RF5616 - Qorvo
... The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrica ...
... The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrica ...
Understanding electromagnetic effects using PCB demos
... demos and used also demos developed by others, such as those described in the IEEE EMC Education Manual [IEEE04] and [IEEE92], or the demo developed within the ASIAN-EU University Network Program [ASEU], or within PATON [PATON09]. Two main drawbacks could be observed: 1. We could easily show the fun ...
... demos and used also demos developed by others, such as those described in the IEEE EMC Education Manual [IEEE04] and [IEEE92], or the demo developed within the ASIAN-EU University Network Program [ASEU], or within PATON [PATON09]. Two main drawbacks could be observed: 1. We could easily show the fun ...
CHAPTER 2 Week 4
... components can be changed faster and more easily with a simulator than they can be by hand calculation or on a lab bread-board. ...
... components can be changed faster and more easily with a simulator than they can be by hand calculation or on a lab bread-board. ...
Product selection for North American exports made easy
... requires that components and assemblies be certified by CSA9, or alternatively, by agencies that have been legitimately recognized for such purposes by Canadian governmental authorities. Some years ago, as a consequence of the NAFTA agreement10, a memorandum of understanding was issued between UL an ...
... requires that components and assemblies be certified by CSA9, or alternatively, by agencies that have been legitimately recognized for such purposes by Canadian governmental authorities. Some years ago, as a consequence of the NAFTA agreement10, a memorandum of understanding was issued between UL an ...
Current Path Analysis for Electrostatic Discharge Protection
... of pads with current paths between them, we model the circuit as a constrained graph, decompose ESD connected components linked with the pads, reduce the graph, and apply the breadthfirst search (BFS) to identify the ESD connected components in each constrained graph and thus the current paths. Exper ...
... of pads with current paths between them, we model the circuit as a constrained graph, decompose ESD connected components linked with the pads, reduce the graph, and apply the breadthfirst search (BFS) to identify the ESD connected components in each constrained graph and thus the current paths. Exper ...
State of the Art, Inc.
... chip resistors. Military, high reliability, and standard grade products are identical except for the extent of screening performed. Military Grade Our MIL-PRF-55342 chip resistors are subject to in-process inspections and Group A, B, and C lot acceptance testing. MIL-PRF-55342 resistors are maintain ...
... chip resistors. Military, high reliability, and standard grade products are identical except for the extent of screening performed. Military Grade Our MIL-PRF-55342 chip resistors are subject to in-process inspections and Group A, B, and C lot acceptance testing. MIL-PRF-55342 resistors are maintain ...
ESD Myths and the Latency Controversy
... However, to keep material costs down, they are often made of insulating plastic. EMC design issues are then addressed using other techniques. In this case, a system was designed using plastic faceplates. The system was in low-level production for more than a year without any indication of a signific ...
... However, to keep material costs down, they are often made of insulating plastic. EMC design issues are then addressed using other techniques. In this case, a system was designed using plastic faceplates. The system was in low-level production for more than a year without any indication of a signific ...
investigation of techniques for reducing unintentional
... This dissertation describes three independent studies related to techniques for reducing unintentional electromagnetic emissions from electronic circuits and systems. The topics covered are: low-inductance multi-layer ceramic capacitor for high frequency circuit board decoupling, the application of ...
... This dissertation describes three independent studies related to techniques for reducing unintentional electromagnetic emissions from electronic circuits and systems. The topics covered are: low-inductance multi-layer ceramic capacitor for high frequency circuit board decoupling, the application of ...
Repairing Williams/Bally WPC Pinball Games from 1990 to 1999, Part
... more information on this). BR5/D3-D6 is the unregulated 12 volts (where BR1/D11-D14 is the regulated 12 volts, which could also be the problem since this powers the entire switch matrix, which ultimately reads the opto switches). Remember there is also a large 10,000 or 15,000 mfd filtering capacito ...
... more information on this). BR5/D3-D6 is the unregulated 12 volts (where BR1/D11-D14 is the regulated 12 volts, which could also be the problem since this powers the entire switch matrix, which ultimately reads the opto switches). Remember there is also a large 10,000 or 15,000 mfd filtering capacito ...
IPC-D-620_FOR INDUSTRY REVIEW(1)
... uninterrupted service is desired but not critical. Typically, the end-use environment would not cause failures. Class 3 - High Performance Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use envi ...
... uninterrupted service is desired but not critical. Typically, the end-use environment would not cause failures. Class 3 - High Performance Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use envi ...
a comparison of surface mount aluminum
... the body but is located along the width and at one end of the capacitor, as shown in Figure 3. This difference clearly requires a redesign of the layout of the circuit board. Until such time that tantalum capacitors become more readily available, the circuit designer should evaluate aluminum electro ...
... the body but is located along the width and at one end of the capacitor, as shown in Figure 3. This difference clearly requires a redesign of the layout of the circuit board. Until such time that tantalum capacitors become more readily available, the circuit designer should evaluate aluminum electro ...
KX-TG4012LAT KX-TG4013LAT KX-TGA403LAT
... In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead. We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu). Th ...
... In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead. We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu). Th ...
Fuse Selection Guide
... 1. Direct Solder - In this method, the fuse is directly soldered into or onto the printed circuit board (PCB). The drawback to this design is the lack of field replaceable parts as discussed in great detail in section 11 but cost can be significantly reduced with this mounting method. 2. Fuse Clips ...
... 1. Direct Solder - In this method, the fuse is directly soldered into or onto the printed circuit board (PCB). The drawback to this design is the lack of field replaceable parts as discussed in great detail in section 11 but cost can be significantly reduced with this mounting method. 2. Fuse Clips ...
The Duplex Optical Voice Link
... 12. Clean both printed circuit boards with soap and warm water to remove solder residue. Soapy water will not harm the components as long as electrical power is not being applied — in which case you don't want to get anywhere near water anyway, for safety's sake. If you used a rosin core solder, cle ...
... 12. Clean both printed circuit boards with soap and warm water to remove solder residue. Soapy water will not harm the components as long as electrical power is not being applied — in which case you don't want to get anywhere near water anyway, for safety's sake. If you used a rosin core solder, cle ...
Electric Discharge Machining (EDM)
... In 1969, Agie launched the world's first numerically controlled wire-cut EDM machine. Seibu developed the first CNC wire EDM machine in 1972 and the first system was manufactured in Japan. Recently, the machining speed has gone up by 20 times. This has decreased machining costs by at least 3 ...
... In 1969, Agie launched the world's first numerically controlled wire-cut EDM machine. Seibu developed the first CNC wire EDM machine in 1972 and the first system was manufactured in Japan. Recently, the machining speed has gone up by 20 times. This has decreased machining costs by at least 3 ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.