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Mechatronics (II)
Seminar:
“Introduction to MEMS Devices
And FEM based COMSOL Multiphysics “
Presented By:
Farid , Alidoust
Ali , Taghizadeh
[email protected]
Department of Mechanical Enginereeing, Islamic Azad University – Tabriz Branch
May 2011
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Topics:
Introduction to MEMS
Devices
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Introduction to
COMSOL
Multiphysics
A multiphysic problem
Simulation in
COMSOL
MEMS Devices:
• Introduction
• Brief History
• Electromechanical Systems
• MEMS
• Current Applications
• Conclusion
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• Introduction
• MEMS = Micro Electro Mechanical System
• Scales of MEMS  1 micro meter to
1 millimeter (10-6 to 10-3 m).
• MEMS rely on technologies of miniaturization.
• Manufactured onto semiconductor material
• Used to make sensors, actuators, accelerometers
switches, and light reflectors
• Used in automobiles, aerospace technology
biomedical applications, ink jet printers,
wireless and optical communications
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• Brief History(1)
1947 Invention of the Point Contact
Transistor
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A transistor uses electrical current or a small
amount of voltage to control a larger change
in current or voltage.
Transistors are the building blocks of
computers, cellular phones, and all other
modern electronics.
In 1947, William Shockley, John Bardeen, and
Walter Brattain of Bell Laboratories built the
first point-contact transistor.
The first transistor used germanium, a
semiconductive chemical .
It demonstrated the capability of building
transistors with semiconductive materials.
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First Point Contact Transistor and Testing
Apparatus (1947)
• Brief History(2)
1954 Discovery of the Piezoresistive Effect in Silicon and
Germanium
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Discovered in 1954 by C.S. Smith.
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The piezoresistive effect of semiconductor can be
several magnitudes larger than that in metals.
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This discovery showed that silicon and germanium
could sense air or water pressure better than metal
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Many MEMS devices such as strain gauges,
pressure sensors, and accelerometers utilize the
piezoresistive effect in silicon.
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Strain gauges began to be developed commercially
in 1958.
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Kulite was founded in 1959 as the first commercial
source of silicon strain gages .
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An Example of a Piezoresistive Pressure Sensor
[MTTC Pressure Sensor]
• Brief History(3)
1958 Invention - First Integrated Circuit (IC)
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Prior to the invention of the IC there were
limits on the size of transistors. They had to
be connected to wires and other electronics.
An IC includes the transistors, resistors,
capacitors, and wires.
If a circuit could be made all together on one
substrate, then the whole device could be
made smaller
In 1958, Jack Kilby from Texas Instruments
built a "Solid Circuit“ on one germanium
chip: 1 transistor, 3 resistors, and 1 capacitor.
Texas Instrument's First Integrated Circuit
[Photos Courtesy of Texas Instruments]
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• Brief History(4)
1971 The Invention of the Microprocessor
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In 1971, Intel publicly introduced the world's first single chip
microprocessor - The Intel 4004
It powered the Busicom calculator
This invention paved the way for the personal computer
The Intel 4004 Microprocessor
[Photo Courtesy of Intel Corporation]
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Busicom calculator
[Photo Courtesy of Intel Corporation]
• Brief History(5)
1979 HP Micromachined Inkjet Nozzle
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Hewlett Packard developed the Thermal Inkjet Technology (TIJ).
The TIJ rapidly heats ink, creating tiny bubbles.
When the bubbles collapse, the ink squirts through an array of nozzles onto
paper and other media.
MEMS technology is used to manufacture the nozzles.
The nozzles can be made very small and can be densely packed for high
resolution printing.
New applications using the TIJ have also been developed, such as direct
deposition of organic chemicals and biological molecules such as DNA
Schematic of an array of
inkjet nozzles
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Close-up view of a commercial
inkjet printer head illustrating
the nozzles
[Hewlett Packard]
• Brief History(6)
1982 LIGA Process Introduced
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LIGA is a German acronym for X-ray lithography
(X-ray Lithographie), Electroplating
(Galvanoformung), and Molding (Abformung).
In the early 1980s Karlsruhe Nuclear Research
Center in Germany developed LIGA.
It allows for manufacturing of high aspect ratio
microstructures.
It allows for manufacturing 3D microstructures.
LIGA structures have precise dimensions and good
surface roughness.
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LIGA-micromachined gear for a mini
electromagnetic motor
[Courtesy of Sandia National Laboratories]
• Brief History(7)
Developments in the 1980's
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In 1988 the first rotary electrostatic side drive motor were made at
UC Berkley.
Design of this Side Drive motor is Based on Brushless DC motor
Concept.
By frequently Energizing opposite channels in stator, rotor absorb
to nearest gear of stator and moves in an electrostatic field.
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First Rotary Electrostatic Side Drive Motor
[Richard Muller, UC Berkeley]
• Brief History(8)
1993 Multi-User MEMS Processes (MUMPs) Emerges
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In 1993 Microelectronics Center of North Carolina (MCNC) created MUMPs:
A foundry meant to make microsystems processing highly accessible and cost
effective for a large variety of users
A three layer polysilicon surface micromachining process
For a nominal cost, MUMPs participants are given a 1 cm2 area to create their
own design.
In 1998, Sandia National Labs developed SUMMiT IV (Sandia Ultra-planar,
Multi-level MEMS Technology 4)
This process later evolved into the SUMMiT V, a five-layer polycrystalline
silicon surface micromachining process
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Two simple structures using the MUMPs process [MCNC]
A MEMS device built using SUMMiT IV
[Sandia National Laboratories]
• Brief History(9)
Late 1990's , Early 2000's BioMEMS
 Scientists are combining
sensors and actuators with
emerging biotechnology.
 Applications include
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drug delivery systems
insulin pumps (see picture)
lab-on-a-chip (LOC)
Glucometers
neural probe arrays
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Insulin pump [Debiotech, Switzerland]
• Brief History(10)
Micro-electronics and MEMS
{ Differences & Analogies }
• MEMS fabrication technology was developed based on
micro-electronic techniques.
• However, there are differences between them.
• MEMS involves more materials than ME.
• MEMS has moving parts Unlike ME.
• ME: 2D structure; MEMS: 3D structure.
• ME: completely protected By packaging;
MEMS: sensors is interfaced with outside environment.
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• Electromechanical Systems
Electromechanical Systems functional block diagram.
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• MEMS(1)
 Microstructure Fabrication
 Materials
 Crystallography – Forms of Silicon
 Amorphous
 Polycrystalline
 Crystalline
 “Miller Planes”
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Miller Indices, Direction Examples
• MEMS(2)
Microstructure Fabrication
-Structural layer
-Sacrificial layer
• Pattern definition
• Photolithography
deposit
• Deposition
• Oxidation, chemical-vapor deposition,
ion implantation
• Removal
pattern
• Etching, evaporation
etch
Microstructure Fabrication
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• MEMS(3)
Microstructure Fabrication , Continued
Processing Techniques
• Deep Reactive Ion Etching (DRIE)
• Surface Laser Micromachining
• LIGA process – Lithography / Electroplating / Molding
• MUMPs
• SUMMIT process
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• MEMS(4)
 The advantages of MEMS devices include
 Size
 High sensitivity
 Low noise
 Reduced cost
 Batch Processing
 The applications for MEMS are so far reaching that a
multi-billion dollar market is forecast.
Key industry applications include transportation,
telecommunications and healthcare.
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• MEMS(5)
MEMS Economy Growing UP !!
Worldwide MEMS Markets
(in Millions of $)
2002
2007
Microfluidics
1401
2241
Optical MEMS
702
1826
RF MEMS
39
249
Other actuators
117
415
Inertial sensors
819
1826
Pressure sensors
546
917
Other sensors
273
830
Total
3900
8300
Worldwide MEMS Market (2002 vs. 2007)
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• Current Applications(1)
 Accelerometers
 Micro Optical Electro Mechanical Systems (MOEMS)
 Digital Mirror Devices (DMD) used in Projection Devices
 Deformable mirrors
 Optical Switches
 Inkjet Print heads (Microfluidics)
 Pressure Sensors
 Gyrometers
 Magnetic heads for hard drives
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• Current Applications(2)
Biomedical
 Micro-arrayed biosensors
 Virus detection
 DNA Chip PCR (Polymerase Chain Reaction)
 Neuron probes (nerve stimulus/repair)
 Retina Implants
 Micro Needles
 Micro Fluidic Pumps
 Insulin Pump (drug delivery)
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• Current Applications(3)
Detection systems
 Micro and Radio Frequency (RF) Switches
 Array Antennas & RF Localization
 RFID Technologies
 Modern “bar-coding” system
 Data Storage Systems
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• Conclusion
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Since the invention of the transistor, scientists have
been trying to improve and develop new micro electro
mechanical systems.
The first MEMS devices measured such things as
pressure in engines and motion in cars.
Today, MEMS are controlling our communications
networks.
MEMS are saving lives by inflating automobile air bags
and beating hearts.
The applications and Growth for
MEMS are endless !
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• COMSOL Multiphysics
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Introduction to Numerical Simulation
FEM(Finite Element Method
COMSOL Products
Interfacing with Engineering Software's
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• Introduction to Numerical Simulation(1)
• We remember some Numerical Methods from Calculus !
• In some Problems , complexity of analytical Methods
enforce us to use numerical solutions
• Such problems that enforce us to use Numerical Methods:
• In Finitie Integral (Rectangular , trapezoidal , Simpson &…)
• Derivation (Finite difference , … )
• Equation roots (Bisection , Newton , Levenberg Marquardt & …)
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• Introduction to Numerical Simulation(2)
• All Physical Problems can defined by Deferential Equations
• To forcast a physical problem we need to engage DEs !!
• Much Complex , The physical Problem
Much Complex Differential Equations
• In Higher Order of DEs , it is so difficult or in some cases
impossible to solve with conventional methods.
• So we use some numerical methods to overcome DEs .
• A Method mostly used to solve & simulate physical
Problems , is FEM (FINITE ELEMENT METHOD)
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• FEM(Finite Element Method)
 The finite element method (FEM) (its practical application often known
as finite element analysis (FEA) ) is a numerical technique for finding
approximate solutions of partial differential equations (PDE) as well as of
integral equations.
 The solution approach is based either on eliminating the differential
equation completely (steady state problems), or rendering the PDE into
an approximating system of ordinary differential equations, which are
then numerically integrated using standard techniques such as Euler's
method, Runge-Kutta, etc.
 Visualization of how a car
deforms in an asymmetrical
crash using finite element analysis
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• Some COMSOL Products
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• COMSOL Import Modules
 COMSOL ScriptTM Interact with Matlab
 Add-ons to the CAD Import Module
 SolidWorks Online Module
 Pro/E Import Module
 CATIA V4 Import Module
 CATIA V5 Import Module
 Inventor Online Module
 VDA-FS Import Module
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• COMSOL Multiphysics
Programming language and fast graphics
 COMSOL Script:
 Fully compatible with the MATLAB language
 All data types except objects
 Command line debugger, dbstop, dbstep, dbcont, ...
 Fast 3D graphics using OpenGL acceleration (50 times faster
than Matlab)
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• COMSOL Multiphysics
Pre-defined multiphysics couplings
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Now , Simulating A Multiphysics
Problem :
(Conjugate Heat Transfer in an air cooled Heatsink)
In COMSOL !
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• Thermal and Structural Analysis of a heatsink (1)
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• Thermal and Structural Analysis of a heatsink(2)
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• Thermal and Structural Analysis of a heatsink(3)
Now ; Simulating in
Comsol Multiphysics
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• References:
 Gad-el-Hak, M. MEMS, Design and Fabrication, Second Edition.
(2005)
 Lyshevski, S., MEMS and NEMS, CRC Press LLC. (2002)
 Maluf, N. and Williams, K., An Introduction to Micromechanical
Systems Engineering, Second Edition, Artechouse, Inc. (2004)
 Microsytems, Same-Tec 2005 Preconference Workshop, July 25
&26, 2005.
 Taylor and Francis, MEMS Introductory Course, Sandia National
Laboratories, June 13-15, 2006.
 What is MEMS technology? MEMS and Nanotechnology
Clearinghouse. http://www.memsnet.org/mems/what-is.html.
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Thanks for your
Attention!
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Questions ?!
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