Survey
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
Alternating current wikipedia , lookup
Power engineering wikipedia , lookup
Switched-mode power supply wikipedia , lookup
Thermal runaway wikipedia , lookup
Electronic engineering wikipedia , lookup
Resilient control systems wikipedia , lookup
Control system wikipedia , lookup
Surface-mount technology wikipedia , lookup
Cross-Cutting Topic Structural and Functional Integration (SFUN) • Technologies and methodologies for achieving higher levels of integration in power electronics (devices through to systems) to enable (some or all of): – – – – – Higher reliability Higher power density (gravimetric/volumetric) Lower cost Better manufacturability Better exploitation of new technologies • Move away from “Lego” power electronics Structural and Functional Integration (SFUN) • This cross-cutting theme is about • What to integrate? • • • • Evaluating benefits “Boundaries” - components/sub-systems/systems What level of “modularity” Trade-off between “one size fits many” and “bespoke systems” • How to achieve integration? • What are the new technologies that can be exploited • Can it be done economically (now/future) • How to design for integration (link with Design Tools and Modelling) • How to implement Structural and Functional Integration (SFUN) • Themes • Themes look at core technologies for Structural and Functional Integration • SFUN activities are identified in all the themes • Cross theme projects • Bring together work from 3 or more themes in a collaborative project to demonstrate exploitation of the core technologies • Two Structural and Functional Integration cross theme projects were funded in the last call • These projects start shortly Next Generation Integrated Drive (NGID) Structural and Functional Integration - UPE Cross Theme Topic Project NGID summary • Two year project • A collaborative project consortium representing all four of the UPE themes • Combining Newcastle University (lead), University of Manchester and University of Nottingham • A work plan and budget to reflect ambitious advanced integrated drives outcomes • A technology demonstrator which showcases cutting edge research contributed from a number areas drawn from technology and techniques developed under the UPE work schemes. NGID - Aims and objectives To differentiate from the previous work on integrated drives, the project will include: • integrated packaging of devices, components and machines • based upon customised components • holistic, integrated design process • step reduction in size and weight, through the combination of a number of technologies NGID - Aims and objectives Technologies and benefits • 1. Use of un-packaged wide bandgap devices, directly bonded to the machine conductors to enable higher electrical frequencies at elevated temperature and lower converter loss. • 2. Reduction of the size and volume of passive devices due to increased switching frequency and physical integration into the motor. • 3. Increased modularity and torque density within the electrical machine, utilising new magnetic materials, insulation, and construction methods, in conjunction with higher power density through ultra-high speed of rotation. • 4. An integrated thermal design and cooling system, using new jointing methods to reduce thermal resistance at material interfaces, enhanced winding thermal conduction using pressed windings and high temperature insulation systems. • 5. Improved EMC through very close coupling of all components. NGID – Theme feed in Drives Converters Components Packaging Work with bare dies Layout/interconnects Compact converters S&FI Distributed control Original UPE ID Machines Macro-thermal High temperature materials Devices Gate drive Control of converters Characterisation Interfaces Demonstrator High Power density Torque density Temperature Speed Advice/ consultation NGID demonstrator High power density Low loss compact converters Harsh environment Operate device at higher power Compact machine Greater efficiency Demonstrator Maximising magnetic performance High phase currents Large rotor volumes High torque density High temperature More device mounting options Mechanical constraints Dynamic controller response Fast switching High Speed The NGID demonstrator will • not be Based around commercially packaged machines or devices/drive circuitry – integration will be at the most fundamental levels • be a step change from existing developments in integrated drive technology expanding the horizon of power density, high temperature operation and high speed and torque operation NGID demonstrator Applications Automotive propulsion Automotive other Industrial/DOL replacement Wind turbine/other renewable Flywheel/KERS Servos Can a specification be readily created/made available? Is there enough potential for significant academic interest and output? Is integration advantageous for this application Downhole Undersea drives Mining drives/EX enviros Specification availability Industrial liaison Existing projects Academic output Plannable papers Interesting Deliverable Is it achievable within the scope of the project budget/time? Two years Six man years Demonstrator Aerospace Does it match the four demonstrator requirements? Demonstrator technical goals High power High density temperature High torque High Speed density Project structure NGID Project WP1 – Actuator design, demonstrator manufacture and assembly (Lead NCL) [M1-M24] T1.1 Design of actuator [NCL] T1.2 Assembly of actuator [NCL] T1.3 Testing and evaluation of demonstrator [NCL] WP2 - Low level drive integration and thermal management (Lead NOT) [M1-24] WP3 - Operation, control and load management (Lead MAN) [M1-M24] T2.1 Component/auxiliaries integration [NOT] T3.1 Control architecture [MAN/NOT] T2.2 Device integration/packaging [NOT] T3.2 Drive energy management and control [MAN/NOT/NCL] T2.3 Circuit development and controller hardware design [NOT] T2.4 In situ-characterisation [NCL] The Team • Newcastle • Barrie Mecrow (PI) • Simon Lambert • Nick Wright • Manchester • Judith Apsley (Manchester lead) • Andrew Forsyth • Sandy Smith • Nottingham • Lee Empringham (Nottingham lead) • Liliana de Lillo • Mark Johnson Compact and Efficient offline LED Drivers Using 800V Lateral IGBTs and Chip-OnBoard Assembly Florin Udrea University of Cambridge The Objectives • To design an off-line LED driver using smart, highly efficient 800V lateral IGBTs for the first time • To use lateral CMOS technology to monolithically integrate a number of components such as gate driver, current sensor, temperature sensor, high voltage start-up device etc. • To use flip-chip or chip-on-board technologies for high voltage devices • To achieve a higher compactness, reliability and a lower component count with cost, performance and efficiency targets • To achieve high level of structural and functional integration 14 Partners • Cambridge University: Prof. Florin Udrea • Device Theme • Nottingham University: Dr. Alberto Castellazzi • Components, Convertors and Drives Theme • Imperial College: Prof. Paul Mitcheson • Convertors, Components and Drives Theme and cross-theme champion for Operational Control and Management • Greenwich University: Prof. Christopher Bailey • Components, and cross-theme champion for Design Tools and Modelling 15 Structure of the Project Cambridge University (Lead Partner) • Project Management • Modelling and design of lateral 800V IGBTs and integrated components • Design of Power IC and testing • LED drive architecture and design • System testing • System reliability Nottingham University Greenwich University • Chip-on board and flip-chip • Reliability and failure mode modelling and optimisation • Electro-thermal modelling and optimisation of system assembly • Sensor integration • Reliability of packages and boards 16 Imperial College Potential for Structural and Functional Integration A typical state of the art high efficiency LED driver showing the components associated and how some of these can be eliminated or integrated using lateral technology 17 Assembly processes for vertical MOSFETs and lateral IGBTs a Assembly of lateral high voltage LIGBTs (compared to vertical devices) is considerably simplified when chip on board and flip chip technologies are used. 18 Summary • Core work on Structural and Functional Integration continues in the themes • Two ambitious and diverse Structural and Functional Integration cross-theme demonstration projects have been funded and will start soon • Many (most) of the project investigators are here today/tomorrow