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Transcript
ORDER NO. KM41006120CE
Telephone Equipment
Model No. KX-TG4011LAT
KX-TG4012LAT
KX-TG4013LAT
KX-TGA403LAT
Expandable Digital Cordless Phone
T: Black Metallic Version
(for Latin America)
© Panasonic System Networks Co., Ltd. 2010
Unauthorized copying and distribution is a violation
of law.
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
2
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
TABLE OF CONTENTS
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. US-DECT Description ------------------------------------ 7
4.2. Block Diagram (Base Unit_Main)---------------------- 9
4.3. Block Diagram (Base Unit_RF Part) -----------------10
4.4. Circuit Operation (Base Unit) -------------------------- 11
4.5. Block Diagram (Handset)-------------------------------18
4.6. Block Diagram (Handset_RF Part)-------------------19
4.7. Circuit Operation (Handset)----------------------------20
4.8. Circuit Operation (Charger Unit) ----------------------22
4.9. Signal Route -----------------------------------------------23
5 Location of Controls and Components ------------------24
6 Installation Instructions ---------------------------------------24
7 Operating Instructions-----------------------------------------24
8 Test Mode ----------------------------------------------------------25
8.1. Engineering Mode ----------------------------------------25
9 Service Mode -----------------------------------------------------29
9.1. How to Clear User Setting (Handset Only)---------29
10 Troubleshooting Guide ----------------------------------------30
10.1. Troubleshooting Flowchart -----------------------------30
11 Disassembly and Assembly Instructions ---------------41
11.1. Disassembly Instructions -------------------------------41
11.2. How to Replace the Handset LCD -------------------44
12 Measurements and Adjustments---------------------------45
12.1. Equipment Required -------------------------------------45
12.2. The Setting Method of JIG -----------------------------45
12.3. Adjustment Standard (Base Unit)---------------------48
12.4. Adjustment Standard (Charger Unit)-----------------49
12.5. Adjustment Standard (Handset) ----------------------50
12.6. Things to Do after Replacing IC or X'tal ------------51
12.7. Frequency Table ------------------------------------------53
13 Miscellaneous ----------------------------------------------------54
13.1. How to Replace the Flat Package IC ----------------54
13.2. How to Replace the Shield Case ---------------------56
13.3. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------58
13.4. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------60
14 Schematic Diagram ---------------------------------------------61
14.1. For Schematic Diagram---------------------------------61
14.2. Schematic Diagram (Base Unit_Main) --------------62
14.3. Schematic Diagram (Handset_Main) ----------------64
14.4. Schematic Diagram (Charger Unit) -----------------66
15 Printed Circuit Board-------------------------------------------67
15.1. Circuit Board (Base Unit_Main) -----------------------67
15.2. Circuit Board (Handset_Main)-------------------------69
15.3. Circuit Board (Charger Unit) ---------------------------71
16 Exploded View and Replacement Parts List -----------72
16.1. Cabinet and Electrical Parts (Base Unit) -----------72
16.2. Cabinet and Electrical Parts (Handset) -------------73
16.3. Cabinet and Electrical Parts (Charger Unit) -------74
16.4. Accessories ------------------------------------------------75
PAGE
16.5. Replacement Parts List--------------------------------- 76
3
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer’s Instructions.
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
4
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
5
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
3 Specifications
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
6
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4 Technical Descriptions
4.1.
US-DECT Description
The frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.53).
4.1.1.
TDD Frame Format
4.1.2.
TDMA system
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 µs, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
7
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.1.3.
Signal Flowchart in the Radio Parts
Reception
A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.
Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in one antenna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base unit RF, RF signal is received in two antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
8
VBAT
RF_PART
RSTN
9
RESET
TXON
TXn
TXp
RXON
RXn
RXp
ANT2
ANT1
SW1
STM/CKM
ANT1 ANT2
SPOUTP
SPOUTN
EEPROM
MEMORY
IC611
BBIC
IC501
SP
VCC
X501
13.824 MHz
SCL, SDA
WP
KEY C
KEY 1
PDN DET
DOUBOUT
VBAT
VCCPA
VBAT_APU
VCC_IF
VCC_FE
VCC_VCO
LOUT
LIN
HOOK
DCIN 2
DCIN 1
BELL
HSMIP
HSMIN
3.0V
RECEIVE
AMP
Q171
SIDE TONE
CIRCUIT
Q161
RESET IC
IC331
3.0 V
REGULATOR
IC302
INUSE
DETECT 1
R131, R133
BELL
DETECT
Q111
D101
R371
R372
DCM
DCP
L1R
L1T
-
+
CHARGE_CONTACT
DC JACK
TEL JACK
KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_Main)
INUSE
DETECT 2
R151,R152
RLY
ٌ
VCCA
4.2.
Q141
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
Block Diagram (Base Unit_Main)
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.3.
Block Diagram (Base Unit_RF Part)
ANT2
TXp
ANT2
TXn
ANT1
DA801
TXON
RXON
RXp
RXn
ANT1
KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_RF Part)
10
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.4.
Circuit Operation (Base Unit)
General Description:
(BBIC, EERROM) is a digital speech/signal processing system that implements all the functions of speech compression and
memory management required in a digital telephone.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
4.4.1.
BBIC (Base Band IC: IC501)
• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
• Block Interface Circuit
RF part, Key scan, Telephone line.
4.4.2.
EEPROM (IC611)
Following information data is stored.
• Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse
11
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.4.3.
Power Supply Circuit/Reset Circuit
The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:
12
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.4.3.1.
Charge Circuit
The voltage from the AC adaptor is supplied to the charge circuits.
13
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.4.4.
Telephone Line Interface
Telephone Line Interface Circuit:
Function
• Bell signal detection
• ON/OFF hook and pulse dial circuit
• Side tone circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T → L101 → R111 → C111 → Q111 → BBIC pin 5 [BELL]
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T → L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition.
Pulse Dial Circuit:
Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
14
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.4.5.
Parallel Connection Detect Circuit/Auto Disconnect Circuit
Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, BBIC disconnects the line after detecting parallel connection is off
hook.
15
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.4.6.
Calling Line Identification (Caller ID)
Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
16
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
Call Waiting Caller ID
Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line → P101 → L101, L102 → C121, C122 → R121, R122 → IC501 (25, 24).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
17
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.5.
Block Diagram (Handset)
3V
IC3
EEPROM
ANT1
X1
10.368 MHz
CHG_DET
CHG_CTL
WP, CLK, DATA
BATTERY
Power_adj
TXn
TXp
VDD_PADRV
PSEL
RESET
Q4
D7
CHARGE
IC801
PON
C144
TXON
RXON
RF_RXn
RF_RXp
BATTERY
1.8V
3V
RF PART
D1
AVD
Q2
CP_VOUT2
BATTERY
LD0_CTRL
BATTERY
IC1
BBIC
MIC
VDDPA
MICp
MICn
3V
1.8V
Receiver
LSRp
LSRn
LED
VDD2
VDD1
(KEY)
Q7
KEY_LED
3V
BELL_LED
Monitor SP
CKM/STM
PAOUTp
PAOUTn
CKM//STM
P3_3~P3_7
P1_1~P1_4
LED
(BELL)
3V
LCD
KEYS
KX-TGA403 BLOCK DIAGRAM (Handset)
18
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.6.
Block Diagram (Handset_RF Part)
TXON
ANT
DA801
RXON
RF_RXn
RF_RXp
KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)
19
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.7.
4.7.1.
Circuit Operation (Handset)
Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.18).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)
- PLL Oscillator
- Detector
- Compress/Expander
- Reception
• RF Power Amp: IC801
- Amplifier for transmission
• EEPROM: IC3
- Temporary operating parameters (for RF, etc.)
4.7.2.
Power Supply Circuit/Reset Circuit
Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → Q2 (1.8 V), IC1-43pin (2.5V)
The Reset signal generates IC1 (61 pin) and 1.8 V.
20
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.7.3.
Charge Circuit
Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+(6.5 V) → F301 → R371 → R372 →CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery...
BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).
4.7.4.
Battery Low/Power Down Detector
Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V(Batt) 2.25 V ± 50 mV
The BBIC detects this level and "
" starts flashing.
• Power Down
Battery voltage: V(Batt) 2.0 V ± 50 mV
The BBIC detects this level and power down.
4.7.5.
Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
21
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.8.
Circuit Operation (Charger Unit)
Charge control is executed at handset side so that the operation when using charger is also controlled by handset.
Refer to Circuit Operation (Handset) (P.20)
The route for this is as follows: DC+pin of J1(+) → F1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of J1(-).
22
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
4.9.
Signal Route
RF part signal route
23
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
5 Location of Controls and Components
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
7 Operating Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
24
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
8 Test Mode
8.1.
8.1.1.
Engineering Mode
Base Unit
25
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
Frequently Used Items (Base Unit)
ex.)
Items
Frequency
ID
Address
00 07 / 00 08
00 02 ~ 00 06
Default Data
00/01
Given value
New Data
-
-
Remarks
Use these items in a READ-ONLY mode to
confirm the contents. Careless rewriting may
cause serious damage to the computer system.
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex)
A
B
C
D
E
F
26
Input Keys
[Flash] + 0
[Flash] + 1
[Flash] + 2
[Flash] + 3
[Flash] + 4
[Flash] + 5
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
8.1.2.
Handset
27
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
Frequently Used Items (Handset)
ex.)
Items
Address
Default Data
New Data
Battery Low
Frequency
ID
00 11 / 00 12
00 07 / 00 08
00 02 ~ 00 06
00 / 00
00 / 01
Given value
-
Possible Adjusted
Value MAX (hex)
-
Possible Adjusted
Value MIN (hex)
-
Remarks
(*2)
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex.)
A
B
C
D
E
F
Input Keys
[Flash] + 0
[Flash] + 1
[Flash] + 2
[Flash] + 3
[Flash] + 4
[Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.
28
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
9 Service Mode
9.1.
How to Clear User Setting (Handset Only)
Handset
Press
, , ,
simultaneously until a beep sound is heard. Then single handset is initialized.
(The contents of user setting are reset to factory default)
*Usage time is not cleared.
29
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
Cross Reference:
Check Power (P.31)
Check Battery Charge (P.32)
Check Link (P.33)
Check the RF part (P.35)
Check Handset Transmission (P.40)
Check Handset Reception (P.40)
Check Caller ID (P.40)
30
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.1. Check Power
10.1.1.1. Base Unit
Cross Reference:
Power Supply Circuit/Reset Circuit (P.12)
Note:
BBIC is IC501.
(*1) Refer to Specifications (P.6) for part number and
supply voltage of AC adaptor.
(*2) Refer to Circuit Board (Base Unit_Main) (P.67).
10.1.1.2. Handset
Cross Reference:
Power Supply Circuit/Reset Circuit (P.20)
31
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.2. Check Battery Charge
10.1.2.1. Base Unit
Cross Reference:
Charge Circuit (P.13)
10.1.2.2. Handset
Cross Reference:
Check Power (P.31)
Charge Circuit (P.21)
10.1.2.3. Charger Unit
Cross Reference:
Charge Circuit (P.21)
32
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.3. Check Link
10.1.3.1. Base Unit
Cross Reference:
Power Supply Circuit/Reset Circuit (P.12)
Check the RF part (P.35)
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.51) for Base Unit.
*2 How to adjust the frequency of X501:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).
To adjust frequency, send command “SFR
“ until the frequency counter becomes13.824 MHZ±55HZ.
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.3.2. Handset
Cross Reference:
Power Supply Circuit/Reset Circuit (P.20)
Check the RF part (P.35)
Note:
*1 How to adjust the frequency of X1:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-46pin).
To adjust frequency, send command “SFR
“ until the frequency counter becomes10.368 MHz±55HZ.
Refer to Things to Do after Replacing IC or X'tal (P.52) for Handset.
34
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.4. Check the RF part
10.1.4.1. Finding out the Defective part
After All the Checkings or Repairing
1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
Note:
(*1) HS: Handset
(*2) BU: Base Unit
35
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.4.2. RF Check Flowchart
Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.37).
Please refer to the each item.
Note:
(*1) Refer to Check Link (P.33).
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.4.3. Check Table for RF part
No.
Item
1 Link Confirmation Normal
HS, BU Mode [Normal Mode]
2
X'tal Frequency confirmation
3
HS, BU Mode: [Adjustment]
TX confirmation
Regular HS (BU) Mode:
[Test RX Mode]
4
BU (HS) Mode:
[Test TX_Burst Mode]
RX confirmation
Regular HS (BU) Mode:
[Test TX_Burst Mode]
5
BU (HS) Mode:
[Test RX Mode]
Range Confirmation Normal
HS, BU Mode: [Normal Mode]
BU (Base Unit) Check
1. Register Regular HS to BU (to be
checked).
2. Press [Talk] key of the Regular HS to
establish link.
Check X'tal Frequency.
(13.824000 MHz ±100 Hz)
HS (Handset) Check
1. Register HS (to be checked) to Regular
BU.
2. Press [Talk] key of the HS to establish link.
Check X'tal Frequency.
(10.368000 MHz ±100 Hz)
1. Place Regular HS 15 cm away from a
checked BU.
2. Confirm "TXDATA" waveform of BU (*1)
and “RXDATA“ waveform of Regular HS by
Digital Oscilloscope.
1. Place Regular BU 15 cm away from a
checked HS.
2. Confirm "TXDATA" waveform of HS (*2)
and "RXDATA" waveform of Regular BU by
Digital Oscilloscope.
1. Place Regular HS 15 cm away from a
checked BU.
2. Confirm "RXDATA" waveform of BU (*1)
and “TXDATA“ waveform of Regular HS by
Digital Oscilloscope.
1. Place Regular BU 15 cm away from a
checked HS.
2. Confirm "RXDATA" waveform of HS (*2)
and "TXDATA" waveform of Regular BU by
Digital Oscilloscope.
1. Register Regular HS to BU (to be
checked).
2. Press [Talk] key of the Regular HS to
establish link.
3. Compare the range of the BU (being
checked) with that of the Regular BU.
1. Register HS (to be checked) to Regular
BU.
2. Press [Talk] key of the HS to establish link.
3. Compare the range of the HS (being
checked) with that of the Regular HS.
Note:
(*1) Adjustment Standard (Base Unit) (P.48)
(*2) Adjustment Standard (Handset) (P.50)
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.4.4. TEST RANGE Check
Circuit block which range is defective can be found by the following check.
Item
Range Confirmation TX TEST
(TX Power check)
HS, BU setting
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1)
Range Confirmation RX TEST
(RX sensitivity check)
HS, BU setting
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1)
BU (Base Unit) Check
1. Register Regular HS to BU (to be checked).
HS (Handset) Check
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the BU and the Regular HS
according to CHART1.
2. Set TX Power of the HS and the Regular BU
according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK = TX Power of the BU is OK.
No Link = TX Power of the BU is NG.
1. Register Regular HS to BU (to be checked).
3. At distance of about 20m between HS and BU,
Link OK = TX Power of the HS is OK.
No Link = TX Power of the HS is NG.
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the BU and the Regular HS
according to CHART1.
2. Set TX Power of the Checking HS and the Regular BU according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the BU is OK.
No Link = RX Sensitivity of the BU is NG.
3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the HS is NG
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (Base Unit) TX Power Check
BU (Base Unit) RX Sensitivity Check
BU (to be checked)
TX Power
Low
High
Regular_HS
TX Power
High
Low
HS (Handset) TX Power Check
HS (Handset) RX Sensitivity Check
HS (to be checked)
TX Power
Low
High
Regular_BU
TX Power
High
Low
Note:
(*1) Refer to Commands (P.47).
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.5. Registering a Handset to the Base Unit
10.1.6. Deregistering a Handset
10.1.7. Deregistering All Handsets by the Base Unit
39
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
10.1.8. Check Handset Transmission
Cross Reference:
Signal Route (P.23)
10.1.9. Check Handset Reception
Cross Reference:
Signal Route (P.23)
Note:
When checking the RF part, Refer to Check the RF part
(P.35).
10.1.10. Check Caller ID
Cross Reference:
Telephone Line Interface (P.14)
Calling Line Identification (Caller ID) (P.16)
Note:
• Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.
• It is also recommended to confirm that the customer is really
a subscriber of the service.
40
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
11 Disassembly and Assembly Instructions
11.1. Disassembly Instructions
11.1.1.
Base Unit
41
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
11.1.2.
Handset
42
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
11.1.3.
Charger Unit
43
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
11.2. How to Replace the Handset LCD
Note:
The illustrations are simplified in this page.
They may differ from the actual product.
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
12 Measurements and Adjustments
This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.30)
12.1. Equipment Required
• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope.
• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)
Hewlett Packard, 53131A is recommended.
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG
Note:
*: If you have the JIG Cable for TCD500 series
(PQZZ1CD505E), change the following values of
resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
<Preparation>
• Serial JIG cable: PQZZ1CD300E*
• PC which runs in DOS mode
• Batch file CD-ROM for setting: PNZZTG4011LA
Resistor
R2
R3
R4
R7
12.2.1. Connections (Base Unit)
Connect the AC adaptor.
Connect the JIG Cable GND (black).
Connect the JIG Cable RX (red) and TX (yellow).
Note:
*: COM port names may vary depending on what your PC calls it.
45
Old value (kΩ)
22
22
22
4.7
New value (kΩ)
3.3
3.3
4.7
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
12.2.2. Connections (Handset)
Connect the DC Power or Battery to BATT+ and BATT-.
Connect the JIG cable GND (black) to GND.
Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
Note:
*: COM port names may vary depending on what your PC calls it.
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
12.2.3. How to install Batch file into P.C.
Note:
• “*****” varies depending on the country or models.
12.2.4. Commands
See the table below for frequently used commands.
Command name
rdeeprom
Function
Read the data of EEPROM
readid
writeid
Read ID (RFPI)
Write ID (RFPI)
hookoff
hookon
getchk
wreeprom
Off-hook mode on Base
On-hook mode on Base
Read checksum
Write the data of EEPROM
Example
Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.
Type “readid”, and the registered ID is read out.
Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.
Type “hookoff”.
Type “hookon”.
Type “getchk”.
Type “wreeprom 01 23 45”. “01 23” is address and “45”
is data to be written.
47
CL2
YLW
ANT2
L362
D363
RED
CHG+2
C352
L372
D142
L361
C142
R161 R164
GND
C122
PbF
UTX
URX
C511
C510
C514
VCCA
C181
C171
R166
CHARGE-
C125
R121
C163 C165
Q161
C121
BLK
CHG-2
R112
L371
C351
D361
C112
R162
R115
C115
L1R
D143
GRN
L1T
C168
C530
L474
L476
C513
C661
VREF
R178
VBG
C478
SPP
R152
C152
R151
R136
C477
SPN
D133
R603
VDDC
E
DCM
PNLB1712Z
IC611
R612
C321
C322
ANT1
+6.5V
IC302
R605
R606
VBAT
TMS
TCK
TDI
TDO
B
CL1
R322
R321 C343
R302
DCDC_OUT
+3.0V
Q601
RTCK
RTCK
R502
R602
R335
4
RA504
IC601
5
FCT
3.0A
DCP
STM/CKM/P15
D472
C476
D153
RA151
1
8
RSTN
D473
C601
R165
C167
R167
C184
R163
C126
R601
R507
C521
F301
CHARGE+
R181
C186
C512
C475
C479
C473
C472
C120
C124 C123
C151
C133
C525
R607
R512
R604
C332
C301
R334
R305
CHG
R122
R503
C524
R505
RA502
R506
4
C611
R301
C307
SP
RED
48
R307
DC
RED WHT
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.37)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)
R304
BLK
DC
6.5V
* Start Monitor
Oscilloscope (*2)
* Send command "SFR", then
the frequency output on this TP.
Frequency Counter (*1)
Spectrum Analyzer
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
12.3. Adjustment Standard (Base Unit)
When connecting the simulator equipment for checking, please refer to below.
12.3.1. Bottom View
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
12.4. Adjustment Standard (Charger Unit)
When connecting the simulator equipment for checking, please refer to below.
12.4.1. Bottom View
Digital
Volt Meter
/2 W
Charge+
Charge-
12
TP3
PNLP1029YA
1
2
PQUP11532Y
F1
PbF
TP4
J1
A
TP3
TP4 (GND)
DC POWER
DC 6.5 V
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
12.5. Adjustment Standard (Handset)
When connecting the simulator equipment for checking, please refer to below.
12.5.1. Component View
PNLB1734Y
BL
K
TP_ANT1
R27
CLK
R332
Q11
R331
C331
CP3.0V
RA40
8
5
IC3
1
4
+
MIC+
C150
GND
R4
RX
TX
GND
R45
C35
R7
R30
R8
R3
C121
Q9
R31
F1
UTX
BAT
Q4
C3
BATT+
R6
R2
MICURX
BATT-
R74
C75
C74
R73
CHG(+)
D3
2.7 V
Zener
C147
C5
CHG(-)
D4
C113
A
MIC
MIC+
MIC-
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.37)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.20)
50
PC
URX
C340
RA61
DC 6.5V
C1
RCVRCV+
DC Power
2.30~2.60V
Current
Probe
C341
AF
Generator
Q7
RA30 RA31
D1
+
E
GND
22pF
Frequency
Counter (*1)
100
1.8V
R330
C342
D7
Oscilloscope
AF Volt Meter
1 F
8
CP 4.0V
CP 3.0V
R248
C172
C2
Q12
C51
CP4.0V
Q10
R20
R249
GND
R37
R36
C39 C30
R23
C52
C53
C55
Digital
Volt Meter
C188
L46
L47
C13
C11
Power Key
C49
C50
21
R403
R404
(at battery low)
RA1
IC1
C97
C17
C96
R215
C12
C18 R28
C40
C54
C332
GND
CLK
C48
Q2
C38
R406
R407
DC POWER
2.00~2.25V
R64
C45
C46
C820
C826
C822
R203
C43
C47
X1
R401
Oscilloscope (*2)
RA32
C881
Q880
C819
8
80 R806
C
C861 C825
JTAG
STM
R63
R405
R66
C44 R225
1
Q401
POWER
1
C138
C805
L801
C860
C182
C400
R880
C834
C73
R807
C10
1.8V RA4
D400
Q400
D13
C72
R801
R808
C880
RA800
R802
R805
C837
R402
R400
IC801
C802
RED
D14
C863 C864
C814
C809
C810
DA801
C827
C812
C803
C813
L802
C806
L803
C811
BLK
SPEAKER
C139
R232
R236
C804
56
R231C201C200
C105
C206
R54
C203
R233
R53 R50
D22
R55
C204
C107
C71
R578
D21
C106
C103
C152
C70
56
TGA250XX
TGA251XX
TGA403XX
C175
150
C580
C187
ANT
TGA650XX
TGA651XX
C104
R
ED
R
EC
EI
VE
R
PbF
C186
DECT Tester
CMD60
GND
KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
KX-TGA251XX
KX-TGA403XX
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
12.6. Things to Do after Replacing IC or X'tal
If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment
data, etc. in memory.
The set doesn't operate if it is not executed.
12.6.1. How to download the data
12.6.1.1. Base Unit
First, operate the PC setting according to The Setting Method of JIG(P.45).
Then download the appropriate data according to the following procedures.
EEPROM (IC611)
X'tal (X1)
Items
How to download/Required adjustment
Adjusted parameter data is stored in memory. 1) Change the address “0001” of EEPROM to “55” to download
(country version batch file, default batch file, the data.
etc.)
2) Default batch file: Execute the command “default.bat”.
3) Country version batch file: Execute the command
“TG4011USLArevXXX_YYY.bat”. (*1)
4) Clock adjustment
System clock
Clock adjustment data is in EEPROM, adjust the data again
after replacing it.
1) Apply 6.5V between DCP ad DCM with DC power.
2) Input Command " sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).
4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz ± 15 Hz.
Note:
(*1) XXX_YYY: revision number
“XXX”, “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.45).
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
12.6.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG(P.45).
Then download the appropriate data according to the following procedures.
EEPROM (IC3)
Items
Adjusted parameter data is
stored in memory.
(country version batch file,
default batch file, etc.)
Battery Monitor Check
-
Battery Low Confirmation
-
Battery Clock Adjustment
(X1)
CLK
How to download/Required adjustment
1) Default batch file: Execute the command “default.bat”.
2) Default batch file (remaining): Execute the command
“TGA402USDEFrevXXX_YYY.bat”. (*2)
3) Country version batch file: Execute the command
“TGA402USLArevXXX_YYY.bat”. (*2)
4) Clock adjustment
5) 2.35 V setting and battery low detection
1) Apply 2.25 V between BATT+ and BATT-.
2) Execute the command
sendchar PAD
sendchar LED 0
sendchar CRX 0 1
sendchar AD1
It assumes that the return value is XX.
a) 6c XX 71: No need to adjust
b) XX: 6A ~ 6B: Need to adjust
XX: 72 ~ 74: Need to adjust
Write AD value of 2.25 V to EEPROM.
ex) read data: XX = 6A, write data:YY = 6A
read data: XX =73, write data: YY = 73
EEPROM = 0009 (Low Voltage) write “YY“
Execute the command “wreeprom 00 09 01 YY“.
EEPROM = 000A (No Voltage) write “YY - 1D“
Execute the command “xwreeprom 00 0A 01 ZZ“.
Note:
No Voltage writing data limit is “00“.
c) XX: 00 ~ 69: Reject
XX: 75 ~ FF: Reject
1) Apply 2.40 V between BATT+ and BATT-.
2) Confirm that there is no flashing of Battery lcon.
3) Apply 2.25 V ± 0.08 V between BATT+ and BATT-.
4)Confirm that there is flashing of Battery lcon.
1) Apply 2.6 V between BATT+ and BATT- with DC power.
2) Input Command “sendchar sfr“, then you can confirm the current value.
3) Check X’tal Frequency. (10.368 MHz ± 100 Hz).
4) If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK execute in the command “sendchar sfr xx xx (where xx is the value)“ so that the reading
of the frequency counter is 10.368000 MHz ± 5 Hz.
Note:
(*2) XXX_YYY: revision number
“XXX” and “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.45).
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
12.7. Frequency Table
Channel 0
Channel 1
Channel 2
Channel 3
Channel 4
Ch. (hex)
00
01
02
03
04
TX/RX Frequency (MHz)
1928.448
1926.720
1924.992
1923.264
1921.536
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
13 Miscellaneous
13.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity → 0.82.
Type → RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4)
13.1.2. How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
13.1.3. How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.1.4. How to Remove a Solder Bridge
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
13.2. How to Replace the Shield Case
13.2.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608°F ± 68°F (320°C ± 20°C)
13.2.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.2.3. How to Remove the Shield Case
Note:
If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
1. Cut the case along perforation.
2. Remove the cut part.
3. Cut the four corners along perforation.
4. Remove the reminds by melting solder.
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KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
13.2.4. How to Install the Shield Case
Note:
• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
• Shield case’s No. : PNMC1013Z
1. Put the shield case.
2. Solder the surroundings.
57
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
13.3. How to Replace the LLP (Leadless Leadframe Package) IC
Note:
This description is only applied on the model with Shield case.
13.3.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608 °F ± 68 °F (320 °C ± 20 °C)
13.3.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.3.3. How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.
58
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
13.3.4. How to Install the IC
1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.
2. Place the solder a little on the land where IC pins are to be attached, then place the IC.
Note:
• When placing the IC, the positioning should be done very carefully.
3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.
Note:
• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.
4. After soldering, confirm there are no short and open circuits with visual inspection.
13.3.5. How to Remove a Solder Bridge
When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.
59
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
13.4. Terminal Guide of the ICs, Transistors and Diodes
13.4.1. Base Unit
13.4.2. Handset
60
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Schematic Diagram (Base Unit_Main))
14.1.1.1. Acoustic Testing Mode
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Schematic Diagram (Handset_Main))
Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.3. Charger Unit (Schematic Diagram (Charger Unit))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
61
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
14.2. Schematic Diagram (Base Unit_Main)
470
R892
ANT2
R807
470
C892
5p
ANT2
W 0.2mm GND
L mm
1st layer
GND
CL2
RXON
C822
10p
W 0.15mm
L 20mm
3rd layer
GND
C827
10p
RXn
GND
C894
C826
2.2p
W 0.2mm
L 10mm
1st layer
C820
1.5p
1.5p
C863
10p
RXp
GND
GND
ANT1
2
GND
1.2p
C896 C859
2.2p 2.2p
C893
CL1
3p
W 0.2mm
L 10mm
1st layer
W 0.2mm
L mm
1st layer
GND
GND
GND
GND
L809
C812
7.5n
0.9p
C805
2.7p
GND
W 0.15mm
L 20mm
3rd layer
470
R891
C891
5p
W 0.15mm
L 5.0mm
1st layer
W 0.15mm
L 5.0mm
1st layer
C825
10p
TXn
GND
470
W 0.2mm
L 10.0mm
1st layer
GND
ANT1
TXON
TXn
TXp
RXp
RXn
RXON
ANT2
C806
2.7p
GND GND
R806
GND
C810
2.4p
2p
3
GND
TXp
DA801
2
3
1
C895
C813
DA802
1
VBAT
TO RF BLOCK
C811
10p
GND
VBAT
(1)
(2)
(3)
(4)
GND
TXON
ANT1
45
C658 NC
C659 NC
C660 NC
NC
NC
NC
NC
NC
NC
53
*WBX01
NC
PARALLEL WIRE
C515
NC
1k
*R512
2
FCT
RA501 33
56
0.1u
C517
0.1u
57
58
C518 0.1u
59
61
62
5
4
63
6
3
64
7
2
8
1
6
8
7
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_RTCK
+3.0V
55
C516
60
ANS_LED
3
RA502
10k
65
66
VDDC
TXp
RXp
RXn
GND_RF
TRSW_p
ANT_n
ATST_n
ATST_p
TEST
RSTN
*IC501
NC
VCC_VCO
GPIO[27]
VDDUSB
DM_USB/GPI28
DP_USB/GPI29
VDDC1
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_RTCK
(5)
*SW1
2
54
STM/CKM/P15
45
C2 B2
51
52
3
4
50
+3.0V
2
NC
NC
MSG_LED
1
KEYIN1
KEYIN2
KEYIN3
KEYS_C
KEYS_D
KEYS_E
C651
C652
C653
C654
C655
C656
49
GND
1
E
*R507
C1 B1
10
1
48
RSTN
NC
5
*R651
*R652
47
*Q651
VBAT
2APVCC
MSG_LED
ANS_LED
NC
KEYIN1
KEYIN2
KEYIN3
KEYS_C
KEYS_D
KEYS_E
46
K1u
* Start Monitor
* When "SFR" command
is executed, 13.824MHz
frequency will be output.
1
*C661
NC
NC: No Components
62
(6)
R502
33
JTAG_RTCK
JTAG_TDI
TDI
RTCK
JTAG_TMS
JTAG_TCK
TCK
TMS
JTAG_TDO
TDO
UTX
UTX
URX
GND
URX
AP1
1
*CE
2
SO
*C601
C
VDD
8
*HOLD
7
3
*WP
SCK
6
4
VSS
SI
5
NC
*IC601
*R601
E
B
NC
Q601
NC
R602
NC
C611
R603
IC611
NC
64K EEPROM
1
2
3
4
A0
VCC
A1
WP
A2
SCL
GND
SDA
0.1u
8
7
1.2V
PDN_DET
R335
+3.0V
R605
R606
63
0
1 VOUT VIN 2
NC 3
*IC331
NC
VSS
4
GND
5.6
R372
C
B
3
NC
VBAT VBAT
L301
6
10
1 2
9
1
NC
2
SA103
NC
R115
NC
NC
C301
*C306
5.6
R371
R112 100k
33u
HOOK
Bell
L372
JJ301
DC/DC CONVERTOR
Q301
1
IC301
2
3
12
11
6
8
7
3 4
5
VOUT 4
EXT
1u
*C351
C112
0.047u
R111 100k
R144 NC
K0.01u
C132
R133 330k
1
0.1u
K
NC
A
*D361
10k
C111
0.047u
R145 2.2k
C152 0.01u
R152 470k
R167 27
C168 NC
2
270V
1
SA101
C102 680p
*C352
C113
K0.68u
R113
47k
R114
NC
0.022u
C171
NC
0.022u
R166
4
33u
L102
P101 22
3.0A
*L361
*L371
L362
NC
10p
K
NC
A
*D363
DCDC_OUT
L101
C308
C302
+3.0V
1
2
NC
+3.0V
12
R165 27k
C167 1000p
C161 10u
R131 10M
2.7k
R142
K
25V
D142 NC
K0.01u
D143
A
100
R176
C164 NC
560
R175
C176 10u
C142
R163
D101
NC
RA504
68
C
R301
IC302
3
R302
NC
2
B
47k
R162
E
C
Q141
C303
3
VOUT2
ADJ
NC
2
3.0V
NC
4
PDN_DET
HOOK
BELL
KEYS_E
KEYS_D
KEYS_C
UTX
URX
2 VOUT1
3
INPUT
4
C305
5
K
VDDC
C304
L501
100n
NC
6
Q142
NC
1
3
RA151
1k
NC
C501
0.1u
E
K
Q111
E
R304
R136
NC
100k
NC
10
R305
1
R141
NC
4
BELL
C307 R307
16
+3.0V
10p
1u
2
B
C322
C321
18
R151
NC
1u
D113
VBG
F100
19
A
390k C122 680p
F140
C506
D133
A
NC
K
390k C121 680p
R122
A
10u
B
NC
VDDC
R121
10p
15
D153
K1.0u
R322
C505
C525 NC
C184
0
C181
R181
NC
*R331
1
NC
SPN
Q143
NC
D331
VDDC
10p
C186
NC
R333
C502
10u
C524 NC
1k
+3.0V
100k
C343
1u
1u
100k
R321
13
R161
2.7k
330u
14
R164
0.1u
20
10p
C125
X501
C163 NC
NC
C331
7
NC
C178
E
Tx
*R332
8
C504
C521
C173
C165 NC
C341
21
Q161
C342
22
E
47k
9
+3.0V
C172 NC
C151 10p
C133 NC
VREF
R334
11
R177
22
R171
1000p K0.22u
Rx
NC
C332
12
Q171
NC
NC
R178
NC
L474
10p
10p
C
C523
R503
C126
NC
*L476
C476
C479
100k
C175
10u
10p
C123
C472 NC
C475 NC
C473 NC
K
K
R172
C
3.3k
3.3k
EEP_SCL
EEP_SDA
EEP_WP
MIN
VCCA
VREF
DCIN3/LIN1
DCIN2
DCIN1
DCIN0/LIN0
DOUBOUT
DOUBCAPP1
DOUBCAPP
DOUBCAPN
DOUBCAPN1
VBAT
COREOUT
VDDC2
GPIO[26]
GPIO[25]
GPIO[24]
GPIO[23]
GPIO[22]
GPIO[21]
GPIO[20]
3.0V
C503
VCCA
R501
10
NC
C124
1000p
C174
VCCA
NC
C185
K2.2u
10p
C120
910
R506 NC
23
24
25
C507
C522
A
A
*D472 NC
B
R505 2.2k
89
*IC501
GND
88
87
86
26
27
28
29
30
31
32
33
34
35
C509 12p
*D473 NC
C477 10p
C478 10p
R160
10k
0.1u
C520
85
84
83
82
81
80
79
78
77
76
C514 0.1u
C513 K2.2u
C512 0.1u
C511 10u
C510 K1u
C530 10p
C508 10p
+3.0V
R612
+3.0V
FLASH_RST
SPI_CLK
SPI_DO
SPI_DI
SPI_CS
SPI_CS
FLASH_RST
KEYIN1
KEYIN2
KEYIN3
36
37
38
39
40
41
42
43
44
13.824M
75
74
TXn
TRSW_n
ANT
VCC_FE
VDD_IF
VCC_IF
VDD_APU
VBAT_APU
XIN
XOUT
DCINS
PWM0
PWM1
SPOUTP
VCCPA
SPOUTN
LOUT
HSSPOUTP
MPWR
HSMIP
HSMIN
MIP
R509 NC
NC
*R607
(5)
C519
0.1u
73
72
71
GPIO[0]/SCL_IIC
GPIO[1]/SDA_IIC
GPIO[2]
GPIO[3]
GPIO[4]
GPIO[5]
GPIO[6]
GPIO[7]
GPIO[8]
VDDIO1
GPIO[9]
GPIO[10]
GPIO[11]
GPIO[12]
GPIO[13]
GPIO[14]
GPIO[15]
GPIO[16]
GPIO[17]
VDDIO2
GPIO[18]
GPIO[19]
(1)
(2)
(3)
(4)
70
69
68
67
SPP
MSG_LED
ANS_LED
SPI_DI
SPI_DO
SPI_CLK
EEP_SCL
EEP_SDA
EEP_WP
(6)
NC
*R604
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
REFERENCE
1XX : TEL LINE
3XX : POWER, CHARGE
4XX : MIC, SP
5XX : BBIC
6XX : FLASH, EEPROM, KEY, LCD
7XX : FOR DK
8XX : RF
C101 680p
(YELLOW)
L1T
(GREEN)
L1R
C115
NC
GAP
Caller ID
+6.5V +6.5V
F301
DCP
DCM
220nH
CHARGE+
17
220nH
CHARGE-
4
NC
CHG+2
NC
CHG-2
NC
+6.5V
VBAT +6.5V
NC
NC
ON/*OFF 5
VIN
NC
VSS
DCDC_IC
5
ZA1 NC
GND
KX-TG4011/4012/4013LA SCHEMATIC DIAGRAM (Base Unit_Main)
NC: No Components
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
14.3. Schematic Diagram (Handset_Main)
Charge Current
BATTERY
F1
BATT+
GND
GND
GND
GND
R331
27k
R332
GND
27k
GND
C10
K2.2u
GND
GND
KEY_LED
ROW1
ROW2
ROW3
ROW0
NC
Q4
C2CP2
6.3V
330u
GND
C332
1u
CKM
LCD_CD
LCD_SCL
LCD_SDA
SOCp
R2
Q2
D1
Q12
C331
1u
R404
NC
GND
1.2k
SOCn
Q11
NC
GND
R7 CHARGE
NC
Q401
R403
NC
CHARGE_CTRL
R330
1M
Q400
C400
NC
C35
J56p
(MAX500mA)
+1.8V
1.8V
LDO_CTRL
NC
R20
10
COL5
R400
NC
GND
1.8V
NC
D400
C342
NC
GND
BATTERY
R401
NC
BATT-
R45
0.1
R407
NC
GND
R402
GND
C341
J39p
GND
C340
NC
R406
NC
+1.8V
3.0V
C39 NC
NC
C3
C1CP1
6.3V
330u
NC
C150
5.6n
BATTERY
4.0V
CP+3.0V CP+4.0V
CP3.0V
CP4.0V
GND
D7
SHARP
2
1
BATTERY
To PA
1
TALK
1
2
2
1
SOFT_C
1u
C50
1u
4
2
5
RF-SHIELD
RE2
*LED21
1
*LED3
*LED2
2
1
8
7
3
6
5
*RA32
120
3
4
1
2
3
4
*RA30
330
4
2
*RA31
330
8
7
6
5
1
GND
NC *LED1
*LED4
*LED9
*LED5
*LED7
*LED6
*LED8
(9)
(10)
LDO_CTRL
LCD B/L
Q7
GND
NC: No Components
64
(7)
(8)
(11)
(12)
(13)
(14)
(15)
KEY_LED
NC
NC
1
2
1
ROW0 RIGHT
LEFT
*R249
NC
*LED23
2
1
SOFT_B
ROW1
2
*R248
0
KEY B/L
[RU]
CP+4.0V
VREFm
R27 820
R28 820
NC
*C139
NC
*C138
C11
K0.1u
R
1
2
2
1
SP
1
DOWN
2
2
2
1
SOFT_A
ROW2
[EX /FX]
CP+3.0V
GND
R215
0
0V
BELL_LED_A
ROW3
*LED12
1
3
2
10.368M
GND
GND
VREFm
*X1
0.75V
COL5
BELL LED
(Amber)
RA4
3.3k
GND
COL4
BATTERY
C49
C18
D10p
250mVp-p
(4)
(5)
(6)
D10p
RX _RF
TO RF BLOCK
UP
1
2
3
4
5
R203
6
F56k
7
8
9
10
C47 1u 11
10p
12
C43
13
C48 NC 14
15
16
17
18
19
20
C182
COL3
C17
3
1
GND
RF_RXp
RF_RXn
RXON
AST
2
2
7
2
4
1
1
1
2
COL2
1
81
1
0
2
2
1
8
2
5
1
1
2
2
COL1
C13
K0.1u
2
1
9
2
1
6
2
3
1
TXON
2
1k
TX _RF
TXp
TXn
COL0
GND
R23
PON
PSEL
VDD_PADRV
S1
K10u
JTAG
100
*IC1
1
40
39
38
37
36
35
34
33
CHARGE
32
31 CHARGE_CTRL
SOCn
30 L46
SOCp
29 L47
28
27
COL0
26
COL1
25
COL2
24
COL3
23
COL4
22
21
C12
C45
K0.1u
VBAT2
CP_C1y
CP_C2x
CP_C1x
VBAT1
PAOUTn/P3_0
VDDPA
PAOUTp/P3_1
P1_7/CHARGE
CHARGE_CTRL
SOCn
SOCp
NTC/ADC2
ADC1/INT0/P1_0
ADC0/P3_3
PARADET/P3_4
RINGOUT/RINGING/P3_5
RINGn/P3_6
RINGp/P3_7
CIDINp/VREFp
6
R66
1k
BELL_LED_A
4
R63
JTAG
LCD_RESET
*LED22
GND
RA61
220
Power_adj
UTX
URX
RSTn
JTAG
P2_5/PCM_FSC/SF
P2_4/SCL1/PCM_DO/DP3
P2_3/SDA1/PCM_DI/DP2
P2_2/PCM_CLK/CLK100
P2_1/ECZ2/PWM1/LED4
P2_0/ECZ1/PWM0/LED3
VDD2
LDORF_CTRL
RF_SUPPLY2
RFP0n
RFP4
RFP3
VDD_PADR
VSS_PADR1
RF_TXp
RF_TXn
VSS_PADR2
RFP2
3p
1
3
10k
2
R64
STM
BAT
UTX
URX
GND
61
62
63
64
65
66
67
68
69
70
C46 71
72
10p
73
74
75
76
77
78
79
80
C96
D10p
LCD_CSB
GND
P0_0/UTX
P0_1/URX
P0_2/SDA2
P0_3/SCL2
P0_4/SPI_EN
P0_5/SPI_CLK
P0_6/SPI_DO
P0_7/SPI_DI
P2_6/WTF_IN
P1_1/INT1/LE
P1_2/INT2/SK
P1_3/INT3/SIO
P1_4/INT4/TDOD
P1_5/INT5/RDI/VDDE
P2_7/BXTAL
VDD1
PON/P1_6
CP_VOUT2/LED2
CP_VOUT1/LED1
CP_C2y
C44
K0.1u
R225
0
NC
VSS_LNA1
RF_RXp
RF_RXn
VSS_LNA2
RFP1
RFP0
REF_RES
AVS_XTAL
XTAL2
XTAL1
AVD_XTAL
RF_SUPPLY1
LDO_CTRL
AVD
LSRn
LSRp
VREFm
MICh
CIDOUT/MICn
CIDINn/MICp
GND
R405 NC
100
R8
GND
+1.8V
C38
C55
D10p GND
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
1k
C51
K1u
C54 D10p
GND
Q9
GND
C52 K10u
1
2
3
4
R3
GND
C53 K10u
C97
D10p
+1.8V
GND
C121
NC
(1)
(2)
(3)
POWER
R31
100
C40
k0.1u
R6
NC
8
7
6
5
R4
NC
RA1
1k
R30
CHG(-)
1.5k
NC
C147
CHARGE
Terminal
C5 K1u
CHG(+)
GND
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
R807
GND
R36
NC CP+3.0V
2p
2p
10p
NC
RF_RXp
GND
GND GND
BPF
W 0.15mm
L 5.0mm
1st layer
C172
K0.1u
GND RA40
10k
GND
RF_RXn
C820
1
DA801
C802
C804
R37
NC
C30
NC
RX_RF
4p
3
1.5p
GND
*C826
2
C803
BATTERY
10p
C837
GND
27n
RXON
220
NC
TP_ANT1
C827
C822
W 0.15mm
L 20+/-2mm
3rd layer
L801
W 0.125mm
L 7.6mm
Gap 0.125mm
1st layer
GND
W 0.15mm
L 5.0mm
1st layer
3
3.3p
C806
GND
RA800
1k
2
1
NC
C881
TXn
TX_RF
W 0.15mm
L 3.0mm x2
1st layer
R805 47
VDD_PADRV
GND
PSEL
PON
3
4
GND
GND
TXON
C864
10p
GND
*C834
1p
10p
1.6p
C805
3.3p
IC801
Pre-matching
C825
1
2
3
4
5
Power_adj
TXp
GND
R806
220
NC
GND
C819
W 0.15mm
L 20+/-2mm
3rd layer
GND
VCC
PSET
PO
GND VCCS
POX
PI
PSEL
PIX
PAON
PRAMP
1.6p
C813
Balun
C188
K1u
100n
10p
3.6n
C810
3.6n
L803
GND
10p
(4)
(5)
(6)
11
GND
10
9
8
7
6
C863 NC
10p
C812
Q880
GNDGNDGND
GND
GND
GND
L802
BATTERY
C811
W 0.15mm
L 20+/-1mm
3rd layer
C809
GND
C808
*IC3
R880 NC
R801:220k
R808:NC
C880 NC
BATTERY
4
100
GND
R808 NC
SDA
2
*R801 1.2k
A2
*R802
SCL
1
3.3n
A1
C814
5
A0
WP
3p
6
VCC
C860
1
2
3
4
7
10p
C861
8
(1)
(2)
(3)
NC
NC
8
7
6
5
Q10
GND
GND
Sp-phone RX/Beep
1
+
SP-PHONE_SPEAKER
-
D13
D14
C72 NC
C73 NC
2
GND GND
GND
GND
LSRp
LSRp
(7)
(8)
LSRn
RX-AF (Handset)
(9)
(10)
LSRp
NC
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
1
2
3
4
5
6
7
8
9
10
11
12
*C580
NC
MICn
-
RCVD21
C70
NC
2
D22
*C175
NC
*R578
NC
TX _AF
GND
+
RECEIVER
LSRn
MICp
GND
1
GND
GND
OPT_PWR
LCD_CSB
RESETB
A0
SCLK
SID
VDD
VDDA
VSS
V0
GND
GND
RS
/CS
SI
SCL
VDD
V0
VR
VOUT
CAP2CAP2+
CAP1CAP1+
VSS
/RES
GND
*C187
C71NC
*R236
NC
*C206*C203
1
NC
*C201
1
*C200 1
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
100p
*C105
NC
*C204
0.1
GND GND GND GND GND
*C186
NC
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
100p
*C103
R55
1k
*R233
430k*R231
*R232 820k
*R54
10k
NC
*C106
*R52
1k
J33p
*C107
*R53
3.3k
*R50
10k
*R51
470
10p
LCD_SDA
LCD_SCL
LCD_CD
LCD_RESET
LCD_CSB
*C104
(11)
(12)
(13)
(14)
(15)
C152
k1000p
RCV+
CP+3.0V
GND GND
GND
GND
C113 D10p
R73
1
82
MIC AP1
R74
2
82
MICD4
D3
C74
C75
D10p
NC
NC D10p
VREFm
GND
VREFm
GND
MIC+
to LCD UNIT (Monochrome 1.4inc 3Line/for TGA250) to LCD UNIT (Monochrome 1.8inc FullDot/for TGA651)
KX-TGA403 SCHEMATIC DIAGRAM (Handset_Main)
65
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
14.4.
Schematic Diagram (Charger Unit)
TP3
1
F1
R1 12
TP2
2
J1
TP4
TP1
G
SCHEMATIC DIAGRAM (Charger Unit)
66
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
15 Printed Circuit Board
15.1. Circuit Board (Base Unit_Main)
15.1.1. Component View
CL2
YLW
ANT2
C351
CHG
CHARGE-
L476
RED
SP
DCM
RED WHT
BLK
DC
DCP
R301
ANT1
R321 C343
TDO
TDI
TCK
TMS
3
4
VBAT
B
CL1
R322
+6.5V
IC302
R605
R606
VBAT
KX-TG4011/4012/4013 CIRCUIT BOARD (Base Unit_Main (Component View))
67
STM/CKM
SPN
3.0A
R305
C307
R302
DCDC_OUT
C322
C321
R307
C477
D472
FCT
R502
STM/CKM/P15
5
RTCK
RTCK
+3.0V
IC611
R612
Q601
E
F301
C301
R304
SPP
RSTN
C476
R512
RA502
R601
R607
R507
C478
D473
8
IC601
4
R603
R602
R335
VDDC
RA504
R334
L371
C514
L474
C530
1
C521
D133
D153
RA151
C479
C601
R503
D361
Q161
C181
C513
C133
R604
C332
C611
C510
C151
R136
}
R152
C152
R151
PNLB1712Z
R506
C511
VCCA
VREF
R178
VBG
C661
+3.0V
C524
R505
C512
C475
C473
C472
C120
C124 C123
R166
URX
R181
C186
C525
R165
C167
C184
C171
C125
R121
UTX
R163
C163 C165
R161 R164
C121
C122
R167
C126
L361
C142
CHARGE+
R162
C168
R122
GRN
D143
R115
R112
C112
GND
PbF
VDDC
L1R
L372
C352
CHG-2
BLK
UTX
URX
L1T
D363
L362
CHG+2
RED
for JIG
GND
D142
C115
ANT1
C341
Q301
L301
KX-TG4011/4012/4013 CIRCUIT BOARD (Base Unit_Main (Bottom View))
C331
R331
1
C892
SP
C502
C501
C517
IC331
R332
1
C523
C520
C519
C822
C504
ZA1
Q651
C820
C827
C826
C863
IC501
R892
NC
MSG_LED
10
KEYIN1 ANS_LED 2APVCC
KEYS_C KEYIN2
KEYS_D KEYIN3
KEYS_E
1
JJ301
IC301
C306
C303
C651
C302
C308
C305
C304
C342
C652
R333
D331
C653
C515
C894
C655
C516
DC
C654
RA501
C656
C518
R652
C658
C522
C507
C806
C811
C895
DA801
C805
C185
C505
R807
C172
R651
C812 L809
C859
C506
C660
WBX01
SW1
C891
C825
DA802
R177
C178
C132
R145
R133
Q111
C175
R172
R114
Q142
RED
R509
R371
YLW
PbF
PNLB1712Z
TEL
GRN
Q143
Q141
R141
R131
BLK
CHG
R372
C102
L102
RED
C111
C101
SA103
P101
C893
ANT2
KX-TG65XX/75XX/40XX
D101
C896
R501
R806
R891
C508
C509
C176
R144
X501
Q171
R142
C164
R171
C113
R113
C173
E
C503
C659
R175
R176
R160
C174
D113
B
HAK_CL1
SA101
WHT
C161
0
3
68
R111
81
81
RED
L101
C
C
BLK
15.1.2. Bottom View
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
15.2. Circuit Board (Handset_Main)
15.2.1. Component View
KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
KX-TGA251XX
KX-TGA403XX
PNLB1734Y
RCV-
TGA650XX
TGA651XX
C175
C186
C187
C580
TGA250XX
TGA251XX
TGA403XX
C152
C70
D22
R55
C204
R231C201C200
C105
C206
R54
C203
R53 R50
R236
C107
C138
C73
RA32
Q880
C819
8
80 R806
C
C861 C825
C826
C822
R64
C45
C46
C820
JTAG
STM
R63
R405
R66
C44 R225
1
R807
RA1
IC1
C48
C40
C54
Q2
C49
C50
C97
C17
C96
R215
C12
C18 R28
X1
C47
R203
C43
21
C188
L46
L47
C13
C11
R401
R37
R36
C39 C30
R23
R27
R20
C2
R332
Q11
R331
C331
R249
C51
CP4.0V
R248 CP3.0V
C172
C332
Q12
C52
C53
C55
X_CLK
(10.368MHZ)
RA40
Q10
R403
R404
C38
R406
R407
CLK
Q401
POWER
D13
C881
C805
L801
C860
C182
C400
R880
C834
C10
1.8V RA4
D400
Q400
SP+
RED
C72
R801
R808
C880
RA800
R802
R805
C837
R402
R400
IC801
C802
SP-
D14
C863 C864
C814
C809
C810
DA801
C827
C812
C803
C813
L802
C806
L803
C811
C804
BLK
SPEAKER
C139
R232
R233
C103
C71
R578
D21
C106
C104
RCV+
BL
K
TP_ANT1
R
ED
R
EC
EI
VE
R
PbF
8
5
IC3
1
4
R330
C342
Q7
RA30 RA31
D1
E
C341
C1
RCV-
MIC+
RCV+
UTX
R4
GND
R45
C35
R7
R30
R8
R3
C121
F1
C150
BATT+
Q9
R31
BATT+
MICURX
BAT
Q4
C3
D7
R6
R2
RA61
C340
BATT-
URX
UTX
JIG
GND
BAT
BATT-
}
C147
R74
C75
C74
R73
CHG(+)
CHG (+)
C5
D3
CHG(-)
D4
C113
MIC
MIC+
A
CHG (-)
MIC-
KX-TGA403 CIRCUIT BOARD (Handset_Main (Component View))
69
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
15.2.2. Bottom View
LED12
PNLB1734Y
PbF
KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
KX-TGA251XX
KX-TGA403XX
CN5
12
1
TGA650XX
TGA651XX
CN51
TGA250XX
TGA251XX
TGA403XX
R51
SOFT_A
LED23
LED3
LED2 LED22
LED1 LED21
R52
SOFT_B
SOFT_C
UP
TALK
S1
LEFT
RIGHT
LED6
LED8
SP
R
DOWN
2
3
LED7
LED5
1
5
6
7
8
9
LED9
LED4
4
0
#
A
MIC
KX-TGA403 CIRCUIT BOARD (Handset_Main (Bottom View))
70
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
15.3. Circuit Board (Charger Unit)
15.3.1. Component View
PQUP11532Y
R1
J1
PNLP1029YA
PbF
A
CIRCUIT BOARD (Charger unit (Component View))
15.3.2. Bottom View
TP4 (GND)
TP3
PNLP1029YA
1
2
PQUP11532Y
F1
PbF
TP4
J1
A
TP3
CIRCUIT BOARD (Charger unit (Bottom View))
71
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
16 Exploded View and Replacement Parts List
16.1. Cabinet and Electrical Parts (Base Unit)
1
3
4
2
7(*1)
5
6
7(*1)
6
PCB1
8
A
9
Ref.No.
Figure
A
Ǿ2.6˜8
mm
Note:
(*1) The SPACERs (No.7) are cut from the excess parts of SPACER (No.108) of Cabinet and Electrical Parts (Handset)
(P.73).
72
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
16.2. Cabinet and Electrical Parts (Handset)
111
B
E106
107
E105
104
E101(*1)
E103
E107
106
105
103
102
E102
108
B
E104
MIC100
PCB100
110
109
112
101
120
118
116
(*2)
119 (*3)
115
114
117
B
Battery cover
Ref.No.
Figure
Spacer (No.119)
B
Ǿ2˜8
Stick it between
ribs.
mm
Put it in the center.
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.44).
(*2) The rechargeable Ni-MH battery HHR-4DPA or HHR-4MRT is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 119) to the exact location described above.
73
113
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
16.3. Cabinet and Electrical Parts (Charger Unit)
200
200-1
PCB200
B
200-3
200-2
B
200-4
Ref.No.
Figure
B
2
74
8 mm
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
16.4. Accessories
A1
A2
75
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
16.5. Replacement Parts List
16.5.1.2. Main P.C. Board Parts
Note:
(*1) When replacing IC611 or X501, make the adjustment
using PNZZTG4011LA Refer to How to download the data
(P.51) of Things to Do after Replacing IC or X'tal.
1. RTL (Retention Time Limited)
Note:
The “RTL” marking indicates that its Retention Time is
Limited.
When production is discontinued, this item will
continue to be available only for a specific period of
time.
This period of time depends on the type of item, and
the local laws governing parts and product retention.
At the end of this period, the item will no longer be
available.
2. Important safety notice
Components identified by the mark indicates special
characteristics important for safety. When replacing any
of these components, only use specified manufacture's
parts.
3. The S mark means the part is one of some identical parts.
For that reason, it may be different from the installed part.
4. ISO code (Example: ABS-94HB) of the remarks column
shows quality of the material and a flame resisting grade
about plastics.
5. RESISTORS & CAPACITORS
Unless otherwise specified;
All resistors are in ohms (Ω) k=1000Ω, M=1000kΩ
All capacitors are in MICRO FARADS (µF) p=µµF
*Type & Wattage of Resistor
Safety
Ref.
No.
PCB1
IC302
IC501
IC611
Q111
Q141
Q142
Q161
Q171
D101
D113
D133
D143
DA801
DA802
L101
L102
L361
L371
L501
L809
RA151
RA501
RA502
RA504
SA101
R111
R112
R113
R114
R121
R122
R131
R133
R141
R142
R145
R151
R152
R160
R161
R162
R163
R164
R165
R167
R171
R172
R175
R176
R178
R181
R321
R322
R334
R335
R371
16.5.1. Base Unit
16.5.1.1. Cabinet and Electrical Parts
Safety
Ref.
No.
1
2
3
4
5
6
7
8
9
Part No.
PNKM1129U3
PNBC1303Z2
K2ECYZ000001
PQJJ1T039S
PNJT1046Z
PNLA1030Z
PNYE1027Z
PNKF1097Z1
PQHA10023Z
Part Name & Description Remarks
CABINET BODY
PS-HB
BUTTON, LOCATOR
ABS-HB
JACK, DC
JACK, MODULAR
CHARGE TERMINAL
ANTENNA
SPACER, ANTENNA
CABINET COVER
PS-HB
RUBBER PARTS,FOOT CUSHION
76
Part No.
Part Name & Description Remarks
PNWP14011LAH MAIN
P.C.BOARD
ASS'Y
(RTL)
(ICs)
C0CBAYG00016 IC
C2HBCY000064 IC(BBIC)
PNWI14011LAH IC(EEPROM)(*1)
(TRANSISTORS)
2SC6054JSL
TRANSISTOR(SI)
B1ACGP000008 TRANSISTOR(SI)
PQVTBF822T7 TRANSISTOR(SI)
2SD0874AS
TRANSISTOR(SI)
2SC6054JSL
TRANSISTOR(SI)
(DIODES)
PQVDMD5S
DIODE(SI)
MA111
DIODE(SI)
MA111
DIODE(SI)
MANV250GEL
DIODE(SI)
B0DDCD000001 DIODE(SI)
B0DDCD000001 DIODE(SI)
(COILS)
PQLQXF330K
COIL
PQLQXF330K
COIL
G1CR22J00006 COIL
G1CR22J00006 COIL
G1CR10J00010 COIL
G1C7N5JA0044 COIL
(RESISTOR ARRAYS)
D1H410220001 RESISTOR ARRAY
EXB28V330
RESISTOR ARRAY
EXB28V103
RESISTOR ARRAY
D1H468020001 RESISTOR ARRAY
(VARISTOR)
J0LF00000048 VARISTOR
(SURGE
ABSORBER)
(RESISTORS)
PQ4R10XJ104 100k
PQ4R10XJ104 100k
ERJ3GEYJ103 10k
ERJ3GEYJ473 47k
ERJ3GEYJ394 390k
ERJ3GEYJ394 390k
PQ4R18XJ106 10M
ERJ3GEYJ334 330k
ERJ3GEYJ104 100k
PQ4R18XJ272 2.7k
ERJ2GEJ222
2.2k
ERJ2GEJ104
100k
ERJ2GEJ474X 470k
ERJ3GEYJ911 910
ERJ3GEYJ104 100k
ERJ3GEYJ473 47k
ERJ12YJ120
12
ERJ3GEYJ272 2.7k
ERJ3GEYJ273 27k
ERJ12YJ270
27
ERJ2GEJ220
22
ERJ2GEJ104
100k
ERJ2GEJ561
560
ERJ2GEJ101
100
ERJ2GEJ102
1k
ERJ2GE0R00
0
ERJ2RKF1400 140
ERJ2RKF1000 100
ERJ2GEJ473
47k
ERJ2GE0R00
0
ERJ1TYJ5R6U 5.6
S
S
S
S
S
S
S
S
S
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
Safety
Ref.
No.
R372
R501
R502
R505
R507
R605
R606
R612
R806
R807
R891
R892
Part No.
ERJ1TYJ5R6U
ERJ3GEYJ100
ERJ2GEJ330
ERJ2GEJ222
ERJ2GEJ102
ERJ2GEJ332
ERJ2GEJ332
ERJ2GEJ103
ERJ2GEJ471
ERJ2GEJ471
ERJ2GEJ471
ERJ2GEJ471
C101
C102
C111
C112
C113
C120
C121
C122
C123
C126
C132
C142
C151
C152
C161
C167
C171
C173
C175
C176
C178
C184
C186
C302
C321
C322
C341
C342
C343
C351
C352
C476
C477
C478
C479
C501
C502
C503
C504
C505
C506
C507
C508
C509
C510
C511
C512
C513
C514
C515
C516
C517
C518
C519
C520
C521
C522
C530
C611
C805
F1K2H681A008
F1K2H681A008
F1J2A473A024
F1J2A473A024
PQCUV1A684KB
ECUE1H102KBQ
F1K2H681A008
F1K2H681A008
ECUE1H100DCQ
ECUE1H100DCQ
ECUV1H103KBV
ECUV1H103KBV
ECUE1H100DCQ
ECUE1C103KBQ
F2G1H1000009
ECUV1H102KBV
ECUV1C223KBV
ECUV1A224KBV
ECUE1H102KBQ
PQCUV0J106KB
ECUE1C223KBQ
ECUV1A105KBV
ECUE1H100DCQ
ECUE1H100DCQ
ECUV1A105KBV
ECUE1H100DCQ
F2A1A3310040
ECUV1C104KBV
ECUE1H100DCQ
ECUV1C105KBV
ECUV1C104KBV
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1A104KBQ
ECJ1VB0G106M
ECJ1VB0G106M
ECUE0J105KBQ
ECJ1VB0G106M
ECUV1A105KBV
ECUV1A225KB
ECUE1H100DCQ
ECUE1H120JCQ
ECUV1A105KBV
ECJ1VB0G106M
ECUE1A104KBQ
ECUV1A225KB
ECUE1A104KBQ
ECUV1A105KBV
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE0J105KBQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1A104KBQ
F1G1H2R7A480
Safety
Part Name & Description Remarks
5.6
10
33
2.2k
1k
3.3k
3.3k
10k
470
470
470
470
(CAPACITORS)
680p
680p
0.047
0.047
0.68
0.001
680p
680p
10p
10p
0.01
0.01
10p
0.01
10
0.001
0.022
0.22
0.001
10
0.022
1
10p
10p
1
10p
330
0.1
10p
1
0.1
10p
10p
10p
10p
0.1
10
10
1
10
1
2.2
10p
12p
1
10
0.1
2.2
0.1
1
0.1
0.1
0.1
0.1
0.1
1
10p
10p
0.1
2.7p
Ref.
No.
C806
C810
C811
C812
C813
C820
C822
C825
C826
C827
C859
C863
C891
C892
C893
C894
C895
C896
Part No.
F1G1H2R7A480
F1G1H2R4A480
F1G1H100A723
F1G1HR90A480
F1G1H2R0A480
F1G1H1R5A480
F1G1H100A723
F1G1H100A723
F1G1H100A723
F1G1H100A723
F1G1H2R2A480
F1G1H1R5A480
F1G1H5R0A480
F1G1H5R0A480
F1G1H3R0A480
F1G1H2R2A480
F1G1H1R2A480
F1G1H2R2A480
P101
SW1
F301
X501
D4DAY220A022
K0H1BA000259
K5H302Y00003
H0J138500011
Part Name & Description Remarks
2.7p
2.4p
10p
0.9p
2p
1.5p
10p
10p
10p
10p
2.2p
1.5p
5p
5p
3p
2.2p
1.2p
2.2p
(OTHERS)
THERMISTOR (POSISTOR)
SPECIAL SWITCH
FUSE
CRYSTAL OSCILLATOR (*1)
16.5.2. Handset
16.5.2.1. Cabinet and Electrical Parts
Safety
Ref.
No.
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
Part No.
PNGP1087Y5
PNYE1026Z
PNKM1123Y6
PNHS1072Z
PQHS10467Z
L0AD02A00043
PQHG10729Z
PNYE1027Z
PNBC1003Y3
PNJK1071V
PNHX1165Z
PNJT1027Z
PNJT1026Z
PQHR11315Z
L0AA02A00095
PQHS10784Y
PQJC10056W
PNKF1093Z1
PNHS1079Z
PNKK1038Y1
Part Name & Description Remarks
PANEL, LCD
TAPE, DOUBLESIDED
CABINET BODY
SPACER, RECEIVER NET
COVER, SPEAKER NET
RECEIVER
RUBBER PARTS, RECEIVER
SPACER, CUSHION LCD
BUTTON, VOLUME KEY
KEYBOARD SWITCH
COVER, LCD SHEET
CHARGE TERMINAL (L)
CHARGE TERMINAL (R)
GUIDE, SPEAKER
SPEAKER
SPACER, SPEAKER NET
BATTERY TERMINAL
CABINET COVER
SPACER, BATTERY
LID, BATTERY
PMMA-HB
PS-HB
ABS-HB
ABS-HB
ABS-HB
ABS-HB
16.5.2.2. Main P.C. Board Parts
Note:
(*1) Reconfirm the model No. written on the handset's name
plate when replacing PCB100. Because the model No. of
the optional handset may differ from the included handset.
(*2) When replacing IC3 or X1, make the adjustment
using PNZZTG4011LA. Refer to Handset (P.52) of Things
to Do after Replacing IC or X'tal.
(*3) When replacing the handset LCD, See How to
Replace the Handset LCD (P.44).
(*4) When removing E106, use special tools (ex. Hot air
disordering tool).
Safety
Ref.
No.
PCB100
IC1
77
Part No.
Part Name & Description Remarks
PNWPGA403LAR MAIN
P.C.BOARD
ASS'Y
(RTL) (*1)
(ICs)
C1CB00003361 IC (BBIC (FLASH))
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
Safety
Ref.
No.
IC3
IC801
Q2
Q4
Q7
Q9
Q11
Q12
D1
D7
D13
D14
D21
D22
DA801
LED4
LED5
LED6
LED7
LED8
LED9
LED21
LED22
LED23
F1
L801
L802
L803
RA1
RA4
RA30
RA31
RA32
RA40
RA61
RA800
L46
L47
R3
R7
R8
R20
R23
R27
R28
R30
R31
R45
R50
R51
R52
R53
R54
R55
R63
R64
R66
R73
R74
R203
R215
R225
R231
R232
R248
R330
Part No.
Part Name & Description Remarks
PNWIGA403LAR IC (EEPROM) (*2)
C1CB00001842 IC
(TRANSISTORS)
B1ADGE000004 TRANSISTOR(SI)
B1ADGE000004 TRANSISTOR(SI)
UN9219J
TRANSISTOR(SI)
2SC6054JSL
TRANSISTOR(SI)
B1ADCF000161 TRANSISTOR(SI)
B1ADCF000161 TRANSISTOR(SI)
(DIODES)
MA2YD2120L
DIODE(SI)
MA2ZD0200L
DIODE(SI)
MA8043M
DIODE(SI)
MA8043M
DIODE(SI)
MA8043M
DIODE(SI)
MA8043M
DIODE(SI)
B0DDCD000001 DIODE(SI)
(LEDS)
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000216 LED
B3ACB0000216 LED
B3ACB0000216 LED
(COILS)
PQLQR2M5N6K COIL
G1C27NJ00010 COIL
G1C3N6ZA0063 COIL
G1C3N6ZA0063 COIL
(RESISTOR ARRAYS)
D1H810240004 RESISTOR ARRAY
D1H433220001 RESISTOR ARRAY
D1H83314A013 RESISTOR ARRAY
D1H433120001 RESISTOR ARRAY
EXB28V121JX RESISTOR ARRAY
EXB28V103
RESISTOR ARRAY
D1H422120001 RESISTOR ARRAY
D1H410220001 RESISTOR ARRAY
(IC FILTERS)
J0JDC0000045 IC FILTER
J0JDC0000045 IC FILTER
(RESISTORS)
ERJ2GEJ102
1k
ERJ2GEJ122
1.2k
ERJ2GEJ101
100
ERJ2GEJ100
10
ERJ2GEJ102
1k
ERJ2GEJ821
820
ERJ2GEJ821
820
ERJ3GEYJ152 1.5k
ERJ2GEJ101
100
ERJ6RSJR10V 0.1
ERJ2GEJ103
10k
ERJ2GEJ471
470
ERJ2GEJ102
1k
ERJ2GEJ332
3.3k
ERJ2GEJ103
10k
ERJ2GEJ102
1k
ERJ2GEJ101
100
ERJ2GEJ103
10k
ERJ2GEJ102
1k
ERJ2GEJ820
82
ERJ2GEJ820
82
D0GA563ZA006 56k
ERJ2GE0R00
0
ERJ2GE0R00
0
ERJ2GEJ824
820k
ERJ2GEJ434X 430k
ERJ2GE0R00
0
ERJ2GEJ105X 1M
Safety
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
78
Ref.
No.
R331
R332
R801
R802
R805
R806
R807
Part No.
ERJ2GEJ273X
ERJ2GEJ273X
ERJ2GEJ122
ERJ2GEJ101
ERJ2GEJ470
ERJ2GEJ221
ERJ2GEJ221
C1
C2
C5
C10
C11
C12
C13
C17
C18
C35
C40
C43
C44
C45
C46
C47
C49
C50
C51
C52
C53
C54
C55
C74
C75
C96
C97
C103
C104
C105
C107
C113
C152
C172
C182
C188
C200
C201
C203
C204
C331
C332
C341
C802
C803
C804
C805
C806
C808
C809
C810
C811
C812
C813
C814
C819
C822
C825
C826
C827
C834
C860
C861
F2A0J3310067
F2A0J3310067
ECUV1A105KBV
ECUV1A225KB
ECUE1A104KBQ
PQCUV0J106KB
ECUE1A104KBQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H560JCQ
ECUE1A104KBQ
ECUE1H100DCQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1H100DCQ
ECUV1A105KBV
ECUV1A105KBV
ECUV1A105KBV
ECUV1A105KBV
PQCUV0J106KB
PQCUV0J106KB
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H101JCQ
F1G1H100A723
ECUE1H101JCQ
ECUE1H330JCQ
ECUE1H100DCQ
ECUE1H102KBQ
ECUE1A104KBQ
F1G1H3R0A480
ECUE0J105KBQ
ECUV1C105KBV
ECUV1C105KBV
ECUV1C105KBV
ECUV1C104KBV
ECUE0J105KBQ
ECUE0J105KBQ
ECUE1H390JCQ
F1G1H2R0A480
F1G1H1R5A480
F1G1H2R0A480
F1G1H3R3A480
F1G1H3R3A480
ECUE1A104KBQ
F1G1H100A723
F1G1H1R6A480
F1G1H100A723
F1G1H100A723
F1G1H1R6A480
ECUE1H332KBQ
F1G1H100A723
F1G1H100A723
F1G1H100A723
F1G1H4R0A480
F1G1H100A723
F1G1H1R0A480
F1G1H100A723
F1G1H3R0A480
MIC100
L0CBAY000032
Part Name & Description Remarks
27k
27k
1.2k
100
47
220
220
(CAPACITORS)
330
330
1
2.2
0.1
10
0.1
10p
10p
56p
0.1
10p
0.1
0.1
10p
1
1
1
1
10
10
10p
10p
10p
10p
10p
10p
100p
10p
100p
33p
10p
0.001
0.1
3p
1
1
1
1
0.1
1
1
39p
2.0p
1.5p
2.0p
3.3p
3.3p
0.1
10p
1.6p
10p
10p
1.6p
0.0033
10p
10p
10p
4p
10p
1p
10p
3p
(OTHERS)
MICROPHONE
S
S
S
S
S
S
S
S
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
Safety
Ref.
No.
E101
Part No.
Safety
Part Name & Description Remarks
L5DYBYY00012 LIQUID CRYSTAL DISPLAY
(*3)
PNHR1247Z
TRANSPARENT PLATE, LCD PMMA-HB
PNHR1246Z
GUIDE, LCD
ABS-HB
PNHX1254Z
COVER, LCD
PNLA1020Z
ANTENNA
PNMC1013Z
CASE,MAGNETIC
SHIELD
(*4)
PNVE1002Z
BATTERY TERMINAL
H0J103500033 CRYSTAL OSCILLATOR (*2)
E102
E103
E104
E105
E106
E107
X1
Ref.
No.
Part No.
PQZZ430PIR
PQZZ430PRB
Part Name & Description Remarks
TIP OF SOLDERING IRON
(*2)
RUBBER OF SOLDERING IRON
(*2)
16.5.3. Charger Unit
16.5.3.1. Cabinet and Electrical Parts
Safety
Ref.
No.
200
Part No.
PNLC1010ZT
200-1
200-2
200-3
200-4
PNKM1131Y2
PNJT1010Z
PNKF1098Z1
PQHA10023Z
Part Name & Description Remarks
CHARGER
UNIT
without
NAME
(RTL)(for
TG4012LAT)(for
TG4013LAT)
CABINET BODY
CHARGE TERMINAL
CABINET COVER
RUBBER
PARTS,
CUSHION
ASS'Y
PLATE
KXKXPS-HB
PS-HB
FOOT
16.5.3.2. Main P.C. Board Parts
Safety
Ref.
No.
PCB200
J1
R1
F1
Part No.
Part Name & Description Remarks
PNWPTGA641CH MAIN
P.C.BOARD
(RTL)
(JACK)
K2ECYB000001 JACK
(RESISTOR)
ERG2SJ120
12
(FUSE)
K5H302Y00003 FUSE
ASS'Y
S
16.5.4. Accessories
Note:
You can download and refer to the Operating Instructions
(Instruction book) on TSN Server.
Safety
Ref.
No.
A1
Part No.
Part Name & Description Remarks
PQLV219Y
AC ADAPTOR
A2
PQJA10075Z
CORD, TELEPHONE
16.5.5. Screws
Safety
Ref.
No.
A
B
Part No.
XTB26+8GFJ
XTB2+8GFJ
Part Name & Description Remarks
TAPPING SCREW
TAPPING SCREW
16.5.6. Fixtures and Tools
Note:
(*1) See Equipment Required (P.45), and The Setting
Method of JIG (P.45)
(*2) When replacing the Handset LCD, See How to
Replace the Handset LCD (P.44)
Safety
Ref.
No.
Part No.
T.I
KXTG4011LAT
KXTG4012LAT
KXTG4013LAT
KXTGA403LAT
Part Name & Description Remarks
PQZZ1CD300E
JIG CABLE (*1)
PNZZTG4011LA BATCH FILE CD-ROM (*1)
79