Survey
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
Capacitive Discontinuity in Cross Talk Effect Mihai Dărăban, Dan Pitică Applied Electronics Department Technical University of Cluj Napoca Cluj Napoca, Romania [email protected] Abstract— There are a lot of studies that show the effect of coupled lines, but most implementation in MatLab are based on using an n-section lump circuit approximation model, which has a limited bandwidth. Also on every PCB, on a trace it appears a capacitive discontinuity, that influences the coupling of the transmission lines. We propose another approach to describe the coupled lines, and which will be capable to determine the effect of capacitive discontinuity on the coupled lines. Keywords-cross talk; pcb; transmision line; coupeld; noise I. INTRODUCTION Cross talk is a phenomenon that appears more and more on the pcb due to the small rise time of the logical gates and also because the space between the traces is getting smaller, following the direction of miniaturization. All the signals on the pcb are affected by cross talk, but in general bus traces are most affected by this signal-integrity, and not only the buses from the on chip but also the ones on the motherboards or other pcb board because of the faster and faster logical families. Because the traces are not uniform, it is possible to appear a capacitive discontinuity that it can influence the propagation of an unwanted signal from one net to an adjacent net (cross talk). There it can appear and inductive discontinuities, but it is complementary to the effect of capacitive discontinuity, so it is enough to study one effect to understand the other one. Capacitive discontinuity doesn’t mean an interrupt in the trace, but a mismatch in the impedance of the trace, that the signal it sees in high frequency. A capacitive discontinuity it is mostly due to the receiver input gate capacitance, corners, via or trace width change. It will be shown the effect of capacitive discontinuity on the cross talk between two adjacent traces. II. THEORETICAL BACKGROUND A. Cross Talk Phenomenon Cross talk appears between two or more adjacent nets because of the electromagnetic field lines, there are electricfield lines between the signal and the return path and loops of magnetic-field lines around the signal and return paths. The electric and magnetic field lines are not confined to the immediate space between the signal and the return paths, the field lines are spread out into the surrounding volume (fringe fields), [3]. Because of the proprieties of electromagnetic field, it is possible that if a signal and his return path are passing together in a region where there are still large fringe filed from another net, the second trace may pick up noise from these field lines, [3]. Cross talk can appear only when on a trace, the signal voltage and current are changing, creating electric and magnetic field lines. There are two types of scenarios in which cross talk may occur: function cross talk noise and dynamic crosstalk, [5]. Function cross talk noise appears when the victim line experiences a voltage spike, because the aggressor (active line) is switching. In the second scenario, cross talk is experienced when aggressor and victim lines are switching simultaneously. On a passive line, cross talk appears at both ends. To distinguish between the two ends of the line where the cross talk can appear, the noise which appears near the source is called “the near-end noise”, and the noise that appears at the other end of the trace is called “far-end noise”, [3]. B. Models to Simulate Cross Talk There are two methods by which cross talk between two traces can be simulated. One method is based on describing the traces using lump-circuit-model approximation. Each trace is represented by n-section of LC cell network. The coupling between the nets is described with the help of mutualcapacitance and mutual inductance elements. The lump-circuit-model it is an approximation, because the actual capacitance and the loop inductance that appears between the trace and its return path, it is distributed uniformly in the n-section of LC cell network. The error of the model it gets lower, as the number of the LC cells which describe the model, are increasing. The formula to compute the minimal number of lumped sections for an accurate model, [3]: n 10 BW TD where: (1) n – the minimum number of lumped sections; BW – the required bandwidth of the model; TD – the time delay of each transmission line. Z odd Lodd ; TDodd Lodd Codd Codd Ceven C11 (4) (5) Ceven – the total capacitance from the signal to the return of one line when the pair is driven in the even mode Leven L11 L12 (6) Figure 1. Structure of a transmision line described using LC cells Another approach which can be used to simulate the cross talk between two adjacent traces is by using odd- and evenmode impedance and the odd- and even-mode time delays, which are able to describe all the transmission-line and coupling effects. The biggest advantage of this model is that its bandwidth is equal to that of an ideal lossless transmission line, [3]. When the cross talk phenomenon is described using the odd and the even mode, it is important how the transmission lines are driven. For the odd mode a differential signal must be applied, and for the even mode a common signal. This is possible because any two waves can be described with the help of a differential and common signal. Leven – the total loop inductance from the signal to the return path of one line when the pair is driven in the even mode Z even Leven ; TDeven Leven Ceven Ceven (7) C. Losses because of skin and dielectric effect When the signal propagates down a trace on a PCB structure, there are two kinds of losses that can appear, on is because of the copper and the dielectric that insulates the traces of the return plane. In copper the losses appear because every trace it has a resistance, which at high frequency it increases because the current it is no longer uniformly distributed in the volume of the trace, appearing the skin effect. The losses in the dielectric between the traces appear also at high frequency when the conductivity of the dielectric increases and because of this a AC – resistance leakage appears between the trace and the return path. Figure 2. EOdd and even propagation mode field lines The transition from the model based on n-section LC cell network to the model based on odd and even mode propagation it is possible based on the following relations: Codd C11 2 C12 (2) Codd – the total capacitance from the signal to the return path of one line when the pair is driven in the odd mode; C11 – the total capacitance from the signal to the return path for the LC network model; C12 – the total mutual capacitance in LC network model; Cload – the loaded capacitance of the signal line (C11 + C12) Lodd L11 L12 (3) Lodd – the total loop inductance from the signal to the return path of one line when the pair is driven in the odd mode; L11 – the total loop inductance from the signal to the return path, for the LC network model; L12 – the total mutual inductance in LC network model In conclusion the losses are frequency-dependent, as can be observed in the following formulas by which are computed the losses in copper and dielectric, [3]: R 0.8 len w 2.5 1 f (8) G tan( ) C R – the resistance of the line, in Ohms; ρ – the bulk resistivity of the conductor, in Ohm-inches; len – the length of the line, in inches; w – the line width, in inches; f – the sine wave frequency, in GHz, 0.8 – a factor due to the specific current distribution in the signal and return paths G – the shunt conductance from the dielectric, in Siemens; tan(δ) – the dissipation factor; ω – the angular frequency, = 2∙π∙f; C – the capacitance between the signal and the return path By introducing this two parameters the compute of the impedance of the trace it is changing, but also it is changing and the formula by which the speed of the signal in the trace is calculated: Z v R L G C dia1 (Vag Z ag ia1 Va 2 ) L11dx (V pg Z pg i p1 V p 2 ) L12dx dt ( L11dx L22dx L12dx L21dx ) (9) 1 ( R 2 2 L2 )(G 2 2C 2 ) 2 LC RG 2 By using R and G we can compute the losses in cross talk using the first model, and for the second model based on odd and even propagation mode, the effect of losses can be observe by calculating the Z and TD using equation (9). III. SIMULATING CROSS TALK IN MATLAB As mentioned above in the paper, the cross talk phenomenon can be simulated by two methods. One method is using n-section of LC cell network to describe the two traces, [1], which are coupled by mutual inductance and capacitance. This model is described mathematical by using ordinary differential equations, which are applied for each LC cell. di p1 dt (V pg Z pg i p1 V p 2 ) L22dx (Vag Z ag ia1 Va 2 ) L21dx ( L11dx L22dx L12dx L21dx ) dva1 dt (C11dx C12dx )(ia1 ia 2 ) C12dx (i p1 i p 2 ) dv p1 (C11dx C12dx )(i p1 i p 2 ) C12dx (ia1 ia 2 ) dt (10) (C11dx C 22dx 2 C11dx C 21dx ) (C11dx C 22dx 2 C11dx C 21dx ) Electrical behavior of each cell that makes up the transmission line is computed using a second set of differential equations, where k it is the number of the cell. The second method to describe the coupling between two nets is by using odd and even propagation method. From the mathematical point of view this method is simple because it doesn’t require the use of ordinary differential equations (ode). This method only uses the propagation delay and the reflection coefficient when a mismatch occurs. Figure 4. The structure of the k cell in the model A. Decribing the N-Sectiont of LC Cell Network Using Ordinary Differential Equations There are three distinct cases to be treated if nets are defined by small infinitesimal, discrete lumped elements placed periodically down the length of the traces. These three scenarios will be described using different sets of ordinary differential equations. The first system of differential equations, it is describing the LC cell electrical behavior at the end of the trace near the voltage source. diak (Va ( k 1) Vak ) L11dx (V p ( k 1) V pk ) L12dx dt ( L11dx L22dx L12dx L21dx ) di pk dt (V p ( k 1) V pk ) L22dx (Va ( k 1) Vak ) L21dx ( L11dx L22dx L12dx L21dx ) dvak (C11dx C12dx )(iak ia ( k 1) ) C12dx (i pk i p ( k 1) ) dt ( L11dx L22dx L12dx L21dx ) dv pk dt (11) (C11dx C12dx )(i pk i p ( k 1) ) C12dx (iak ia ( k 1) ) ( L11dx L22dx L12dx L21dx ) The last system of ordinary differential equations, it describes the cell from the far end of the line, where the lode is placed. Figure 3. The structure of the first cell in the model Figure 5. The structre of the last cell in the model diaN (Va ( N 1) VaL) ) L11dx (V p ( N 1) V pL ) L12dx dt ( L11dx L22dx L12dx L21dx ) di pN dt (V p ( N 1) V pL ) L22dx (Va ( N 1) VaL ) L21dx ( L11dx L22dx L12dx L21dx ) dvaL (C11dx C12dx )(iaN iaL ) C12dx (i pN i pL ) dt ( L11dx L22dx L12dx L21dx ) dv pL dt (12) (C11dx C12dx )(i pN i pL ) C12dx (iaN iaL ) ( L11dx L22dx L12dx L21dx ) Figure 7. The signals that apears in odd even propagation mode B. Describing the Coupling Between Two Adjacent Lines Using Odd and Even Propagation Mode Analyzing the cross talk phenomenon using n section LC cell network it needs a lot of computation resources and time, because each cell it is described by a system of four ordinary differential equations. A method to reduce the time need to compute is using odd and even mode propagation method. For this method it is needed only two transmission lines, one it simulates the odd-mode and the second one the even mode. The propagation time and impedance for each mode are computed using relations described in section II.B. Because of the difference between the two propagation modes it is important that the value of time step used to resolve the equations in MatLab, must be the lowest common divisor between todd and teven. The odd and even propagation mode will be resolved using this time step so that there will be an integer number of steps for each mode of propagation and also the results of calculation to have the same time base, to be able to add and subtract the results from the odd and even propagation mode to obtain the signals on the active and passive line. The signals from the active line are obtained by adding the results from the odd and even propagation modes. On the other hand the signals from the passive line are obtained by subtracting the odd propagation mode results from the results obtained in the even propagation mode. Figure 6. The model to simulate odd even propagation mode Because any wave can be described with the help of an odd and even wave, the odd and even wave which are applied on the two transmission lines are obtained as follows: Vodd Veven Vactive V pasive 2 Vactive V pasive (13) Figure 8. The signals on the active and passive line The two transmission lines that simulate the odd and even propagation modes are implemented in MatLab using reflection coefficient. The two pair of lines are geometrically symmetric with the same line widths and dielectric spacing. If the conductors are not symmetric the odd and even mode voltage are no longer so simple, and a field solver is needed to determine the specific odd and even mode voltage patterns 2 Let’s presume that there are two transmission lines coupled, each line has a total inductance of 89,6nH and a total capacitance of 38.61pF, the value of total mutual inductance is of 20.03nH, and the total mutual capacitance is of 4.48pF. Computing the parameters of odd and even propagation mode, using the values above, we obtain Zodd=38.24Ω, Zeven=53.28Ω, todd=1.82ns and teven=2.06ns. The small difference of 0.24ns between the two types of propagation it’s responsible for the near and noise and far end noise on the passive line. C. Comparison Between the Two Models The time step which we showed is very important how it selected for the odd and even mode propagation model, it is also a problem in the first method which has been described. Every cell in the n section LC cell network has its time delay which must be higher than the time between two samples of the signal applied to the line, to obtain accurate results. In the first model the time step it can get very small depending on the value of n, which determines the number of LC cell sections. As can be observed in figures below by increasing the number of sections the model error it gets smaller but the time delay per cell it gets smaller also, increasing a lot the time needed to finish the simulation. Figure 9. Near end noise on the passive line when ranging the number of cells in the model Figure 12. Spectrum if the near and far end noise on the passive line Each of the methods presented it is capable of determine the losses that appear in the transmission line because of skin effect and losses in dielectric. This is done by breaking the signals applied to the lines in their spectral components using fast fourier transformation. To the transmission lines are applied only the sine waves components with their corresponding amplitudes and phases. The number of sine waves which are applied it is determined by the minimal bandwidth required to reproduce the rise time of the original signal, [3]: Figure 10. Far end noise on the passive line when ranging the number of cells in the model In cross talk the value of n computed using equation (1), it is no longer correct because the spectrum of cross talk is larger than that of the signal that appears on a transmission line which is not coupled. By increasing the number of cells the components of high frequency that appear on the far signal on the passive line are not cut off, and so we obtain an accurate value of the amplitude. Also the higher number of cells is reducing the ringing effect that is a falls noise, which appears because of the limited bandwidth of the model. Figure 11. Spectrum of the signals on the active line Odd and even propagation model it has a bandwidth which is equal to that of an ideal lossless transmission line, and so the time step it only depends on the lowest common divisor between todd and teven. BW 0.35 rise time (14) BW – the required bandwidth to reproduce the rise time of the signal; rise time – the rise time of the signal o which FFT was applied In the first model the cell it is changing by introducing R, responsible for losses in cooper, and G responsible for losses in dielectric. Each of these two parameters is computed each time a sine component it is applied, by using the formulas from section II.C. The structure of each cell is that from the figure 13. Figure 13. The cell structure when introducing skin and dielectric losses Figure 14. The signals on the active and passive line when introducing skin and dielectric losses (simulated using 30 cells, BW=1.5GHz) By introducing the skin and dielectric losses the amplitude of the noise on the passive line decreases, because of the attenuation introduced by the increased resistance of the traces and the leakage resistance of the dielectric. IV. HOW DOES CAPACITIV DISCONTINUITY INFLUENCE THE CROSS TALK BETWEEN TWO TRACES Coupling between two traces can be influence by the distance between them or by their dimensions, but another source which can affect the coupling between the two traces, is a mismatch in impedance. A mismatch on one of the traces coupled can occur because of a capacitive discontinuity, which appears because of a via, or a change in the width of the trace or because of the input gate capacitance. The capacitive discontinuity it appears for the signal like a lump capacitor, which produces a mismatch in the impedance the signal it sees when traveling down the line, resulting in reflections. The values of capacitive discontinuity it varies between 0.2-1pF for a via, [4], and between 2pF to 10pF for the input gate capacitance. For the first model it is very simple to observe the effects of capacitive discontinuity, it is only necessary to specify the position along the line of the capacitive discontinuity, by point the LC cell in which appears. In that cell the equations that describe the propagation of signals are modified, according to the new lump capacitance that appears on the line. A solution to reduce the crosstalk when a capacitive discontinuity appears is to place it as much as possible to the near end of the transmission line but that affects the signal on the active line, [2], so a compromise must be made. Figure 16. How the possition of capacitiv discontinuity can influence the noise levels V. The second model is better to be used in simple coupled transmission lines, and that lines should be symmetrical as much as possible to obtain accurate results. The model it has an infinite bandwidth and the time needed to compute it is smaller than that of the ordinary differential equation model. In both models time step it is crucial but especially in the first model, in the second one the precision whit which the results are computed it is more important, because the reflected wave after a number of propagation tend to get very small, and so we need a lot of digits after the decimal point to obtain good results. REFERENCES [1] [2] [3] [4] [5] Figure 15. Simulating capacitiv discontinuity using LC network cell CONCLUSION As we showed the both methods have their ups and downs. The first model it is easier to be used in complex coupled transmission lines because it only requires some minor modification in the equation system to describe the discontinuity that can appear. The accuracy of the results depends of a lot of parameters. If we want a good accuracy then the time needed to compute must increase, and also we must pay attention to the bandwidth of the model by selecting the correct number of the LC network cells, which describes the model. M. Rangu and C. Negrea, “An educational tool for transmission lines animations”, ISSE Conference, 12-16 May 2010 Warsaw, Poland, in press M. Daraban and D. Pitica, “The Influence of Capacitive Discontinuity in Signal Inegrity on PCB Traces”, ISSE Conference, 12-16 May 2010 Warsaw, Poland, in press E. Bogatin, “Signal and power integrity - simplified”, Second edition, Pretince Hall, pp. 337–553, July 2009 N. Codreanu, “Metode avansate de investigatie a structurilor PCB”, Cavallioti, pp. 175-237, 2009 B. K. Kausik and S. Sarkar, “Crosstalk analysis for a CMOS gate driven inductively and capacitively coupeld interconects”, Microelectronics Journal, vol. 39, pp. 1834-1842, 2008