Download Electronic Mfg Overall

Design for Mass Production
Prototype
Production Design
• One of a kind or few of a kind
• Mass Production Quantities
• Represents abstract of production design
• Typically Use Surface Mount Technology
• Typically Thru Hole Components
• Mat & Asm Cost is an allocated requirement
• Cost is not part of requirements allocation
• Mat Cost use est annual production
volumes
• Assembly process is not of interest
• Assembly levels, PCBs do NOT match PD
• Define Assembly process flow diagram(s)
• Define Assembly levels
• Used for verification of requirements
• Mfg test process part of Asm costs
• Major Deliverables: Model
• Major Deliverables: Paper Exercise
• Working Demonstration Model
• Costed Bill of Materials incl package
info
• Demonstrate Major Functions
• Minimal Documentation
• PCB Asm-Test Process Flow Diagrams
• Plan, Parts List, PCB Layouts
• Demonstration Photos/Videos
• Assembly Level Diagram
• PCB Layouts (optional)
Both are Required
Design for Mass Production
Manufacturing Processes
• Printed Circuit Board Assembly (PCB): Must specify or
account for all components mounted into, onto or attached in
some way to a printed circuit board as well as test for same
– Electrical Components: Passives, IC’s, Optical, ElecMech, ElecMag,
Connectors, Switches, Sensors, Protection Devices, etc
– Mechanical Components: Heat Sinks, Thermal Grease, Pullers,
Stiffeners, Mounting Hardware, Sensors, Protection Devices, etc
• High Level Assembly (HLA): Must specify or account for
all elements or parts of an assembly level including testing
– Electrical Elements: PCB’s, Cables, Harnesses, Fans, Power
Supplies, Sensors, Protection Devices, User Displays, Switches, etc
– Mechanical Elements: Enclosures, Feet, Standoffs, Card Guides,
Gaskets, Sealants, Fasteners, Hardware, etc
Design for Mass Production
Printed Circuit Board Assemblies
• Printed Circuit Boards (PCBs):
– Convenient form of interconnecting electrical components using
industry standard attachment processes
– 3 Basic Types of PCB-Component Assembly Technology
• Thru Hole (TH)
• Surface Mount (SMT)
• Micro-electronic Multi-Chip-Module (MCM)
– 3 Basic Types of PCB substrate systems (fabs)
• Rigid epoxy including FR4, BT and others
• Ceramic, Alumina (Al203), AlNi or other exotics
• Flexible Substrate (flex circuit)
– Single, Double and Multi-Layered
Design for Mass Production
PCB Manufacturing Guide Links
•fullnet.com/u/tomg/gooteepc.htm
•ee.washington.edu/circuit_archive/text/design.html
•precisioncircuits.com.au/cid/hm_cid.html
•amscourseware.com/guidelines.htm
•filtranmicro.com/design.html
•goldengategraphics.com/pcgloss.htm
•elchempub.com/files/electroc2.htm
•pcbprotech.com/Dh3/DH3right.htm
•pcbprototyping.com/html/html_edu.htm
Design for Mass Production
Plated VIAs
Design for Mass Production
Basic Photo-Etch
PCB Mfg Process
Plated Through Hole
PCB Cross Section
Design for Mass Production
VIA Aspect Ratio – Very Important
Aspect Ratio =
Bd Thickness
VIA Diameter
Aspect Ratios > 5 May
Challenge Drilling,
Plating & other PCB
Mfg Processes
Cross Section Example of Failed VIA due to poor drilling, plating
Design for Mass Production
Cu PCB Trace Width & Depth
IPC Current Capacity Limitations
Design for Mass Production
Cu PCB Trace Conductor
IPC* Spacing vs Voltage Summary
(*Simplified)
Design for Mass Production
Signal Routing is Important!
The PCB is part of the circuit
Good Signal Routing
Equal Lengths, Uniform
Good Power
Bus Routing
Poor Power
Routing
Bypass Caps
Closest to IC
Power Pins
Bypass Caps and 1
Conductor too
Lengthy
Poor Signal Routing
Un-Equal Lengths, Non-uniform
Design for Mass Production
PCB Ionic Cleanliness is Important
• Acetate & Formate - These organic acids can be extracted from some solder masks. High levels can be indicative of an
incompletely cured solder mask. Incomplete cure can allow exposure of the copper traces to the environment resulting in
corrosion and board failure.
• Bromide: Brominated compounds are added to laminates as a flame retardant. Some laminates are employing alternate,
non-bromine, flame retardants. These are usually called specified as containing non-halogen flame retardants. The surface
bromide concentration is a function of the laminate heat history. Bromide has also been identified as a component in some
marking ink formulations and some solder masks.
• Chloride - Chloride ions are the single most damaging material that can be on the board. High levels are usually due
to insufficient washing prior to applying the solder mask. Chloride can also be transferred to the board by handling.
• Nitrate and Ammonium - Both of these can be introduced in various plating processes.
• Sulfate - Sulfate is rarely a problem. High levels are usually caused by poor housekeeping: dirty equipment, unpainted
walls or unsealed floors.
• Sodium & Potassium - Sodium can be induced by handling but is also a component of tap water and may be indicative of
poor water treatment. In this case, chloride, calcium and magnesium should also be present.
• Calcium and Magnesium - Calcium and magnesium come from rinse water and are indicative of poor water quality.
• Citrate - Citrate salts and acids are components of some gold plating solutions. They also are in many environmentally
friendly cleaners.
IPC-6012 mandates the total ionic cleanliness prior to solder mask be <10ug/in2 in NaCl equivelants (IPC-TM-650)
Most Low Signal Or High Bias, High Reliability Designs Require Much Lower Levels on Individual Ions
Design for Mass Production
TH: Thru-Hole Technology
Design for Mass Production
Thru-Hole Device Packages
• Passives and Discretes
 Axial Leaded (2 terminal, lying down)
o Resistors, Capacitors, Inductors, Diodes
 Radial Leaded (2 terminal, standing up)
o Capacitors, Inductors, LEDs, MOVs, Power Resistors, …
 T0 – Series (2-N terminals, Most Accommodate Std Heat Sink hardware)
o T0-92 Small Signal Transistors, Regulators, References
o T0-220 Moderate Power (~1W) Transistors, Regulators, Amplifiers
o T0-3 Higher Power (~3W) Transistors, Regulators, Amplifiers
Design for Mass Production
Transistor Package Examples
Design for Mass Production
Thru-Hole Device Packages
•
Integrated Circuits, Resistors, Relays

DIP (Dual In-Line Package)

PDIP, CDIP

SIP (Single In-Line Package)

Rectangular
Design for Mass Production
P-DIP (plastic) and C-DIP (ceramic) Examples
Design for Mass Production
SMT: Surface Mount Technology
Design for Mass Production
SMT – Surface Mount Technology Generations
20mm
DIP
Small Outline Package
Shrink SO Package
Thin Shrink SOP
3 mm
Depopulated, Very Thin, Quad Flat Pack, No
Leads
Design for Mass Production
Discretes: Rectangular
(Example 0402)
Design for Mass Production
SOT – Small Outline Transistors (SOT-3, SOT-223)
Design for Mass Production
QFP – Quad Flat Packs
Design for Mass Production
Quad Flat Pack – QFP, PQFP
Design for Mass Production
PLCC – Plastic Leaded Chip Carriers
Design for Mass Production
BGA – Ball Grid Arrays
Design for Mass Production
Typical BGA Pin Layout
Design for Mass Production
Electronic Assembly Quality
Design for Mass Production
Electronic Assembly Quality and Standards
Design for Mass Production
Component
Procure
Setup
Substrate
(Fab)
Fabrication
Fab, Comp
Prep
Bake, Clean
Thru Hole
Mechanical
Hand
Operations
Simplified Comparison
of Thru Hole and SMT
PCB Assembly Process
SMT
Screen
Solder Paste
Auto
Component
Insertion
Vision
System
Inspection
Auto
Component
Placement
Wave Solder
Vision
System
Inspection
Reflow
Solder
(Oven)
Lead
Trim
Stresses and
Test
Processes
Vision/Xray
System
Inspection
Design for Mass Production
Setup
Screen Print
SMT Placement
Hand Assembly
Wave Solder
Final Assembly
In Circuit Test
Stress Screen
Functional Test
Reflow
Wash
Pack / Ship
Typical SMT Complex Circuit Board Assembly
Design for Mass Production
Solder Geometry Variability in SMT and THT
Design for Mass Production
IPC = Institute of Printed Circuits, WWW.IPC.ORG
Association Connecting Electronics Industries
•
•
•
•
•
•
IPC-A-610 Acceptability of Electronic Assemblies
IPC-6011 Series of Board PCB Performance Standards
IPC/EIA J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
IPC-7095 Design and Assembly Process Implementation for BGAs
IPC-2221 Generic Std for Printed Board Design
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology
Printed Board Assemblies
Quality!
Design for Mass Production
IPC Electronic Assembly Classifications
3.
High Reliability Electronic Products:
Ref: IPC-A-610, IPC-JSTD-001, IPC-7095
PROCESS CONTROL – PROCESS QUALITY
•
2.
1.
Aerospace, Military
Continued performance, performance on demand, and extended life is
critical and equipment downtime cannot be tolerated. Equipment must
function when required with a high level of reliability assurance.
# of Bds, # of solder joints
# of Mechanical Cycles
•
End-use environment is harsh
•
Includes equipment for commercial, military products, and for such
applications as life support or missile systems.
Dedicated Service Electronic Products:
10 Yr Stresses
4# of Power Cycles
# of Therm Cycles, Excursion
Telecom & Certain Medical
•
Continued performance, extended life and uninterrupted service is desired
but not critical.
•
Typically the end-use environment would not cause failures
•
Includes communications equipment, sophisticated business machines,
instruments and military equipment
General Electronic Products:
•
Function of the completed assembly is the major requirement
•
Cosmetic imperfections are not important
•
Includes consumer, some computer, peripherals, general military HW
Design for Mass Production
IPC Workmanship Classes: Solder Volume, Shape, Placement Control
3.
High Reliability Electronic Products: Includes the equipment for commercial and military products where
continued performance or performance on demand is critical. Equipment downtime cannot be tolerated, and
functionality is required for such applications as life support or missile systems. Printed board assemblies in
this class are suitable for applications where high levels of assurance are required and service is essential.
•
2.
Dedicated Service Electronic Products: Includes communications equipment, sophisticated business
machines, instruments and military equipment where high performance and extended life is required, and for
which uninterrupted service is desired but is not critical. Typically the end-use environment would NOT cause
failures.
•
1.
Requirement for Aero-Space, Certain Military, Certain Medical
Requirement for High Eng Telecom, COTS Military, Medical
General Electronic Products: Includes consumer products, some computer and peripherals, as well as
general military hardware suitable for applications where cosmetic imperfections are not important and the
major requirement is function of the completed printed board assembly.
100 %
100 %
75 %
75 %
50 %
50 %
25 %
25 %
0%
0%
Min PTH Vertical Fill: Class 2 = 75%
Ref: IPC-A-610, IPC-JSTD-001
IPC-7095
BGA Std
Class 1
Class 2
Class 3
Max Void Size
60% Dia
36% Area
45% Dia
20.3% Area
30% Dia
9% Area
Max Void
Size at
Interfaces
50% Dia
25% Area
35% Dia
12.3% Area
20% Dia
4% Area
Class 3 = 100%
Design for Mass Production
BGA Void Size and Locations, Uniform Void Position Distributions
Sampling_Grid
Position
Model
Solder_Joint_Radius
Void_Distance
Void_Radius
Void_Solder
Interface Distance
S = Shell
Potential for Early Life Failure (ELFO) if S < D/10 =
(solder_joint_radius)/10
S =Shell = solder_joint_radius – (void_distance + void_radius)
S
Design for Mass Production
CLASS 1
Solder Joint_Radius: 0.225 mm
Void_Radius: 0.135 mm
Void_Area: 36% of Joint Area
Failure criteria: D/10
P(D<10) = 81.11 %
CLASS 2
Solder Joint_Radius: 0.225 mm
Void_Radius: 0.1013 mm
Void_Area: 20% of Joint Area
Failure criteria: D/10
P(D<10) = 52.21 %
CLASS 3
Solder Joint_Radius: 0.225 mm
Void_Radius: 0.0675 mm
Void_Area: 9% of Joint Area
Failure criteria: D/10
P(D<10) = 27.00 %
Design for Mass Production
Class vs Shell Size Relative Probabilities
~ 2x more likely to exceed D/10 threshold with Class 2 vs Class 3
S = Shell
Depth
Design for Mass Production
Physics of Failure: Accumulated Fatigue Damage (AFD) is related to the number of stress
cycles N, and mechanical stress, S, using Miner’s rule
Exponent B comes from the S-N diagram. It is typically ~3 for 63/37 SnPb Solders
Example: Solder Joint
Shear
voids
Effective cross-sectional
Effective
crossForce
Area: D/2
F
sectional
Area: D
Applied stress:
Let  = 10, then
Applied stress:
AFD with voids will “age” about
1000x faster than AFD with no voids
Voids in solder joints
Design for Mass Production
IPC-A-610 Conditions
•
IPC-A-610 Workmanship Conditions
– Target Condition- This is the most desired condition and previously was referred
to as preferred. It is not always essential to achieve this condition for reliability
considerations.
– Acceptable Condition- is a condition that, while not at a Target Condition, will
result in a reliable product for the application. Corrective actions shall be
directed to move toward the Target Condition.
– Nonconforming Process Indicator- Is when a condition exists which does not
affect the use of the product, but is not optimum. May result in repair, rework or
scrap depending upon the customer’s requirements. Corrective action is
necessary to bring the result back toward the Target.
– Nonconforming Defect Condition- is when a condition exists that does not meet
the reliability or performance in the application. Correction action is mandatory.
There are three key words used in the
workmanship standards: Must, Shall and
Should.
All the IPC-A-610 Measurements utilize
•
•
•
Temp (Deg F/C)
Mass (Oz/Kg)
Distance (mils/mm)
Must means mandatory for Class 1, 2, & 3
Shall means mandatory for Class 3 only.
Should means recommended only for Class
1,2 & 3.
Quality!
Design for Mass Production
Solder Joints
•
Solder Joints: A solder joint is formed when two metal surfaces are soldered together.
The solder fills the void between the surfaces and is the area most important. It provides
the majority of “strength of attachment.” A solder fillet is formed after the solder joint is
filled, and, is the visible solder verifying the presence of the solder joint.
–
–
–
–
Blow Hole Defects: Blowholes are solder voids visible from the surface going into the solder joint
alongside a through-hole lead. A blowhole is a nonconforming process indicator provided the
solder connection meets the minimum circumference and depth requirements.
Dewetting Defects: Solder joints are visually inspected for wetting characteristics. Dewetting
occurs because the flux has been burned off and moisture attacks the surfaces. A good indicator of
dewetting is solder pooling and pulling back off leads or lands.
Oxidation Defects: When moisture in the air attacks a solder joint, it forms a protective rust-like
layer. This is referred to as oxidation, which attacks metal surfaces. Oxidation dramatically reduces
the transfer efficiency of thermal energy.
Dimensional Defects: For any of the above in addition to poor placement, screening, reflow and
other processes, solder joint geometric defect limits are clearly specified in these Stds (see above)
Design for Mass Production
Discrete Component Geometries
NOTES
1. The maximum fillet may overhang the land or extend onto the top of the chip cap metallization; however the
solder shall not extend further onto the component body.
2. Properly wetted fillet evident.
Design for Mass Production
J-Lead Component Geometries
NOTES
1. The maximum solder fillet shall not touch package body. 2. Properly wetted fillet evident.
Design for Mass Production
Gull Wing Component Geometries
NOTES
1. Solder fillet may extend through the top bend. Solder must not touch the package body or end seal, except for low profile
SMD devices, e.g., SOICs, SOTs. Solder should not extend under the body of low profile surface mount components whose
leads are made of Alloy 42 or similar metals.
2. Must not violate minimum design conductor spacing.
3. Properly wetted fillet evident.
Design for Mass Production
Thru-Hole Component Geometries
NOTES
1. Wetted solder refers to solder applied by the solder process.
2. The 25% unfilled volume includes both source and destination side depressions.
Design for Mass Production
Advanced Packaging
Design for Mass Production
Through Hole
Surface Mount
CSP / WLP
(CSP = Chip Scale Package,
WLP = Wafer Level Package)
TSOP
CSP/WLP
 25 mil pitch
 Area array 0.8 mm to 0.5 mm
 Limited by perimeter leads
 Limited by substrate wiring
100 mil pitch
 Limited by through hole spacing
IC Packaging Progression:
Design for Mass Production
Fujitsu SuperCSP
Redistribution
Trace (Cu)
SiN
Al Pad
Polyimide Layer
Die
Encapsulant
Barrier Metal
Solder Ball
Metal Post (Cu)
• Solder balls on copper posts
• Redistribution wiring to posts
• Encapsulant is molded onto wafer
Design for Mass Production
Wafer Level Packaging Will Become Std
VOLUME
Thru Hole
•DIP
•Pin Grid
1960
Surface Mount
•QFP
•TSOP
•SOJ
•BGA
1980
2000
YEAR
Chip Scale
•CSP
•Wafer Level
•Stacked Die
•SiP
Design for Mass Production
10000
Flip-Chip
Underfill+
µProcessor
1000
ASICs
Pins (#)
DRAM
SRAM
Flash
100
Passives
Analog ICs
10
Power ICs
Discretes
1
1
10
100
Die Area (mm2)
1000
Design for Mass Production
Process Flow:
Wafer Level Packaging
vs.
Conventional Packaging
* From Motorola
Design for Mass Production
Waste Electrical and Electronic Equipment
(WEEE)
Restrictions on Hazardous Substances (RoHS)
European Community Directives 2002/95/EC & 2002/96/EC
Will impact global electronics industry (incl USA)
Design for Mass Production
WEEE
Directive 2002/96/EC “on Waste Electrical and Electronic Equipment“
 Producers must take back waste electronic equipment from collection points
 Financing:

Producers/Importers are responsible for financing and treatment of waste equipment from private
households (which includes most small businesses)


Product sales can show a visible fee for up to 10 years
Producers and users others than private households may conclude agreements stipulating other
financing methods
 Products have to be marked with the brand of the producer, recycling symbol & date
 Producers must provide specific disassembly information for treatment facilities
 Targets are set in the directive for reuse, recovery and recycling (ex. Medical)
 Producers/Importers have to be registered with local systems
 Member states have to report on the targets; so record keeping required
Labeling Must Include the WEEE Symbol and Guidance Info
Date of manufacture:
month / year
“This symbol indicates that the waste of electrical and electronic
equipment must not be disposed as unsorted municipal waste and must be
collected separately. Please contact t he manufacturer or other authorized
disposal company to decommission your equipment.”
Typical Guidance Statement for Industrial Equipment
Design for Mass Production
WEEE Regulated Materials and Devices
• 1) Polychlorinated biphenyls (PCB) containing capacitors in accordance
with Council Directive 96/59/EC of 16 September 1996 on the disposal of
polychlorinated biphenyls and polychlorinated terphenyls (PCB/PCT) (1).
• 2) Mercury containing components, such as switches or backlighting lamps,
• 3) Batteries Including,
Lithium batteries
Alkali-Manganese batteries
Dry cell batteries
Nickel-cadmium rechargeable batteries
Lead rechargeable batteries
Silver round cell batteries
• 4) Printed circuit boards of mobile phones generally, and of other devices if
the surface of the printed circuit board is greater than 10 square centimeters.
• 5) Toner cartridges, liquid and pasty, as well as color toner.
• 6) Plastic containing brominated flame retardants.
• 7) Asbestos waste and components which contain asbestos.
Design for Mass Production
WEEE Regulated Materials and Devices
• 8) Cathode ray tubes
• 9) Refrigerant including chlorofluorocarbons, hydrochlorofluorocarbons,
hydrofluorocarbons & hydrocarbons
• 10) Gas discharge lamps such as halogen, neon, xenon, etc
• 11) Liquid crystal displays (together with their casing where appropriate) of a
surface greater than 100 square centimeters and all those back-lighted with gas
discharge lamps
• 12) External electric cables
• 13) Components containing refractory ceramic fibers as described in
Commission Directive 97/69/EC of 5 December 1997 adapting to technical progress
Council Directive 67/548/EEC relating to the classification, packaging and labeling of
dangerous substances (2).
• 14) Components containing radioactive substances (except components below
exemption thresholds set in Art. 3 of and Annex I to Directive 96/29/Euratom of 13
May 1996 laying down basic safety standards for the protection of the health of
workers and the general public against the dangers arising from ionizing radiation (3))
.
• 15) Electrolytic capacitors containing substances of concern (height > 25 mm,
diameter > 25 mm or proportionately similar volume) .
Design for Mass Production
WEEE Implementation Difficulties
– Member States can expand the equipment list
– Producers will be accountable for records of annual mass of each restricted
substance shipped into each EC country
– But conflicts among accounting firms on how to reserve for WEEE
obligations, some countries may charge up-front
• Firms may have to pay into a deposit system;
• and reserve for a contingent liability
– Some European wide associations being formed to manage WEEE
• But member states have strong incentive to keep all waste in their system
to maximize fee income
– Definition of “producer” is problematic
• What happens if distributors ship equipment from one member state to
another? Who is responsible as the “producer”?
Design for Mass Production
Recycling Passport
Master Recycling Passport
WEEE requires special
identification of waste
for recycling or special
handling
Model Type xxx
Type Number
(Operator Manual)
03/2003
Page 1 of 41
mailto:[email protected]
File:
2003.03.04_rp neu.doc
( ++49 89 6207-3681 / FAX: ++49 89 6207-7140
1. General view of the device
8
5
6
4
1
1
7
1
2
Example: Agfa Copier
Edition:
1
Editor / Department
2
3
9
1
0
1
1
3
Design for Mass Production
China RoHS
Key Elements
SJ
P.R.C. Electronic Industry Standards
SJ╳╳╳—200╳
•
•
Product Labeling
Substance Limit Table
IPC 1752 Material Declaration
•
Packaging Labeling
Marks of Preventing and Controlling Pollution by
Electronic Information Products and Marking
Requirements
Promulgated on 200╳-╳╳-╳╳
╳╳-╳╳
Effective as of 200 ╳-
Promulgated by PRC Ministry of Information
Industry
Design for Mass Production
1. Labeling
Logo 1: Labeling for RoHS compliant product
China RoHS Compliance: Comply to EU 1000PPM for all
substances except Cadmium at 100PPM (Homogenous
Substance Limits)
No Exemptions Allowed
Logo 2: Labeling for RoHS non-compliant product
Number indicates Environmental Protection Use Period – Period in
years that worst case substance remains user safe (Operating
lifetime of the product unless maintenance items have noncompliance)
Design for Mass Production
• For products whose Hazardous Substance concentration exceeds limits, in
addition to Symbol 2, the names and contents of hazardous substances shall be
specified in instruction brochure
• Example of the table is shown below:
Part name
Part 1
Part 2
Toxic and Hazardous Substances and Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
×
○
○
○
○
×
Hexavalent Polybromina Polybromited
nated
Chromium
biphenyls
diphenyl
(Cr6+)
(PBB)
ethers
(PBDE)
×
○
○
○
○
○
Hazardous Substance exceeds MCV limit
Hazardous Substance is below MCV
(i.e. contained)
limit
The Table shall be in Chinese. The height of Chinese(i.e.
characters,
numbers and
not contained)
alphabetical [symbols] used in the marking should not be smaller than 1.8 mm.
2. Over-Under Table
Design for Mass Production
•
Producers or importers shall follow the material codes prescribed in GB
18455-2001 (Packaging Recycling Marks) to indicate what material is used in
the packaging. The packaging material codes shall be marked on the packages
of the products.
•
Table of Packaging Material Codes
Type
Name
Codes
I
Plastic
High density polyethylene HDPE; Low density polyethylene LDPE;
Polyvinyl chloride PVC; Polyester PET; Polypropylene PP; Polystyrene PS
II
Paper
Paper WPP; Paperboard PB; Corrugated cardboard CB; Corrugated
fiberboard FB; Non-corrugated fiberboard NCFB
III
Metal
Steel FE; Aluminum ALU
IV
Composite
Material
V
VI
Glass
Colorless GL1; Brown GL2; Green GL3
Wood
Natural wood NW
Plastic/aluminum 11; Plastic/tin 12; Plastic/mixed metals 13; Plastic/glass
14;Glass/aluminum 21; Glass/tin 22; Glass/mixed metals 23; Paper or
fiberboard/plastic 31; Paper or fiberboard/aluminum 32; Paper or
fiberboard/tin 33; Paper or fiberboard/mixed metals 34; Paper or
fiberboard /plastic/metal 41
3. Marking of Packaging Materials
Design for Mass Production
EU RoHS
Directive 2002/95/EC “on the Restriction of certain Hazardous
Substances in Electrical and Electronic Equipment“ (ROHS)
Requirements:
Covered Equipment put on the market after July 1, 2006 is not allowed to
contain (1000PPM mass or less in homogenious materials, 100PPM or less for Cd):
 Lead
 Mercury
 Cadmium
 Hexavalent Chromium (used mostly for corrosion protection)
 Polybrominated Biphenyls (PBB) or
 Polybrominated Diphenyl ethers (PBDE) (flame retardants)
Limited, but critical exemptions (medical devices for example)
Design for Mass Production
2006 – Products/Industries 2012? – Med Devices
•
•
•
•
•
•
•
•
Large household appliances
Small household appliance
IT and telecommunications
equipment
Consumer equipment
Lighting equipment
Electrical and electronic tools
Toys, leisure and sports
equipment
Automatic dispensers
•
•
•
DI Products (X-Ray, MR, CT,
etc.)
Patient Monitoring
EKG, Lab Eq, Dialysis
Category 8 and 9 Exclusions May End 2012
Design for Mass Production
Pb Free Replacement Solder Properties
Alloy
Composition
Liquidus
Temp.
(ºC)
Sn-37Pb (63% Tin, 37% Lead)
Reflow
Temp.
(ºC)
Sn-3.5Ag
221
200-220
240 – 250
Sn-0.7Cu
227
245 – 255
Sn-3.0Ag-0.5Cu*
220**
238 – 248
Sn-3.2Ag-0.5Cu
218
238 – 248
Sn-3.5Ag-0.75Cu*
218
238 – 248
Sn-3.8Ag-0.7Cu
220**
238 – 248
Sn-4.0Ag-1.0Cu*
220**
238 – 248
Sn-4.7Ag-1.7Cu*
244**
237 – 247
Sn-0.2Ag-2Cu-0.8Sb*
285**
246 - 256
Sn-2.5Ag-0.8Cu-0.5Sb*
225
233 – 243
Sn-2Ag-7.5Bi*
216**
220 – 230
Sn-3Ag-3Bi*
218**
233 – 243
Sn-3Ag-5Bi*
216**
230 – 240
Sn-3.4Ag-4.8Bi*
215**
225 – 235
Sn-3.5Ag-3Bi*
217**
230 – 240
Sn-3.2Ag-1.1Cu-3Bi*
240**
230 – 240
Sn-3.5Ag-3In-0.5Bi*
215**
230 – 240
Sn-4.0Ag-0.5Cu
176-183
217-218
217-210
217-219
Sn-5Sb
Sn-3Bi-8Zn
Melting
Range#
(ºC)
217-220
232-240
226-228%
200-216
189-199
**V. Solberg, "No-Lead Solder for CSP: The Impact of Higher Temperature SMT Assembly Processing," Proc. NEPCON West 2000 Conf. (Feb. 28 - Mar. 2, 2000) Anaheim, CA (Source: Indium Corp.)
#N.-C. Lee, "Lead-Free Chip-Scale Soldering of Packages," Chip Scale Review, March-April 2000
*Many of the above are Patented compositions; may require licensing or royalty agreements before use.
Design for Mass Production
Design for Mass Production
Design for Mass Production
Metal Migration
• Voltage-Humidity Stresses
• Migration, Tin Whiskers
PCB VIA Cracking
• Thermal Cycling
Stress
• PCB Insulation
Material
High Density Interconnect
Failures
• Voiding in Solder Joints,
Underfills
• Crack Propagations
• Compromising Reliability
New Pb Free Materials  New Failure Modes
Design for Mass Production
Covered Equipment
Categories of electrical and electronic equipment covered by
RoHS, Annex IA
1)
2)
3)
4)
5)
6)
7)
8)
9)
10)
Large household appliances
Small household appliances
IT and telecommunications equipment
Consumer equipment
Lighting equipment
Electrical and electronic tools (with the exception of large-scale
stationary industrial tools)
Toys, leisure and sports equipment
Medical devices (with the exception of all implanted and infected
products)
Monitoring and control instruments
Automatic dispensers
Not currently in scope of EU Directive
Design for Mass Production
RoHS Definition of “Equipment“ falling into scope
Equipment, which:
1.
Is dependent on electric current or electromagnetic fields in order to work properly
(electric current or electromagnetic fields as primary energy), and equipment for the
generation, transfer and measurement of such currents and fields, and
2.
Is covered by the categories set out in annex I A, and
3.
is listed in annex I B (examples for the categories), and
4.
Is designed for use with a voltage rating not exceeding 1000 Volt for alternating
current and 1500 Volt for direct current, and
5.
Is not a product which is intended for specifically military purposes, and
6.
Is not part of another type of equipment that does not fall under the scope of the
directive