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Quotes for:
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Gantry: we should “oversize” this for additional 30-40%
more capacity, if the price is reasonable. We should be
able to accommodate 8” and well as 6”
OGP: we need this for testing, verifying and measuring
components as well as the assembled module
Wirebonder: Hesse&Knipps BJ820 is available for ~$75K.
If we go ahead and purchase this wirebonder, this gives us
a chance to experiment with wirebonding before the
preseries
Thermal burn-in station: need a design and cost
Service contracts for tools?
Shipping containers for modules? Ship every two weeks
to Fermilab? Cost of shipping and packaging? Recycle
shipping containers
Module assembly consumables? Epoxy, ... ?
N. Akchurin, 12 April 2016
TTU
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Cleanroom Status and Items
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Vladimir is looking at NTC rooms 101 and 101A. We will
have a cost estimate in a couple of weeks
I discussed with Romo and Dorsette the possibility of using
the Innovation Hub and Research Center. More
discussion is necessary (a couple of weeks)
Additional cost items:
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Consumables (gowns, masks, shoe covers, etc) assumed to be $5K/month
Tech/institutional labor to maintain cleanroom
N. Akchurin, 12 April 2016
TTU
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Testing
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There are different levels of testing:
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Deep Testing: testing every conceivable aspect of sensors before and
after irradiation, testing PCBs with components, and complete modules
Sensor Acceptance Test: perform tests on one sensor out of a “boat”
before module assemble starts
Module Readiness Test: perform a series of tests to qualify an assembled
module for cassette assembly before shipping
N. Akchurin, 12 April 2016
TTU
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Scheduling
Assume a 2-month period repeats itself for the duration of the
project
Batch 1 (~10% of total) is special. Develop a schedule for
Batch 3 to 10 with appropriate lags (start to start, end to
start linkages)
N. Akchurin, 12 April 2016
TTU
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402.04
Endcap
Calorimetry
402.4.2
Management
402.4.3
Sensors
402.4.3.1
Milestones and
Externals
402.04.06
Backing
Calorimeter
402.4.4
Modules
402.4.4.1
Milestones and
Externals
402.4.4.2 Module
Components
402.4.4.3 Module
Factories
402.4.4.4
Assembly of
Standard Modules
Site 1
402.4.4.5
Assembly of
Standard Modules
Site 2
402.4.4.6
Assembly of OddSized Modules
402.4.5.1
Milestones and
Externals
402.4.5.2 Cooling
plates
402.4.5
Cassettes
402.04.07
Electronics and
Services
402.4.5.3
Electrical
Components
402.4.5.4
Mechanics and
Tooling
402.4.5.5 FH
Cassettes
402.4.3.2
Standard Sensors
402.4.4.2.1 Base
plates
402.4.4.3.1 Test
Stands
402.04.05.02.01
Procurement
402.4.5.3.1 LV
Circuit Boards
402.4.5.4.1
Cassette Frames
402.4.5.5.1
Cassette
Components
Reception and
Test
402.4.3.3 Oddsized Sensors
402.4.4.2.2
Kapton
402.4.4.3.2 Site 1
402.04.05.02.02
Fabrication
402.4.5.3.2 HV
Cables
402.4.5.4.2
Cassette
Assembly Tooling
402.4.5.5.2
Cassette
Assembly
402.4.4.2.3 Cover
plates
402.4.4.3.3 Site 2
402.04.05.02.03
Testing
402.4.5.3.3
Cassette interface
402.4.5.4.3
Cassette Electrical
Test Stands
402.4.5.5.3
Cassette Testing
402.4.4.2.4 Circuit
Boards
402.4.4.3.4 Site 3
402.04.05.02.04
Shipping
402.4.5.4.4
Cassette Thermal
Test Stands
402.4.5.5.4
Cassette Shipping
N. Akchurin, 12 April 2016
TTU
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