Download Better Heat Dissipation with Metal Nanocomposite Carbon Nano

1
2
nm
Better Heat Dissipation with Metal Nanocomposite
Carbon Nano Tubes
Heat sinks are component that cools
devices by dissipating the generated
heat into the surrounding air. Carbon
nanotubes (CNTs) have been found
to be a better alternative for copper
(Cu) to be used in heat sinks due to
their
flexibility,
resilience
and
lightness. The invention of a
fabrication process of copper matrix
nanocomposite
powder
is
an
innovative dispersion method to
formulate multi-walled Cu-nanotubes
with enhanced thermal conductivity.
Computer components can thus be
kept as cool as possible for as long
as possible.
The ultra-large-scale-integration of integrated circuits (IC), microelectronic components and devices continuously increases power
density. State-of-the-art ICs for microprocessors operated at high frequencies are routinely characterised by power densities on
the order of tens of W/cm2. Such a large density leads to highly localised heating of ICs (“hot spot”) and subsequent hazard to
failure, thus, the importance to overcome this problem for the next-generation of IC packages, lasers and microwave generators. A
most accurate and reliable control of those high heat dissipating devices is mandatory for achieving the highest possible
performance and instrument solution.
Heat sinks are components that cool devices by dissipating the generated heat into the surrounding air. Heat sinks are usually
placed in direct contact with the heat source that absorbs the heat and thermally conduct the heat. The end surfaces of such
conducting devices are often coupled with heat exchangers, e.g. in the case of a computer wherein a fan is installed to dissipate
the heat and similarly, radiators installed for automobiles. Thermal conductivity of the heat sink is one of the most important
parameters that determines the rate of cooling since it is in direct contact with the source. Heat sinks with low thermal conductivity
are limited by spreading resistance. The spreading resistance occurs when heat is dissipated from a smaller area to a larger area
with finite thermal conductivity. Therefore for a better heat sink, the material used should provide a large surface area and high
thermal conductivity.
Traditionally, copper (Cu) was used in heat sinks, but with semiconductors shrinking at an accelerated pace, their alternates were
sought. Carbon nanotubes (CNTs) are an alternate source for these semiconductors where they are more flexible, resilient and 10
times lighter than any other cooling material available. However, there are still modifications being done to improve the efficiency
of carbon nanotubes. The present invention provides a novel dispersion method to formulate multi-walled Cu-nanotubes with
enhanced thermal conductivity.
•
The
method
of
thermal
management
of
portable
electronic element using carbon
nano tube metal nanocomposite
has been protected via the filing of
a Malaysian patent.
The inventors would like to speak
to companies interested
in
licensing the technology.
This multi-level mixing technique shows a uniform dispersion of CNTs in Cu
matrix
•
CNTs functionalisation process has enhanced both Cu-CNT bonding and CNTs
dispersion
•
Adding 10 vol% of CNTs showed high thermal conductivity of 581 W/mK with
approximately 70% higher than the most advanced competitor approach of CuCNTs nanocomposites
•
Same composite shows 45% higher than pure cast copper and 35% higher than
pure silver, which is considered the highest thermal conductive metal
J
E: [email protected]
T: +603 8319 3116)
Most of the electronic devices are not certified to function properly beyond 80°C. In a loaded PC with standard cooling, operating
temperatures can easily exceed the limit. The life of an electronic device is directly related to its operating temperature. Each 10°C
temperature rise reduces component life by 50%. Conversely, each 10°C temperature reduction increases component life by 100%.
Therefore, it is recommended that computer components be kept as cool as possible for maximum reliability, longevity, and return on
investment.
© 2014 PlaTCOM Ventures. All rights reserved.
www.platcomventures.com