Operational Transconductance Amplifier in 350nm CMOS technology
... discussed with emphasis on individual sub-blocks namely: Core, Common-Mode Feedback and Bias. Design procedure of each sub-block is given, as well. For this purpose a set of useful curves is extracted using SPICE giving the insight into MOS device behavior in target technology process. Important des ...
... discussed with emphasis on individual sub-blocks namely: Core, Common-Mode Feedback and Bias. Design procedure of each sub-block is given, as well. For this purpose a set of useful curves is extracted using SPICE giving the insight into MOS device behavior in target technology process. Important des ...
Preliminary Design - Queen's University
... 3. Preliminary Design 4. Components 5. Progress Report ...
... 3. Preliminary Design 4. Components 5. Progress Report ...
nanopower circuit design in low
... Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, ...
... Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, ...
MDT-ASD: LVDS properties
... Was any attention paid to minimizing impact of single point failures? Were any techniques used to enhance reliability (multiple vias, wider than nominal widths, clearances, etc.)? Is there data on chip lifetime from the manufacturer? Has the process been used in a similar way for other circuits? How ...
... Was any attention paid to minimizing impact of single point failures? Were any techniques used to enhance reliability (multiple vias, wider than nominal widths, clearances, etc.)? Is there data on chip lifetime from the manufacturer? Has the process been used in a similar way for other circuits? How ...
Circuit Tester - Morris Products
... voltage from 80 to 500 volts - thus adequately covering the voltages found in most homes.To determine the hot side of any AC receptacle,ground one tester probe and insert the other in either side of the receptacle.The tester will glow when the hot side is touched. CAUTION: Use extreme caution when c ...
... voltage from 80 to 500 volts - thus adequately covering the voltages found in most homes.To determine the hot side of any AC receptacle,ground one tester probe and insert the other in either side of the receptacle.The tester will glow when the hot side is touched. CAUTION: Use extreme caution when c ...
Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small plate (""chip"") of semiconductor material, normally silicon. This can be made much smaller than a discrete circuit made from independent electronic components. ICs can be made very compact, having up to several billion transistors and other electronic components in an area the size of a fingernail. The width of each conducting line in a circuit can be made smaller and smaller as the technology advances; in 2008 it dropped below 100 nanometers, and has now been reduced to tens of nanometers.ICs were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using discrete electronic components. The integrated circuit's mass production capability, reliability and building-block approach to circuit design ensured the rapid adoption of standardized integrated circuits in place of designs using discrete transistors.ICs have two main advantages over discrete circuits: cost and performance. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Furthermore, packaged ICs use much less material than discrete circuits. Performance is high because the IC's components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components. As of 2012, typical chip areas range from a few square millimeters to around 450 mm2, with up to 9 million transistors per mm2.Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of integrated circuits.