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Keeping Hot Chips Cool Thermal Management for Green Computing Yang Ge Professor Qinru Qiu utline • Background – Need for green computing – Adverse effects of high temperature – Thermal management techniques • Ongoing project – Power and thermal management for single chip cloud computer (SCC) The need for green computing • Computers consume 3% of US energy use – Saving 1% of energy of data center is more than saving a power plant • Each computer generates 1 ton of CO2 every year – Equivalent to the CO2 emission of a car driving a round trip between New York and Los Angeles Power and Cost for Cooling Systems • The energy dissipation for cooling system is high – Cooling fan power can reach up to 51% of the overall server power budget • The cooling cost is expensive in large data centers – The total cooling costs for large data centers can run into tens of millions of dollars Other 6% Fans Mem 20% CPU Fans 51% Mem Other CPU 24% IBM P670 Server power breakdown Adverse effects of high temperature to VLSI Chips • Affects the system reliability and causes permanent device failure • Doubles leakage power consumption every 9oC increase • Requires to increase fan speed which could reduce fan life time Thermal Management Techniques Offline Techniques Temperature aware scheduling Dynamic voltage frequency scaling Online Techniques Temperature aware task migration Ongoing Project • Power and thermal management for single chip cloud computer (SCC) Overview of SCC Architecture • 24 tiles arranged in 6X4 arrays • 2 CPUs on each tile • A router associated with each tile • 4 memory controllers go to on board memory Management Console PC (MCPC) • SCC and MCPC communicates over PCIe bus • MCPC runs Ubuntu 10.04 x64 and SW from Intel • Load Linux image on each core • read and modify SCC registers • Load programs on the SCC cores. Power and Thermal Management • 6 voltage domains • 24 Frequency domains, one for each tile • 2 temperature sensors on each tile • Voltage and frequency can be changed separately on each domain hank y u