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ECE 477 Digital Systems Senior Design Project Rev 9/12 Homework 6: Printed Circuit Board Layout Design Narrative Team Code Name: Sports Telemetry Device Group No. 5 Team Member Completing This Homework: Kayode Adeniji________________________ E-mail Address of Team Member: oadeniji@ purdue.edu Evaluation: SEC DESCRIPTION MAX 1.0 Introduction 5 2.0 PCB Layout Design Considerations - Overall 20 3.0 PCB Layout Design Considerations - Microcontroller 10 4.0 PCB Layout Design Considerations - Power Supply 10 5.0 Summary 5 6.0 List of References 10 App A PCB Layout Top & Bottom Copper Screenshot 20 App B PCB Layout To-Scale Component Side Layout 20 TOTAL 100 Comments: Comments from the grader will be inserted here. SCORE ECE 477 Digital Systems Senior Design Project Rev 9/12 1.0 Introduction The main goal of this project is to build a wireless telemetry system that measures angular and translational accelerations experienced by athletes and store the data on an external device. In addition, there will be have wireless capabilities for the device to be able to transmit the stored data from the monitoring device to a base station on the side line. The main purpose of the project is to detect potential brain injury in athletes as quickly as possible, to ensure that the likelihood of permanent damage is minimized. The project contains four printed circuit boards in total, three for the monitoring device and one for the base station. The monitoring device has two PCBs positioned above the ear of each player and houses a 2-axis gyroscope and an accelerometer with a connector to the main PCB that is located behind the head. The main PCB houses a microcontroller, an accelerometer, a charging circuit; two linear voltage regulators, a capacitive proximity sensor, a radio frequency transceiver and NAND flash memory. Connected to the linear voltage regulators will be a lithium ion battery but it will not be housed on the board. It will be housed in a compartment close to the board and be connected by wires. The base station PCB has similar components to the one located behind the head excluding some components. It houses a microcontroller, an RF transceiver, NAND flash memory and a USB controller. The base station PCB also has connection to a lithium ion battery that will not be housed on the board itself. A major constraint for the PCB design is the size, the monitoring device is expected to be placed on the head of the players and should also be able to easily and comfortably fit inside a helmet (Football) if necessary. The two PCBs that are supposed to go on the side of the head are pretty small because they only contain a single gyroscope and accelerometer; which are also very small components. Currently, the side PCBs are 30mm x 45mm and the PCB at the back of the head is 80mm x 50mm. These seem like good dimensions at the moment but may be subject to revision after a closer look at packaging feasibility. -1- ECE 477 Digital Systems Senior Design Project Rev 9/12 2.0 PCB Layout Design Considerations - Overall Due to the fact that a small PCB size is desired, the component placement is crucial, namely for the PCB that is going at the back of the head. The microcontroller is centralized at the top of the board because it is connected to all the other components. The capacitive sensor is located near the microcontroller at the bottom left hand side and the accelerometer is located at the top right hand side. The RF transceiver is isolated at the bottom right hand side to ensure that it is not covered and is in a location that will maximize its functionality. The power supply circuit, which includes the two linear voltage regulators, the battery connection and the charging circuit, are isolated at the top left hand side of the board. The ground will be routed underneath the power supply and then have the bypassing components connected to it to reduce its interference with rest of the components on the board [1]. The oscillator circuit for the microcontroller is located at the bottom of the board, under the micro because it is noisy and thus it is best to isolate it from the other connections. The NAND flash memory is also located at the bottom of the board simply for space management and the USB connection is located on the edge of the board for easy access. The PCB has two 7-input connectors on either side of the board that will connect the relevant signals to each of the two side PCBs. The side PCBs do not require much component mapping because they each only have two components (the gyroscope and the accelerometer). 3.3 volts will power all of the components on the board; this comes from the 3.7-volt lithium ion battery that is connected to two linear voltage regulators, which brings the voltage down to the desired 3.3 volts. Since all the components can operate at the same input voltage, the main consideration that needs to be taken, placement-wise, is isolating the power supply circuit from the rest of the board to reduce noise. Another noise reducing strategy implemented was to place the decoupling capacitors close to the input pins, which is done for all the components. 3.0 PCB Layout Design Considerations - Microcontroller The microcontroller is centered as much as possible on the PCB. The model being used is an ATxmega256A3BU that has 64 pins. During the initial routing, all the pins were describing clearance errors but a simple change of the DRC to a minimum clearance of 6 mil resolved this issue. The external oscillator that is used is located under the microcontroller to reduce the noise and it operates at 33kHz, which is sufficient for this project. The input and output capacitors are -2- ECE 477 Digital Systems Senior Design Project Rev 9/12 placed as close to the pins of the linear voltage regulators as possible as advised on the datasheet [2]. The trace width size of the traces to the microcontroller pads are 10 mil, which is the same width used around the board except for the power and ground. 4.0 PCB Layout Design Considerations - Power Supply The power supply takes input from a USB input and a 3.7-volt lithium ion rechargeable battery, which is the main source of power for this project, which will be located in a separate compartment close to the PCB. The connector for this is on the bottom side of the top left hand corner of the board. A Maxim 1555 charging circuit is used and is located close to the power supply takes input from the USB and the output charges the battery. All these power supply components are placed close to each other and away from the rest of the components on the board to minimize noise. The board uses two regulated power supplies that are both 3.3V. These supplies are linear voltage regulators that are designed according to the correct specifications on the datasheet [2]. The main design consideration that was derived from the datasheet is placing the bypass capacitors close to the input pins to reduce the supply ripple and also to provide instantaneous current. For thermal dissipation considerations, a ground plane will be used, which will be connected to the linear voltage regulators by vias that are placed underneath them. The maximum current that is estimated on the board is 200mA and a trace width size of 12 mil will be used for the ground and power traces. The 3.3V and the GND from the power supply will be traced to the other side of the board so that all the components that require them will easily be able to access them. 5.0 Summary In conclusion, the components on the back PCB will be efficiently placed through the use of intelligent board mapping/planning and manual trace insertion. The two, side PCBs are not really a problem because the components are few and very small so space isn’t much of a constraint. The PCB for the base station is similar in that there are no size limitations for it as its purpose is simply to remain on the sideline and collect information, so this board can be significantly bigger -3- ECE 477 Digital Systems Senior Design Project Rev 9/12 than the other three PCBs. The recommended trace width size from an online trace width calculator for the power is 3.5mil and for the other signals is about 2.3mil but the chosen trace width sizes of 12mil and 10mil respectively should be satisfactory [3]. All that is left to finish is the PCB for the base station, adding the ground plane and fixing a few errors. Some of these errors include vias that are touching, a few right angles on the traces, some overlapping and general routing changes to improve the visual appeal of the board. Generally, single point power and ground layouts will be used, as recommended in the Motorola in their semiconductor application note, as well as some other noise reduction techniques outlined here [4]. -4- ECE 477 Digital Systems Senior Design Project Rev 9/12 6.0 List of References [1] Texas Instruments, “PCB Design Guidelines for Reduced EMI.” [Online] Available: http://www.ti.com/lit/an/szza009/szza009.pdf [2] Texas Instruments, “200mA Low-Iq Low Dropout Regulator for portable devices.” [Online] Available: http://pdf1.alldatasheet.com/datasheet-pdf/view/355086/TI/TLV70033Q1.html [3] “ANSI IPC-2221A PCB Trace Width Calculator.” [Online] Available: http://www.desmith.net/NMdS/Electronics/TraceWidth.html [4] Motorola, “System Design and Layout Techniques for Noise Reduction in MCU Based Systems.” [Online] Available: https://engineering.purdue.edu/ece477/Homework/CommonRefs/AN1259.pdf -5- ECE 477 Digital Systems Senior Design Project Appendix A: PCB Layout Top & Bottom Copper (Back Board) -6- Rev 9/12 ECE 477 Digital Systems Senior Design Project PCB Layout Top & Bottom Copper (Side Board) -7- Rev 9/12 ECE 477 Digital Systems Senior Design Project Appendix B: PCB Layout To-Scale Component Side Layout Back PCB Side PCB -8- Rev 9/12