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Unit 5: Electricity
Unit 5: Electricity

Ultra-Compact Power Conversion Based on a CMOS
Ultra-Compact Power Conversion Based on a CMOS

... A CMOS-compatible microfabricated inductor is presented. The inductor consists of a planar spiral coil optionally sandwiched between upper and lower magnetic core layers. Core materials investigated include ferrite-filled polymer and electrodeposited nickel-iron permalloy (Ni0o80Fe0o20). Four core c ...
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... cadence virtuoso tool with 45 nm technology .We designed 3 bit flash converter in this work. Flash“3” bit converter, simply require 23-1= 7 comparators. A resistive divider that incorporated in converter employs 23 = 8 resistors for providing the reference voltage in the comparators or converters. R ...
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Bipolar Junction Transisitors-III - CIIT Virtual Campus: Digital Library

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... Email: sa.tawfi[email protected] J. Low Power Electronics 2009, Vol. 5, No. 4 ...
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IOSR Journal of VLSI and Signal Processing (IOSR-JVSP)

Defense - Auburn University
Defense - Auburn University

...  EPC of single-Vth design is independent of Vth  Dual-Vth approach is effective to suppress leakage and reduce minimum EPC  For given circuit, the proposed framework uses the gate slack based algorithm to generate optimum dual-Vth design with minimum EPC, optimum Vdd, optimum high Vth level and e ...
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Circuit Concepts Word Document

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The Effect of the Length of Wire on the Current and Voltage of Series

Subthreshold FinFET for Low Power Circuit Operation: A Study of
Subthreshold FinFET for Low Power Circuit Operation: A Study of

View File
View File

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Integrated circuit



An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small plate (""chip"") of semiconductor material, normally silicon. This can be made much smaller than a discrete circuit made from independent electronic components. ICs can be made very compact, having up to several billion transistors and other electronic components in an area the size of a fingernail. The width of each conducting line in a circuit can be made smaller and smaller as the technology advances; in 2008 it dropped below 100 nanometers, and has now been reduced to tens of nanometers.ICs were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using discrete electronic components. The integrated circuit's mass production capability, reliability and building-block approach to circuit design ensured the rapid adoption of standardized integrated circuits in place of designs using discrete transistors.ICs have two main advantages over discrete circuits: cost and performance. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Furthermore, packaged ICs use much less material than discrete circuits. Performance is high because the IC's components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components. As of 2012, typical chip areas range from a few square millimeters to around 450 mm2, with up to 9 million transistors per mm2.Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of integrated circuits.
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