* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
Download Chapter 5 Lecture Notes - the GMU ECE Department
Mains electricity wikipedia , lookup
Flexible electronics wikipedia , lookup
Immunity-aware programming wikipedia , lookup
Alternating current wikipedia , lookup
Switched-mode power supply wikipedia , lookup
Thermal runaway wikipedia , lookup
Earthing system wikipedia , lookup
Integrated circuit wikipedia , lookup
Current source wikipedia , lookup
Resistive opto-isolator wikipedia , lookup
Rectiverter wikipedia , lookup
History of the transistor wikipedia , lookup
Two-port network wikipedia , lookup
Buck converter wikipedia , lookup
ECE 333 Linear Electronics Chapter 5 MOS Field-Effect Transistors (MOSFETs) Why MOSFETs Device Structure Physical Operation I-V Characteristics MOSFET Circuits at DC The Body Effect and Other Topics 1 Introduction • • • • • • The invention of MOSFETs (page 248) MOSFET vs. BJT MOSFET in Integrated Circuits VLSI Digital Circuit and Analog Circuit Memory 2 5.1 Device Structure and Physical Operation • 5.1.1 Device Structure 3 5.1.1 Device Structure (b) cross section. Typically L = 0.03 μm to 1 μm, W = 0.05 μm to 100 μm, and the thickness of the oxide layer (tox) is in the range of 1 to 10 nm. 4 5.1.2 Operation with Zero Gate Voltage • Two pn junctions back-to-back • Prevent current conduction from drain to source when vD is applied • Very high resistance (of the order of 1012 Ω) 5 5.1.3 Creating a Channel for Current Flow Figure 5.2 The enhancement-type NMOS transistor with a positive voltage applied to the gate. An n channel is induced at the top of the substrate beneath the gate. 6 5.1.3 Creating a Channel for Current Flow • Overdrive voltage vOV 𝑣𝑂𝑉 = 𝑣𝐺𝑆 − 𝑉𝑇 • Electron Charge in the channel |𝑄| = 𝐶𝑜𝑥 (𝑊𝐿)𝑣𝑂𝑉 • Oxide Capacitance 𝐶𝑜𝑥 𝜖𝑜𝑥 = 𝑡𝑥𝑜 7 5.1.4 Applying a Small vDS 8 5.1.4 Applying a Small vDS 9 5.1.4 Applying a Small vDS |𝑄| = 𝐶𝑜𝑥 𝑊𝑣𝑂𝑉 𝑢𝑛𝑖𝑡 𝑐ℎ𝑎𝑛𝑛𝑒𝑙 𝑙𝑒𝑛𝑔𝑡ℎ Electron drift velocity = 𝜇𝑛 𝐸 = 𝑣𝐷𝑆 𝜇𝑛 𝐿 𝑊 𝑖𝐷 = [(𝜇𝑛 𝐶𝑜𝑥 )( )𝑣𝑂𝑉 ]𝑣𝐷𝑆 𝐿 10 5.1.4 Applying a Small vDS |𝑄| = 𝐶𝑜𝑥 𝑊𝑣𝑂𝑉 𝑢𝑛𝑖𝑡 𝑐ℎ𝑎𝑛𝑛𝑒𝑙 𝑙𝑒𝑛𝑔𝑡ℎ Electron drift velocity = 𝜇𝑛 𝐸 = 𝑣𝐷𝑆 𝜇𝑛 𝐿 𝑊 𝑖𝐷 = [(𝜇𝑛 𝐶𝑜𝑥 )( )𝑣𝑂𝑉 ]𝑣𝐷𝑆 𝐿 𝑟𝐷𝑆 = 1 𝜇𝑛 𝐶𝑜𝑥 𝑊 𝐿 𝑣𝑂𝑉 𝑟𝐷𝑆 = 1 𝜇𝑛 𝐶𝑜𝑥 𝑊 𝐿 (𝑣𝐺𝑆 −𝑉𝑡 ) 𝑘𝑛 = 𝜇𝑛 𝐶𝑜𝑥 𝑊 𝐿 11 5.1.5 Operation as vDS is Increased 12 13 14 5.1.5 Operation as vDS is Increased 1 [𝑉𝑂𝑉 + 𝑉𝑂𝑉 − 𝑣𝐷𝑆 ] ∙ 𝑣𝐷𝑆 2 𝑊 1 𝑖𝐷 = 𝑘′𝑛 ( )(𝑉𝑂𝑉 − 𝑣𝐷𝑆 )𝑣𝐷𝑆 𝐿 2 15 5.1.5 Operation as vDS is Increased 𝑊 1 𝑖𝐷 = 𝑘′𝑛 ( )(𝑉𝑂𝑉 − 𝑣𝐷𝑆 )𝑣𝐷𝑆 𝐿 2 𝑖𝐷 = 𝑘′ 𝑛 𝑊 1 [(𝑣𝐺𝑆 −𝑉𝑡 )𝑣𝐷𝑆 − 𝑣𝐷𝑆 2 ] 𝐿 2 16 5.1.6 Operation for vDS>VOV: Channel Pinch-off and Current Saturation 𝑣𝐷𝑆 = 𝑉𝑂𝑉 Triode region 1 𝑎𝑟𝑒𝑎 = 𝑉𝑂𝑉 ∙ 𝑣𝐷𝑆 | at this point 2 1 ′ 𝑊 𝑖𝐷 = 𝑘 𝑛 𝑣𝑂𝑉 2 2 𝐿 17 5.1.6 Operation for vDS>VOV: Channel Pinch-off and Current Saturation 1 ′ 𝑊 𝑖𝐷 = 𝑘 𝑛 𝑣𝑂𝑉 2 2 𝐿 1 ′ 𝑊 𝑖𝐷 = 𝑘 𝑛 (𝑣𝐺𝑆 − 𝑉𝑡 )2 2 𝐿 Example 5.1 Consider a process technology for which Lmin=0.4um, tox=8nm, un=450 cm2/Vs, and Vt=0.7V. (a)Find Cox and k’n. (b)For a MOSFET with W/L=8 um / 0.8 um, calculate VOV, VGS and VDSmin needed to operate the transistor in the saturation region with a dc current ID=100uA. (c)For the device in (b), find the values of VOV and VGS required to cause the device to operate as a 1000-Ω resistor for very small vDS. 18 5.1.7 The p-Channel MOSFET To form a channel, it must have 𝑣𝐺𝑆 ≤ 𝑉𝑡𝑝 |𝑣𝐺𝑆 | ≥ |𝑉𝑡𝑝 | 19 5.1.8 Complementary MOS or CMOS 20 5.2 Current-Voltage Characteristics • 5.2.1 Circuit Symbol Figure 5.11 (a) Circuit symbol for the n-channel enhancement-type MOSFET. (b) Modified circuit symbol with an arrowhead on the source terminal to distinguish it from the drain and to indicate device polarity (i.e., n channel). (c) Simplified circuit symbol to be used when the source is connected to the body or when the effect of the body on device 21 operation is unimportant. 5.2.2 i-v 22 5.2.2 i-v Figure 5.12 The relative levels of the terminal voltages of the enhancement NMOS transistor for operation in the triode region and in the saturation region. 23 5.2.2 i-v 24 5.2.3 The iD – vGS Characteristics • When the MOSFET is used to design an amplifier, it is operated in the saturation region. 1 ′ 𝑊 𝑖𝐷 = 𝑘 𝑛 (𝑣𝐺𝑆 − 𝑉𝑡𝑛 )2 2 𝐿 1 ′ 𝑊 𝑖𝐷 = 𝑘 𝑛 𝑣𝑂𝑉 2 2 𝐿 Nonlinear linear amplifier? (chapter 7) 25 5.2.3 The iD – vGS Characteristics 26 5.2.3 The iD – vGS Characteristics Figure 5.15: Large-signal, equivalent-circuit model of an n-channel MOSFET operating in the saturation region. 27 Example 5.2 Consider an NMOS transistor fabricated in a 0.18um process with L=0.18 um and W=2um. The process technology is specified to have Cox=8.6 fF/um, un=450cm2/Vs and Vtn=0.5V. (a)Find VGS and VDS that result in the MOSFET operating at the edge of saturation with iD=100uA. (b) If VGS is kept constant, find VDS that results in iD=50uA. (c) To investigate the use of the MOSFET as a linear amplifier, let it be operating in saturation with VDS=0.3V. Find the change in iD resulting from vGS changing from 0.7 V by 0.01V and by -0.01V. Solution: Kn=unCox(W/L)=4.3 mA/V2 1 ′ 𝑊 2 (a) With nMOSFET in saturation: 𝑖𝐷 = 2 𝑘 𝑛 𝐿 𝑣𝑂𝑉 So, vOV=0.22V VGS=vOV + Vtn = 0.72 V At the edge: VDS = VGS – Vtn = 0.22 V 28 (b) With VGS kept constant at 0.72V, iD reduced the nMOSFET will now be operating in triode region 𝑊 1 𝑖𝐷 = 𝑘′𝑛 ( )(𝑉𝑂𝑉 − 𝑣𝐷𝑆 )𝑣𝐷𝑆 𝐿 2 Because VOV is 0.22 V with VGS = 0.72V, We have: VDS = 0.06 V or 0.39 V (two solutions from the above eq. Because 0.39 V is above VOV, not in triode region, so only VDS=0.06V is correct solution. (c) For vGS=0.7V, VOV=0.2V and VDS=0.3V, the transistor is 1 operating in saturation region: 𝑖𝐷 = 𝑘𝑛 𝑣𝑂𝑉 2 = 86 𝜇𝐴 2 Now with VGS=0.71V, VOV=0.21V, iD=94.8 uA With VGS=0.69V, VOV=0.19V, iD=77.6 uA. The change of + or – 0.01V, the change of iD is similar 8.8 ~ 8.4 uA 29 5.2.4 Finite output resistance in Saturation • Channel-length modulation (real MOSFET) 1 ′ 𝑊 𝑖𝐷 = 𝑘 𝑛 2 𝐿 𝑣𝐺𝑆 − 𝑉𝑡𝑛 2 (1 + 𝜆𝑣𝐷𝑆 ) 30 5.2.4 Finite output resistance in Saturation 1 ′ 𝑊 𝑖𝐷 = 𝑘 𝑛 2 𝐿 𝑣𝐺𝑆 − 𝑉𝑡𝑛 2 (1 + 𝜆𝑣𝐷𝑆 ) ro: output resistance 𝑑𝑖𝐷 𝑟𝑜 = 𝑑𝑣𝐷𝑆 −1 𝑤𝑖𝑡ℎ 𝑣𝐺𝑆 𝑐𝑜𝑛𝑠𝑡𝑎𝑛𝑡 VA: A device parameter in V 31 5.2.4 Finite output resistance in Saturation 𝑑𝑖𝐷 𝑟𝑜 = 𝑑𝑣𝐷𝑆 −1 𝑤𝑖𝑡ℎ 𝑣𝐺𝑆 𝑐𝑜𝑛𝑠𝑡𝑎𝑛𝑡 𝑟𝑜 = 𝑉𝐴 𝐼′𝐷 32 5.2.5 Characteristics of the p-Channel MOSFET Figure 5.19 (a) Circuit symbol for the p-channel enhancement-type MOSFET. (b) Modified symbol with an arrowhead on the source lead. (c) Simplified circuit symbol for the case where the source is connected to the body. 33 34 5.3 MOSFET Circuits at DC • Simple model: 𝜆 = 0 35 5.4 The Body Effect and Other Topics 36 • Temperature Effects: (i) Vt decreases by about 2 mV for every 1oC rise in temperature (ii) K’ decreases with temperature increase – dominant effect So current decreases with increasing temperature 37 • Breakdown and input protection • Velocity Saturation (107 cm/s limit) • Depletion-type MOSFET 38