MAX16999 Ultra-Low Output Voltage, Low-Quiescent-Current Linear Regulator for High-Temperature Applications General Description
... Linear Regulator for High-Temperature Applications The MAX16999 linear regulator operates from a 2.5V to 5.5V input voltage and delivers 100mA continuous load current with a low quiescent current typically around 13µA. The output voltage is preset to internally trimmed voltages in the 0.5V to 3.3V r ...
... Linear Regulator for High-Temperature Applications The MAX16999 linear regulator operates from a 2.5V to 5.5V input voltage and delivers 100mA continuous load current with a low quiescent current typically around 13µA. The output voltage is preset to internally trimmed voltages in the 0.5V to 3.3V r ...
Si7034-A10 - Silicon Labs
... Figure 5. Si7034 Block Diagram The Si7034 is a digital relative humidity and temperature sensor that integrates temperature and humidity sensor elements, an analog-to-digital converter, signal processing, calibration, polynomial non-linearity correction, and an I2C interface all in a single chip. Th ...
... Figure 5. Si7034 Block Diagram The Si7034 is a digital relative humidity and temperature sensor that integrates temperature and humidity sensor elements, an analog-to-digital converter, signal processing, calibration, polynomial non-linearity correction, and an I2C interface all in a single chip. Th ...
VISHAY IRLZ1 datasheet
... All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contain ...
... All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contain ...
Evaluation of Power Transistors Figure of Merit for Hard
... the most manners (switching frequency, load current). It must be said, that all FOMs have been computed for main circuit variables, at which experimental measurements were provided (Table 3). As can be seen, the value of FoM from Table 2 is higher compared to FoMSW , because losses from gate drive a ...
... the most manners (switching frequency, load current). It must be said, that all FOMs have been computed for main circuit variables, at which experimental measurements were provided (Table 3). As can be seen, the value of FoM from Table 2 is higher compared to FoMSW , because losses from gate drive a ...
p-n Junction Photocurrent Modelling Evaluation under Optical and Electrical Excitation
... corresponding concentration profile (NT) [9]. Recombination states have been attributed either to crystal defects, or to the presence of contaminants. Recombination effects developing either within the depletion layer width (w) or within the minority carrier diffusion lengths at each side of the p-n ...
... corresponding concentration profile (NT) [9]. Recombination states have been attributed either to crystal defects, or to the presence of contaminants. Recombination effects developing either within the depletion layer width (w) or within the minority carrier diffusion lengths at each side of the p-n ...
TPS54331 3-A 28-V Input Step Down DC
... The TPS54331 device has a preset switching frequency of 570 kHz. The TPS54331 device requires a minimum input voltage of 3.5 V for normal operation. The EN pin has an internal pullup current source that can adjust the input-voltage undervoltage lockout (UVLO) with two external resistors. In addition ...
... The TPS54331 device has a preset switching frequency of 570 kHz. The TPS54331 device requires a minimum input voltage of 3.5 V for normal operation. The EN pin has an internal pullup current source that can adjust the input-voltage undervoltage lockout (UVLO) with two external resistors. In addition ...
PS9331L, PS9331L2 Data Sheet Preliminary
... (1) By-pass capacitor of more than 1.0 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too ...
... (1) By-pass capacitor of more than 1.0 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too ...
PAM3131 Description Pin Assignments
... 4.7µF minimum value capacitor from VO to GND is also required. To improve transient response, noise rejection, and ripple rejection, an additional 1 0μF or larger, low ESR capacitor is recommended at the output. A higher-value, low ESR output capacitor may be necessary if large, fast-rise-time load ...
... 4.7µF minimum value capacitor from VO to GND is also required. To improve transient response, noise rejection, and ripple rejection, an additional 1 0μF or larger, low ESR capacitor is recommended at the output. A higher-value, low ESR output capacitor may be necessary if large, fast-rise-time load ...
AL8400 /AL8400Q Description Pin Assignments
... The AL8400 Linear LED driver controller uses an external pass element to drive the LEDs and uses its FB pin to sense the LED current through an external resistor RSET. The pass element is driven by the AL8400’s open collector OUT pin which allows the pass element to be either an NPN transistor or N- ...
... The AL8400 Linear LED driver controller uses an external pass element to drive the LEDs and uses its FB pin to sense the LED current through an external resistor RSET. The pass element is driven by the AL8400’s open collector OUT pin which allows the pass element to be either an NPN transistor or N- ...
HGTG10N120BN, HGTP10N120BN, HGT1S10N120BNS 35A, 1200V, NPT Series N-Channel IGBT Features
... the hand being used should be grounded by any suitable means - for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM ...
... the hand being used should be grounded by any suitable means - for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM ...
GBJ25005 - GBJ2510 Features Mechanical Data
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
MAX4575/MAX4576/MAX4577 ±15kV ESD-Protected, Low-Voltage, Dual, SPST, CMOS Analog Switches General Description
... Level 4 (the highest level) of IEC 1000-4-2, without additional ESD protection components. The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2. Because series resistance is lower in the IEC 1000-4-2 ESD test model (Figure 8), the ...
... Level 4 (the highest level) of IEC 1000-4-2, without additional ESD protection components. The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2. Because series resistance is lower in the IEC 1000-4-2 ESD test model (Figure 8), the ...
Texas Instruments DRV8834 stepper motor driver datasheet
... The output driver block of each H-bridge consists of N-channel power MOSFETs configured as an Hbridge to drive the motor windings. Each H-bridge includes circuitry to regulate or limit the winding current. With proper PCB design, each H-bridge of the DRV8834 can driving up to 1.5-A RMS (or DC) conti ...
... The output driver block of each H-bridge consists of N-channel power MOSFETs configured as an Hbridge to drive the motor windings. Each H-bridge includes circuitry to regulate or limit the winding current. With proper PCB design, each H-bridge of the DRV8834 can driving up to 1.5-A RMS (or DC) conti ...
TLP2361 - Toshiba America Electronic Components
... Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %, respectively. ...
... Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %, respectively. ...
MAX5923 +60V Simple Swapper Hot-Swap Switch General Description Features
... The MAX5923 provides an Enable input to enable/disable the device with a logic signal and logic output POK that indicates when the output voltage has reached within 750mV of the input voltage. Three fault conditions are monitored: a zero-current condition, an overcurrent condition, and a thermal ove ...
... The MAX5923 provides an Enable input to enable/disable the device with a logic signal and logic output POK that indicates when the output voltage has reached within 750mV of the input voltage. Three fault conditions are monitored: a zero-current condition, an overcurrent condition, and a thermal ove ...
Datasheet - Diodes Incorporated
... 6. Specifications in bold type are limited to -40C ≤ TJ ≤ +125C. Limits over temperature are guaranteed by design, but not tested in production. 7. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. 9. Regulation is measured a ...
... 6. Specifications in bold type are limited to -40C ≤ TJ ≤ +125C. Limits over temperature are guaranteed by design, but not tested in production. 7. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. 9. Regulation is measured a ...
DMN4026SSD Product Summary Features
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
ADR5040 数据手册DataSheet 下载
... Ultracompact SC70 and SOT-23 packages Low temperature coefficient: 75 ppm/°C (maximum) Pin compatible with LM4040/LM4050 Initial accuracy: ±0.1% No external capacitor required Wide operating current range: 50 μA to 15 mA Extended temperature range: −40°C to +125°C ...
... Ultracompact SC70 and SOT-23 packages Low temperature coefficient: 75 ppm/°C (maximum) Pin compatible with LM4040/LM4050 Initial accuracy: ±0.1% No external capacitor required Wide operating current range: 50 μA to 15 mA Extended temperature range: −40°C to +125°C ...
General Description Features
... All devices are 100% production tested at +25°C. All temperature limits are guaranteed by design. Inputs AC-coupled to GND. Testing performed with an 8Ω resistive load in series with a 68µH inductive load across the BTL outputs. Minimum output power is guaranteed by pulse testing. Testing performed ...
... All devices are 100% production tested at +25°C. All temperature limits are guaranteed by design. Inputs AC-coupled to GND. Testing performed with an 8Ω resistive load in series with a 68µH inductive load across the BTL outputs. Minimum output power is guaranteed by pulse testing. Testing performed ...
Thermal runaway
Thermal runaway refers to a situation where an increase in temperature changes the conditions in a way that causes a further increase in temperature, often leading to a destructive result. It is a kind of uncontrolled positive feedback.In other words, ""thermal runaway"" describes a process which is accelerated by increased temperature, in turn releasing energy that further increases temperature. In chemistry (and chemical engineering), this risk is associated with strongly exothermic reactions that are accelerated by temperature rise. In electrical engineering, thermal runaway is typically associated with increased current flow and power dissipation, although exothermic chemical reactions can be of concern here too. Thermal runaway can occur in civil engineering, notably when the heat released by large amounts of curing concrete is not controlled. In astrophysics, runaway nuclear fusion reactions in stars can lead to nova and several types of supernova explosions, and also occur as a less dramatic event in the normal evolution of solar mass stars, the ""helium flash"".There are also concerns regarding global warming that a global average increase of 3-4 degrees Celsius above the preindustrial baseline could lead to a further unchecked increase in surface temperatures. For example, releases of methane, a greenhouse gas more potent than CO2, from wetlands, melting permafrost and continental margin seabed clathrate deposits could be subject to positive feedback.