Download CMOS VLSI Design CMOS VLSI Design 4th Ed. 2

Lecture 23:
I/O
Outline
 Basic I/O Pads
 I/O Channels
– Transmission Lines
– Noise and Interference
 High-Speed I/O
– Transmitters
– Receivers
 Clock Recovery
– Source-Synchronous
– Mesochronous
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CMOS VLSI Design 4th Ed.
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Input / Output
 Input/Output System functions
– Communicate between chip and external world
– Drive large capacitance off chip
– Operate at compatible voltage levels
– Provide adequate bandwidth
– Limit slew rates to control di/dt noise
– Protect chip against electrostatic discharge
– Use small number of pins (low cost)
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I/O Pad Design
 Pad types
– VDD / GND
– Output
– Input
– Bidirectional
– Analog
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Output Pads
 Drive large off-chip loads (2 – 50 pF)
– With suitable rise/fall times
– Requires chain of successively larger buffers
 Guard rings to protect against latchup
– Noise below GND injects charge into substrate
– Large nMOS output transistor
– p+ inner guard ring
– n+ outer guard ring
• In n-well
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Input Pads
 Level conversion
– Higher or lower off-chip V
– May need thick oxide gates
VDDH
A
 Noise filtering
A
– Schmitt trigger
– Hysteresis changes VIH, VIL
VDDL
Y
VDDL
A
Y
weak
Y
Y
weak
A
 Protection against electrostatic discharge
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ESD Protection
 Static electricity builds up on your body
– Shock delivered to a chip can fry thin gates
– Must dissipate this energy in protection circuits
before it reaches the gates
Diode
clamps
 ESD protection circuits
R
PAD
– Current limiting resistor
Thin
Current
gate
limiting
oxides
– Diode clamps
resistor
 ESD testing
1500 
Device
– Human body model
Under
100 pF
Test
– Views human as charged capacitor
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Bidirectional Pads
 Combine input and output pad
 Need tristate driver on output
– Use enable signal to set direction
– Optimized tristate avoids huge series transistors
PAD
En
Din
Dout
NAND
Dout
En
Y
Dout
NOR
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Analog Pads
 Pass analog voltages directly in or out of chip
– No buffering
– Protection circuits must not distort voltages
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MOSIS I/O Pad
 1.6 mm two-metal process
– Protection resistors
– Protection diodes
– Guard rings
– Field oxide clamps
PAD
600/3
264 
185 
Out
240
48
90
160
20
40
En
In
Out
In_unbuffered
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In_b
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UofU I/O Pad
 0.6 mm three-metal process
– Similar I/O drivers
– Big driver transistors
provide ESD protection
– Guard rings around
driver
En
Enb
PAD
Enbuf
Out
Enbuf
Out
100
52
52
100
30
30
In
Enb
Driver drain
diodes
In_unbuffered
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In_b
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I/O Channels
 I/O Channel: connection between chips
– Low frequency: ideal equipotential net
– High frequency: transmission line
 Transmission lines model
– Finite velocity of signal along wire
– Characteristic impedance of wire
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When is a wire a T-Line?
 When propagation delay along the wire is
comparable to the edge rate of the signal
propagating
 Depends on
– Length
– Speed of light in the medium
– Edge rate
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Example
 When must a 10 cm trace on a PCB be treated as a
transmission line
– FR4 epoxy has k = 4.35 (e = ke0)
– Assume rise/fall times are ¼ of cycle time
 Signal propagation
velocity
8
3 10 ms
c
v

 14.4 cm
ns
2.086
4.35
 Wire flight time
t
10 cm
 0.7 ns
14.4 cm
ns
 Thus the wire should be treated as a transmission
line when signals have a period < 2.8 ns (> 350 MHz)
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Characteristic Impedance
 Z0: ratio of voltage to current of a signal along the line
 Depends on the geometry of the line
Microstrip: Outer layer of PCB
Z0 
60
4h
ln
0.457k  0.67 0.67  0.8w  t 
Stripline: Inner layer of PCB
Z0 
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60
4h
ln
k 0.67  0.8w  t 
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Example
 A 4-layer PCB contains power and ground planes on the inner
layers and signals on the outer layers. The board uses 1 oz
copper (1.4 mils thick) and the FR4 dielectric is 8.7 mils thick.
How wide should the traces be to achieve 50  characteristic
impedance?
 This is a microstrip design. Solve for w with
– t = 1.4 mils
60
4h
Z

ln
– h = 8.7 mils
0
0.457k  0.67 0.67  0.8w  t 
– k = 4.35
– Z0 = 50 
 w = 15 mils
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Reflections
 When a wave hits the end of a transmission line,
part of the energy will reflect if the load impedance
does not match the characteristic impedance.
 Reflection coefficient: G 
Z L  Z0
Z L  Z0
 A wave with an amplitude of Vreflected = GVincident
returns along the line.
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Example: Reflections
 A strong driver with a
Thevenin equivalent
resistance of 10  drives an
unterminated transmission
line with Z0 = 50  and flight
time T. Plot the voltage at
the 1/3 point and end of the
line.
 Reflection coefficients:
GS 
10  50
2
  50
  ; GL 
1
10  50
3
  50
10 
Thevenin
Equivalent
Driver
1
0
Z0 = 50 
Vin
Vmid
Unterminated
Receiver
Vout
1
5/6
Vin
0
5/3
20/18
50/54
1
70/54
170/162
5/6
130/162
Vmid
10/18
0
5/3
70/54
1
10/18
130/162
Vout
0
 Initial wave: 50/(10+50) = 5/6
 Observe ringing at load
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0
T
5/6
CMOS VLSI Design 4th Ed.
2T
5/6
-10/18
3T
-10/18
4T
20/54
5T
20/54
6T
-40/162
7T
8T
-40/162
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Intersymbol Interference
 Must wait until reflections damp out before sending
next bit
 Otherwise, intersymbol interference will occur
 With an unterminated transmission line, minimum bit
time is equal to several round trips along the line
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Example: Load Termination
 Redo the previous example if
the load is terminated with a
50  resistor.
 Reflection coefficients:
10 
Thevenin
Equivalent
Driver
1
0
Z0 = 50 
Vin
Vmid
Vout
50 
Receiver w/
Load Termination
1
10  50
2
50  50
GS 
  ; GL 
0
10  50
3
50  50
 Initial wave: 50/(10+50) = 5/6
 No ringing
 Power dissipation in load
resistor
5/6
Vin
0
1
5/6
Vmid
0
1
5/6
Vout
0
0
T
5/6
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2T
3T
4T
5T
6T
7T
8T
No
Reflection
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Example: Source Termination
 Redo the previous example if
the source is terminated with
an extra 40  resistor.
 Reflection coefficients:
10 
Thevenin
Equivalent
Driver
40 
1
0
Z0 = 50 
Vin
Vmid
Vout
Unterminated
Receiver
1
GS 




50  50
  50
 0; G L 
1
50  50
  50
Initial wave: 50/(50+50) = 1/2
No ringing
No power dissipation in load
Taps along T-line
momentarily see invalid levels
Vin
1/2
0
1
Vmid
1/2
0
1
Vout
0
0
T
1/2
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CMOS VLSI Design 4th Ed.
2T
1/2
3T
4T
5T
6T
7T
8T
No
Reflection
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Termination Summary
 For point-to-point links,
source terminate to save
power
 For multidrop busses, load
terminate to ensure valid
logic levels
 For busses with multiple
receivers and drivers,
terminate at both ends of
the line to prevent
reflections from either end
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Noise and Interference
 Other sources of intersymbol
interference:
– Dispersion
• Caused by nonzero line
resistance
– Crosstalk
• Capacitive or inductive coupling
between channels
– Ground Bounce
• Nonzero return path impedance
– Simultaneous Switching Noise
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High-Speed I/O
 Transmit data faster than the flight time along the line
 Transmitters must generate very short pulses
 Receivers must be accurately synchronized to detect
the pulses
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High Speed Transmitters
 How to handle termination?
– High impedance current-mode driver + load term?
– Or low-impedance driver + source termination
 Single-ended vs. differential
– Single-ended uses half the wires
– Differential is Immune to common mode noise
 Pull-only vs. Push-Pull
– Pull-only has half the transistors
– Push-pull uses less power for the same swing
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High-Speed Transmitters
Pull-Only
Push-Pull
Single-Ended
Gunning Transceiver
Logic (GTL)
Differential
Current Mode
Logic (CML)
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CMOS VLSI Design 4th Ed.
Low-Voltage
Differential
Signalling
(LVDS)
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AC Coupling
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Programmable Drive Current
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Slew Rate Control
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De-emphasizing Transmitter
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Time Interleaved Transmitter
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Multilevel Transmitter
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High-Speed Receivers
 Sample data in the middle of the bit interval
 How do we know when?
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Source-Synchronous Clocking
 Send clock with the data
 Flight times roughly match each other
– Transmit on falling edge of tclk
– Receive on rising edge of rclk
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Single vs. Double Data Rate
 In ordinary single data rate (SDR) system, clock
switches twice as often as the data
 If the system can handle this speed clock, the data
is running at half the available bandwidth
 In double-data-rate (DDR) transmit and receive on
both edges of the clock
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Phase Alignment
 If the DDR clock is aligned to the transmitted clock, it
must be shifted by 90º before sampling
 Use PLL
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Mesochronous Clocking
 As speeds increase, it is difficult to keep clock and
data aligned
– Mismatches in trace lengths
– Mismatches in propagation speeds
– Different in clock vs. data drivers
 Mesochronous: clock and data have same
frequency but unknown phase
– Use PLL/DLL to realign clock to each data
channel
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Phase Calibration Loop
 Special phase detector compares clock & data phase
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Hogge Detector
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Alexander Detector
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TRNG
 Based on some random physical process
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Chip Identification
 The ID circuit must generate a binary ID code
 The ID code must be repeatable and reliable over
supply, temperature, aging, and thermal noise.
 The ID code length and stability must allow a high
probability of correct identification of each die.
 The ID circuit must exhibit low power consumption
and require no calibration.
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