HMC478MP86
... covering DC to 4 GHz. This Micro-P packaged amplifier can be used as a cascadable 50 Ohm RF/IF gain stage as well as a LO or PA driver with up to +20 dBm output power. The HMC478MP86 offers 22 dB of gain with a +32 dBm output IP3 at 850 MHz while requiring only 62 mA from a single positive supply. T ...
... covering DC to 4 GHz. This Micro-P packaged amplifier can be used as a cascadable 50 Ohm RF/IF gain stage as well as a LO or PA driver with up to +20 dBm output power. The HMC478MP86 offers 22 dB of gain with a +32 dBm output IP3 at 850 MHz while requiring only 62 mA from a single positive supply. T ...
Analog Devices Welcomes Hittite Microwave Corporation
... General Description The HMC326MS8G & HMC326MS8GE are high efficiency GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC driver amplifiers which operate between 3.0 and 4.5 GHz. The amplifier is packaged in a low cost, surface mount 8 leaded package with an exposed base for improved RF and therm ...
... General Description The HMC326MS8G & HMC326MS8GE are high efficiency GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC driver amplifiers which operate between 3.0 and 4.5 GHz. The amplifier is packaged in a low cost, surface mount 8 leaded package with an exposed base for improved RF and therm ...
rf and microwave engineering
... Common with M.Tech (Communication Systems) Microwave Components and Networks (MTCS-6(b)) 1. Introduction to microwaves and applications, advantages of microwaves, EM spectrum domain, electric and magnetic fields static electric and magnetic fields, time varying electric and magnetic fields, electrom ...
... Common with M.Tech (Communication Systems) Microwave Components and Networks (MTCS-6(b)) 1. Introduction to microwaves and applications, advantages of microwaves, EM spectrum domain, electric and magnetic fields static electric and magnetic fields, time varying electric and magnetic fields, electrom ...
HMC-APH634 - Micross Components
... The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C ...
... The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C ...
HMC221A / 221AE - Datasheet.Live
... The HMC221A(E) is a low-cost SPDT switch in a 6-lead SOT26 plastic package for use in general switching applications which require very low insertion loss and very small size. This device can control signals from DC to 3 GHz and is especially suited for 900 MHz, 1.8 - 2.2 GHz, and 2.4 GHz ISM applic ...
... The HMC221A(E) is a low-cost SPDT switch in a 6-lead SOT26 plastic package for use in general switching applications which require very low insertion loss and very small size. This device can control signals from DC to 3 GHz and is especially suited for 900 MHz, 1.8 - 2.2 GHz, and 2.4 GHz ISM applic ...
HMC197A - Hittite Microwave Corporation
... The HMC197A(E) is a low-cost SPDT switch in a 6-lead SOT26 plastic package for use in general switching applications which require very low insertion loss and very small size. The device can control signals from DC to 3 GHz and is especially suited for 900 MHz, 1.8 - 2.2 GHz, and 2.4 GHz ISM applica ...
... The HMC197A(E) is a low-cost SPDT switch in a 6-lead SOT26 plastic package for use in general switching applications which require very low insertion loss and very small size. The device can control signals from DC to 3 GHz and is especially suited for 900 MHz, 1.8 - 2.2 GHz, and 2.4 GHz ISM applica ...
HMC476SC70
... The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and b ...
... The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and b ...
Microwave
Microwaves are a form of electromagnetic radiation with wavelengths ranging from as long as one meter to as short as one millimeter; with frequencies between 300 MHz (100 cm) and 300 GHz (0.1 cm). This broad definition includes both UHF and EHF (millimeter waves), and various sources use different boundaries. In all cases, microwave includes the entire SHF band (3 to 30 GHz, or 10 to 1 cm) at minimum, with RF engineering often restricting the range between 1 and 100 GHz (300 and 3 mm).The prefix micro- in microwave is not meant to suggest a wavelength in the micrometer range. It indicates that microwaves are ""small"", compared to waves used in typical radio broadcasting, in that they have shorter wavelengths. The boundaries between far infrared, terahertz radiation, microwaves, and ultra-high-frequency radio waves are fairly arbitrary and are used variously between different fields of study.Beginning at about 40 GHz, the atmosphere becomes less transparent to microwaves, at lower frequencies to absorption from water vapor and at higher frequencies from oxygen. A spectral band structure causes absorption peaks at specific frequencies (see graph at right). Above 100 GHz, the absorption of electromagnetic radiation by Earth's atmosphere is so great that it is in effect opaque, until the atmosphere becomes transparent again in the so-called infrared and optical window frequency ranges.The term microwave also has a more technical meaning in electromagnetics and circuit theory. Apparatus and techniques may be described qualitatively as ""microwave"" when the frequencies used are high enough that wavelengths of signals are roughly the same as the dimensions of the equipment, so that lumped-element circuit theory is inaccurate. As a consequence, practical microwave technique tends to move away from the discrete resistors, capacitors, and inductors used with lower-frequency radio waves. Instead, distributed circuit elements and transmission-line theory are more useful methods for design and analysis. Open-wire and coaxial transmission lines used at lower frequencies are replaced by waveguides and stripline, and lumped-element tuned circuits are replaced by cavity resonators or resonant lines. In turn, at even higher frequencies, where the wavelength of the electromagnetic waves becomes small in comparison to the size of the structures used to process them, microwave techniques become inadequate, and the methods of optics are used.