Download Lecture 12: Gate Sizing

Survey
yes no Was this document useful for you?
   Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Document related concepts
no text concepts found
Transcript
ELEC 7770
Advanced VLSI Design
Spring 2010
Gate Sizing
Vishwani D. Agrawal
James J. Danaher Professor
ECE Department, Auburn University
Auburn, AL 36849
[email protected]
http://www.eng.auburn.edu/~vagrawal/COURSE/E7770_Spr10
Spring 2010, Mar 10
ELEC 7770: Advanced VLSI Design (Agrawal)
1
Clock Distribution
clock
Spring 2010, Mar 10
ELEC 7770: Advanced VLSI Design (Agrawal)
2
Clock Power
Pclk
= CLVDD2f + CLVDD2f / λ + CLVDD2f / λ2 + . . .
stages – 1
= CLVDD2f Σ
n= 0
where CL =
λ =
1
─
λn
total load capacitance
constant fanout at each stage in distribution network
Clock consumes about 40% of total processor power.
Spring 2010, Mar 10
ELEC 7770: Advanced VLSI Design (Agrawal)
3
Delay of a CMOS Gate
Intrinsic capacitance
Gate capacitance
CMOS
gate
Cint
Cg
CL
Propagation delay through the gate:
tp
= 0.69 Req(Cint + CL)
≈ 0.69 ReqCg(1 + CL /Cg)
= tp0(1 + CL /Cg)
Spring 2010, Mar 10
ELEC 7770: Advanced VLSI Design (Agrawal)
4
Req, Cg, Cint, and Width Sizing
 Req: equivalent resistance of “on” transistor,



proportional to L/W; scales as 1/S, S = sizing
factor
Cg: gate capacitance, proportional to CoxWL;
scales as S
Cint: intrinsic output capacitance ≈ Cg, for
submicron processes
tp0: intrinsic delay = 0.69ReqCg; independent of
sizing
Spring 2010, Mar 10
ELEC 7770: Advanced VLSI Design (Agrawal)
5
Effective Fan-out, f
 Effective fan-out is defined as the ratio
between the external load capacitance and
the input capacitance:
Spring 2010, Mar 10
f
=
CL/Cg
tp
=
tp0(1 + f )
ELEC 7770: Advanced VLSI Design (Agrawal)
6
Sizing an Inverter Chain
1
2
Cg1
N
Cg2
CL
Cg2
= f2Cg1
tp1
= tp0 (1 + Cg2/Cg1)
tp2
= tp0 (1 + Cg3/Cg2)
N
tp
=
Σ tpj
j=1
Spring 2010, Mar 10
N
=
tp0
Σ (1 + Cgj+1/Cgj)
j=1
ELEC 7770: Advanced VLSI Design (Agrawal)
7
Minimum Delay Sizing
Equate partial derivatives of tp with respect to Cgj to 0:
1/Cg1 – Cg3/Cg22 = 0, etc.
or Cg22 = Cg1×Cg3, etc. i.e., gate capacitance is geometric
mean of forward and backward gate capacitances.
Also, Cg2/Cg1 = Cg3/Cg2, etc. i.e., all stages are sized up by
the same factor f with respect to the preceding stage:
CL/Cg1 = F = fN, tp = Ntp0(1 + F1/N)
Spring 2010, Mar 10
ELEC 7770: Advanced VLSI Design (Agrawal)
8
Minimum Delay Sizing
Equate partial derivatives of tp with respect to N to 0:
dNtp0(1 + F1/N)
───────── = 0
dN
i.e., F1/N – F1/N(ln F)/N = 0
or ln f = 1 → f = e = 2.7 and N = ln F
Spring 2010, Mar 10
ELEC 7770: Advanced VLSI Design (Agrawal)
9
Sizing for Energy Minimization
Main idea: For a given circuit, reduce energy
consumption by reducing the supply voltage. This will
increase delay. Compensate the delay increase by
transistor sizing.
Ref: J. M. Rabaey, A. Chandrakasan and B. Nikolić,
Digital Integrated Circuits, Second Edition, Upper
Saddle River, New Jersey: Pearson Education, 2003,
Section 5.4.
Spring 2010, Mar 10
ELEC 7770: Advanced VLSI Design (Agrawal)
10
Summary
 Device sizing combined with supply voltage



reduction reduces energy consumption.
For large fan-out energy reduction by a factor of
10 is possible.
An exception is F = 1 case, where the minimum
size device is also the most effective one.
Oversizing the devices increases energy
consumption.
Spring 2010, Mar 10
ELEC 7770: Advanced VLSI Design (Agrawal)
11
Related documents