Download Voltage-to-Frequency and Frequency-to

VFC32
®
Voltage-to-Frequency
and Frequency-to-Voltage
CONVERTER
FEATURES
DESCRIPTION
● OPERATION UP TO 500kHz
The VFC32 voltage-to-frequency converter provides
an output frequency accurately proportional to its
input voltage. The digital open-collector frequency
output is compatible with all common logic families.
Its integrating input characteristics give the VFC32
excellent noise immunity and low nonlinearity.
● EXCELLENT LINEARITY
±0.01% max at 10kHz FS
±0.05% max at 100kHz FS
● V/F OR F/V CONVERSION
● MONOTONIC
● VOLTAGE OR CURRENT INPUT
Full-scale output frequency is determined by an external capacitor and resistor and can be scaled over a
wide range. The VFC32 can also be configured as a
frequency-to-voltage converter.
APPLICATIONS
The VFC32 is available in 14-pin plastic DIP, SO-14
surface-mount, and metal TO-100 packages. Commercial, industrial, and military temperature range models
are available.
● INTEGRATING A/D CONVERTER
● SERIAL FREQUENCY OUTPUT
● ISOLATED DATA TRANSMISSION
● FM ANALOG SIGNAL MOD/DEMOD
● MOTOR SPEED CONTROL
● TACHOMETER
VOUT
Comparator
Input
+VCC
fOUT
–In
One-Shot
+In
Common
VFC32
–VCC
One-Shot
Capacitor
International Airport Industrial Park
• Mailing Address: PO Box 11400
• Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd.
• Tucson, AZ 85706
Tel: (602) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP
• Telex: 066-6491 • FAX: (602) 889-1510 • Immediate Product Info: (800) 548-6132
©
SBVS015
1977 Burr-Brown Corporation
PDS-372G
Printed in U.S.A. October, 1998
SPECIFICATIONS
At TA = +25°C and VCC = ±15V, unless otherwise noted.
VFC32KP, KU
PARAMETER
CONDITIONS
INPUT (V/F CONVERTER) FOUT = VIN/7.5 R1 C1
Voltage Range(1)
Positive Input
Negative Input
Current Range(1)
Bias Current
Inverting Input
Noninverting Input
Offset Voltage(2)
Differential Impedance
Common-mode
Impedance
MIN
TYP
>0
>0
>0
INPUT (F/V CONVERTER) VOUT = 7.5 R1 C1 FIN
Impedance
Logic “1”
Logic “0”
Pulse-width Range
ACCURACY
Linearity Error(3)
Offset Error Input
Offset Votlage(2)
Offset Drift(6)
Gain Error(2)
Gain Drift(6)
Full Scale Drift
(offset drift and
gain drift)(6, 7)
Power Supply
Sensitivity
MIN
+0.25mA
x R1
–10
+0.25
MIN
✽
✽
✽
✽
✽
✽
500 || 3
✽
✽
150 || 10
+1.0
–0.05
✽
✽
✽
✽
✽
300 || 3
50 || 10
0.1
100
250
4
150k/FMAX
VFC32SM
MAX
✽
300 || 10
MAX
UNITS
✽
✽
V
✽
✽
✽
✽
V
mA
✽
✽
✽
nA
nA
mV
kΩ || pF
✽
✽
✽
✽
✽
✽
TYP
✽
✽
✽
✽
✽
✽
✽
✽
✽
✽
✽
✽
MΩ || pF
✽
✽
✽
kΩ || pF
V
V
µs
±0.005
±0.010(4)
✽
✽
✽
✽
% of FSR(5)
±0.025
±0.05
✽
✽
✽
✽
% of FSR
±0.05
1
±3
5
±75
±75
f = 10kHz
f = 10kHz
TYP
✽
✽
✽
✽
20
100
1
650 || 10
0.01Hz ≤ Oper
Freq ≤ 10kHz
0.1Hz ≤ Oper
Freq ≤ 100kHz
0.5Hz ≤ Oper
Freq ≤ 500kHz
VFC32BM
MAX
f = DC, ±VCC = 12VDC
to 18VDC
✽
✽
✽
✽
±50
±50
4
±0.015
✽
✽
✽
✽
✽
±70
±70
±100
±100
% of FSR
✽
±150
±150
mV
ppm of FSR/°C
% of FSR
ppm/°C
ppm of FSR/°C
✽
% of FSR/%
✽
✽
V
✽
✽
µA
✽
✽
V
s
ns
✽
✽
V
mA
Ω
pF
✽
OUTPUT (V/F CONVERTER) (open collector output)
ISINK = 8mA
Voltage, Logic “0”
Leakage Current,
Logic “1”
Voltage, Logic “1”
0
VO = 15V
External Pull-up Resistor
Required (see Figure 4)
For Best Linearity
IOUT = 5mA, CLOAD = 500pF
Pulse Width
Fall Time
0.2
0.4
0.01
1.0
✽
✽
✽
✽
✽
✽
✽
VPU
✽
0.25/FMAX
✽
✽
400
OUTPUT (F/V CONVERTER) VOUT
IO ≤ 7mA
VO ≤ 7VDC
Closed Loop
Without Oscillation
Voltage
Current
Impedance
Capacitive Load
DYNAMIC RESPONSE
Full Scale Frequency
Dynamic Range
Settling Time
Overload Recovery
✽
✽
0 to +10
+10
500(8)
(V/F) to Specified Linearity
for a Full Scale Input Step
< 50% Overload
✽
✽
(9)
(9)
±11
TEMPERATURE RANGE
Specification
Operating
Storage
✽
✽
1
100
6
POWER SUPPLY
Rated Voltage
Voltage Range
Quiescent Current
✽
✽
0
–25
–25
±15
±5.5
±20
±6.0
+70
+85
+85
–25
–55
–65
✽
✽
kHz
decades
✽
✽
✽
✽
✽
✽
✽
✽
+85
+125
+150
–55
–55
–65
V
V
mA
+125
+125
+150
°C
°C
°C
✽ Specification the same as VFC32KP.
NOTES: (1) A 25% duty cycle (0.25mA input current) is recommended for best linearity. (2) Adjustable to zero. See Offset and Gain Adjustment section. (3) Linearity error is specified
at any operating frequency from the straight line intersecting 90% of full scale frequency and 0.1% of full scale frequency. See Discussion of Specifications section. Above 200kHz,
it is recommended all grades be operated below +85°C. (4) ±0.015% of FSR for negative inputs shown in Figure 5. Positive inputs are shown in Figure 1. (5) FSR = Full Scale Range
(corresponds to full scale frequency and full scale input voltage). (6) Exclusive of external components’ drift. (7) Positive drift is defined to be increasing frequency with increasing
temperature. (8) For operations above 200kHz up to 500kHz, see Discussion of Specifications and Installation and Operation sections. (9) One pulse of new frequency plus 1µs.
VFC32
2
ELECTROSTATIC
DISCHARGE SENSITIVITY
ABSOLUTE MAXIMUM RATINGS
Supply Voltage ................................................................................... ±22V
Output Sink Current (FOUT ) ................................................................ 50mA
Output Current (VOUT) ...................................................................... +20mA
Input Voltage, –Input ..................................................................... ±Supply
Input Voltage, +Input ..................................................................... ±Supply
Comparator Input .......................................................................... ±Supply
Storage Temperature Range:
VFC32BM, SM ............................................................. –65°C to +150°C
VFC32KP, KU ................................................................ –25°C to +85°C
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING
NUMBER(1)
VFC32KP
VFC32BM
VFC32SM
VFC32KU
14-Pin Plastic DIP
TO-100 Metal
TO-100 Metal
SO-14 SOIC
010
007
007
235
TEMPERATURE
RANGE
0°C to 70°C
–25°C to +85°C
–55°C to +125°C
0°C to +70°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PIN CONFIGURATIONS
Top View
M Package
(TO-100)
P Package
U Package
(Epoxy Dual-in-line)
VOUT
–In
–VCC (Case)
10
Input Amp
2
9
Switch
3
One-Shot
Capacitor
1
Oneshot
8
4
7
5
NC
+VCC
Common
Comparator
Input
–In
1
NC
2
13 VOUT
NC
3
12 +VCC
–VCC
4
11 Common
One-Shot
Capacitor
5
NC
6
fOUT
7
6
fOUT
Input
Amp
Switch
+In
Oneshot
14 +In
10
Comparator
Input
9
NC
8
NC
NC = no internal connection
External connection permitted.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
3
VFC32
TYPICAL PERFORMANCE CURVES
At TA = +25°C and VCC = ±15V, unless otherwise noted.
LINEARITY ERROR vs OPERATING FREQUENCY
LINEARITY ERROR vs FULL SCALE FREQUENCY
1
fFULL SCALE = 10kHz, 25% Duty Cycle
TA = +25°C
Linearity Error (Hz)
Duty Cycle = 25%
at Full Scale
0.01
TA = +25°C
0.001
0.5
0
–0.5
–1.0
1k
10k
100k
1M
0
1k
2k
Full Scale Frequency (Hz)
3k
1000
100
(SM, KP, KU)
(BM)
10
1k
10k
100k
Full Scale Frequency (Hz)
VFC32
4k
5k
6k
7k
Operating Frequency (Hz)
FULL SCALE DRIFT vs FULL SCALE FREQUENCY
Full Scale Temp Drift (ppm of FSR/°C)
Typical Linearity Error (% of FSR)
0.10
4
1M
8k
9k
10k
APPLICATION INFORMATION
approximately 2.5Vp-p integrator voltage waveform. If C2’s
value is made too low, the integrator output voltage can
exceed its linear output swing, resulting in a nonlinear
response. Using C2 values larger than shown in Figure 2 is
acceptable.
Figure 1 shows the basic connection diagram for frequencyto-voltage conversion. R1 sets the input voltage range. For a
10V full-scale input, a 40kΩ input resistor is recommended.
Other input voltage ranges can be achieved by changing the
value of R1.
V FS
R1 =
(1)
0.25mA
Accuracy or temperature stability of C2 is not critical because its value does not directly affect the output frequency.
For best linearity, however, C2 should have low leakage and
low dielectric absorption. Polycarbonate and other film
capacitors are generally excellent. Many ceramic types are
adequate, but some low-voltage ceramic capacitor types
may degrade nonlinearity. Electrolytic types are not recommended.
R1 should be a metal film type for good stability. Manufacturing tolerances can produce approximately ±10% variation
in output frequency. Full-scale output frequency can be
trimmed by adjusting the value of R1—see Figure 3.
The full-scale output frequency is determined by C1. Values
shown in Figure 1 are for a full-scale output frequency of
10kHz. Values for other full-scale frequencies can be read
from Figure 2. Any variation in C1—tolerance, temperature
drift, aging—directly affect the output frequency. Ceramic
NPO or silver-mica types are a good choice.
FREQUENCY OUTPUT PIN
The frequency output terminal is an open-collector logic
output. A pull-up resistor is usually connected to a 5V logic
supply to create standard logic-level pulses. It can, however,
be connected to any power supply up to +VCC. Output pulses
have a constant duration and positive-going during the oneshot period. Current flowing in the open-collector output
transistor returns through the Common terminal. This terminal should be connected to logic ground.
For full-scale frequencies above 200kHz, use larger capacitor values as indicated in Figure 2, with R1 = 20kΩ.
The value of the integrating capacitor, C2, does not directly
influence the output frequency, but its value must be chosen
within certain bounds. Values chosen from Figure 2 produce
fO
VINT
Pull-Up Voltage
0V ≤ VPU ≤ +VCC
+15V
C2
10nF film
+5V
0.1µF
VINT
RPU
4.7kΩ
R1
40kΩ
fOUT
VIN
0 to 10kHz
One-Shot
0 to 10V
VFC32
0.1µF
Pinout shown is
for DIP or SOIC
packages.
C1
3.3nF
NPO Ceramic
–15V
FIGURE 1. Voltage-to-Frequency Converter Circuit.
5
VFC32
VPU
≤ 8mA
RPU
FREQUENCY-TO-VOLTAGE CONVERSION
PRINCIPLES OF OPERATION
Figure 4 shows the VFC32 connected as a frequency-tovoltage converter. The capacitive-coupled input network C3,
R6 and R7 allow standard 5V logic levels to trigger the
comparator input. The comparator triggers the one-shot on
the falling edge of the frequency input pulses. Threshold
voltage of the comparator is approximately –0.7V. For
frequency input waveforms less than 5V logic levels, the
R6/R7 voltage divider can be adjusted to a lower voltage to
assure that the comparator is triggered.
The VFC32 operates on a principle of charge balance. The
signal input current is equal to VIN/R1. This current is
integrated by input op amp and C2, producing a downward
ramping integrator output voltage. When the integrator output ramps to the threshold of the comparator, the one-shot is
triggered. The 1mA reference current is switched to the
integrator input during the one-shot period, causing the
integrator output ramp upward. After the one-shot period,
the integrator again ramps downward.
The value of C1 is chosen from Figure 2 according to the
full-scale input frequency. C2 smooths the output voltage
waveform. Larger values of C2 reduce the ripple in the
output voltage. Smaller values of C2 allow the output voltage
to settle faster in response to a change in input frequency.
Resistor R1 can be trimmed to achieve the desired output
voltage at the full-scale input frequency.
The oscillation process forces a long-term balance of charge
(or average current) between the input signal current and the
reference current. The equation for charge balance is:
I IN = I R(AVERAGE)
(2)
V IN
= f O t OS (1mA)
R1
(3)
0.1µF
Where:
fO is the output frequency
tOS is the one-shot period, equal to
tOS = 7500 C1 (Farads)
C2
Capacitor Value
10nF
1nF
33,000pF
C1 =
– 30pF
fFS (kHz)
The values suggested for R1 and C1 are chosen to produce a
25% duty cycle at full-scale frequency output. For full-scale
frequencies above 200kHz, the recommended values produce a 50% duty cycle.
R1 = 40kΩ
Above 200kHz Full-Scale
66,000pF
C1 =
– 30pF
fFS (kHz)
100pF
R1 = 20kΩ
10pF
1k
10k
(4)
100k
1M
Full Scale Frequency (Hz)
FIGURE 2. Capacitor Value Selection.
VINT
C2
0.1µF
13
Gain Trim
10kΩ
VIN
10
+5V
+15V
4.7kΩ
12
7
35kΩ
1
One-Shot
14
+15V
10MΩ
Offset
Trim
11
1mA
100kΩ
VFC32
–15V
4
Pinout shown is for
DIP and SOIC packages.
–15V
FIGURE 3. Gain and Offset Voltage Trim Circuit.
VFC32
6
5
C1
33nF
fO
+15V
2.5V
0V
0 to 10kHz
0V
–2.5V
12kΩ
500pF
fIN
5V Logic
Input
C2
0.1µF
2.2kΩ
VO
0 to 10V
R1
40kΩ
+15V
13
12
10
7
10MΩ
1
+15V
One-Shot
14
100kΩ
–15V
11
VFC32
4
5
C1
3.3nF
–15V
FIGURE 4. Frequency-to-Voltage Converter Circuit.
+15V
+5V
0.1µF
C2
2nF
13
12
10
7
1
VIN
One-Shot
14
fOUT
0 to 50kHz
0V to –10V
R1
40kΩ
11
VFC32
Nonlinearity may be higher than
specified due to common-mode
voltage on op amp input.
0.1µF
4
5
C1
650pF
Pinout shown is
for DIP or SOIC
package.
–15V
FIGURE 5. V/F Converter—Negative Input Voltage.
7
VFC32
NC
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
VFC32BM
OBSOLETE
TO-100
LME
10
TBD
Call TI
Call TI
-25 to 85
VFC32KP
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
VFC32KP
VFC32KPG4
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
VFC32KP
VFC32KU
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
VFC32KU
VFC32KU/2K5
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
VFC32KU
VFC32KUE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
VFC32KU
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
VFC32KU/2K5
Package Package Pins
Type Drawing
SOIC
D
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
9.0
2.1
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
VFC32KU/2K5
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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