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Catalytic NO Decomposition on Cu-ZSM5: Kinetically Relevant Elementary Steps and Speciation and Role of Cu Structures Bjorn Moden, Patrick Da Costa, Deuk Ki Lee, Enrique Iglesia Department of Chemical Engineering, University of California at Berkeley, Berkeley, CA 94720 Catalytic NOx decomposition remains the most robust strategy for NOx removal from lean combustion effluent streams, because it does not require a reductant. Microporous solids with exchanged cations [1] are among the most active NO decomposition catalysts reported, but their catalytic activity remains too low for practical applications. Many studies have addressed the structural requirements and reaction pathways for this reaction, but the nature of the active Cu species, the unusual temperature dependence of the reaction rates, and the details of the elementary steps involved, especially those required for O2 formation, remain the subject of active study. Here, we report direct evidence for the involvement of (Cu2+-O2--Cu2+)2+ dimers and of redox cycles in NO decomposition turnovers and for a novel mechanism for O2 formation involving the use of NO as an oxygen carrier among distant (Cu2+-O2--Cu2+)2+ dimers. The number and type of Cu2+ and Cu+ structures on Cu-ZSM5 were measured during steady-state and transient NO decomposition and during treatment in CO, H2, or He using X-ray absorption spectroscopy and mass spectrometric analysis of the products formed [2]. Isolated Cu2+ and (Cu2+-O2--Cu2+)2+ dimmers at zeolite exchange sites, were the predominant Cu-species on oxidized catalysts. NO, CO, and He led only to the reduction of Cu dimers to Cu+ species, but H2 reduced both dimers and monomers to Cu0 and restored protons to the exchange sites. The reduction stoichiometries showed that the fraction of the Cu present as dimers increased from 0.46 to 0.78 as the Cu/Al ratio increased from 0.12 to 0.60. The number of Cu2+ monomers reached a constant value of ~0.15 Cu2+/Al, suggesting that only some Al-Al pairs can stabilize such species, which require smaller Al-Al distances than larger (Cu2+-O2--Cu2+)2+ structures. The measured Cu speciation is consistent with the Al radial distribution in the ZSM5 samples used in this study (Si/Al=13-15) [3]. The amount of oxygen evolved as O2 during thermal treatment in He was smaller than that removed with H2 (as H2O) or CO (as CO2), suggesting that only vicinal Cu dimers autoreduce via recombinative desorption steps. N2 and N2O formation rates during NO decomposition were accurately described using a mechanism-based rate equation (r = kapp[NO]2/(1+Kα[O2]1/2), and the rates were proportional to the number of Cu dimers, except at the lowest Cu/Al ratio (0.12), suggesting that dimers are required for kinetically relevant elementary steps [4] (Table). Cu-dimers formed at low Cu/Al ratios appear to have stronger Cu-O bonds, as shown by the higher temperature required for their reduction in CO or He; therefore, the heat of oxygen adsorption is higher leading to a higher Kα, and thus to comparably lower turnover rates. A sequence of elementary steps for N2O, NO2, N2, and O2 formation was proposed by combining steady-state [5] and isothermal and non-isothermal transient rate data [6] with previous spectroscopic evidence for specific adsorbed species [7]. Elementary steps include the cycling of Cu-dimers between (Cu2+-O2--Cu2+)2+ and (Cu+(vac)-Cu+)2+ and the quasi-equilibrium between O2 and (Cu2+-O2--Cu2+)2+. The latter proceeds via a sequence of steps involving NO as a regenerable oxygen carrier, which provides a more efficient route for O2 formation than recombinative desorption steps, which can occur only for vicinal Cu dimers. Oxygen coverages measured during isothermal cycling between He and NO/He streams confirmed the redox nature of NO decomposition catalytic sequences and the role of Cu dimers with labile oxygen atoms as the active structures. N2O is initially formed near ambient temperature product after NO adsorption on reduced Cu+ dimers. The low activation energy for this step, the significant heat of adsorption of NO on Cu+ dimers, and the transition in most abundant surface intermediates from {Cu2+-O2--Cu2+}2+ to {Cu+-(vac)-Cu+}2+ lead to the observed decrease in NO decomposition rates above 750 K. Quasi-equilibrium between O2 and O* is mediated by a set of steps involving NO2 formation and decomposition, which lead to equilibrium NO2, NO and O2 concentrations during NO decomposition at 650-850 K. In these steps, NO acts as a regenerable oxygen carrier, which allows kinetic communication among distant adsorbed oxygen atoms via diffusion of NO2 in the gas phase. Isothermal cycling from NO/He to He and steady-state NO decomposition rates showed that adsorbed nitrate (NO3*), which has been detected by infrared spectroscopy at temperatures up to 673 K [7], is the relevant intermediate in O2 formation during catalytic NO decomposition. The rate expression for NO decomposition and for product formation and the temperature dependence of their rate parameters are consistent with this mechanistic proposal and with the observed temperature effects on the relative abundance of adsorbed species. This study suggests that (Cu+-□-Cu+) structures that can accommodate vicinal adsorbed NO molecules required for N2O formation, and the availability of reversible {Cu2+-O2--Cu2+}2+-{Cu+-□Cu+}2+ cycles (which avoid the formation and agglomeration of Cu0) account for the unique catalytic properties of Cu-ZSM5 in NO decomposition reactions. Table 1. NO decomposition rates per Cutotal, per Cudimer and per Cu2+ on a set of CuZSM5 samples labeled Cu(atomic Cu/Al ratio) at 773 K. For the rate comparison, the rates were extrapolated to the inlet pressures (1 kPa NO and 0 kPa O2). Catalyst Cu(0.60) Cu(0.58) Cu(0.38) Cu(0.36) Cu(0.12) N2 + N2O rate x103 (mol (mol Cui)-1 s-1) per Cutotal per Cudimer per Cu2+ 6.6 8.5 30.2 6.4 9.2 21.4 4.7 7.8 11.8 4.0 7.1 9.0 0.6 1.2 1.1 References 1. M. Iwamoto, H. Yahiro, Y. Mine and S. Kagawa, Chem. Lett., 2 (1989) 213. 2. P. Da Costa, B. Moden, G. D. Meitzner, D. K. Lee and E. Iglesia, Phys. Chem. Chem. Phys., 4 (2002) 4590. 3. M. J. Rice, A. K. Chakraborty and A. T. Bell, J. Catal., 194 (2000) 278. 4. G. D. Lei, B. J. Adelman, J. Sarkany and W. M. H. Sachtler, Appl. Catal. B, 5 (1995) 245. 5. B. Moden, P. Da Costa, B. Fonfe, D. K. Lee and E. Iglesia, J. Catal., 209 (2002) 75. 6. B. Moden, P. Da Costa, D. K. Lee and E. Iglesia, J. Phys. Chem. B, 106 (2002) 9633. 7. M. V. Konduru and S. S. C. Chuang, J. Phys. Chem. B, 103 (1999) 5802.