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AMERICAS’ EDITION
FEBRUARY
2 016
PRODUCT AND TECHNOLOGY NEWS FROM FUTURE ELECTRONICS
Renesas
Introducing the Renesas
Synergy™ Platform
PAGES 4-5
Infineon
OPTIGA™ TPM:
Certified Security Solutions
for Trusted Computing
in PC and
Embedded Applications
PAGE 6
TE Connectivity
MS5525DSO: Save Space
with Fully Calibrated Pressure
and Temperature Sensor
in a Small Package
PAGE 11
Vishay
The Internet of Things (IoT) –
Touching the Human Body
PAGE 13
APPLICATION SPOTLIGHT
RL78/G1D Intelligent Bluetooth® Smart MCUs
3
4-5
6
7
7
8
8
8
9
10
10
11
11
12
12
13
24
COMPONENT FOCUS
Cambridge CMOS Sensors
Ultra-Low Power Gas Sensors
14
Microchip
MCP9600: Fully Integrated Thermocouple EMF to ºC Converter
14
NXP
NFC Smart Connected Home
15
CUI Inc.
Level VI-Compliant AC-DC Power Supplies Suitable for Global Use
16
CUI Inc.
The Power to Heal, Deliver, Connect and Build – The Power of Things™16
17
LittelfuseXTREME-GUARD™ ESD Suppressors Reduce Power Consumption and Ensure Data Integrity
Susumu
Precision Chip Resistors with the Highest Power Rating
17
E-Switch
Large Selection of Tact Switches with Multiple Options
18
Adam Tech
Industry Standard Cable Assemblies
18
Future Electronics
Analog Corner
20-21
Low-power RL78 Microcontroller and Bluetooth Low
Energy (BLE) wireless technology increase battery life
and accelerate Bluetooth connected device development
■
Power Saving
■ High
integration minimizes BOM
cost; Balun, on-chip 32 KHz oscillator
Key Features
Bluetooth Smart v4.1 connectivity
supported in embedded and
modem modes
■ Industry-leading support tools shorten
time to market
■ 'RF Adaptable Technology' automati-
State-of-the-art radio
technology enables reliable communications
with low current
consumption.
4 mA
capability enables convenient
application upgrades in the field
(Data transfer 1 second interval/
Connection always on)
2 mA
1 mA
0 mA
MCU
Oper. Sta.
Deep
Sleep
Wake
up RUN
Best setting
to MCU operation
HALT
RUN
STOP
RUN
S
T
O
P
Deep
Sleep
Deep
Sleep
RL78/G1D MCUs prioritize current consumption
at near distances or communication range at far
distances.
Simplified
RF Design
Bluetooth
Reception/Transmission
Average current is 10 µA !
3 mA
Efficient Connection Technology
■ Firmware-over-the-air (FOTA)
cally optimizes power consumption
versus communication range
Receiver
Sensitivity
Design Versatility + System
Performance Optimization
documented test procedure facilitate
radio certification
Rx current of 3.5 mA
Outstanding Tx/Rx
Power Efficiency
Interference
Rejection
■ BT SIG qualified stack plus
■ Peak Tx current of 4.3 mA and peak
Current
APPLICATION SPOTLIGHT
Renesas
RL78/G1D Intelligent Bluetooth® Smart MCUs
Renesas
Introducing the Renesas Synergy™ Platform
InfineonOPTIGA™ TPM: Certified Security Solutions for Trusted Computing in PC and Embedded Applications
Yageo
Resistor Products for Internet of Things (IoT) Applications
Zilog
32-bit Cortex-M3 Based Programmable Motor Controllers
CypressEZ-BLE™ PSoC® Module
Cypress
The Industry’s Lowest Power Energy Harvesting PMIC for IoT Devices
Cypress
Comparing IoT Memory Types
SemtechLoRa® Products Enable the Internet of Things
ON Semiconductor
High Performance Sub-1 GHz Radio Devices
TE Connectivity
HM1500LF and HTM2500LF Temperature and Relative Humidity Modules
TE Connectivity
MS5525DSO: Save Space with Fully Calibrated Pressure and Temperature Sensor in a Small Package
TE Connectivity
BLE Wireless Sensor Tag Demo V1.1
Sensirion
SHT3x Series Digital and Analog Humidity and Temperature Sensors
Lattice Semiconductor
iCE40 UltraLite™ - The Best Solution for IoT Devices
Vishay
The Internet of Things (IoT) – Touching the Human Body
STMicroelectronics
ST Solutions for IoT Sensor Objects
Wake
up
High level of
integration
simplifies RF
design and
reduces BOM
count.
L&C
DC/DC
Antenna
BALUN
RL78/G1D MCU
BLE Connectivity Solution
Operation period of RL78/G1D (About 7 ms)
Interval time (1 second)
TECHNICAL VIEW
Future Electronics
How to Design a Wireless Lighting Network for High Performance, High Reliability and Low BoM Cost
AD
Future Lighting Solutions
We Accelerate Time to Revenue by Providing…
22-23
Module Reference Designs
■
19
Commercial Modules from Gainspan
Tx Output Power:
0dBm & 20dBm
■ GS780MIZ
■ GS780MEZ
Sample Programs
■
■
■
Current and previous versions of the virtual FTMs are available at www.FutureElectronics.com/FTM
■
19 mm
■
■
To buy products or download data, go to
www.FutureElectronics.com/FTM
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Pin
Count
48 pins
Package
Plastic
WQFN
(6x6 mm)
Evaluation Kit
Fields of
Application
Ordering Part
Number
Consumer
R5F11AGGANB
Industrial
R5F11AGGDNB
Consumer
R5F11AGHANB
Industrial
R5F11AGHDNB
Consumer
R5F11AGJANB
Industrial
R5F11AGJDNB
Code
Flash
Memory
Data
Flash
Memory
RAM
128 KB
8 KB
12 KB
192 KB
8 KB
16 KB
256 KB
8 KB
20 KB
Evaluation PC GUI
P/N: RTK0EN0001D01001BZ
For information on Bluetooth Smart, go to bit.ly/1O7yIAC
To evaluate today, get your Bluetooth Low Energy Kit: P/N: RTK0EN0001D01001BZ
Register at
www.FutureElectronics.com/FTM/Register
Accuracy of technical data: All technical data, information, detachable insert(s) or loose advertisement(s) contained in this magazine is derived from information provided by Future Electronics’ suppliers. Such information has not been verified by Future
Electronics and we make no representation, nor assume any liability as to its accuracy. Future Electronics does not assume liability in respect to loss or damage incurred as a consequence of or in the connection with the use of such data and information.
Prices subject to change without notice. ®Delight the Customer is a registered trademark of Future Electronics.
2
The RL78/G1D Group
Firmware Over The Air update (FOTA)
Virtual UART
iOS and Android demo apps
Beacon stack
BT Developer Studio plug-in
TCP/IP stack
1.800.FUTURE.1 • www.FutureElectronics.com
Renesas Synergy Software Package (SSP)
At the heart of Renesas Synergy™ Software
is the Synergy Software Package (SSP) that
integrates Express Logic ThreadX® RTOS,
plus stacks, libraries and utilities, including
NetX Duo™, USBX™, GUIX™, and FileX®,
with a rich application framework and
drivers – all optimized specifically for the
Renesas Synergy™ MCU architecture.
Renesas Synergy™ Microcontrollers
Series S7
High Performance
• 240 MHz ARM® Cortex®-M4
CPU w/FPU
• Up to 4 MB Code Flash
• Up to 640 KB SRAM
• Dual Ethernet MAC Controller
w/PTP
• USBHS and USBFS
• CAN, SSI, QSPI, and SDHI
• Graphics LCD Controller w/2D
Drawing Engine
• Capacitive Touch Sensing Unit
• TRNG, Crypto, HASH
• Integral Safety
Series S5
High Integration
• To 200 MHz ARM® Cortex®-M4
CPU w/FPU
• Up to 2 MB Code Flash
• Up to 640 KB SRAM
Coming Soon
Series S3
High Efficiency
• 48 MHz ARM® Cortex®-M4
CPU w/FPU
• Up to 1 MB Code Flash
• Up to 192 KB SRAM
• USBFS
• CAN, SSI, QSPI, and SDHI
• 14-bit A/D Converter and
12-bit D/A Converter
• OPAMP
• High-Speed and Low-Power
Analog Comparators
• Capacitive Touch Sensing Unit
• TRNG, Crypto, HASH
• Integral Safety
Series S1
Ultra Low Power
• 32 MHz ARM® Cortex®-M0+
CPU
• Up to 128 KB Code Flash
• Up to 16 KB SRAM
• USBFS
• CAN
• 14-bit A/D Converter and
12-bit D/A Converter
• Low-Power Analog Comparator
• Capacitive Touch Sensing Unit
• TRNG, Crypto, HASH
• Integral Safety
Renesas Synergy™ Tools & Kits
Renesas Synergy is a comprehensive platform that integrates a real-time
operating system, middleware and other software with a family of
highly scalable microcontrollers, as well as development tools, designed
to improve productivity. This tight coupling, along with a wide range of
application and product examples, allows you to focus on innovation and
deliver differentiated products faster than ever before.
Elements of Renesas Synergy have been designed to provide unprecedented compatibility and scalability.
Well-designed software APIs make software development at an application level a reality. Systematic testing,
qualification, maintenance and support that follow well-defined software lifecycle management principles reduce
risk for software developers.
With the out-of-box integration of software and hardware, the Renesas Synergy Platform now allows you to
improve your time to market, eliminate barriers to entry brought on by the risks of new technologies and upfront
costs, and lower your total cost of ownership with bundled, maintained and verified baseline resources.
The Renesas Synergy Platform will continue to evolve over time, bringing new technologies and features that
maintain compatibility so you can keep your products on
the cutting edge. To catch the next wave and learn more,
please visit: bit.ly/1MtOeCo
©2016 Renesas Electronics America Inc. (REA). All rights reserved. Renesas Synergy is a trademark
of Renesas Electronic Corporation. All trademarks are the property of their respective owners.
e2 studio, an Integrated Solution Development Environment (ISDE)
• Industry-standard Eclipse-based tool with multiple plug-ins
• GNU ARM C compiler (IAR ARM compiler option)
• New Project Generator for quick and easy project setup
• Pin, Clock, and Interrupt Configurator to personalize design, error
check, and generate start-up code
• GUIX Studio – desktop graphical user interface design tool
• Smart manual. Interactive wiki-based, context-aware
embedded document system
• RTOS-aware debugging via J-Link JTAG and single-wire
interfaces
•TraceX™ real time task monitoring for ThreadX
Hardware Kits
• Development Kits (DK) for full project development. Modular access to all MCU features and pins
• Starter Kits (SK) for low-cost introduction to using the Renesas Synergy Platform
• Promotion Kits (PK) for experiencing the Renesas Synergy Platform without any barrier
Renesas Synergy™ Solutions
Product Example Kits (PE)
Application Example Kits (AE)
• Human Machine Interface with brilliant-color TFT LCD and
wired/wireless connectivity
• Industrial data logger w/precision analog and wireless
• Capacitive touch deep evaluation modules
• More to come for motor control, industrial networking, and mesh
networked sensors
Renesas Synergy™ Gallery
• Showroom website for access to Renesas Synergy Platform
ecosystem of software, tools, and services
• All licensing and downloading of Reness Synergy tools, SSP,
demonstrations, and qualified SW add-ons from Renesas
• Browse and download verified software add-on components, tools,
and services from third-party suppliers
• Visit the Renesas Synergy Gallery at:
https://synergygallery.renesas.com
For more information or to get your Renesas Synergy Kit, go to bit.ly/1MtOeCo
APPLICATION SPOTLIGHT
APPLICATION SPOTLIGHT
OPTIGA™ TPM: Certified Security Solutions for
Trusted Computing in PC and Embedded Applications
Resistor Products for Internet of Things (IoT) Applications
FEATURES AND APPLICATIONS
The Infineon OPTIGA™ TPM (Trusted Platform Module) family is a
standardized security controller family which provides a wide range
of security functions for embedded platforms. As the leader of Trusted
Computing solutions, Infineon offers a broad range of products
meeting your specific requirements.
Current applications of IoT include healthcare
systems, buildings and home automation,
as well as transportation. As the wearable
market expands, Yageo provides high
reliability for current sensors and high
precision in thin film resistors to meet this
increasing need.
Security and Functionality
All OPTIGA TPM products are based on Infineon’s advanced hardware
security technology. The products are designed according to the Trusted
Computing Group (TCG) specifications and are Common Criteria certified1
to EAL4+. The security functions include system and data integrity,
authentication, secured communication, secured data storage and secured
updates.
™
Performance and Power
Implemented on a 16-bit state-of-the-art security controller from
Infineon, the products meet the latest Microsoft Windows boot time and
performance criteria. Furthermore the products are supported in Linux OS
and derivates.
A sleep current of down to 110μA allows smooth integration into a broad
range of devices requiring power efficient battery operated designs.
The OPTIGA TPM family supports an improved commercial temperature
range as standard (-20°C to +85°C) as well as an extended temperature
range (-40°C to +85°C) for industrial applications. The OPTIGA™ TPM is
available in TSSOP-28 package or the small VQFN-32 package (5 x 5mm2),
which saves precious board space on your mobile platforms.
Migrate to TCG TPM 2.0 Today
Leading the way into the future, Infineon is the first provider offering a TPM
2.0 product according to the latest specification. With this early expertise
we support your smooth transition to the new standard.
Fully Certified and State-of-The-Art Security
For new products of the Infineon OPTIGA™ TPM family, the Common Criteria
certification is a key focus. As the first and still leading the list, Infineon had
its TPMs listed on the official TCG product list showing that the TCG TPM
standard is fulfilled.
Infineon is a driver in the Trusted Computing Group (TCG), the
standardization organization formed to develop open, vendor-neutral,
global industry standards for hardware security. With an Infineon
representative serving as the TCG president and a strong presence and
chairs in various working groups, Infineon is working on future security
standards and driving innovation.
To buy products or download data, go to
www.FutureElectronics.com/FTM
6
The PA series, with high power, is used mostly
in power, networking and automotive applications.
The PE series is used mostly in smartphones,
tablets, battery-power and LED lighting
applications.
PE and PA current sensors offer accurate direct
current measurement while protecting the circuit
from excessive current.
Thin Film Resistors (RT/AT series)
•Case size: 0201 to 2512 (RT),
0402 to 1206 (AT)
•High precision and high stability
•Superior resistance against sulfur-containing
environment
•AEC-Q200 compliant (AT)
•Low TCR, low electrical noise
RT and AT thin film resistors feature high precision
RT with superior TCR (down to ±5ppm/°C)
and enhanced stability that is ideal for audio,
telecommunications, medical and industrial
test & measurement equipment.
FEATURES
•Standardized security controller
•TCG certified products
•Products with TPM 1.2 and 2.0
•Standard and extended temperature range (-40°C to +85°C)
•Firmware upgrade capability
•SPI, I2C and LPC interface
•VQFN-32 and TSSOP-28 package
•CC and FIPS certification
Extended Temperature Range and Packages
™
Current Sensors (PA/PE series)
•Case size: 2512 (PA), 0201 to 2512 (PE)
•Low TCR, automotive grade metal
current sensors
The RT series is often used in smart meters,
intelligent homes and inverters. The AT series
can be found in automotive and general
industrial applications.
To buy products or download data, go to
www.FutureElectronics.com/FTM
BENEFITS
•Innovative security solutions provided by the market leader
•High confidence level based on Common Criteria certification
•Easy integration based on standardization
Introducing ZNEO32!
APPLICATIONS
Zilog’s Line of 32-bit Cortex-M3 based Programmable Motor Controllers
•Notebooks/PCs/tablets/servers
•Networking components
•Industrial automation
•Single board devices
•Home automation
•Automotive
ZNEO32! uses high performance 32-bit computing, 3-phase PWM generators, and high speed ADC units to provide an effective, low cost system solution for motor applications.
OPTIGA™ TPM
This family builds a root of trust in PC, mobile and embedded solutions
based on the Trusted Computing Group specifications.
SLB 9645
2
SLB 9665
SLB 9670
SLB 9670
TPM 1.2
TPM 1.2
TPM 2.0
TPM 1.2
TPM 2.0
I C interface
LPC interface
LPC interface
SPI interface
SPI interface
Based on
common criteria
certified code
Common
criteria
certified
Common
criteria
certified
Common
criteria
certified
Common
criteria certified
(pending)
2
1
SLB 9660
2
The Trusted Computing Group (TCG) specifications for the standardized TPM v1.2 only consider LPC and SPI interfaces.
The I2C interface is not part of the TCG defined specification. The SLB 9645 is built on the TCG compliant, EAL4+
certified TPM hardware and firmware, with the addition of I2C support.
2
Product versions for Chrome OS available
1.800.FUTURE.1 • www.FutureElectronics.com
Part Number
Core
Flash
SRAM Max. Freq.
Z32F06410AES
Z32F06410AKS
Z32F12811ARS
Z32F12811ATS
Z32F38412ALS
Z32F38412ATS
Cortex-M3
Cortex-M3
Cortex-M3
Cortex-M3
Cortex-M3
Cortex-M3
64KB
64KB
128KB
128KB
384KB
384KB
8KB
8KB
12KB
12KB
16KB
16KB
48MHz
48MHz
72MHz
72MHz
72MHz
72MHz
ADC
Resoluon
12-bit x 2-unit
12-bit x 2-unit
12-bit x 3-unit
12-bit x 3-unit
12-bit x 2-unit
12-bit x 2-unit
Speed
1.5MS/s
1.5MS/s
1.5MS/s
1.5MS/s
1.5MS/s
1.5MS/s
Key Features:
• High performance low-power Cortex-M3 core
• 64KB, 128KB, or 384KB code flash
• Memory with cache funcon
• 8KB, 12KB, or 24KB SRAM
• 3-Phase PWM with ADC triggering funcon (1-2 channels)
• 1.5Msps high speed ADC with sequenal conversion funcon
• Watchdog mer
• External communicaon ports
• Six general purpose mers
• Industrial grade operang temperature (-40°C ~ +85°C)
Typical Applicaons:
• BLDC/PMSM motors
• Outdoor air condioners
• Washing machines
• Refrigerators
For more information or to buy products, go to www.FutureElectronics.com/FTM
TIMERS
6-16bit
6-16bit
6-16bit
6-16bit
10-16bit + FRT
10-16bit + FRT
UART SPI
2
2
2
4
4
4
1
1
2
2
2
2
I2C
MPWM
ADC
I/O Ports
Pkg.
1
1
2
2
2
2
1
1
2
2
2
2
2-unit 11 ch
2-unit 8 ch
3-unit 16 ch
3-unit 16 ch
2-unit 16 ch
2-unit 16 ch
44
28
48
64
86
64
48 LQFP
32 LQFP
64 LQFP
80 LQFP
100 LQFP
80 LQFP
ZNEO32! Evaluaon Kits
Z32F0640100KITG
ZNEO32! 64K Evaluaon Kit
Z32F1280100KITG
ZNEO32! 128K Evaluaon Kit
Z32F06410AxS Block Diagram
JTAG/SWD
POR
Cortex-M3
DMA
4Ch
CACHE
FLASH
64KB
BOOTROM
MOSC
(4/8Mhz Xtal)
VDC/LVD
(1.8V)
PLL
12bit ADC x2
(1.5Msps)
3-Phase PWM
x1
AHB MATRIX
SRAM
8KB
APB
GPIO
SYSCON
UART x2
WDT
SPI x1
TIMER X6
12C x1
APPLICATION SPOTLIGHT
Semtech’s LoRa® products enable the
EZ-BLE™ PSoC® Module
SWD/
GPIO
EZ-BLE PSoC Module is a fully integrated, fully certified, 11 x 11 x 1.8mm,
programmable, Bluetooth Smart or Bluetooth Low Energy (BLE)
module designed for ease-of-use and reducing time-to-market. It
contains Cypress’s PSoC 4 BLE chip, two crystals, antenna, shield and
passive components.
EZ-BLE PSoC Module provides a simple and low cost way to add a
microcontroller, CapSense® touch controller and Bluetooth Smart
connectivity to any system. EZ-BLE PSoC Module integrates programmable
analog and programmable digital blocks to enable sensor-based designs
for IoT products.
5
Power/
Ground
2
EZ-BLE™ PSoC® Module
32.768kHz Crystal
23
PSoC®4 BLE
XRES
LPCOM/OPAMP
SPI/I2C/
UART/
CapSense®/
ADC/
PWM/GPIO
Trace
Antenna
24MHz Crystal
VREF
Energy Harvesting PMIC and EZ-BLE Target Tiny Battery-Free IoT Devices
Cypress’s S6AE101A/102A/103A Power Management ICs (PMICs) for
energy harvesting are the industry’s lowest power devices, enabling
the use of very small solar cells for battery-free BLE IoT devices such
as wireless sensor nodes.
Primary Battery
(Optional)
Energy Harvesting PMIC
Power Gating
Switch
Multiplexer
System
Load2
Storage
Control
Series
Solar Cell
The devices require a very small quiescent current of 250nA and startup
power of 1.2μW, and integrate system level features such as an LDO,
comparator and auxiliary battery support. As a result, a light powered BLE
Beacon or wireless sensor node can have a footprint as small as 1cm2.
System
Load1
SW_CONT/
COMPOUT
Over-Voltage
Portection
VIN_LDO
Control Block
ENA_COMP
ENA_LDO
STBY_LDO
Timer for
Power Gating
Switch Control
INT
VOUT_LDO
LDO
Vref
Cypress’s S6SAE101A00SA1002 Solar Powered IoT Device Kit includes an
S6AE101A energy harvesting PMIC and an EZ-BLE PRoC Module. It offers
everything needed (including design example firmware) to develop a
light-powered BLE IoT device.
COMPP
COMPM
Comparator
CIN0
CIN1
CIN2
Comparing IoT Memory Types
In IoT applications, Flash and EEPROMs are the prevalent memories
used for data storage, mainly attributed to the low cost per megabit
and larger densities available. However, floating gate technologies
have a drawback in terms of energy consumption when writing
frequently – it drains batteries faster.
Serial Nonvolatile Memory Technology Comparison:
Features
Operating voltage
SPI speed
Cypress 2Mb
F-RAM
2Mb EEPROM
2Mb NOR Flash
4Mb MRAM
2.0V to 3.6V
1.8V to 5.5V
2.7V to 3.6V
3.0V to 3.6V
40MHz
5MHz
75MHz
50MHz
10,611,178
6606
11
5000
10
Unlimited
Many developers partition Flash (which is by far the cheapest memory per
bit) or use an EEPROM that consumes less energy (i.e., write infrequently to
Flash and use EEPROM as a front-end for heavy writes). EEPROM standby
and active modes consume lower currents than Flash.
Energy (µJ)/1-byte
write
314
63996
Bandwidth (KB/s)
5000
25
Write endurance
(Cycles)
10
1.2 x 10
The ideal play for write intensive applications is an external serial interface
F-RAM (which has addressing capability), high speeds (40MHz SPI) and low
active energy consumption (typically less than 100uA/MHz) and is available
in up to 4Mb densities.
Lifetime at 5ms
write frequency
15,855 years
100 minutes
8.3 minutes
Unlimited
No. of writes
with 3V,
220mAh battery
7,552,985
37,127
2,239
359,666
Nonvolatile
retention
100 years
100 years
20 years
20 years
Active write
current
3mA at 40MHz
3mA at 5MHz
15mA at 75MHz
46.5mA at 50MHz
To buy products or download data, go to
www.FutureElectronics.com/FTM
14
6
5
Write energy in µJ consumed by different memory types
8
1.800.FUTURE.1 • www.FutureElectronics.com
For more information or to buy products, go to www.FutureElectronics.com/FTM
APPLICATION SPOTLIGHT
APPLICATION SPOTLIGHT
MS5525DSO: Save Space with Fully Calibrated Pressure
and Temperature Sensor in a Small Package
High Performance Sub-1 GHz Radio Devices
core with 64kB Flash, 8.25kB RAM, and sleep
current consumption of 500nA to 1500nA.
ON Semiconductor’s Sub-1 GHz product family
provides an easy entry to high performance
wireless connectivity for the Internet of
Things (IoT).
ON Semiconductor Sub-1 GHz RF products are
designed to provide maximum performance and
minimum power consumption for every major
wireless sub-1 GHz standard. These solutions
combine high performance RF and baseband
components, ultra low power microcontroller
technology and support for high performance
firmware stacks on one chip.
The AX5043 radio transceiver is the leading
sub-1 GHz transceiver for data rates ranging
from 0.1kbps to 125kbps, covering Sigfox,
KNX, Wireless M-Bus, and EnOcean standards.
Also available is the AX5051 radio transceiver,
supporting the high data rates required for
802.15.4, ZigBee, and 6LowPAN.
The AX8052F1xx family combines the superb
performance of ON Semiconductor wireless
transceivers and an ultra low power microcontroller
ON Semiconductor high performance radio
products are a driving force behind the IoT
infrastructure, enabling users quick and easy
access to Sigfox, POCSAG, and FLEX networks.
The ready-to-use devices AX-SFEU, AX-SFUS,
AX-WMEU, and AX-EOEU are pre-programmed
for the chosen standard and come with an AT
user interface.
To simplify the entry into wireless solutions,
ON Semiconductor provides modules and a
comprehensive suite of development kits with
supporting application generator software.
FEATURES
•27MHz to 1050MHz carrier frequency range
•6.5mA to 11mA receive current
•ASK, FSK, PSK, AM, FM, AFSK, MSK, OQPSK
modulations supported
•Shaping for all modulation (GFSK, GMSK,
shaped ASK and PSK)
•RF transceiver, RF MCU, RF modules
To buy products or download data, go to
www.FutureElectronics.com/FTM
The MEAS MS5525DSO from TE Connectivity (TE) is a new generation
of digital small outline pressure sensors with SPI and I2C bus
interface designed for high volume OEM users.
APPLICATIONS
•Sigfox, POCSAG, FLEX IoT applications
•EnOcean, Wireless KNX, Wireless M-Bus
•ZigBee, 6LowPAN system (with AX5051)
•Automatic meter reading
•Home building automation, IoT and security
TOOLS
•AXRadioLAB application generator
•AXcode Blocks IDE
•DVK-BASE-2-GEVK development kit
•F143-MINI-GEVK development kit
•AX-SIGFOX-GEVK development kit
Temperature and Relative Humidity Modules
HM1500LF: Relative Humidity Module
Based on the rugged HS1101LF capacitive
humidity sensor, TE Connectivity’s (TE)
HM1500LF is a dedicated humidity transducer
designed for OEM applications where a reliable
and accurate measurement is needed. Direct
interface with a microcontroller is made
possible with the module’s linear voltage output.
HM1500LF SPECIFICATIONS
•Small size product
•Product free from Lead, Cr(6+), Cd and Hg
•Humidity calibrated within ±2% @55% RH
•Typical 1Vdc to 3.6Vdc output for
0 to 100% RH at 5Vdc supply
•Ratiometric to voltage supply from
4.75Vdc to 5Vdc
•Patented solid polymer structure
HM1500LF
10
HTM2500LF SPECIFICATIONS
•Hermetic housing
•Humidity calibrated within ±2% @55% RH
•Temperature measurement through
NTC 10kΩ ±1% direct output
•Small size product
•Typical 1Vdc to 4Vdc output for
0 to 100%RH at 5Vdc
This new sensor module generation is based on leading MEMS technology
and latest benefits from TE's proven experience and know-how in high
volume manufacturing of pressure modules, which have been widely used
for over a decade.
The rugged engineered thermoplastic transducer is available in single and
dual port configurations, and can measure absolute, gauge, compound,
and differential pressure from 1psi to 30psi.
FEATURES
•Integrated digital pressure sensor (24-bit ΔΣ ADC)
•Fast conversion down to 1ms
•Low power, 1μA (stand-by <0.15μA)
•Supply voltage: 1.8V to 3.6V
•Pressure range: 1psi to 30psi
•I2C and SPI interface
•Small outline IC package
•Barbed pressure ports
APPLICATIONS
•CPAP
•Ventilators and pneumatic control
•Altitude and airspeed measurements
•Gas flow sensing and valve control systems
•HVAC monitoring and leak detection
BLE Wireless Sensor Tag Demo V1.1
HTM2500LF: Temperature and
Relative Humidity Module
Based on the rugged HTS2035SMD humidity/
temperature sensor, TE's HTM2500LF is a
dedicated humidity and temperature transducer
designed for OEM applications where a reliable
and accurate measurement is needed. Direct
interface with a microcontroller is made
possible with the module’s humidity linear
voltage output.
The sensor module includes a pressure sensor and an ultra low power
24-bit ΔΣ ADC with internal factory calibrated coefficients. It provides
a 24-bit digital pressure and temperature value and different operation
modes that allow the user to optimize for conversion speed and current
consumption. The MS5525DSO can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of
programming internal registers in the device.
HM2500LF
FEATURES
•Full interchangeability
•High reliability and long term stability
•Not affected by water immersion
•Suitable for 3Vdc to 10Vdc supply voltage
•Ratiometric to voltage supply (HTM2500LF
only)
APPLICATIONS
•Industrial (HM1500LF and HTM2500LF)
•Process control (HM1500LF and HTM2500LF)
•Hygrostat (HTM2500LF only)
•Data logger (HTM2500LF only)
To buy products or download data, go to
www.FutureElectronics.com/FTM
The Sensor Tag Demo V1.1 reports humidity, temperature and
barometric pressure through a wireless Bluetooth 4.0 smart link. It is
based on TE's MEAS low power digital component sensors HTU21D(F)
for RH/T (datasheet HPC199) and MEAS ultra compact micro altimeter
MS5637 (datasheet DA5637-02BA03).
Android application is available for free download from the Google Play
Store and will turn your smartphone or tab to a display and datalog
terminal. Refer to the WPC001 for installation guidelines and user manual.
An optional USB dongle is available to connect the Sensor tag to your personal
laptop. Refer to the WPC002 for Windows application installation.
The tag has been design for an expected lifetime of 3 months on a
standard CR2032 cell battery at the fastest acquisition rate of one point
per second.
FEATURES
•Bluetooth low energy tag
•Humidity (0% to 100% RH)
•Temperature (-20ºC to +85ºC)
•Pressure (300 to 1200mBar)
•Android and Windows PC compatible
APPLICATIONS
•HVAC
•Weather stations
•Datalogging
•Altimeters
•Smartphones and tab accessories
WPP100B001: BLE Sensor Tag Demo with free Android application from
Google Play Store
WPP109B001: BLE Sensor Tag Demo plus USB dongle key for Windows
PC application
To buy products or download data, go to
www.FutureElectronics.com/FTM
TE Connectivity, TE and TE connectivity (logo) are trademarks.
1.800.FUTURE.1 • www.FutureElectronics.com
MEAS, TE Connectivity, TE and TE connectivity (logo) are trademarks.
1.800.FUTURE.1 • www.FutureElectronics.com
11
APPLICATION SPOTLIGHT
SHT3x Series Digital and Analog Humidity and
Temperature Sensors
The versatile SHT3x series consists of a group
of humidity and temperature sensors with
multiple accuracy levels and features. The
3x series delivers impressive performance
and is the ideal solution for a wide range of
demanding sensing applications.
TOUCHING THE HUMAN BODY
FEATURES
•Size: 2.5 x 2.5 x 0.9mm
•Output: I²C, voltage out
•Supply voltage range: 2.4V to 5.5V
•Energy consumption: 4.8µW
•RH operating range: 0% to 100% RH
•Temperature operating range: -40°C to +125°C
(-40°F to +257°F)
•RH response time: 8 sec (tau63%)
•Programmable alert function
SHT3x includes a user programmable alert
function, where the sensor can be used as a
humidity and temperature guard. Additionally,
Sensirion’s latest innovation contains their world
premiere, analog ratiometric voltage output. The
SHT3x series combines multiple functions and
various interfaces (I2C, voltage out) with
a user-friendly, wide operating voltage range
(2.4V to 5.5V). In addition, the technology
enables a small footprint of 2.5 x 2.5mm with
a height of 0.9mm.
The SHT3x Series of Humidity
and Temperature Sensors
•SHT30 - low cost version, ± 3% RH accuracy
•SHT31 - standard version, ±2% RH accuracy
•SHT35 - available Q2 2016
APPLICATIONS
The STS3x Series of Temperature Sensors
•STS3x - available Q2 2016
•Appliance
•Automotive
•Building technology
•Consumer electronics
•Internet of Things (IoT)/wearables
•Medical
•Industrial automation
Like all sensors from Sensirion, the SHT3x is
based on the unique CMOSens® Technology,
iCE40 UltraLite
VISHAY and the
INTERNET of THINGS (IoT)
which allows a high production volume at an
exceptional price/performance ratio. Sensirion
has once again launched one of the smallest
and most versatile humidity sensors for multiple
market applications.
To buy products or download data, go to
www.FutureElectronics.com/FTM
Vishay has stepped up to the challenges of the Internet of Things (IoT) with
a broad portfolio of unique passive and active solutions. These best-in-class
components are optimally suited for the “Things” being controlled and monitored
through IoT applications.
MSS2P2 – RECTIFIER
298D, 298W – CAPACITORS
Si8817DB – MOSFET
High-Power-Density Schottky
Rectifier in Low-Profile MicroSMP
Package
Solid Tantalum Chip Capacitors
in Small Case Sizes for SpaceConstrained Designs
Lower Conduction Losses for
Reduced Power Consumption
and Longer Battery Life
Low forward voltage drop, low power
losses in space-saving package (2.5
mm x 1.3 mm footprint, 0.65 mm height)
Industry’s highest capacitance density,
small sizes including 0603 and 0402
footprints, and no piezoelectric noise
P-channel MOSFET with low RDS(on) of
76 mΩ at 4.5 V gate drive in smallest
0.8 mm x 0.8 mm x 0.4 mm chipscale
package
VCNL4020 – SENSOR
MCS0402 – RESISTOR
VBUS05B1-SD0 – DIODE
Minimize Accidental Touch Input
to Reduce Call Drops and
Unintended App Launches
Professional and Precision Chip
Resistors with Excellent Stability
Low-Capacitance (Down to
0.29 pF Typical) BiSy Single-Line
ESD Protection Diode in CLP0603
Package
Fully integrated sensor with I2C
interface,16-bit resolution, and
proximity range of up to 20 cm with
programmable thresholds
The 0402 case size offers resistance
down to 10 Ω and 100 Ω, (professional
and precision respectively) for all TCR /
tolerance combinations
ESD protection diode in CLP0603
package saves board space in portable
electronics (0.6 mm x 0.3 mm footprint,
0.27 mm height)
TM
The Best Solution For IoT Devices
Lowest Power, Most Capable, Tiny Footprint
0.45mm thick
TM
1.44mm
iCE40
UltraLite
1.44mm
More IP than the
competition
Less power
consumption than our
previous family
Less power needed
with more LUT density
than the competition
Smaller package size
than the competition
Low Power Functions
GLUE LOGIC
ALWAYS-ON
BRIDGING
GPIO Expansion &
Aggregation
Sensor Interface
RFEE
Signal Detect &
Validate
Pre-process/Filter
I C/SPI
Level Shifting
PWM Generation
SDIO
2
and more...
For more information or to buy products, go to: www.FutureElectronics.com/FTM
For more information or to buy products, go to www.FutureElectronics.com/FTM
COMPONENT FOCUS
INDUSTRY LEADING GAS SENSORS AND SOLUTIONS
NXP’s NFC Smart Connected Home
Technology Overview
Benefits of CCS8xx Sensor Product Family
Cambridge CMOS Sensors (CCS) Metal Oxide (MOX) gas sensors are developed
using unique technology platforms enabling sensor miniaturization, low power
consumption and ultra-fast response times for a wide range of applications.
CCS miniature gas sensors use a unique silicon platform with advanced sensing
materials, with:
CCS gas sensor platforms incorporate a proprietary micro hotplate architected
into a highly reliable thermally isolating structure. When combined with CCS
advanced MOX materials, provide a family of ultra-small MOX gas sensors. To
maximize the MOX gas sensitivity the material is heated to a stable elevated
temperature. The internal heating element brings the MOX material to
temperature (150°C to 450°C) within milliseconds. The sensitivity of the MOX
material at these temperatures combined with advanced algorithms give an
indication of the gas concentration present.
■
Highly sensitive and ultra-fast response times
■
Reliable and stable gas detection
■
Ultra-low power consumption for portable handheld devices
Advanced algorithms support the CCS8xx family of MOX gas sensors for easy
and timely integration into a wide range of applications.
The following table indicates the key product parameters for our CCS8xx family of ultra-low power gas sensors.
1
2
3
Product
Description
Average Power
Consumption1
Package
CCS801
Indoor Air Quality (IAQ) monitoring
<1mW1
2 x 3mm DFN
CCS811
Indoor Air Quality (IAQ) monitoring
<1.2mW1
2.7 x 4mm LGA
CCS8023
Carbon monoxide detection
<1mW1
2 x 3mm DFN
CCS803
Ethanol detection
<10mW2
2 x 3mm DFN
Based on a sensor measurement duty cycle of 2.5%
Based on a 20s warm-up period and a 10s measurement window performed once in a 2 min period for Alcohol breath analysis
CO selectivity requires carbon filter
Our expecations and need to be connected is augmented every day,
especially in our homes. Our entertainment systems, lights, thermostats, and even appliances are being connected to the internet.
The Internet of Things (IoT), which is the term used to define to the network of
connected devices, enhances our experience and simplifies the management
of our home environment. NFC can be used to make smarter applicances,
for example, tapping a frozen dinner and having the microwave adjust for
the ideal settings for best results. NFC can also be used to extend displays.
Where space or cost concerns may limit your display, NFC can essentially
‘add’ a display by way of a smartphone or a tablet.
Why NFC for the Connected Home?
For more information or to buy products, go to
www.FutureElectronics.com/FTM
NFC is important for many reasons:
•Simplicity: Connecting devices to the home network by just a simple
tap, no complicated passwords or product codes.
•Security: Where some wireless technologies have to travel a long range,
essentially a ‘shout’, NFC is a whisper, using proximity of under 10cm.
Eavesdropping is nearly impossible. NFC speaks with intention.
•Power Savings: Peer to peer mode can be passive with only one device
active and drawing power. Working in passive mode results in a reduced
power consumption.
Why NXP NFC?
10 years ago, NXP co-invented NFC technology and co-founded the NFC
Forum, the standards based organization that includes more than 170
member companies. NXP is the NFC market leader, and has shipped
hundreds of millions of units, accounting for more than 80% of all NFC
enabled point of sale (POS) terminals and more than 90% of all NFC
enabled smartphones. NXP has the most extensive NFC portfolio and is
the most trusted name in NFC technology.
MCP9600: Fully Integrated
Thermocouple EMF to °C Converter
The NTAG21xF features best in class RF performance, a large range
of memory sizes, as well as field detection and SLEEP mode in a small
footprint. This makes it particularly well suited for smart media and mass
market applications
NXP NFC Featured Products
PRH601/PR601HL: High performance NFC integrated reader solution
CLRC66302HN: High performance NFC reader solution
NTAG213F/216F: NFC Forum Type 2 Tag compliant IC with 144/504/888
bytes user memory
Buy Options
For more information about NXP’s complete NFC products and detailed
specs, please refer to www.nxp.com/nfc or download the NXP Semiconductors
app at https://play.google.com/store/apps/details?id=com.nxp.android.
app&hl=en.
NXP Readers/NXP NTAG
NXP’s deep portfolio of NFC products includes NFC frontend, controllers
and connected tags.
NXP provides highly integrated RFID reader modules which combine the
functionality of discrete ICs while simplifying development. The PRH601
and PR601 implement an LPC1227 Cortex M0, and a CLRC663 contactless
reader IC while the PRH601 adds the HTRC110 HITAG Reader IC. Both
modules comply with ISO/IEC14443A&B, ISO/IEC15693 and FeliCa and
are available in LQFP100 package.
Microchip Technology offers an extensive portfolio of thermal management solutions that cover
a wide variety of markets and applications. The MCP9600 is a fully integrated thermocouple TC
EMF-to-temperature converter which supports eight thermocouple types (K, J, T, N, S, E, B and R). The
miniature 5 x 5 mm packaging makes the MCP9600 well suited for many types of portable and handheld
equipment, while the high integration simplifies design and reduces time to market.
Precision instrumentation
Precision temperature sensor
• Precision, high-resolution Analog-to-Digital Converter (ADC)
• Math engine with firmware to support type K, J, T, N, S, E, B and R thermocouples
•
•
MCP9600 Thermocouple EMF to °C
Converter (ADM00665)
NXP’s NTAG family fully complies to NFC Form Tag specs, ensuring
universal interoperability with NFC devices. Additionally NXP NTAG is
based on ISO 14443A standard, allowing easy integration into existing
infrastructures using MIFARE and SmartMX. NXP NTAG I2C offers contact
and contactless interfaces. The IC communicates quickly and easily with a
microcontroller and memory. The NTAG I2C also can supply power to external
devices such as the micro via embedded energy harvesting circuitry.
To buy products or download data, go to
www.FutureElectronics.com/FTM
For more information or to buy products, go to www.FutureElectronics.com/FTM
www.microchip.com/mcp9600
The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks are the property of their registered owners. © 2015
Microchip Technology Inc. All rights reserved. 9/15
DS20005443A
1.800.FUTURE.1 • www.FutureElectronics.com
15
COMPONENT FOCUS
COMPONENT FOCUS
Level VI-Compliant AC-DC Power Supplies Suitable for Global Use
conform to these new performance standards by
February 10, 2016.
CUI Inc has announced a family of Level
VI-compliant external AC-DC power supplies
which feature interchangeable AC input
blades for use in mains outlets worldwide.
The wall plug-in SMI5-USB, SMI6, SMI18, SMI24
and SMI36 include AC blade options for North
America, Europe, the UK, Australia and China,
and support loads ranging between 5W and
36W. The power supplies all meet the stringent
requirements of the US Department of Energy’s
new Level VI standards, which are intended to
lower the amount of power consumed when the
end application is not in use or is no longer connected to the system.
FEATURES
The 5W, 6W, 18W, 24W and 36W multi-blade
adapters feature a wide universal input-voltage
range of 90V to 264V AC and are available in
single output voltages from 5V to 48V DC. All
models meet the Level VI standard’s no-load
power consumption limit of <0.1W.
The SMI5-USB comes with an integrated USB
connector and offers UL/cUL, GS and RCM safety
approvals, while the SMI6 series also includes
CCC and PSE safety approvals. The SMI18 and
SMI24 series both offer UL/cUL, GS and PSE
safety approvals, while the SMI36 series also has
a CCC safety approval. All models conform to the
FCC Part 15 Class B standards for EMI/EMC, and
bear the CE mark.
Any manufacturer wishing to market an end
product with an external adapter in the US must
To buy products or download data, go to
www.FutureElectronics.com/FTM
The power to
Safeguard sensitive devices with 30kV
contact/air ESD withstand rating while
maintaining signal integrity for data rates
up to 5.0GHz.
FEATURES
•±5% load regulation
•100MΩ isolation resistance at 500V DC
•Operating temperature range: 0°C to +40°C
•Over-voltage protection
•Overcurrent protection
•Short-circuit protection
APPLICATIONS
•Consumer products
•Industrial equipment
•Mobile devices
.
HEAL
DELIVER
CONNECT
BUILD
The Power of Things
XTREME-GUARD™ ESD Suppressors
Reduce Power Consumption and Ensure Data Integrity
TM
Technology is transforming the world around us at a rapid pace. While you are designing the products that will save lives and bring global
communities together, we are developing the power systems to support your most demanding applications. Our power expertise and collaborative
approach are in place to support you while you shape the future of technology.
For more information or to buy products, go to
www.FutureElectronics.com/FTM
The XGD Series XTREME-GUARD ESD
Suppressor, available in 0402- and 0603-sized,
flat-topped surface mount packages, protects
sensitive electronics against electrostatic
discharges as high as 30kV and is suitable for
high voltage applications up to 32VDC . When
correctly integrated into a circuit design, the XGD
Series can safely absorb repetitive ESD strikes
nearly four times the maximum level specified in
the IEC61000-4-2 international standard without
performance degradation. Even after multiple
ESD strikes, it exhibits ultra-low leakage current
(<1nA), ensuring minimal power losses, so it’s
well-suited for protecting battery-powered
electronics like wearables.
•High ESD withstand rating: 30kV contact/air
discharge
•High voltage rating: 24VDC for XGD10402,
32VDC for XGD10603
•Low (<1nA) leakage current
•Ultra-low capacitance: 0.04pF for XGD10402,
0.09pF for XGD10603
•Flat top, surface mount form factor
BENEFITS
•Greater level of ESD protection and design
flexibility for enclosure, button and
touchscreen
•Wider voltage range for a broader variety
of electronic devices
•Lower power consumption, ideal for batterypowered devices, such as wearable devices and
energy-efficient devices
•Ideal for high frequency and high speed data,
video, antenna and I/O circuits
•Facilitates pick-and-place assembly and
enables more compact circuit board designs
To buy products or download data, go to
www.FutureElectronics.com/FTM
Precision Chip Resistors with the Highest Power Rating
The latest spin off from Susumu’s RG series,
best performing and most reliable thin film
chip resistors in the market, is the PRG series
with a power rating almost 5 times as high as
the RG series.
Size and Power
The PRG series, long side terminal products, are
currently offered in 3 sizes: 1206 size is rated
at 1W, 2010 size is rated at 2W and 2512 size is
rated at 3W. These power ratings are about 4 to
8 times higher than typical chip resistors with
the same size. For example, most 1206 resistors
are rated 0.125W or at most 0.25W. Normally, it
takes 2512 size to offer 1W.
Electrical Characteristics and Reliability
Because the PRG series is an offspring of the RG
series, the PRG series maintains all the thin film
characteristics of the RG series such as precise
absolute tolerance (±0.1% ), small temperature
coefficient of resistance (25ppm/°C), low noise,
and wide range of operating temperature
(-55°C to +155°C). Likewise, reliability of the
PRG series is just as good as the RG series.
The maximum drift for most standard reliability
tests such as short time overload, load life, temperature humidity bias, thermal shock, and high
temperature exposure is specified as 0.05% to 0.1%.
For applications that require extreme precision
and reliability such as precision industrial and
medical instrumentation, test and measuring
instrumentation, optical and telecommunication,
automotive electronics, laboratory grade scales,
power supplies, and power grid infrastructure,
now you have a choice among Susumu’s three
Type
Size
(in inches)
Power Rating
Resistance
Tolerance
±0.1%(B)
PRG3216
1206
1.0W
±0.5%(D)
±0.1%(B)
PRG5025
2010
1.5W~2.0W
±0.5%(D)
±0.1%(B)
PRG6432
1.800.FUTURE.1 • www.FutureElectronics.com
2512
2.0W~3.0W
±0.5%(D)
highly precise and highly reliable RG series family
products: the original RG series for general purpose,
the URG series where ultra reliability is required,
and the PRG series for applications of extreme
high power requirements. The RG, URG and PRG
series are all RoHS compliant and 100% lead-free.
To buy products or download data, go to
www.FutureElectronics.com/FTM
TCR
±25ppm/°C(P)
±25ppm/°C(Q)
±25ppm/°C(P)
±25ppm/°C(Q)
±25ppm/°C(P)
±25ppm/°C(Q)
±25ppm/°C(P)
±25ppm/°C(Q)
±25ppm/°C(P)
±25ppm/°C(Q)
±25ppm/°C(P)
±25ppm/°C(Q)
Resistance Range (Ω)
+E24 and E56 Series R Value
47-100k
10-100k
2.5-100k
Packaging
Tape and Reel
T5=5000pcs
47-200k
10-200k
2.5-200k
47-250k
Tape and Reel
T4=4000pcs
10-250k
2.5-250k
17
COMPONENT FOCUS
Making LED Lighting Solutions Simple™
E-Switch´s Large Selection of Tact Switches with Multiple Options
E-Switch offers a wide variety of tact
switches with many different options from
ultra miniature in size with dual LED
illumination, to sealed tact switches with
IP67 ratings.
Applications for tact switches are numerous,
including: medical devices, consumer electronics,
handheld electronics, audio/visual, test equipment,
instrumentation, telecommunication equipment,
computer peripherals, wearable technology, and
much much more!
The TL6100 series is processed sealed and can
withstand typical water washing. It also offers a
long operating life of up to 1 million cycles and
multiple actuator heights.
•Multiple operating forces of 130gf, 160gf,
300gf, 500gf
•Gold or silver contact option
•Multiple actuator lengths
•Operating temperature: -40°C to +85°C
The brand new TL3750 series ultra miniature tact
switch offers many features and has a 300,000
cycle life expectancy.
•Ultra miniature – 2.0 x 3.0mm
•Surface mount termination
•Very low profile – 0.58mm
•Operating temperature: -30°C to +85°C
•Electrical life/mechanical life: 300,000 cycles
The TL3301 series is designed for SMT
applications. Each model has different features
ranging from low profile designs, to many
actuator sizes and operating forces.
•SMT design – 6 x 6mm
•Compatible with lead-free soldering
•Life expectancy: 100,000 cycles typical
•Operating temperature: -20°C to +70°C
•Dielectric strength: 250VAC
The TL6215 series illuminated sealed tact switch
offers multiple color LED and cap options. It
also offers a choice in right angle or vertical thru
hole mount.
•Illumination options
•Right angle or vertical thru hole mount
•IP67 ratings
•Multiple cap options
•Operating temperature: -20°C to +70°C
We Accelerate
Time to Revenue
by Providing
To buy products or download data, go to
www.FutureElectronics.com/FTM
Industry Standard Cable Assemblies
CA-USB-AM-CM-XFT
USB 2.0 CABLE,
A MALE TO TYPE C MALE
Adam Tech standard cable
assemblies provide system designers
a comprehensive assortment of
cable solutions for both power and
signal applications in the telecom,
datacom, industrial, healthcare and
consumer industries. Our product
offering includes USB, HDMI,
D-Sub, VGA, DVI, DisplayPort, Power
Cords & CAT 5e, CAT 6, CAT 6a,
CAT 7 and CAT 7a.
For more information or to buy products,
go to www.FutureElectronics.com/FTM
CA-USB3-AM-BM-XFT
USB 3.0 CABLE, A MALE TO B MALE
CA-USB3-AM-AF-XFT
USB 3.0 CABLE, A MALE TO A FEMALE
CA-USB-AM-BM-XFT
USB 2.0 CABLE, A MALE TO B MALE
The Most Comprehensive System-Level Product Portfolio
u Solid-State Lighting Expertise
u Design Support Services
u Global Supply Chain and Business Solutions
u
CA-USB-AM-AF-XFT
USB 2.0 CABLE, A MALE TO A FEMALE
NPC-5E-XXX-XX
CAT 5E RJ45 8P8C TO RJ45 8P8C
NO BOOT
CA-MINIDP-HDMIF-XFT
MINI DISPLAY PORT
MALE TO HDMI FEMALE
CA-USB-AM-AM-XFT
USB 2.0 CABLE, A MALE TO A MALE
CA-VGA-M-M-XFT
VGA CABLE, HD15 MALE TO HD15 MALE
NPC-5E-XXX-XX-BB
CAT 5E RJ45 8P8C TO RJ45 8P8C
BUBBLE BOOT
NPC-6-XXX-XX-BB
CAT 6 RJ45 8P8C TO RJ45 8P8C
BUBBLE BOOT
CA-MINIDP-DVIM-XFT
MINI DISPLAY PORT
MALE TO DVI MALE
CA-MINIDP-VGAF-XFT
MINI DISPLAY PORT
MALE TO VGA FEMALE
PC-0102060AC03/PC-0102076AC03
NORTH AMERICAN POWER CORD
NEMA -15P TO IEC C13.18/3SVT
NPC-6-XXX-XX
CAT 6 RJ45 8P8C TO RJ45 8P8C
NO BOOT
CA-HDMI-AM-AM-XFT
HDMI 1.4 HDMI 19P A PLUG
HDMI 19P A PLUG
www.FutureLightingSolutions.com
ANALOG CORNER
ANALOG CORNER
Drivers
Power Regulation, Conversion and Management
BCR420U/421U: Adjustable Current
Regulators Simplify the Driving of
LED Strips
®
The BCR420U/BCR421U monolithically integrates a
transistor, diodes and resistors to function as a Constant
Current Regulator (CCR) for linear LED driving. The
device regulates with a preset 10mA nominal that can
be adjusted with external resistor up to 350mA. It is
designed for driving LEDs in strings and will reduce
current at increasing temperatures to self-protect.
Operating as a series linear CCR for LED string current
control, it can be used in multiple applications, as long
as the maximum supply voltage to the device is <40V.
FEATURES
2EDN7524: Dual-Channel 5A, High Speed,
Low Side Gate Driver
• 10mA ±10% constant preset output current
• Up to 350mA adjustable current with an external
resistor
• Negative temperature coefficient (NTC)
• Parallel devices to increase regulated current
• Up to 40V (BCR420) supply voltage
• Up to 1W power dissipation in SOT26 (SC-74)
• -55°C to +150°C operating junction temperature
range
• AEC-Q101 qualified
2EDN7524 is a fast dual-channel 5A gate driver optimized
for driving both Standard and Super-junction MOSFETs,
as well as GaN power switching devices. The input
signals are low voltage TTL and 3.3V CMOS-compatible
with a very broad voltage handling capability of up to
+20V and down to -10VDC . The unique ability to handle
-10VDC at the input pins protects the device against
ground bouncing. Each of the two outputs is able to sink
and source a 5A current utilizing a true rail-to-rail output
stage, which ensures very low impedances of 0.7Ω up
to the positive and 0.55Ω down to the negative rail
respectively.
Interface
XR33202: Lowest Power RS-485 Transceiver
with 1.65V to 5.5V I/O Interface
The XR33202 is a high performance TIA-485/TIA-422
transceiver designed to meet the increasing system
requirements found in today’s portable/handheld,
process control and industrial equipment. The device
operates at a maximum data rate of 20Mbps and
features a 1.65V to 5.5V I/O logic supply, simplifying
multi-voltage system interfacing requirements. The
receiver includes full fail-safe circuitry, guaranteeing a
logic high receiver output when the receiver inputs are
open, shorted or undriven. The XR33202 receiver input
impedance is at least 96kΩ (1/8 unit load), allowing
more than 256 devices on the bus.
The AS1383 is a synchronous, high efficiency DC-DC
boost converter running at a constant frequency of
3.5MHz. This very high oscillator frequency allows the
usage of a low profile inductor with only 1μH. This
results in a very small board space requirement for the
complete solutions including all external components,
making it ideal for use in space-constrained products
such as wristbands. AS1383 features a power save mode
for light loads and it provides high efficiency across
wide load range.
AL1696: Cost-Effective Dimmable LED
Driver With Wide Triac Compatibility
The AL1696 is a highly integrated high power factor constant current converter for mains dimmable LED driver
applications. The AL1696 is based on buck or buck-boost
topology and operating in boundary conduction mode
(BCM) to ease in EMI/EMC qualification and testing to
meet the latest regulatory standards. The design only
requires a single winding inductor and achieves a tight
current sense tolerance of ±3%. The device features a
low operating current of 120μA, with a 150μA start-up
current, and is compatible with a wide range of leadingedge and trailing-edge dimmers, providing compliance
with the NEMA SSL6 dimming curve.
®
20
• 5A peak source/sink current
• <10ns propagation delay tolerance
• 19 ns (typ.) propagation delay
• Outputs robust against reverse current
• <1ns channel-to-channel miss match
• 5ns (typ.) rise/fall times
• 8V UVLO option
• -10V control and enable input robustness
• 2 independent channels
• Industry standard pin-out and packages
FEATURES
ISL8018: 8A Low Quiescent Current High
Efficiency Synchronous Buck Regulator
• 3.0V to 5.5V supply operation
• Enhanced receiver fail-safe protection
• Driver short circuit limit and thermal shutdown
for overload protection
• 3µA (max) stand-by current
• Hot swap glitch protection on DE and RE pins
• 1.65V to 5.5V I/O logic interface VL pin
• ±15kV ESD (IEC61000-4-2 air discharge)
• -40°C to +125°C ambient operating temperature
range
• Lead-free (RoHS 6) DFN package
• 1k MSRP: $1.60 US
Power Regulation, Conversion and Management
AS1383: 200mA, 3.5MHz DC-DC Step Up
Converter
FEATURES
FEATURES
• 2.7V to 5.5V input voltage range
• 2.7V to 5.0V fixed and adjustable output voltage
• Output disconnect during shutdown
• 3.5MHz fixed-frequency
• Anti-ringing control minimizes EMI
• Up to 92% power efficiency
• Automatic power save operation for light loads
• 25µA quiescent current
• 6-pin WL-CSP, 0.4mm pitch
• 1k MSRP: $0.25 US
The ISL8018 is a high efficiency, monolithic, synchronous
step down DC/DC converter that can deliver up to 8A
continuous output current from 2.7V to 5.5V input
supply. The output voltage is adjustable from 0.6V to VIN .
With an adjustable current limit, reverse current
protection, pre-bias start and over-temperature
protection, the ISL8018 offers a highly robust power
solution. It uses current control architecture to deliver
fast transient response and excellent loop stability.
Sensors
TDC-GP30-F01: Single-Chip Hardware and
Software Solution for Ultrasonic Water
Flow Metering
TDC-GP30-F01 is a complete ultrasonic flow metering
solution, including the flow calculation. It drastically
simplifies the design of ultrasonic heat and water meters
and is the necessary step for compact energy-saving
ultrasonic water meters. The ultra-low current
capabilities allow the use of standard 2/3 AA or AA
lithium thionyl chloride batteries at 6-8 Hz measuring
frequency even in the water meter version. The
TDC-GP30-F01 firmware does the linearization and
temperature compensation based on spool-piece
specific calibration data and completes the system-onchip approach.
FEATURES
• Up to 97% efficiency
• Adjustable current limit
• Internal soft start and internal/external
compensation
• 500kHz to 4MHz adjustable frequency
• Peak current limiting, hiccup mode short circuit
protection and over-temperature protection
• ±10% output voltage margining
• Start-up with pre-biased output
• Soft stop output discharge during disabled
• External synchronization up to 4MHz
• 1k MSRP: $1.60 US
FEATURES
• High performance + ultra-low power 32-bit CPU
• Transducers can be connected directly to GP30 with
no external components required
• Firmware adopts automatically to zero flow (2Hz) or
flow (8Hz) condition
• Error handling, bubble detection
• SPI, UART and pulse interface
• Advanced high-precision analog part
• Firmware for calculation of flow, volume and
temperature, including linearization and two-point
calibration
• -40°C to +125°C ambient temperature range
• QFN32, QFN40 packages
• 1k MSRP: $9.50 US
FEATURES
• Internal MOSFET up to 300V/3A, 500V/2A, 600V/2A
• 150µA start-up current
• 120µA operation current
• Under voltage lockout (UVLO)
• Cycle-by-cycle overcurrent protection (OCP)
• Over-temperature protection (OTP)
• ±3% current sense tolerance
• Single winding inductor
• Wide range of dimmer compatibility
• Leading-edge blanking (LEB)
• Output short protection (OSP)
• SO-7 package
MLX92292: Micro-Power Programmable
and ASIL B Capable Hall Effect Switch/Latch
The MLX92292 delivers switch and latch functions, but
unlike existing products on the market it can determine
the presence of magnetic fields that are lateral, not
just orthogonal, to the device. It supports ASIL B safety
integrity level (in accordance with ISO 26262), with an
array of built-in diagnostic mechanisms available. The
MLX92292 is available in pre-programmed units or endof-line (EoL) programmed device that is configured (via
its output pin) during the OEM production process, so
system optimization is fully realized.
To buy products or download data, go to
www.FutureElectronics.com/FTM
1.800.FUTURE.1 • www.FutureElectronics.com
1.800.FUTURE.1 • www.FutureElectronics.com
FEATURES
• Programmable permanent magnet temperature
coefficient
• Programmable output function – direct or inverted
• Programmable diagnostic period in fail safe state
• Unique identification number (ID) for device
traceability
• Under-voltage lockout
• Reverse supply voltage protection and thermal
protection
• Programmable switch or latch sensor function
• Programmable operating period
• Integrated self-diagnostic functions
• 40V load dump
• High ESD rating
• TSOT-3L and TO92-3L packages
21
TECHNICAL VIEW
TECHNICAL VIEW
How to Design a Wireless Lighting Network for High Performance,
High Reliability and Low BoM Cost
By: László Fisi, Field Applications Engineer, Future Electronics
LED light sources are highly efficient and
offer the potential to dramatically reduce
energy consumption and operating costs
compared to conventional incandescent
lamps. In fact, while the replacement of conventional lamps with LED lamps dramatically
reduces the amount of electricity that
a lighting installation uses, there is more
that lighting users and specifiers can do to
save energy.
One of the main advantages of LED lighting is
that it is very easy to control the light output of
LEDs linearly and instantly, from nearly 0% up
to maximum brightness. So in fact, the scope
for energy savings is even greater if an intelligent
control scheme is applied to a lighting installation.
For instance, LED street lights can be made to
react to the intensity of ambient light (sunlight
or moonlight), supplementing the natural light
to reach a desired lux value in the illuminated
area. Use of proximity sensing allows the lights
to be dimmed when no-one is in or near the
illuminated area.
Today’s LED drivers support various means
for adjusting the duty cycle of an LED lamp,
controlled either by a microcontroller’s PWM
signal, or a 0-10V DC or 1-10V DC output.
Wide-Area Control Network for Lighting
An intelligent dimming scheme, responsive to
ambient light, therefore helps to save even more
energy. But what is the right sensing and control
architecture for such an installation?
It would be possible to install completely
autonomous, unconnected lighting units, each
with its own ambient light sensor (photometer),
proximity sensor and control circuit. But this
architecture has two disadvantages:
•Every lighting unit carries the cost of the
sensing components
•Central monitoring, control and diagnostic
functions are not supported
It is, in fact, highly desirable to connect street
lights to a control network. Not only does this
enable the operator to detect instantly when
a lamp fails, so that it can be repaired quickly
to avoid prolonged downtime, it also allows
for central control of an entire lighting scheme.
For instance, a municipal authority might wish
to override the normal ambient/proximity light
sensor controls at special times, such as firework
displays, festivals or big cultural or sporting
events.
22
In the past, exterior lighting networks used a
dedicated network cable (such as an RS-485
link) for connectivity, but the cost of supplying
and installing additional signal cabling alongside
the power cabling makes this option unattractive.
This led to efforts to implement Power Line
Communications (PLC), in which data signals
are carried on the same copper cable as the
power. The reliability of such PLC systems,
however, has been called into question, because
communication is prone to failure or disruption
in the presence of noise and interference on the
power line.
By contrast, wireless RF communication eliminates
the cost and time involved in installing data
cabling, and with sophisticated channel-hopping
and other techniques is highly resistant to
interference.
The challenge in a street lighting network is to
implement RF communications successfully over
a wide area, in which the total distance from the
central control point to the farthest node could
be tens of kilometers. For reasons of cost, the RF
transmissions should be carried in license-free
ISM bandwidth. (Mobile telephone or cellular
networks offer guaranteed wide-area coverage,
but the cost of equipment and monthly data
plans effectively rules them out for cost-sensitive
lighting applications.)
But ISM-band radios typically have a maximum
point-to-point span of 2km. Wide-area coverage
therefore requires a communications protocol
that can support multi-path routing of data
packets, using intermediate nodes to forward
packets to nodes on the edge of the network,
while avoiding transmission failures caused by
collisions between packets.
A successful new street lighting installation,
supported by Future Electronics in Hungary,
provides a model for the use of ISM bandwidth
to connect hundreds of lighting units over a wide
area to a lighting control unit. In this installation,
photo-sensors were placed on a small number
of units, and their readings were used to control
the dimming of lighting units nearby (which
could be assumed to be exposed to similar levels
of ambient light).
Network Protocol Avoids Collisions
Each lighting unit contains a SPIRIT1 RF transceiver supplied by STMicroelectronics, which can
be configured to operate at various frequencies
below 1GHz. In boosted power mode (16dBm
maximum Transmit power), the SPIRIT1 is capable
of transmitting over a maximum range of 3km
in open space. This transmission range varies
depending on the bit rate chosen by the user and
on the user’s Transmit power configuration.
Figure 1 outlines the hardware design of each
street light node. As it shows, the power supply
Mains (PSU)
Mains (230V)
RF Antenna
3.3V
Constant Current
12V
0-10V
SMPS
11V Integrator
Tag,
Amplifier
3.3V
5V
Peripheries
B
C
A
B
C
Both the hidden node and exposed node
problems are eliminated by the application of
the MACAW protocol. A hidden node might
not receive the sender’s RTS frame, but it will
receive the receiver’s CTS frame, and then
remain silent to keep the channel between
sender and receiver clear.
D
Figure 2: How the hidden (top) and exposed node (bottom)
problems occur
One of the advantages of the SPIRIT1 transceiver
is that its packet structure supports the use of
advanced anti-collision network protocols which
eliminate the hidden node problem (see Figure 3).
PWM
Microcontroller
Spirit 1
LED
String
A
Local UART,
Analog in,
I2C Extender
SPI
Figure 1: Block diagram of a street lamp communicating via
the SPIRIT1 RF transceiver
is configured so as to provide a 0-10V DC or
1-10V DC analog signal controlled by a microcontroller’s PWM channel. This analog voltage
controls the dimming of the LED light source.
When implementing a multi-path RF network,
the communications protocol has to offer the
following features:
•Conflict resolution
•Support for packet repetition
•Route mapping and route optimization
•‘Island mode’ operation in case of
communication breakdown
•Error reporting
In particular, a solution had to be found for two
common problems found in multi-path wireless
networks: the hidden node problem and the
exposed node problem. (In this type of complex
network, packets are transmitted along a chain
of nodes, each node in turn passing the message
on to a neighboring node. Unlike a star network,
for instance, this topology has no central hub
or router controlling the timing and routing of
every transmission.)
In the case of a hidden node, A cannot see C;
both A and C might both attempt to transmit
to B at the same time, leading to a conflict
and a failed transmission. In the exposed node
problem, A requests permission to transmit a
message to B. When B clears A to send its message, C thinks that the channel is busy, and so
delays sending to D a message that it wishes to
transmit. In fact, the channel between D and C
is not busy (see Figure 2).
1.800.FUTURE.1 • www.FutureElectronics.com
preamble
credit
priority
source
destination
control
load
checksum
Figure 3: The structure of a SPIRIT1 packet
The preamble performs a synchronization function,
while the credit specifies the packet’s life so that
packets cannot circulate indefinitely. The priority
is indicated by the third block. The source
and destination blocks contain the source and
destination addresses. The control block contains the control byte packet descriptors.
The load contains the actual information to be
transmitted; and the checksum is what it says it is.
In fact, the SPIRIT1 can process in hardware
certain other packet structures, such as those
carried by Wireless Metering Bus (WM-Bus)
networks and ST’s own STack protocol. However,
both the WM-Bus and STack protocols have
1-byte address fields, limiting a network to a
maximum of 256 nodes. For a large-scale street
lighting network, a 2-byte address field
is required.
For this reason, the installation in Hungary
adopted the MACAW (Multiple Access with
Collision Avoidance for Wireless) protocol, which
is supported by the SPIRIT1 transceiver. A
MACAW transmission follows this process:
•The sender asks whether it can send a packet
to the receiver, by transmitting an RTS
(Request To Send) frame. This makes all nodes
around the sender remain silent temporarily in
order to avoid a collision.
•The RTS frame contains the address of the
receiver. The receiver gets it, and sends back a
CTS (Clear To Send) frame, which means that
the receiver is ready for the packet.
•The sender sends the data packet to the
receiver
•The receiver answers with an ACK or NACK
frame to acknowledge receipt or to tell the
sender that the frame has not been received.
In the case of an exposed node, it is possible
for A to send an RTS to B at the same time as
D sends an RTS to C, causing a collision (see
Figure 2). In this case, the MACAW protocol
ensures that B and C are both aware of the
collision. After an interval, the length of which
is determined by a random number generator,
the senders begin negotiating for access to the
channel again.
c
CR: 252
d
CR: 251
e
b
CR: 250
r
CR: 253
n
CR: 252
s
k
CR: 253
CR: 254
o
CR: 250
f
CR: 253
CR: 251 CR: 252
i
g
h
CR: 250
CR: 255
z
CR: 254
t
l
CR: 255
p
CR: 251
j
u
Y
Figure 4: The MACAW protocol’s routing provides for
efficient use of network capacity
Intelligent Routing for
Fast Data Transmission
The other important feature of a MACAW
network is its provision for intelligent routing.
All nodes are within range of one or more other
nodes. Whenever a new node joins the network,
it sends a discovery message to neighboring
nodes, which forward it on until it reaches the
network access point (in the case of this street
lighting application, a wireless gateway at the
lighting operator’s control center).
Each time the message is forwarded, the credit
score is reduced by one, and the value of the
received signal strength and routing data are
added to the packet (see Figure 4). The credit
score starts at 256, so theoretically a linear
end-to-end range of 256km could be achieved,
for instance, with a string of 256 nodes in which
each node is 1km away from its neighbor.
Multiple discovery packets then arrive at the access point. It selects the route to the new node
that has the best combination of features (such
as highest credit score, adequate signal strength
at all nodes). This path will be used in future for
all communications between the access point
and the new node.
1.800.FUTURE.1 • www.FutureElectronics.com
The network path management supported by
the MACAW protocol loads the network with
much less traffic, and transmission times can be
reliably kept down to a fraction of a second even
across networks with hundreds of nodes and an
edge-to-edge span of more than 100km. Should
a transmission path fail, the receiver node simply
sends a new discovery message in order to
configure a new route.
CR: 254
CR: 251
CR: 250
a
m
In practice, this intelligent routing scheme
results in better network performance than is
achieved in full-blown mesh networks, in which
all data packets are always transmitted to all
nodes. Mesh networks are commonly swamped
by traffic, leading to repeated collisions and
re-transmissions. In a complex mesh network, it
can take as long as 30 minutes for a packet to
travel from one edge of the network to another.
The protocol also provides a fail-safe mechanism: if communication fails permanently, the
microcontroller in the lighting unit switches to
‘island mode’. In this mode, it operates autonomously, switching the lamp on and off in real
time according to a pre-programmed pattern.
Central Control, Superior Energy Savings
The RF network implemented for the street
lighting installation in Hungary provides for realtime control and monitoring of every lighting
unit’s status, energy consumption and so on.
It also enables enhanced energy savings (and
therefore cost savings) by dimming the lamps in
response to inputs from ambient light sensors
or proximity sensors. Because of the network,
inputs from one sensor can be used to control
multiple lighting units.
The installation’s designers achieved a remarkable combination of high network performance
and low cost.
•The SPIRIT1 transceiver is a low-cost device
that uses license-free ISM bandwidth, but
that is extremely well supported with sofware
libraries, drivers and other development
resources provided by STMicroelectronics.
•By using RF technology, the installers avoided
the cost of installing network cabling.
•The MACAW protocol implemented in this
installation provides for quick and reliable
data transmission, giving the lighting system
operator instant visibility and control of every
lighting unit over a wide area, while avoiding
collisions.
To buy products or download data, go to
www.FutureElectronics.com/FTM
23
MAILROOM – PLEASE RECYCLE.
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to the purchasing department or fax this
back page to toll free number, 1-800-645-2953
ST Solutions for IoT Sensor Objects
STM32
Bluemicrosystem3:
SPWF01S for Wi-Fi sensor nodes and Wi-Fi hubs
• Bluemicrosystem3 is a platform based on the STM32
open development environment that lowers the barrier
for developers, allowing fast, affordable prototyping
with development continuity to final devices. It allows
the developers to address complete middleware for
applications with temperature and humidity sensors,
pressure and motion sensors, real-time motion sensor
data fusion, activity recognition, carry position, and free
fall detection, all with very low power Bluetooth low energy
(BlueNRG) connectivity.
• The SPWF01S is a “cloud compatible” Wi-Fi module
embedding all the FW e.g. TLS/SSL security, rest API, to easily
connect sensors and actuators to remote cloud services
• Available in a small form factor (26.92 x 15.24 x 2.35mm)
both with and without antenna
• Easy interface to host microcontroller through UART and
AT commands set
• System modes: MiniAP, IBSS and station
• Built-in application: sockets, web server, rest API
• Over the air firmware and external flash update
• Easy configuration (SSID, PWD) in MiniAP
• X-NUCLEO-IDW01M1 expansion board for full STM32 ODE
support
The SPWF01S represents the perfect solution
to get a sensor nodes network securely
connected to a cloud service provider,
allowing remote acces to the nodes.
The user experience is enhanched by:
• Bluetooth smart apps and SDKs available both for Android
and iOS
• NFC provisioning for the Bluetooth smart app
With an out of the box experience, the Bluemicrosystem3
Bluetooth Smart sensor node is the perfect solution for IoT
connected nodes.
For the full reference design or to buy products, go to www.FutureElectronics.com/FTM