Homework 6
... communication and control board will utilize a ground plane for all digital and control logic. The power board will not have a ground plane since most of the signals that are grounded are high voltage AC signals and separating the grounds from the digital logic will reduce noise. The 3.3V regulator ...
... communication and control board will utilize a ground plane for all digital and control logic. The power board will not have a ground plane since most of the signals that are grounded are high voltage AC signals and separating the grounds from the digital logic will reduce noise. The 3.3V regulator ...
Vex compass module
... In the process of designing this part, we also used Autodesk Inventor to create the enclosure. We started with a base from the limit switch module and modified it to work with the size and shape of the new PCB. This also allows for the part to seamlessly fit with other VEX parts and our robot desig ...
... In the process of designing this part, we also used Autodesk Inventor to create the enclosure. We started with a base from the limit switch module and modified it to work with the size and shape of the new PCB. This also allows for the part to seamlessly fit with other VEX parts and our robot desig ...
PI3DPxxx_App_PI3HDxxx-Layout Guideline
... To provide a clean power supply for Pericom high-speed device, few recommendations are listed below: ...
... To provide a clean power supply for Pericom high-speed device, few recommendations are listed below: ...
Class Assessment Sheet
... for connections Explain it is safe to use bare wires in this work because they are using batteries with low voltage Explain that wires are usually covered with plastic because plastic is an insulator ...
... for connections Explain it is safe to use bare wires in this work because they are using batteries with low voltage Explain that wires are usually covered with plastic because plastic is an insulator ...
ZXFV302EV - Mouser Electronics
... closely spaced low-inductance connections from some components to the continuous ground plane (some of these holes are not visible in the figures for the Evaluation Board – artworks and NC drill output can be provided if required). ...
... closely spaced low-inductance connections from some components to the continuous ground plane (some of these holes are not visible in the figures for the Evaluation Board – artworks and NC drill output can be provided if required). ...
PCB Layout Design Considerations
... and costly. In addition, using ground planes makes it difficult to track the flow of currents, which might become troublesome because noisy motor currents could interfere with digital pins on the PCB and compromise the stability of signal level. Instead of using ground planes, we decided to route al ...
... and costly. In addition, using ground planes makes it difficult to track the flow of currents, which might become troublesome because noisy motor currents could interfere with digital pins on the PCB and compromise the stability of signal level. Instead of using ground planes, we decided to route al ...
Document
... The main health effect of exposure to electromagnetic radiation is heating of body tissue. Guidance on safe levels of RF radiation is available from government and international bodies (HPA – Health Protection Agency and ICNIRP- International Committee on Non-Ionising Radiation Protection) DO NOT lo ...
... The main health effect of exposure to electromagnetic radiation is heating of body tissue. Guidance on safe levels of RF radiation is available from government and international bodies (HPA – Health Protection Agency and ICNIRP- International Committee on Non-Ionising Radiation Protection) DO NOT lo ...
Extended ADSR BOM / Build doc
... Main pcb and component pcb are to be connected through precision DIP socket and pins. It is recommended to use the pins on the main pcb (facing down, soldered from above) and the pin sockets on the component pcb (standing up, soldered from the front panel side). Break or cut off the pieces you need ...
... Main pcb and component pcb are to be connected through precision DIP socket and pins. It is recommended to use the pins on the main pcb (facing down, soldered from above) and the pin sockets on the component pcb (standing up, soldered from the front panel side). Break or cut off the pieces you need ...
In a series circuit, every device must function for the circuit to be
... voltage across the components is shared The voltage of series circuit is equal to the voltage source, for example if you have a 12 volt battery, then the voltage is 12 volts. Remember with series circuit, there is voltage drop across each resistor. To find voltage drop use ohm’s law. ...
... voltage across the components is shared The voltage of series circuit is equal to the voltage source, for example if you have a 12 volt battery, then the voltage is 12 volts. Remember with series circuit, there is voltage drop across each resistor. To find voltage drop use ohm’s law. ...
Series & Parallel Circuits PowerPoint
... If a portion of the series component goes down nothing that follows that portion will work as the circuit has been broken, however if the parallel components still have energy ...
... If a portion of the series component goes down nothing that follows that portion will work as the circuit has been broken, however if the parallel components still have energy ...
ZPCB2252-MML/MMR & ZPCB2252-MSL/MSR Eaton’s Cooper Mimic PCB Eaton Product Datasheet Addressable Fire Products
... This offers more capability to the extensive options already offered by the CF3000 control panel. The ZPCB2252-MML or ZPCB2252-MMR is the master PCB which can control up 32 outputs. If further outputs are required ZPCB2252-MSL or ZPCB2252-MSR can daisy chain onto the master PCB offering a total outp ...
... This offers more capability to the extensive options already offered by the CF3000 control panel. The ZPCB2252-MML or ZPCB2252-MMR is the master PCB which can control up 32 outputs. If further outputs are required ZPCB2252-MSL or ZPCB2252-MSR can daisy chain onto the master PCB offering a total outp ...
Bipolar transistors II, Page 1 Bipolar Transistors II
... against a wet sponge. 2) It is advisable to tin the junctions separately by solder, before soldering them together. The tip of the iron should be kept tinned and shiny at all times. 3) When applying solder to a junction, the junction should be kept at a high temperature, just as the solder. One way ...
... against a wet sponge. 2) It is advisable to tin the junctions separately by solder, before soldering them together. The tip of the iron should be kept tinned and shiny at all times. 3) When applying solder to a junction, the junction should be kept at a high temperature, just as the solder. One way ...
Simulation of high speed serial interconnection - Indico
... Simulation of high speed serial interconnection (report from PH/ESE first discussion about high speed serial link simulations) ...
... Simulation of high speed serial interconnection (report from PH/ESE first discussion about high speed serial link simulations) ...
doc - Cornerstone Robotics
... Solid vs Stranded: When electricity flows through a wire, it mostly flows on the surface of the wire, not through the middle. This means that a "wire" of a given size that made up of many smaller strands can carry more power than a solid wire - simply because the stranded wire has more surface are ...
... Solid vs Stranded: When electricity flows through a wire, it mostly flows on the surface of the wire, not through the middle. This means that a "wire" of a given size that made up of many smaller strands can carry more power than a solid wire - simply because the stranded wire has more surface are ...
1 Conductors and Insulators Tutorial Cornerstone Electronics
... Solid vs Stranded: When electricity flows through a wire, it mostly flows on the surface of the wire, not through the middle. This means that a "wire" of a given size that made up of many smaller strands can carry more power than a solid wire - simply because the stranded wire has more surface are ...
... Solid vs Stranded: When electricity flows through a wire, it mostly flows on the surface of the wire, not through the middle. This means that a "wire" of a given size that made up of many smaller strands can carry more power than a solid wire - simply because the stranded wire has more surface are ...
- Satcure
... remove them as a cluster, then separate and replace the parts which don't need to be changed. As capacitors supplied tend to be slightly wider than originals, fit largest first, bend wires over to hold them, and solder when they are all positioned neatly. Make sure capacitor metal cans can not overl ...
... remove them as a cluster, then separate and replace the parts which don't need to be changed. As capacitors supplied tend to be slightly wider than originals, fit largest first, bend wires over to hold them, and solder when they are all positioned neatly. Make sure capacitor metal cans can not overl ...
PCB Layout Tips
... • Start with connectors, pushbuttons, etc. Their location is often fixed due to the function or form factor of the product. • Pay attention to which components have lots of connections between them, try to orient the components so that the traces can be straightforward. • Partition the board accordi ...
... • Start with connectors, pushbuttons, etc. Their location is often fixed due to the function or form factor of the product. • Pay attention to which components have lots of connections between them, try to orient the components so that the traces can be straightforward. • Partition the board accordi ...
PCB Layout Tips
... • Start with connectors, pushbuttons, etc. Their location is often fixed due to the function or form factor of the product. • Pay attention to which components have lots of connections between them, try to orient the components so that the traces can be straightforward. • Partition the board accordi ...
... • Start with connectors, pushbuttons, etc. Their location is often fixed due to the function or form factor of the product. • Pay attention to which components have lots of connections between them, try to orient the components so that the traces can be straightforward. • Partition the board accordi ...
Plating of Contact Surfaces in Switchgear and Circuit Breakers
... temperature rise allowed is considerably higher for plated connections than it is for unplated connections. Typically, the limit for unplated copper connections is 30ºC rise, while the limit for plated connections is 65ºC rise. The higher temperature rise is allowed for plated connections because pl ...
... temperature rise allowed is considerably higher for plated connections than it is for unplated connections. Typically, the limit for unplated copper connections is 30ºC rise, while the limit for plated connections is 65ºC rise. The higher temperature rise is allowed for plated connections because pl ...
Data Sheet Tungsten-Copper
... Tungsten-Copper (WCu) is a composite material with a heterogeneous structure. Typically, a porous blank is produced by pressing and sintering tungsten powder. The remaining pores are sealed by immersing in liquid copper (=infiltration). Furthermore, the production of WCu can also be carried out by m ...
... Tungsten-Copper (WCu) is a composite material with a heterogeneous structure. Typically, a porous blank is produced by pressing and sintering tungsten powder. The remaining pores are sealed by immersing in liquid copper (=infiltration). Furthermore, the production of WCu can also be carried out by m ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.