Survey
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
Slide -1 Ground Bounce and EMC Bouncing Out Ground Bounce to Improve Signal Integrity and EMC Dr. Eric Bogatin, Signal Integrity Evangelist, Bogatin Enterprises, a LeCroy Company www.beTheSignal.com Sept 2011 Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -2 Ground Bounce and EMC Overview • A methodology for solving problems • The ground bounce problem • The essential principles • Why ground bounce is also an EMC problem • Solutions Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -3 Ground Bounce and EMC For More Information www.beTheSignal.com Recent Publications Future class schedules My Blog: What I learned this month Recorded webinars www.PrintedCircuitUniversity.com for online training Published by Prentice Hall, 2009 Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -4 Ground Bounce and EMC Fastest Way to Solve a Problem is to Identify its Root Cause If you have the wrong root cause, you will only fix the problem by luck Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -5 Ground Bounce and EMC Identify the Problem: Ground Bounce On Chip Icharge Idischarge Switching lines Quiet data line V SS V CC L Bonding common lead inductance GND • • • • • Power L Bonding 15836 © 1991 Integrated Circuit Engineering Corporation Identify the problem Understand the essential principles Find the root cause Establish the design guideline Create a specific design rule Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -6 Ground Bounce and EMC The Origin of Ground Bounce Signal 2 Voltage across signal 2 has ground bounce voltage in series with it - crosstalk I1 L11 Signal 1 1 L21 I2 2 L22 VgndBounce Common return I1 = I2 dNtotal = dt VgndBounce = (L22 − L21 ) Ntotal = L22I 2 − L21I1 dI1 dI = Ltotal 1 dt dt In what interconnect elements will return currents overlap? In what signaling scheme will net return currents be mostly constant? Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -7 Ground Bounce and EMC Confirm Root Cause with Simple Simulation (using QUCS) n lines 2v/div 1v/div Data line Quiet line RT = 1 nsec L_comm = 4 nH n = 4 switching TD = 1.1 nsec R_source = 20 Ohms common lead inductance Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -8 Ground Bounce and EMC Turn the Root Cause into a Design Guideline with the “Youngman Principle” Read www.bethesignal.com/blog, Nov 9, 2008 “If your arm hurts when you raise it, don't raise your arm.” “If problem A happens when your design has feature B, then eliminate feature B from your design” Identify the root cause of a problem and fix the root cause Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -9 Ground Bounce and EMC In Which Interconnect Structures Will Ground Bounce Arise? • Two ingredients for ground bounce: Screwed up return path: higher inductance than a wide plane Overlapping return currents for different signal lines • Applying the Youngman Principle: how to reduce ground bounce? Don’t screw up the return path Don’t overlap return currents • Where we expect to see ground bounce: Resistor SIPS Narrow package traces, Narrow connector pins Gaps in planes Vias, connectors Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -10 Ground Bounce and EMC Return Bounce in Resistor Networks TT electronics Bourns muRata Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -11 Ground Bounce and EMC Calculating Total Inductance of the Return Path is Hard! w “if all you have is a hammer, everything looks like a nail” Signal path s Total Inductance per length, nH/inch Return path Total inductance of return path 20 18 16 14 12 s = 40 mils s = 30 mils s = 20 mils s = 10 mils 10 8 6 4 2 0 5 10 15 20 25 30 35 40 45 For w = s Ltotal ~ 10 nH/inch 50 Trace Width, mils Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -12 Ground Bounce and EMC Estimating Ground Bounce Noise Vgnd = L totaln Vgnd dI dt Vsig = L totaln L xn = 2% x total Z0RT RT Ltotal[nH] = total inductance of return path n = number of simultaneous signals switching RT[nsec] = 10-90 rise time of signal current V dI = sig dt Z 0RT Ltotal ~ 10 nH/inch x Len Ltotal ~ 5 nH Ltotal ~ 2 nH Example: n = 3, RT = 0.5 nsec gb noise ~ 2% x 2 x 3 / 0.5 = 24% Example: n = 2, RT = 1 nsec gb noise ~ 2% x 5 x 2 / 1 = 20% Do you wonder why ground bounce is so common in packages and connectors? Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -13 Ground Bounce and EMC Overlapping Return Currents = Ground Bounce • Ltotal ~ 10 nH/inch x Len of overlapping return currents • Example: 1 signal switching, with returns overlapping for 0.25 inches Vgnd • L n = total Vsig Z 0RT Ltotal = 2.5 nH x 2 legs = 5 nH • Z0 = 50 Ohms, RT = 1 nsec, n = 1 Ltotal ~ 10 nH/inch x 0.25 inches = 2.5 nH 0.25 inches Vgnd Vsig L n 5 x1 = total = = 10% Z 0RT 50 x 1 If there are 3 signals switching, noise ~ 30%, more if RT < 1 nsec Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -14 Ground Bounce and EMC Radiated Emissions from Antennas 1000000 (at 3 meters) R E= 5.5 Pradiated R E = far field strength in V/m R = distance from source in m Pradiated = total radiated power in W Field Strength ( V/m) 100000 10000 1000 100 µV/m 100 10 1.E-09 1.E-08 1.E-07 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 Radiated power (Watts) A few nanowatts of radiated power will fail FCC class B! Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -15 Ground Bounce and EMC Preventing EMI Problems is Hard! “There are two kinds of designers: those who are trying to design antennas on purpose and those that aren’t doing it on purpose” Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -16 Ground Bounce and EMC Two Fundamental Types of Antennas- and Currents Electric dipole Cable shield + + Noisy plane I ~ - chassis If C = 1 pF, Z = 1600 Ω @ 100 MHz I Magnetic dipole Transmission line Where is the return current path in each antenna? Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -17 Ground Bounce and EMC Common Currents and Failing FCC + + Len I ~ I Direction of max radiation ~ - (conductive plate) Isolated dipole E = 4π x 10 −7 f x I x Len = 0.4 µV / m x f x I R f in MHz, I in microAmps @ 100 MHz, E ~ 100 uV/m is FCC, class B limit Imax = 100uV / m = 3uA 0.4uV / m x 100MHz Only takes ~ 3 uA common current to fail FCC! Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -18 Ground Bounce and EMC Example: Common Currents and Radiation from Ground Bounce E = 4π x 10 −7 E= I= Len = R= f= f x I x Len R field in V/m current in Amps length of monopole in m distance to point in m sine wave frequency in Hz E = 1.2 x 10 −6 Cable shield Noisy plane chassis 10 8 x 10 −4 x 1 = 4000 µV / m 3 Voltage noise = 100 mV Impedance ~ 1 kΩ Ω CM Current ~ 100 µA Len ~ 1 m R=3m @ 100 MHz Should you be worried? Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -19 Ground Bounce and EMC Apply Youngman’s Principle to Fix EMC Problems from Ground Bounce Cable shield Noisy plane Icm chassis Icm • Solutions: Reduce total inductance of return path: short, wide conductors, signal and return currents in proximity L total dIplane = Z cm dt Iplane = current in the planes Ltotal = total inductance of the return plane Zcm = impedance the common current sees Reduce dI/dt in the planes- diff signaling, ondie, on-pkg caps Increase comm signal impedance: ferrites! Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -20 Ground Bounce and EMC Finite Width of Return Path Cable shield Noisy plane D. S. Britt, D. H. Hockanson, F. Sha, J. Drewniak, T. Hubbing and T. Van Doran, “Effects of Gapped Ground Planes and Guard Traces on Radiated EMI”, IEEE Symposium on Electromagnetic Compatibility, 1997, p. 159 chassis Gap just under the trace Common current Keep return path width > 3 x w Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -21 Ground Bounce and EMC Radiated Emission from Cables Really Comes from the Connectors Enclosure IC = Signal I/O 1 dI 1 20mA L total = 0.1nH = 10µA ZC dt 200 1n sec • How much external magnetic fields around a coax? 0.1 nH asymmetric connector, causing some total inductance • What is the total inductance of the return path of a coax? • How much ground bounce will appear in an ideal coax connector? • Asymmetrical connector causes total inductance in return path • Return current through total inductance causes voltage noise • Voltage noise drives common currents in cable • Cable radiates. Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -22 Ground Bounce and EMC Common Currents and Connector Quality IEEE EMC Symposium 2009 Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -23 Ground Bounce and EMC Ground Bounce Can Ruin Your Day • Causes excessive cross talk Can be long range Grows with more signals switching simultaneously Grows inversely with rise time • Causes EMI In connectors In planes • Fix ground bounce by Don’t screw up the return path Don’t share return paths Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com Slide -24 Ground Bounce and EMC For More Information www.beTheSignal.com Recent Publications Future class schedules My Blog: What I learned this month Recorded webinars www.PrintedCircuitUniversity.com for online training Published by Prentice Hall, 2009 Bogatin Enterprises, LLC, a LeCroy Company 2011 www.beTheSignal.com