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IITC home page: http://www.ieee.org/conference/iitc Chris Burke or Garth Miller BtB Marketing Communications (919) 872-8172 [email protected] or [email protected] For Immediate Release IITC conference returns to the greater Silicon Valley area for 2010. . . 2010 IEEE International Interconnect Technology Conference Calls for Papers That Describe Innovative Work On Interconnects For Devices, Boards & Systems BURLINGAME, CA (December 1, 2009) -- The 13th annual IEEE International Interconnect Technology Conference (IITC) and exhibition has announced a Call for Papers for work describing innovative developments in the critically important field of interconnections for electronic systems. The conference seeks papers on all aspects of interconnects for device, circuit board and system-level applications. The deadline for submission of paper abstracts is Feb. 1, 2010. IITC 2010 will be held June 7-9 at the Hyatt Regency San Francisco Airport Hotel in Burlingame. It will be preceded by a day-long Short Course on leading-edge interconnect technologies on Sunday, June 6. The conference attracts professionals in semiconductor processing, interconnect design, academia and equipment development. The traditional U.S. venue is now one of three international locations for this important technology conference, which rotates among them annually. In 2009, IITC was held in Sapporo, Japan, while the 2011 edition will take place in Europe. “Interconnections have become tremendously important in recent years because of their potential to become bottlenecks to higher performance, and because they are key to achieving some of the most exciting ideas in electronics, such as 3D systems. This year new, relevant focus areas have been added, including the relationship of device interconnects with system-level interconnections and interfaces,” said Michael Armacost, IITC 2010 Publicity Chair and Managing Director at Applied Materials, Inc. “The IITC conference is a premier global forum for specialists and suppliers to come together to discuss, demonstrate and exhibit advanced interconnect techniques, materials, architectures and processes that shed light on the best ways forward.” IITC 2010 is seeking papers in the areas of process integration (for logic and/or memory); reliability; advanced interconnects and systems interconnections; through-silicon vias and 3D integration; packaging; novel materials and concepts; process modeling, and all backend materials and unit processes associated with interconnect technology, including indepth explorations of related manufacturing issues. IITC 2010 Call for Papers/page 2 Papers from universities, national laboratories, semiconductor manufacturers, foundries, and equipment/materials suppliers are encouraged. Following a rigorous review, papers will be selected for either oral presentations or poster presentations during the exhibition hours. In addition, papers will be selected for a special poster session for new engineers and students. The IITC 2010 Call for Papers and paper-submission requirements can be found on the conference website, http://www.ieee.org/conference/iitc. For additional information and inquiries, interested persons may contact Wendy Walker at Widerkehr & Associates, 19803 Laurel Valley Place, Montgomery Village, MD 20886 USA; tel. +1-301-527-0900 ext 3; fax. +1-301-527-0994; e-mail [email protected] A limited number of papers reporting the latest breakthroughs may be accepted as latenews papers. The late-news deadline is March 26, 2010. About the IEEE IEEE (Institute of Electrical and Electronics Engineers, Inc.), the world’s largest technical professional association, is commemorating its 125th anniversary in 2009 by “Celebrating 125 Years of Engineering the Future” around the globe. Through its more than 375,000 members in 160 countries, IEEE is a leading authority on a wide variety of areas ranging from aerospace systems, computers and telecommunications to biomedical engineering, electric power and consumer electronics. Dedicated to the advancement of technology, IEEE publishes 30 percent of the world's literature in the electrical and electronics engineering and computer science fields, and has developed over 900 active industry standards. The organization annually sponsors more than 850 conferences worldwide. Additional information about IEEE can be found at http://www.ieee.org. ###