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Sulfur passivation of GaAs metal-semiconductor field

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... compositions (Bi1–xTmx)2O3, x = 0.11, 0.14 and 0.20, and (Bi1–yLuy)2O3, y = 0.15, 0.20 and 0.25, were dry homogenized in an agate mortar, heat treated at 750 °C for 3 h and then slowly furnace cooled. The samples were characterized by XRD, TEM/SAED, SEM, DTA and EIS techniques. The effect of thermal ...
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Adhesion



Adhesion is the tendency of dissimilar particles or surfaces to cling to one another (cohesion refers to the tendency of similar or identical particles/surfaces to cling to one another). The forces that cause adhesion and cohesion can be divided into several types. The intermolecular forces responsible for the function of various kinds of stickers and sticky tape fall into the categories of chemical adhesion, dispersive adhesion, and diffusive adhesion. In addition to the cumulative magnitudes of these intermolecular forces, there are certain emergent mechanical effects that will also be discussed at the end of the article.
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