOR SW2 - LOAD AND STORAGE SELECTOR Silkscreen 5.0 4.1 3.3 Silkscreen C S Vout 5.0 V 4.1 V 3.3 V Load J2 and J3 J2 and J3 LED Storage Off-board only Onboard 1000uF Cap N/A L CAUTION • Keep areas around the heat sink clear for optimal air flow • Avoid excessive shock or vibration • Avoid exposure to water or high moisture environments THR-DS-WPG-1 0613 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.