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DYNAMIC LOGIC
Dynamic CMOS
• In static circuits the output is connected to either
GND or VDD via a low resistance path.
– fan-in of n requires 2n (n N-type + n P-type) devices
• Dynamic circuits use temporary storage of signal
values on the capacitance of high impedance nodes.
– requires on n + 2 (n+1 N-type + 1 P-type) transistors
Dynamic Gate
Clk
Clk
Mp
off
Mp on
Out
In1
In2
In3
CL
PDN
A
C
B
Clk
Me
Clk
Two phase operation
Precharge (Clk = 0)
Evaluate (Clk = 1)
1
Out
((AB)+C)
off
Me on
Conditions on Output
• Once the output of a dynamic gate is discharged, it
cannot be charged again until the next precharge
operation.
• Inputs to the gate can make at most one transition
during evaluation.
• Output can be in the high impedance state during
and after evaluation (PDN off), state is stored on CL
Properties of Dynamic Gates
• Logic function is implemented by the PDN only
– number of transistors is N + 2 (versus 2N for static complementary CMOS)
• Full swing outputs (VOL = GND and VOH = VDD)
• Non-ratioed - sizing of the devices does not affect the
logic levels
• Faster switching speeds
– reduced load capacitance due to lower input capacitance (Cin)
– reduced load capacitance due to smaller output loading (Cout)
– no Isc, so all the current provided by PDN goes into discharging CL
Properties of Dynamic Gates
• Overall power dissipation usually higher than static
CMOS
– no static current path ever exists between VDD and GND
(including Psc)
– no glitching
– higher transition probabilities
– extra load on Clk
• PDN starts to work as soon as the input signals exceed
VTn, so VM, VIH and VIL equal to VTn
– low noise margin (NML)
• Needs a precharge/evaluate clock
Issues in Dynamic Design 1: Charge
Leakage
CLK
Clk
Mp
Out
CL
A
Clk
Me
Evaluate
VOut
Precharge
Leakage sources
Leakage is dominated by the subthreshold current
Solution to Charge Leakage
Keeper
Clk
Mp
A
Mkp
CL
Out
B
Clk
Me
Same approach as level restorer for pass-transistor logic
Issues in Dynamic Design 2: Charge
Sharing
Clk
Mp
Out
A
CL
B=0
Clk
CA
Me
CB
Charge stored originally on CL
is redistributed (shared) over
CL and CA leading to reduced
robustness
Charge Sharing Example
Clk
Ca=15fF
B
Cc=15fF
A
A
B
B
C
C
Clk
Out
CL=50fF
!B
Cb=15fF
Cd=10fF
Charge Sharing
Assume that initial voltage Vx=0 and Vout=VDD
VDD
case 1) if V out < VTn
VDD
Mp
Clk

Mp
Out
Out
CL
Ma
A
A
CL
Ma
X X
M
B = 0 B = 0 Mb b

Clk
Me
Me
C
Caa
Cb
Cb
Vx increases up to VDD-VTn
when Ca is small comparing to CL
C L VDD = C L Vout  t  + Ca  VDD – V Tn  V X  
or
Ca
V out = Vout  t  – V DD = – --------  V DD – V Tn  V X  
CL
case 2) if V out > VTn
Ca 
 ---------------------
Vout = –V DD 
C
+
C
 a
L
as CL VDD=CL VOUT + Ca VOUT
VOUT = VDD CL / (CL+Ca)
Vx increases less up to
VOUT
when Ca is larger
Solution to Charge Redistribution
Clk
Mp
Mkp
Clk
Out
A
B
Clk
Me
Precharge internal nodes using a clock-driven transistor (at
the cost of increased area and power)
Issues in Dynamic Design 3:
Backgate Coupling
Clk
Mp
A=0
Out1 =1
CL1
Out2
CL2
B=0
Clk
Me
Dynamic NAND
Static NAND
When In goes up from 0 to VDD, output of static
NAND gate (Out2) goes down from VDD to 0 and
pulls down Out1 through the capacitive coupling
In
Backgate Coupling Effect
3
2
Out1
1
Clk
0
In
Out2
-1
0
2
Time, ns
4
6
Issues in Dynamic Design 4: Clock
Feed Through
Clk
Mp
A
CL
So voltage of Out can rise above VDD.
B
Clk
Out
Coupling between Out and Clk input
of the precharge device due to the
gate to drain capacitance.
Me
The fast rising (and falling edges) of
the clock couple to Out.
Clock Feed Through
Clock feed through
Clk
Out
2.5
In1
In2
1.5
In3
In &
Clk
0.5
In4
Clk
Out
-0.5
0
0.5
Time, ns
More noise is generated as
a result of clock coupling
1
Clock feed through
Other Effects
• Capacitive coupling between output wires
pulls down prestored charges
• Substrate coupling
• Minority charge injection
• Supply noise (negative ground bounce
may discharge the output)
Cascading Dynamic Gates
V
Clk
Clk
Mp
Clk
Mp
Out1
In
Clk
Out2
In
Out1
Me
Clk
Output signal loss
VTn
Me
V
Out2
t
Only 0  1 transitions allowed at inputs!
So do not connect these gates directly
Domino Logic
Clk
In1
In2
In3
Clk
Mp
11
10
PDN
Me
Out1
Clk
Mp Mkp
Out2
00
01
In4
In5
Clk
PDN
Me
Here we guarantee proper 0 to 1 transitions between gates
Why Domino?
Clk
Ini
Inj
Clk
PDN
Ini
Inj
PDN
Ini
Inj
PDN
Like falling dominos!
Ini
Inj
PDN
Properties of Domino Logic
• Only non-inverting logic can be implemented
• Very high speed
– static inverter can be skewed, only L-H transition
so make PMOS of inverter stronger
– Input capacitance reduced
so smaller logical effort
Designing with Domino Logic
VDD
VDD
VDD
Clk
Mp
Clk
Mp
Out1
Mr
Out2
In1
In2
In3
PDN
Clk
Me
PDN
In4
Clk
Inputs = 0
during precharge
Me
Can be eliminated!
but be aware of the
short circuit path from
delayed clock
Footless Domino
VDD
Clk
VDD
Mp
Clk
Mp
Out1
0
0
Clk
Mp
Out2
1
0
In1
1
VDD
Outn
1
0
In2
1
0
In3
1
0
The first gate in the chain needs a foot switch
Precharge is rippling – short-circuit current
A solution is to delay the clock for each stage
Inn
1
0
1
Differential (Dual Rail) Domino
off
Clk
Out = AB
1
on
Mp Mkp
Mkp
0
Clk
Mp
1
A
!A
0
!B
B
Clk
Me
Solves the problem of non-inverting logic
Out = AB
np-CMOS
Clk
In1
In2
In3
Clk
Mp
PDN
Me
11
10
Out1
Clk
Me
In4
In5
PUN
Possible coupling
in longer runs to
dynamic node
00
01
Clk
Mp
Out2
(to PDN)
Only 0  1 transitions allowed at inputs of PDN
Only 1  0 transitions allowed at inputs of PUN
NORA Logic
Clk
In1
In2
In3
Clk
Mp
11
10
Out1
PDN
Clk
Me
In4
In5
PUN
use np-CMOS blocks
00
01
Clk
Me
to other
PDN’s
Mp
Out2
(to PDN)
to other
PUN’s