Download Prof Jon Clare

Cross-Cutting Topic
Structural and Functional Integration (SFUN)
• Technologies and methodologies for achieving higher levels of
integration in power electronics (devices through to systems)
to enable (some or all of):
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Higher reliability
Higher power density (gravimetric/volumetric)
Lower cost
Better manufacturability
Better exploitation of new technologies
• Move away from “Lego” power electronics
Structural and Functional Integration (SFUN)
• This cross-cutting theme is about
• What to integrate?
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Evaluating benefits
“Boundaries” - components/sub-systems/systems
What level of “modularity”
Trade-off between “one size fits many” and “bespoke systems”
• How to achieve integration?
• What are the new technologies that can be exploited
• Can it be done economically (now/future)
• How to design for integration (link with Design Tools and
Modelling)
• How to implement
Structural and Functional Integration (SFUN)
• Themes
• Themes look at core technologies for Structural and
Functional Integration
• SFUN activities are identified in all the themes
• Cross theme projects
• Bring together work from 3 or more themes in a
collaborative project to demonstrate exploitation of the
core technologies
• Two Structural and Functional Integration cross theme
projects were funded in the last call
• These projects start shortly
Next Generation
Integrated Drive
(NGID)
Structural and Functional Integration - UPE Cross
Theme Topic Project
NGID summary
• Two year project
• A collaborative project consortium representing all four of
the UPE themes
• Combining Newcastle University (lead), University of
Manchester and University of Nottingham
• A work plan and budget to reflect ambitious advanced
integrated drives outcomes
• A technology demonstrator which showcases cutting edge
research contributed from a number areas drawn from
technology and techniques developed under the UPE
work schemes.
NGID - Aims and objectives
To differentiate from the previous work on integrated
drives, the project will include:
• integrated packaging of devices, components and
machines
• based upon customised components
• holistic, integrated design process
• step reduction in size and weight, through the
combination of a number of technologies
NGID - Aims and objectives
Technologies and benefits
• 1. Use of un-packaged wide bandgap devices, directly bonded to
the machine conductors to enable higher electrical frequencies at
elevated temperature and lower converter loss.
• 2. Reduction of the size and volume of passive devices due to
increased switching frequency and physical integration into the
motor.
• 3. Increased modularity and torque density within the electrical
machine, utilising new magnetic materials, insulation, and
construction methods, in conjunction with higher power density
through ultra-high speed of rotation.
• 4. An integrated thermal design and cooling system, using new
jointing methods to reduce thermal resistance at material
interfaces, enhanced winding thermal conduction using pressed
windings and high temperature insulation systems.
• 5. Improved EMC through very close coupling of all components.
NGID – Theme feed in
Drives
Converters
Components
Packaging
Work with bare dies
Layout/interconnects
Compact converters
S&FI
Distributed control
Original UPE ID
Machines
Macro-thermal
High
temperature
materials
Devices
Gate drive
Control of
converters
Characterisation
Interfaces
Demonstrator
High
Power density
Torque density
Temperature
Speed
Advice/
consultation
NGID demonstrator
High power
density
Low loss compact converters
Harsh
environment
Operate device at
higher power
Compact machine
Greater efficiency
Demonstrator
Maximising
magnetic
performance
High phase currents
Large rotor volumes
High torque
density
High
temperature
More device
mounting
options
Mechanical constraints
Dynamic controller response
Fast switching
High
Speed
The NGID demonstrator will
• not be Based around commercially packaged machines or devices/drive circuitry –
integration will be at the most fundamental levels
• be a step change from existing developments in integrated drive technology expanding the
horizon of power density, high temperature operation and high speed and torque operation
NGID demonstrator Applications
Automotive
propulsion
Automotive
other
Industrial/DOL
replacement
Wind turbine/other
renewable
Flywheel/KERS
Servos
Can a specification be readily
created/made available?
Is there enough potential for
significant academic interest and
output?
Is integration advantageous
for this application
Downhole
Undersea drives
Mining drives/EX
enviros
Specification availability
Industrial
liaison
Existing
projects
Academic output
Plannable
papers
Interesting
Deliverable
Is it achievable within the
scope of the project
budget/time?
Two years
Six man
years
Demonstrator
Aerospace
Does it match the four
demonstrator requirements?
Demonstrator technical goals
High power
High
density
temperature
High torque
High Speed
density
Project structure
NGID Project
WP1 – Actuator design,
demonstrator manufacture
and assembly (Lead NCL)
[M1-M24]
T1.1 Design of actuator
[NCL]
T1.2 Assembly of actuator
[NCL]
T1.3 Testing and evaluation
of demonstrator [NCL]
WP2 - Low level drive
integration and thermal
management (Lead NOT)
[M1-24]
WP3 - Operation, control
and load management
(Lead MAN) [M1-M24]
T2.1 Component/auxiliaries
integration [NOT]
T3.1 Control architecture
[MAN/NOT]
T2.2 Device
integration/packaging
[NOT]
T3.2 Drive energy
management and control
[MAN/NOT/NCL]
T2.3 Circuit development
and controller hardware
design [NOT]
T2.4 In situ-characterisation
[NCL]
The Team
• Newcastle
• Barrie Mecrow (PI)
• Simon Lambert
• Nick Wright
• Manchester
• Judith Apsley (Manchester lead)
• Andrew Forsyth
• Sandy Smith
• Nottingham
• Lee Empringham (Nottingham lead)
• Liliana de Lillo
• Mark Johnson
Compact and Efficient offline LED Drivers Using 800V
Lateral IGBTs and Chip-OnBoard Assembly
Florin Udrea
University of Cambridge
The Objectives
• To design an off-line LED driver using
smart, highly efficient 800V lateral IGBTs
for the first time
• To use lateral CMOS technology to
monolithically integrate a number of
components such as gate driver, current
sensor, temperature sensor, high voltage
start-up device etc.
• To use flip-chip or chip-on-board
technologies for high voltage devices
• To achieve a higher compactness,
reliability and a lower component count
with cost, performance and efficiency
targets
• To achieve high level of structural and
functional integration
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Partners
• Cambridge University: Prof. Florin Udrea
• Device Theme
• Nottingham University: Dr. Alberto Castellazzi
• Components, Convertors and Drives Theme
• Imperial College: Prof. Paul Mitcheson
• Convertors, Components and Drives Theme and cross-theme
champion for Operational Control and Management
• Greenwich University: Prof. Christopher Bailey
• Components, and cross-theme champion for Design Tools and
Modelling
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Structure of the Project
Cambridge University
(Lead Partner)
• Project Management
• Modelling and design of
lateral 800V IGBTs and
integrated components
• Design of Power IC and
testing
• LED drive architecture
and design
• System testing
• System reliability
Nottingham University
Greenwich University
• Chip-on board and flip-chip
• Reliability and failure
mode modelling and
optimisation
• Electro-thermal modelling
and optimisation of
system
assembly
• Sensor integration
• Reliability of packages and
boards
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Imperial College
Potential for Structural and Functional
Integration
A typical state of the art high efficiency LED driver showing the components
associated and how some of these can be eliminated or integrated using lateral
technology
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Assembly processes for vertical
MOSFETs and lateral IGBTs
a
Assembly of
lateral high
voltage LIGBTs
(compared to
vertical devices)
is considerably
simplified when
chip on board and
flip chip
technologies are
used.
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Summary
• Core work on Structural and Functional Integration
continues in the themes
• Two ambitious and diverse Structural and Functional
Integration cross-theme demonstration projects have
been funded and will start soon
• Many (most) of the project investigators are here
today/tomorrow