Download 8542

8542
854211
854219
854220
854280
854290
electronic integrated circuits & microassembl, pts
Monolithic Integrated Circuits, Digital
Other Monolithic Integrated Circuits
Hybrid Integrated Circuits
Other (Electronic Integrated Circuits and Microassemblies)
Parts of Electronic Integrated Circuits and Microassemblies
American Standards
ANSI/EIA 656-A-1999 (R2005), I/O Buffer
Information Specification (IBIS)
(SP-3527)
IBIS is a standard for electronic behavioral
specifications of digital integrated circuit
input/output (I/O) analog characteristics. IBIS
specifies a consistent software-parsable format
for essential behavioral information. Within the
IBIS format, vendors can accurately model
compatible buffers. The goal of IBIS is to
support all simulators of all degrees of
sophistication.
IEEE 1076.4-2000, Standard for VITAL
Application Specific Integrated Circuit
(ASIC) Specification
Provides a standard method of modeling ASICs
[Application Specific Integrated Circuits] in
VHDL. This method is aimed at providing
efficient, accurate, and tool-independent
simulation suitable for large chip-level designs
typical of those that are based on ASICs.
IEEE 1500-2005, Standard Testability
Method for Embedded Core-Based
Integrated Circuits C/TT
Defines a protocol and management elements
suitable for advertising information to stations
attached to the same 802 LAN for the purpose
of populating physical topology and device
discovery management information databa
ANSI INCITS 410-2006, Information
technology - Identification cards - Limited
Use (LU), Proximity Integrated Circuit
Card (PICC)
A physical specification with similar electronic
characteristics of a Proximity Integrated Circuit
Cards (PICCs) such as those specified within
ISO/IEC 14443 Part-2 and 3 but in thinner ID-1
(card body) formats as defined within the
selected card thickness of ISO/IEC 15457 for
thin flexible cards. Construction attributes,
pertaining to the materials, functionality and
environmental requirements and targeted use
are also specified. This type of PICC is to be
classified as a Limited Use - Proximity
Integrated Circuit Card (LU-PICC.
INCITS/ISO/IEC 10373-3-2001 (R2006),
Identifications Cards - Test Methods Part 3: Integrated Circuit(s) Cards with
Contacts and Related Interface Devices
This part of ISO/IEC 10373 defines test
methods for characteristics of integrated
circuit(s) cards with contacts and related
interface devices according to the definition
given in ISO/IEC 7816. Each test method is
cross-referenced to one or more base
standards, which may be ISO/IEC 7810 or one
or more of the supplementary standards that
define the information storage technologies
employed in identification card applications.
INCITS/ISO/IEC 10536-1-1992 (R2004),
Identification Cards - Contactless
Integrated Circuit(s) Cards - Part 1:
Physical Characteristics
This part specifies the physical characteristics
of contactless integrated circuit(s) cards
(CICCs). It applies to identification cards of the
ID-1 card type. Annex A includes test methods
and acceptance criteria for certain of the
requirements.
INCITS/ISO/IEC 10536-2-1995 (R2004),
Identification Cards - Contactless
Integrated Circuit(s) Cards - Part 2:
Dimensions and Location of Coupling
Areas
This part of ISO/IEC 10536 specifies the
dimensions, location, nature and assignment of
each of the coupling areas to be provided for
interfacing slot or surface card coupling devices
(CCDs) with contact less integrated circuit(s)
cards (CICCs) of the ID-1 card type. Annex A
shows the determination of the X and Y axes
which are used in relating the field locations to
the CICC. Annex B shows examples of
coupling elements in both a CICC and a CCD.
INCITS/ISO/IEC 14443-2-2001 (R2006),
Identification Cards - Contactless
Integrated Circuit(s) Cards - Proximity
Cards - Part 2: Radio Frequency Power
and Signal Interface
This part of ISO/IEC 14443 specifies the
characteristics of the fields to be provided for
power and bi-directional communication
between proximity coupling devices (PCDs)
and proximity cards (PICCs). This part of
ISO/IEC 14443 is intended to be used in
conjunction with other parts of ISO/IEC 14443.
INCITS/ISO/IEC 14443-2-2001/AM1-2005,
Identification cards - Contactless
integrated circuit(s) cards - Proximity
cards - Part 2: Radio frequency power
and signal interface - Amendment 1: Bit
rates of fc/64, fc/32 and fc/16
Amendment 1 to ISO/IEC 14443-2:2001.
INCITS/ISO/IEC 14443-3-2001 (R2006),
Identification Cards - Contactless
Integrated Circuit(s) Cards - Proximity
Cards - Part 3: Initialization and
Anticollision
This part of ISO/IEC 14443 describes: - polling
for proximity cards (PICCs) entering the field of
a proximity coupling device (PCD); - the byte
format, the frames and timing used during the
initial phase of communication between PCDs
and PICCs; - the initial Request and Answer to
Request command content; - methods to detect
and communicate with one PICC among
several PICCs (anticollision); - other
parameters required to initialize
communications between a PICC and PCD; optional means to ease and speed up the
selection of one PICC among several PICCs
based on application criteria.
INCITS/ISO/IEC 14443-3-2001/AM1-2005,
Identification cards - Contactless
integrated circuit(s) cards - Proximity
cards - Part 3: Initialization and
anticollision - Amendment 1: Bit rates of
fc/64, fc/32 and fc/16
Amendment 1 to ISO/IEC 14443-3:2001.
INCITS/ISO/IEC 14443-4-2001 (R2006),
Identification Cards - Contactless
Integrated Circuit(s) Cards - Proximity
Cards - Part 4: Transmission Protocol
This part of ISO/IEC 14443 specifies a
half-duplex block transmission protocol
featuring the special needs of a contactless
environment and defines the activation and
deactivation sequence of the protocol. This part
of ISO/IEC 14443 is intended to be used in
conjunction with other parts of ISO/IEC 14443
and is applicable to proximity cards of Type A
and Type B.
INCITS/ISO/IEC 15693-1-2000 (R2006),
Identification Cards - Contactless
Integrated Circuit(s) Cards - Vicinity
Cards - Part 1: Physical Characteristics
This part of ISO/IEC 15693 specifies the
physical characteristics of vicinity cards (VICC).
It applies to identification cards of the card type
ID-1 operating in vicinity of a coupling device.
This part of ISO/IEC 15693 shall be used in
conjunction with later parts of ISO/IEC 15693.
INCITS/ISO/IEC 15693-2-2000 (R2006),
Identification Cards - Contactless
Integrated Circuit(s) Cards - Vicinity
Cards - Part 2: Air Interface and
Initialization
This part of ISO/IEC 15693 specifies the nature
and characteristics of the fields to be provided
for power and bidirectional communications
between vicinity coupling devices (VCDs) and
vicinity cards (VICCs.
INCITS/ISO/IEC 15693-3-2001 (R2006),
Identification Cards - Contactless
Integrated Circuit(s) Cards - Vicinity
Cards - Part 3: Anticollision and
Transmission Protocol
This part of ISO/IEC 15693 describes: protocol and commands, - other parameters
required to initialize communications between a
VICC and a VCD, - methods to detect and
communicate with one card among several
cards ("anticollision"), - optional means to ease
and speed up the selection of one among
several cards based on application criteria.
INCITS/ISO/IEC 7816-1-1998 (R2005),
Identification Cards - Optical Memory
Cards - Integrated Circuit(s) Cards with
Contacts - Part 1: Physical
Characteristics
This part of ISO/IEC 7816 specifies the
physical characteristics of integrated circuit(s)
cards with contacts. It applies to identification
cards of the ID-1 card type which may include
embossing and/or a magnetic stripe as
specified in ISO/IEC 7811-1 to ISO/IEC 7811-6.
INCITS/ISO/IEC 7816-1-1998/AM1-2003,
Identification cards - Integrated circuit(s)
cards with contacts - Part 1: Physical
characteristics - Amendment 1: Maximum
height of the IC contact surface
Amendment 1 to ISO/IEC 7816-1:1998.
INCITS/ISO/IEC 7816-10-1999 (R2005),
Identification Cards - Integrated Circuit(s)
Cards with Contacts - Part 10: Electronic
Signals and Answer to Reset for
Synchronous Cards
This part of ISO/IEC 7816 specifies the power,
signal structures, and the structure for the
answer to reset between an integrated circuit(s)
card with synchronous transmission and an
interface device such as a terminal.
INCITS/ISO/IEC 7816-11-2004,
Identification cards - Integrated circuit
cards - Part 11: Personal verfication
through biometric methods
This part of ISO/IEC 7816 specifies security
related interindustry commands to be used for
personal verification with biometric methods in
integrated circuit(s) cards. It also defines the
data structure and data access methods for
use of the card as a carrier of the biometric
reference data and/or as the device to perform
the verification of a personal biometric (on-card
matching). Identification of persons using
biometric methods is outside the scope of this
standard.
INCITS/ISO/IEC 7816-15-2004,
Identification cards - Integrated circuit
cards with contacts - Part 15:
Cryptographic information application
This part of ISO/IEC 7816 specifies an
application in a card. This application contains
information on cryptographic functionality. This
part of ISO/IEC 7816 defines a common syntax
and format for the cryptographic information
and mechanisms to share this information
whenever appropriate.
INCITS/ISO/IEC 7816-2-1999 (R2005),
Information Technology - Identification
Cards - Optical Memory Cards Integrated Circuit(s) Cards with Contacts Part 2: Dimensions and Location of the
Contacts
This part of ISO/IEC 7816 specifies the
dimensions, locations and assignment for each
of the contacts on integrated circuit(s) cards of
an ID-1 card type.
INCITS/ISO/IEC 7816-2-1999/AM1-2004,
Identification cards - Integrated circuit
cards - Part 2: Cards with contacts Dimensions and location of the contacts
AMENDMENT 1: Assignment of contacts
C4 and C8
Amendment 1 to ISO/IEC 7816-2:1999.
INCITS/ISO/IEC 7816-3-1997 (R2004),
Information Technology - Identification
Cards - Integrated Circuit(s) Cards with
Contacts - Part 3: Electronic Signals and
Transmission Protocols
This part of ISO/IEC 7816 specifies the power
and signal structures, and information
exchange between an integrated circuit(s) card
and an interface device such as a terminal. It
also covers signal rates, voltage levels, current
values, parity convention, operating procedure,
transmission mechanisms and communication
with the card. It does not cover information and
instruction content, such as identification of
issuers and users, services and limits, security
features, journaling and instruction definitions.
INCITS/ISO/IEC 7816-3-1997/AM1-2002,
Identification cards - Integrated circuit(s)
cards with contacts - Part 3: Electronic
signals and transmission protocols Amendment 1: Electrical characteristics
and class indication for integrated
circuit(s) cards operating at 5 V 3 V and
Amendment 1 modifies Part 3 of ISO/IEC 7816-3.
INCITS/ISO/IEC 7816-4-1995 (R2004),
Information Technology – Identification
Cards – Integrated Circuit(s) Cards with
Contacts – Part 4: Interindustry
Commands for Interchange
This part of ISO/IEC 7816 specifies the content
of the messages, commands and responses,
transmitted by the interface device to the card
and conversely, the structure and content of
the historical bytes sent by the card during the
answer to reset, the structure of files and data
as seen at the interface when processing
interindustry commands for interchange, etc. It
does no cover the internal implementation
within the card and/or the outside world. It
allows further standardization of additional
interindustry commands and security
architecture.
INCITS/ISO/IEC 7816-4-1995/AM1-1997
(R2004), Information Technology Identification Cards - Integrated Circuit(s)
Cards with Contacts - Part 4: Interindustry
Commands for Interchange
AMENDMENT 1: Impact of Secure
Messaging on the Structures of APDU
Amendment 1 published in 1997 modifies the
1995 edition of Part 4 of ISO/IEC 7816.
INCITS/ISO/IEC 7816-5-2004, Identification
cards - Integrated circuit cards - Part 5:
Registration of application providers
This part of ISO/IEC 7816 specifies a
registration procedure for application providers,
and establishes the authorities and procedures
to ensure and optimize the reliability of this
registration.
INCITS/ISO/IEC 7816-6-1996, AM1-2000
(R2005), Identification Cards - Integrated
Circuit(s) Cards with Contacts - Part 6:
Interindustry Data Elements AMENDMENT 1: IC Manufacturer's
Register
Specifies the numbering system, the rules for
assignment, and the assigned values to identify
manufacturers of integrated circuits used in
contact and/or contactless integrated circuit
cards.
INCITS/ISO/IEC 7816-6-2004, Identification
cards - Integrated circuit cards - Part 6:
Interindustry data elements for
interchange
This document specifies, directly or by
reference, data elements, including composite
data elements, that may be used in
interindustry interchange.
INCITS/ISO/IEC 7816-7-1999 (R2005),
Identification Cards - Integrated Circuit(s)
Cards with Contacts - Part 7: Interindustry
Commands for Structured Card Query
Language (SCQL)
Specifies the concept of a SCQL database
(SCQL = Structured Card Query Language
based on SQL, see ISO 9075) and the related
interindustry enhanced commands.
INCITS/ISO/IEC 7816-8-2004, Identification
Cards - Integrated Circuit(s) Cards with
Contacts - Part 8: Security Related
Interindustry Commands
This document specifies interindustry
commands that may be used for cryptographic
operations. The choice and conditions of use of
cryptographic mechanisms may affect card
exportability. The evaluation of the suitability of
algorithms and protocols is outside the scope
of this document. It does not cover the internal
implementation within the card and/or the
outside world.
INCITS/ISO/IEC 7816-9-2004, Identification
cards - Integrated circuit cards - Part 9:
Commands for card management
This document specifies interindustry
commands for card and file management.
These commands cover the entire life cycle of
the card and therefore some commands may
be used before the card has been issued to the
cardholder or after the card has expired. It does
not cover the internal implementation within the
card and/or the outside world.
International Standards
ISO
ISO/IEC 10373-3:2001
Identification cards - Test methods - Part 3: Integrated
circuit(s) cards with contacts and related interface
devices
ISO/IEC 10536-1:2000
Identification cards - Contactless integrated circuit(s)
cards - Close-coupled cards - Part 1: Physical
characteristics
ISO/IEC 10536-2:1995
Identification cards - Contactless integrated circuit(s)
cards - Part 2: Dimensions and location of coupling
areas
ISO/IEC 10536-3:1996
Identification cards - Contactless integrated circuit(s)
cards - Part 3: Electronic signals and reset procedures
ISO/IEC 14443-1:2000
Identification cards - Contactless integrated circuit(s)
cards - Proximity cards - Part 1: Physical characteristics
ISO/IEC 14443-2:2001
Identification cards - Contactless integrated circuit(s)
cards - Proximity cards - Part 2: Radio frequency power
and signal interface
ISO/IEC 14443-3:2001
Identification cards - Contactless integrated circuit(s)
cards - Proximity cards - Part 3: Initialization and
anticollision
ISO/IEC 14443-4:2001
Identification cards - Contactless integrated circuit(s)
cards - Proximity cards - Part 4: Transmission protocol
ISO/IEC 15693-1:2000
Identification cards - Contactless integrated circuit(s)
cards - Vicinity cards - Part 1: Physical characteristics
ISO/IEC 15693-2:2006
Identification cards - Contactless integrated circuit cards
- Vicinity cards - Part 2: Air interface and initialization
ISO/IEC 15693-3:2001
Identification cards - Contactless integrated circuit(s)
cards - Vicinity cards - Part 3: Anticollision and
transmission protocol
ISO/IEC 7816-10:1999
Identification cards - Integrated circuit(s) cards with
contacts - Part 10: Electronic signals and answer to
reset for synchronous cards
ISO/IEC 7816-11:2004
Identification cards - Integrated circuit cards - Part 11:
Personal verification through biometric methods
ISO/IEC 7816-12:2005
Identification cards - Integrated circuit cards - Part 12:
Cards with contacts - USB electrical interface and
operating procedures
ISO/IEC 7816-15:2004
Identification cards - Integrated circuit cards - Part 15:
Cryptographic information application
ISO/IEC 7816-1:1998
Identification cards - Integrated circuit(s) cards with
contacts - Part 1: Physical characteristics
ISO/IEC 7816-2:1999
Identification cards - Integrated circuit cards - Part 2:
Cards with contacts - Dimensions and location of the
contacts
ISO/IEC 7816-3:2006
Identification cards - Integrated circuit cards - Part 3:
Cards with contacts - Electrical interface and
transmission protocols
ISO/IEC 7816-4:2005
Identification cards - Integrated circuit cards - Part 4:
Organization, security and commands for interchange
ISO/IEC 7816-5:2004
Identification cards - Integrated circuit cards - Part 5:
Registration of application providers
ISO/IEC 7816-6:2004
Identification cards - Integrated circuit cards - Part 6:
Interindustry data elements for interchange
ISO/IEC 7816-7:1999
Identification cards - Integrated circuit(s) cards with
contacts - Part 7: Interindustry commands for Structured
Card Query Language (SCQL)
ISO/IEC 7816-8:2004
Identification cards - Integrated circuit cards - Part 8:
Commands for security operations
ISO/IEC 7816-9:2004
Identification cards - Integrated circuit cards - Part 9:
Commands for card management
IEC
IEC 60050-521 Ed. 2.0 b:2002 International Electrotechnical Vocabulary - Part
521: Semiconductor devices and integrated
circuits
IEC 60191-3 Ed. 2.0 b:1999 Mechanical standardization of semiconductor
devices - Part 3: General rules for the preparation
of outline drawings of integrated circuits
Gives guidance on the preparation of drawings of integrated
circuits outlines.
IEC 60191-5 Ed. 2.0 b:1997 Mechanical standardization of semiconductor
devices - Part 5: Recommendations applying to
integrated circuit packages using tape automated
bonding (TAB)
Gives recommendations applying to integrated circuits
supplied in packages using tape automated bonding (TAB) as
the principal component for structural and interconnection
functions. Covers the requirements for tape with bonded
integrated circuits (IC) as supplied by a manufacturer to a
user.
IEC 60191-6-2 Ed. 1.0 en:2001 "Mechanical standardization of semiconductor
devices - Part 6-2: General rules for the
preparation of outline drawings of surface mounted
semiconductor device packages - Design guide for
1,50 mm, 1,27 mm and 1,00 mm pitch ball and
column terminal packages"
Covers the requirements for the preparation of drawings of
integrated circuit outlines for the various ball and column
terminal packages.
IEC 60603-12 Ed. 1.0 b:1992 "Connectors for frequencies below 3 MHz for use
with printed boards - Part 12: Detail specification
for dimensions, general requirements and tests for
a range of sockets designed for use with
integrated circuits"
"Covers dimensions, general requirements and tests for a
range of sockets designed for use with integrated circuits in
dual-in-line format. Sockets include standard type and
low-profile type. "
IEC 60747-1 Ed. 2.0 en:2006 Semiconductor devices - Part 1: General Gives the general requirements
applicable to the discrete
semiconductor devices and integrated circuits covered by the
other parts of IEC 60747 and IEC 60748.
IEC 60747-10 Amd.3 Ed. 2.0 b:1996 Amendment 3 - Semiconductor devices - Part 10:
Generic specification for discrete devices and
integrated circuits
IEC 60747-10 Ed. 2.0 b:1991 Semiconductor devices - Part 10: Generic
specification for discrete devices and integrated
circuits
"It is a generic specification for semiconductor devices,
discrete devices and integrated circuits, including multichip
integrated circuits, but excluding hybrid circuits. It defines
general procedures for quality assessment to be used in the
IECQ System and gives general rules for measuring methods
of electrical characteristics, climatic and mechanical tests, and
endurance tests. "
IEC 60747-16-1 Ed. 1.0 en:2001 Semiconductor devices - Part 16-1: Microwave
integrated circuits - Amplifiers
"Provides the terminology, the essential ratings and
characteristics, as well as the measuring methods, for
integrated circuit microwave power amplifiers
IEC 60747-16-10 Ed. 1.0 en:2004 Semiconductor devices - Part 16-10: Technology
Approval Schedule (TAS) for monolithic
microwave integrated circuits
"Specifies the terms, definitions, symbols, quality system, test,
assessment and verification methods and other requirements
relevant to the design, manufacture and supply of monolithic
microwave integrated circuits in compliance with the general
requirements of the IECQ-CECC System for electronic
components of assessed quality."
IEC 60747-16-2 Ed. 1.0 en:2001 Semiconductor devices - Part 16-2: Microwave
integrated circuits - Frequency prescalers
"Provides terminology and letter symbols, essential ratings and
characteristics, as well as measuring methods for the
integrated circuit micowave frequency prescalers. "
IEC 60747-16-3 Ed. 1.0 en:2002 Semiconductor devices - Part 16-3: Microwave
integrated circuits - Frequency converters
"Provides new measuring methods, terminology and letter
symbols, as well as essential ratings and characteristics for
integrated circuit microwave frequency converters."
IEC 60747-16-4 Ed. 1.0 en:2004 Semiconductor devices - Part 16-4: Microwave
integrated circuits - Switches
"Provides new measuring methods, terminology and letter
symbols, as well as essential ratings and characteristics for
integrated circuit microwave switches. Switches in this
standard are based on SPDT (single pole double throw).
However, this standard is applicable to the other types of
switches."
IEC 60747-2 Ed. 2.0 b:2000 Semiconductor devices - Discrete devices and
integrated circuits - Part 2: Rectifier diodes
"Gives standards for rectifier diodes such as avalanche,
controlled avalanche or fast-switching rectifier diodes. "
IEC 60747-5-1 Amd.1 Ed. 1.0 b:2001 Amendment 1 - Discrete semiconductor devices
and integrated circuits - Part 5-1: Optoelectronic
devices - General
IEC 60747-5-1 Amd.2 Ed. 1.0 b:2002 Amendment 2 - Discrete semiconductor devices
and integrated circuits - Part 5-1: Optoelectronic
devices - General
IEC 60747-5-1 Ed. 1.2 b:2002 Discrete semiconductor devices and integrated
circuits - Part 5-1: Optoelectronic devices General
Deals with the terminology relating to the semiconductor
optoelectronic devices.
IEC 60747-5-2 Amd.1 Ed. 1.0 b:2002 Amendment 1 - Discrete semiconductor devices
and integrated circuits - Part 5-2: Optoelectronic
devices - Essential ratings and characteristics
IEC 60747-5-2 Ed. 1.0 b:1997 Discrete semiconductor devices and integrated
circuits - Part 5-2: Optoelectronic devices Essential ratings and characteristics
"Gives the essential ratings and characteristics of the following
categories or subcategories of optoelectronic devices which
are not intended to be used in the field of fibre optic systems
or subsystems: Semiconductor photoemitters, semiconductor
photoelectric detectors, semiconductor photosensitive devices,
and semiconductor devices utilizing the optical radiation for
internal operation."
IEC 60747-5-3 Amd.1 Ed. 1.0 b:2002 Amendment 1 - Discrete semiconductor devices
and integrated circuits - Part 5-3: Optoelectronic
devices - Measuring methods
IEC 60747-5-3 Ed. 1.0 b:1997 Discrete semiconductor devices and integrated
circuits - Part 5-3: Optoelectronic devices Measuring methods
Describes the measuring methods applicable to the
optoelectronic devices which are not intended to be used in
the fibre optic systems or subsystems.
IEC 60747-7 Ed. 2.0 b:2000 Semiconductor discrete devices and integrated
circuits - Part 7: Bipolar transistors
Gives the requirements applicable to the following
sub-categories of bipolar transistors: -low power signal
transistors (excluding switching applications); -power
transistors (excluding switching and high-frequency
applications); -high-frequency power transistors for amplifier
and oscillator applications; -switching transistors.
IEC 60748-1 Ed. 2.0 b:2002 Semiconductor devices - Integrated circuits - Part
1: General
"Constitutes the general part of IEC 60748. Together with the
relevant material of IEC 60747-1, it gives general information
on integrated circuits. "
IEC 60748-11 Amd.1 Ed. 1.0 b:1995 Amendment 1 - Semiconductor devices Integrated circuits - Part 11: Sectional specification
for semiconductor integrated circuits excluding
hybrid circuits
IEC 60748-11 Amd.2 Ed. 1.0 b:1999 Amendment 2 - Semiconductor devices Integrated circuits - Part 11: Sectional specification
for semiconductor integrated circuits excluding
hybrid circuits
IEC 60748-11 Ed. 1.0 b:1990 Semiconductor devices - Integrated circuits - Part
11: Sectional specification for semiconductor
integrated circuits excluding hybrid circuits
"Applies to encapsulated semiconductor integrated circuits,
including multichip integrated circuits, but excluding hybrid
circuits. Gives details of the Quality Assessment Procedures,
the inspection requirements, screening sequences, sampling
requirements, test and measurement procedures required for
the assessment of semiconductor integrated circuits, including
digital, analogue and interface circuits. "
IEC 60748-11-1 Ed. 1.0 b:1992 Semiconductor devices - Integrated circuits - Part
11 - Section 1: Internal visual examination for
semiconductor integrated circuits excluding hybrid
circuits
IEC 60748-2 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits
This publication gives standards for the following categories or
sub-categories of devices: -Combinatorial and sequential
digital circuits; -Integrated circuit memories; -Integrated circuit
microprocessors; -Charge-transfer devices. Should be used
together with IEC 60747-1 and 60748-1.
IEC 60748-2-1 Ed. 1.0 b:1991 Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section One: Blank
detail specification for bipolar monolithic digital
integrated circuit gates (excluding uncommitted
logic arrays)
IEC 60748-2-1 Ed. 1.0 b:1991 Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section One: Blank
detail specification for bipolar monolithic digital
integrated circuit gates (excluding uncommitted
logic arrays)
IEC 60748-2-10 Ed. 1.0 b:1994 Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section 10: Blank
detail specification for integrated circuit dynamic
read/write memories
IEC 60748-2-10 Ed. 1.0 b:1994 Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section 10: Blank
detail specification for integrated circuit dynamic
read/write memories
IEC 60748-2-11 Ed. 1.0 b:1999 "Semiconductor devices - Integrated circuits - Part
2-11: Digital integrated circuits - Blank detail
specification for single supply integrated circuit,
electrically erasable, and programmable read-only
memory "
IEC 60748-2-12 Ed. 1.0 b:2001 Semiconductor devices - Integrated circuits part2-12: Digital integrated circuits - Blank detail
specification for programmable logic devices
(PLDs)
IEC 60748-2-12 Ed. 1.0 b:2001 Semiconductor devices - Integrated circuits part2-12: Digital integrated circuits - Blank detail
specification for programmable logic devices
(PLDs)
IEC 60748-2-2 Amd.1 Ed. 1.0 b:1994 "Amendment 1 - Semiconductor devices.
Integrated circuits - Part 2: Digital integrated
circuits - Section two: Family specification for
HCMOS digital integrated circuits, series 54/74
HC, 54/74 HCT, 54/74 HCU"
IEC 60748-2-2 Ed. 1.0 b:1992 "Semiconductor devices. Integrated circuits - Part
2: Digital integrated circuits - Section two: Family
specification for HCMOS digital integrated circuits,
series 54/74 HC, 54/74 HCT, 54/74 HCU"
IEC 60748-2-20 Ed. 1.0 b:2000 Semiconductor devices - Integrated circuits Part
2-20: Digital integrated circuits - Family
specification - Low voltage integrated circuits
"The dimensions of integrated circuit devices being continually
reduced, to obtain better performance and higher density, the
electric fields within the die will increase, which leads to
reduced reliability. This standard aims at giving interface
specifications for various sets of values, where each
comprises the nominal value of power supply voltage, its
tolerances, and the worst-case limit values of the input and
output voltages for low voltage integrated circuits."
IEC 60748-2-20 Ed. 1.0 b:2000 Semiconductor devices - Integrated circuits Part
2-20: Digital integrated circuits - Family
specification - Low voltage integrated circuits
"The dimensions of integrated circuit devices being continually
reduced, to obtain better performance and higher density, the
electric fields within the die will increase, which leads to
reduced reliability. This standard aims at giving interface
specifications for various sets of values, where each
comprises the nominal value of power supply voltage, its
tolerances, and the worst-case limit values of the input and
output voltages for low voltage integrated circuits."
IEC 60748-2-3 Ed. 1.0 b:1992 "Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section three: Blank
detail specification for HCMOS digital integrated
circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)"
IEC 60748-2-4 Ed. 1.0 b:1992 "Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section four: Family
specification for complementary MOS digital
integrated circuits, series 4000 B and 4000 UB"
IEC 60748-2-4 Ed. 1.0 b:1992 "Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section four: Family
specification for complementary MOS digital
integrated circuits, series 4000 B and 4000 UB"
IEC 60748-2-5 Ed. 1.0 b:1992 Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section five: Blank
detail specification for complementary MOS digital
integrated circuits (series 4000 B and 4000 UB)
IEC 60748-2-6 Ed. 1.0 b:1991 Semiconductor devices. Integrated circuits - Part
2: Digital integrated circuits - Section Six: Blank
detail specification for microprocessor integrated
circuits
IEC 60748-2-7 Ed. 1.0 b:1992 Semiconductor devices. Integrated circuits - Part
2: Digital integrated circuits - Section seven: Blank
detail specification for integrated circuit fusible-link
programmable bipolar read-only memories
IEC 60748-2-7 Ed. 1.0 b:1992 Semiconductor devices. Integrated circuits - Part
2: Digital integrated circuits - Section seven: Blank
detail specification for integrated circuit fusible-link
programmable bipolar read-only memories
IEC 60748-2-8 Ed. 1.0 b:1993 Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section Eight: Blank
detail specification for integrated circuit static
read/write memories
IEC 60748-2-8 Ed. 1.0 b:1993 Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section Eight: Blank
detail specification for integrated circuit static
read/write memories
IEC 60748-2-9 Ed. 1.0 b:1994 Semiconductor devices - Integrated circuits - Part
2: Digital integrated circuits - Section 9: Blank
detail specification for MOS ultraviolet light
erasable electrically programmable read-only
memories
IEC 60748-20 Amd.1 Ed. 1.0 b:1995 Amendment 1 - Semiconductor devices.
Integrated circuits. Part 20: Generic specification
for film integrated circuits and hybrid film
integrated circuits
IEC 60748-20 Ed. 1.0 b:1988 Semiconductor devices. Integrated circuits. Part
20: Generic specification for film integrated circuits
and hybrid film integrated circuits
"Applies to film integrated circuits and to hybrid film integrated
circuits both passive and active. Applies also to
partly-completed F and HFICs supplied to customers for
subsequent processing as well as to chip carrier circuits
having more than one chip, provided that they have been
interconnected by film interconnection techniques. This
specification defines the quality assessment procedures and
the methods for electrical, climatic, mechanical and endurance
tests. It outlines the requirements which shall be applied to the
release of circuits using either qualification approval
procedures or capability approval procedures. "
IEC 60748-20-1 Ed. 1.0 b:1994 Semiconductor devices - Integrated circuits - Part
20: Generic specification for film integrated circuits
and hybrid film integrated circuits - Section 1:
Requirements for internal visual examination
"The purpose of these examinations is to check the internal
materials, construction and workmanship of film and hybrid
integrated circuits (F and HFICs). These examinations will
normally be used prior to tapping or encapsulation to detect
and eliminate the F and HFICs with internal defects that could
lead to device failure in normal application. Other acceptance
criteria may be agreed upon with the purchaser or supplier,
respectively. "
IEC 60748-21 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part
21: Sectional specification for film integrated
circuits and hybrid film integrated circuits on the
basis of qualification approval procedures
"Applies to film and hybrid film integrated circuits,
manufactured as catalogue or as custom-built products whose
quality is assessed on the basis of Qualification Approval.
Presents preferred values for rating and characteristics,
selects from the generic specification the appropriate tests and
measuring methods and gives general performance
requirements to be used in detail specifications for film and
hybrid film integrated circuits. "
IEC 60748-21-1 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part
21-1: Blank detail specification for film integrated
circuits and hybrid film integrated circuits on the
basis of qualification approval procedures
IEC 60748-22 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part
22: Sectional specification for film integrated
circuits and hybrid film integrated circuits on the
basis of the capability approval procedures
"Applies to film and hybrid film integrated circuits (F and HICs),
manufactured as catalogue or as custom-built circuits whose
quality is assessed on the basis of the capability approval
procedure. Presents preferred values for ratings and
characteristics, selects from the generic specification the
appropriate tests and measuring methods and gives general
performance requirements to be used in detail specifications
for film and hybrid film integrated circuits. "
IEC 60748-22-1 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part
22-1: Blank detail specification for film integrated
circuits and hybrid film integrated circuits on the
basis of the capability approval procedures
IEC 60748-23-1 Ed. 1.0 en:2002 Semiconductor devices - Integrated circuits - Part
23-1: Hybrid integrated circuits and film structures
- Manufacturing line certification - Generic
specification
Applies to high quality hybrid integrated circuits (with films)
incorporating special customer quality and reliability
requirements. Hybrid integrated circuits may be fully or partly
completed. Partly completed devices are those that may be
supplied to customers for further processing.
IEC 60748-23-2 Ed. 1.0 en:2002 Semiconductor devices - Integrated circuits - Part
23-2: Hybrid integrated circuits and film structures
- Manufacturing line certification - Internal visual
inspection and special tests
"Applies to high quality approval systems for hybrid integrated
circuits and film structures. The purpose of the tests is to
perform visual inspections on the internal materials,
construction and workmanship of hybrid, multichip and
multichip module microcircuits and passive elements used for
microelectronic applications including r.f./microwave. These
tests will normally be used on microelectronic devices prior to
capping or encapsulation to detect and eliminate devices with
internal non-conformances that could lead to device failure in
normal application. They may also be employed on a sampling
basis to determine the effectiveness of the manufacturers'
quality control and handling procedures."
IEC 60748-23-3 Ed. 1.0 en:2002 Semiconductor devices - Integrated circuits - Part
23-3: Hybrid integrated circuits and film structures
- Manufacturing line certification - Manufacturers'
self-audit checklist and report
Applies to a high quality approval system for hybrid integrated
circuits and film structures.This checklist is intended for the
use of a hybrid microcircuit manufacturer's internal
assessment team. It will provide the hybrid manufacturer and
the National Supervising Inspectorate with ongoing information
on process control demonstrating compliance with IEC
60748-23-1.
IEC 60748-23-4 Ed. 1.0 en:2002 Semiconductor devices - Integrated circuits - Part
23-4: Hybrid integrated circuits and film structures
- Manufacturing line certification - Blank detail
specification
Serves as a Blank Detail Specification for a high quality
approval system and contains requirements for style and
layout and minimum content of detail specifications. These
requirements are applicable when the detail specification is
published.
IEC 60748-23-5 Ed. 1.0 en:2003 "Semiconductor devices - Integrated circuits, Part
23-5: Hybrid integrated circuits and film structures
- Manufacturing line certification - Procedure for
qualification approval"
Applies to high quality hybrids (with films) incorporating special
customer quality and reliability requirements whose quality is
assessed on the basis of Qualification Approval. NOTE: Hybrid
integrated circuits may be fully or part completed.
IEC 60748-3 Amd.1 Ed. 1.0 b:1991 Amendment 1 - Semiconductor devices.
Integrated circuits. Part 3: Analogue integrated
circuits
IEC 60748-3 Amd.2 Ed. 1.0 b:1994 Amendment 2 - Semiconductor devices.
Integrated circuits. Part 3: Analogue integrated
circuits
IEC 60748-3 Ed. 1.0 b:1986 Semiconductor devices. Integrated circuits. Part 3:
Analogue integrated circuits
"Gives standards on the following sub-categories of analogue
integrated circuits: -operational amplifiers (having two inputs
and one output); -audio-amplifiers, video-amplifiers and
multichannel amplifiers for telecommunications; -R.F. and I.F.
amplifiers; -voltage and current regulators; -analogue signal
switching circuits. Should be used with IEC 60747-1 and
60748-1. "
IEC 60748-4 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part
4: Interface integrated circuits
"Gives requirements for the following categories of interface
integrated circuits:line circuits (transmitters and receivers),
sense amplifiers, peripheral drivers (including memory drivers)
and level shifters, voltage comparators, linear and non-linear
analogue-to digital and digital-to-analogue converters, control
circuits for switch-mode power supplies, companding PCM
coder-decoders (CODEC), digital interface integrated circuits
(UBF), integrated service digital network (ISDN). "
IEC 60748-4-1 Ed. 1.0 b:1993 Semiconductor devices - Integrated circuits - Part
4: Interface integrated circuits - Section 1: Blank
detail specification for linear digital-to-analogue
converters (DAC)
IEC 60748-4-2 Ed. 1.0 b:1993 Semiconductor devices - Integrated circuits - Part
4: Interface integrated circuits - Section 2: Blank
detail specification for linear analogue-to-digital
converters (ADC)
IEC 60748-4-3 Ed. 1.0 en:2006 Semiconductor devices - Integrated circuits - Part
4-3: Interface integrated circuits - Dynamic criteria
for analogue-digital converters (ADC)
"Specifies a set of measuring methods and requirements for
testing ADCs under dynamic conditions, together with
associated terminology and characteristics"
IEC 60748-5 Ed. 1.0 b:1997 Semiconductor devices - Integrated circuits - Part
5: Semicustom integrated circuits
"Specifies standards on the subcategories of semicustom
integrated circuits. Provides basic information on terminology
and graphical symbols, essential ratings and characteristics,
functional specifications, measuring methods, acceptance and
reliability."
IEC 61523-1 Ed. 1.0 en:2001 Delay and power calculation standards - Part 1:
Integrated circuit delay and power calculation
systems
"The scope of the DPCS standard is to make it possible for
integrated circuit designers to analyze chip timing and power
consistently across a broad set of EDA applications, for
integrated circuit vendors to express timing and power
information once (for a given technology), and for EDA
vendors to meet their application performance and capacity
needs."
IEC 61739 Ed. 1.0 b:1996 Integrated circuits - Part 1: Procedures for
manufacturing line approval and quality
management
"Establishes the general requirements for delivery of qualified
products through manufacturing line approval under the IECQ
system and for registration in the Qualified Manufacturer List
(QML). Also describes procedures and requirements for
approval, qualification and registration of manufacturing line,
for maintenance of the QML, for audits and for the automatic
qualification of products from the approved manufacturing
line."
IEC 61943 Ed. 1.0 b:1999 Integrated circuits - Manufacturing line approval
application guideline
"Defines how to apply the principles and requirements given in
IEC 61739 to monolithic integrated circuits. The standard is
applicable to those manufacturers of integrated circuits (ICs)
who apply for manufacturing line approval. The objective is to
establish consistency in the requirements used by
manufacturers and auditors for techniques related to
integrated circuit manufacturing. Each manufacturer may use
his own methods for satisfying the requirements of this
standard, provided that the required level of control in the
manufacturing line is reached. "
IEC 61964 Ed. 1.0 b:1999 Integrated circuits - Memory devices pin
configurations
Applies to pinout package configurations of solid state
integrated circuit memory devices. The purpose of this
standard is to establish a registration procedure for such
configurations.
IEC 61967-1 Ed. 1.0 b:2002 "Integrated circuits - Measurement of
electromagnetic emissions, 150 kHz to 1 GHz Part 1: General conditions and definitions "
"Provides general information and definitions on measurement
of conducted and radiated electromagnetic disturbances from
integrated circuits. Also provides a description of
measurement conditions, test equipment and set-up as well as
the test procedures and content of the test reports. A test
method comparison table is included to assist in selecting the
appropriate measurement method(s). Measurement of the
voltage and current of conducted RF emissions or radiated RF
disturbances, coming from an integrated circuit under
controlled conditions, yields information about the potential for
RF disturbances in an application of the integrated circuit. "
IEC 61967-2 Ed. 1.0 b:2005 "Integrated circuits - Measurement of
electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions - TEM
cell and wideband TEM cell method "
"This test procedure defines a method for measuring the
electromagnetic radiation from an integrated circuit (IC). The
IC being evaluated is mounted on an IC test printed circuit
board (PCB) that is clamped to a mating port (referred to as a
wall port) cut in the top or bottom of a transverse
electromagnetic (TEM) or wideband gigahertz TEM (GTEM)
cell. The test board is not inside the cell, as in the conventional
usage, but becomes a part of the cell wall. This method is
applicable to any TEM or GTEM cell modified to incorporate
the wall port; however, the measured radio frequency (RF)
voltage will be affected by many factors. The primary factor
affecting the measured RF voltage is the septum to IC test
board (cell wall) spacing. This procedure was developed
using a 1 GHz TEM cell with a septum to floor spacing of 45
mm and a GTEM cell with average septum to floor spacing of
45 mm over the port area. Other cells may not produce
identical spectral output but may be used for comparative
measurements, subject to their frequency and sensitivity
limitations. A conversion factor may allow comparisons
between data measured on TEM or GTEM cells with different
septum to floor spacing. The IC test board controls the
geometry and orientation of the operating IC relative to the cell
and eliminates any connecting leads within the cell (these are
on the backside of the board, which is outside the cell). For the
TEM cell, one of the 50 ports is terminated with a 50 load.
The other 50 port for a TEM cell, or the single 50 port for a
IEC 61967-4 Amd.1 Ed. 1.0 b:2006 "Amendment 1 - Integrated circuits - Measurement
of electromagnetic emissions, 150 kHz to 1 GHz Part 4: Measurement of conducted emissions - 1
Ω/150 Ω direct coupling method "
IEC 61967-4 Ed. 1.1 b:2006 "Integrated circuits - Measurement of
electromagnetic emissions, 150 kHz to 1 GHz Part 4: Measurement of conducted emissions - 1
Ω/150 Ω direct coupling method"
Specifies a method to measure the conducted electromagnetic
emission (EME) of integrated circuits by direct radio frequency
(RF) current measurement with a 1 Ω resistive probe
and RF voltage measurement using a 150 Ω coupling
network. These methods guarantee a high degree of
repeatability and correlation of EME measurements. IEC
61967-1 specifies general conditions and definitions of the test
methods.
IEC 61967-5 Ed. 1.0 b:2003 "Integrated circuits - Measurement of
electromagnetic emissions, 150 kHz to 1 GHz -
Part 5: Measurement of conducted emissions Workbench Faraday Cage method"
Describes a method to measure the conducted
electromagnetic emission of integrated circuits either applied
on a standardised test-board or on a final printed circuit board
(PCB). Has a high repeatability and a good relationship to the
measured RF emission of final applications with the integrated
circuits used.
IEC 61967-6 Ed. 1.0 b:2002 "Integrated circuits - Measurement of
electromagnetic emissions, 150 kHz to 1 GHz Part 6: Measurement of conducted emissions Magnetic probe method "
"Specifies a method for evaluating RF currents on the pins of
an integrated circuit (IC) by means of non-contact current
measurement using a miniature magnetic probe. This method
is capable of measuring the RF currents generated by the IC
over a frequency range of 0,15 MHz to 1 000 MHz."
IEC 62132-1 Ed. 1.0 b:2006 "Integrated circuits - Measurement of
electromagnetic immunity, 150 kHz to 1 GHz Part 1: General conditions and definitions"
"This part of IEC 62132 provides general information and
definitions on measurement of conducted and radiated
electromagnetic immunity of integrated circuits (ICs) to
conducted and radiated disturbances. It also provides a
description of measurement conditions, test equipment and
set-up, as well as the test procedures and content of the test
reports. A test method comparison table is included in Annex
A to assist in selecting the appropriate measurement
method(s). This standard describes general conditions
required to obtain a quantitative measure of immunity of ICs in
a uniform testing environment. Critical parameters that are
expected to influence the test results are described. Deviations
from this standard are noted explicitly in the individual test
report. The measurement results can be used for comparison
or other purposes. Measurement of the injected voltages and
currents, together with the responses of the ICs tested at
controlled conditions, yields information about the potential
immunity of the IC to conducted and radiated RF disturbances
in a given application. "
IEC 62132-4 Ed. 1.0 b:2006 Integrated circuits - Measurement of
electromagnetic immunity 150 kHz to 1 GHz - Part
4: Direct RF power injection method
"Describes a method to measure the immunity of integrated
circuits (IC) in the presence of conducted RF disturbances,
e.g. resulting from radiated RF disturbances. This method
guarantees a high degree of repeatability and correlation of
immunity measurements. This standard establishes a
common base for the evaluation of semiconductor devices
used in equipment functioning in an environment subject to
unwanted radio frequency electromagnetic waves. "
IEC 62132-5 Ed. 1.0 b:2005 "Integrated circuits - Measurement of
electromagnetic immunity, 150 kHz to 1 GHz Part 5: Workbench Faraday cage method "
"This measurement procedure describes a measurement
method to quantify the RF immunity of integrated circuits (ICs)
mounted on a standardized test board or on their final
application board (PCB), to electromagnetic conductive
disturbances."
IEC 62265 Ed. 1.0 en:2005 "Advanced Library Format (ALF) describing
Integrated Circuit (IC) technology, cells and
blocks"
"Provides rules that describe ALF and how tool developers,
integrators, library creators, and library users should use it."
IEC/TR 61967-4-1 Ed. 1.0 en:2005 "Integrated circuits - Measurement of
electromagnetic emissions, 150 kHz to 1 GHz Part 4-1: Measurement of conducted emissions - 1
Ω/150 Ω direct coupling method Application guidance to IEC 61967-4"
"Serves as an application guidance and relates to IEC
61967-4. The division of IC types into -> IC function modules
and the software modules for -> cores with CPU can be used
for Parts 3, 5 and 6 of IEC 61967. Gives advice for performing
test methods described in IEC 61967-4 by classifying types of
integrated circuits (ICs) and providing hints for test
applications related to the IC type classification. To obtain
comparable results of IC emission measurements using IEC
61967-4, definitions are given which are in addition to the
general conditions specified in IEC 61967-1 and IEC 61967-4.
These definitions concern IC related operating modes, pins
and ports to be tested, test set-ups according IEC 61967-4,
including description of load circuits and RF path, and IC
related emission limits (or limit classes). Parts of the guidance
provided by this technical report may be applicable to other
parts of IEC 61967."
IEC/TS 61944 Ed. 1.0 b:2000 Integrated circuits - Manufacturing line approval Demonstration vehicles
Establishes the characteristics of standard evaluation
components (SEC) used for verifying capability and reliability.
IEC/TS 61967-3 Ed. 1.0 b:2005 "Integrated circuits - Measurement of
electromagnetic emissions, 150 KHz to 1 GHz Part 3: Measurement of radiated emissions Surface scan method"
"This part of IEC 61967 provides a test procedure which
defines a method for evaluating the near electric, magnetic or
electromagnetic field components at or near the surface of an
integrated circuit (IC). This diagnostic procedure is intended
for IC architectural analysis such as floor planning and power
distribution optimization. This test procedure is applicable to
measurements from an IC mounted on any circuit board that is
accessible to the scanning probe. For comparison of surface
scan emissions between different ICs, the standardized test
board defined in IEC 61967-1 should be used. This technique
is capable of providing a detailed pattern of the radio
frequency (RF) sources internal to the IC. The resolution of the
measurement is determined by the capability of the
measurement probe and the precision of the probe positioner.
This method is intended for use over the 10 MHz to 1 GHz
frequency range. Extended upper frequency limits are possible
with existing probe technology but are beyond the scope of
this specification. The probe is mechanically scanned
according to a programmed pattern in a parallel or
perpendicular plane to the IC surface. The data is computer
processed to provide a colour- enhanced representation of the
field strength at the scan frequency. "