Survey
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
FBK 3D CMS pixel sensors preliminary lab measurements E. Alagoz1, A. Krzywda1, D. Bortoletto1, I. Shipsey1, G. Bolla1, and G. F. Dalla Betta2, M. Boscardin3, S. Kwan4 1Physics Department, Purdue University, West Lafayette, IN 47907-2036 USA 2NFN and University of Trento 3FBK, Via S. Croce 77 - 38122 Trento – Italy 4Fermilab, Batavia, IL 60510-5011 USA CMS Tracker Upgrade Plenary, 22 July 2011 Outline • 3D vs planar • FBK 3D pixel sensors for CMS – Readout chip (ROC) characterization tests – Noise tests – Charge collection tests • FBK 3D pixel sensors testbeam plans at FNAL • Summary and outlook 3D vs planar • p+ and n+ electrodes are arrays of columns that penetrate into the bulk • Lateral depletion • Charge collection is sideways • Superior radiation hardness due to smaller electrode spacing: - smaller carrier drift distance - faster charge collection - less carrier trapping - lower depletion voltage • Higher noise • Complex, non-standard processing depletion ionizing particle PLANAR: n+ depletion p+ 3D: n+ e 300µm p-type p-type h p+ 50µm FBK 3D sensors • FBK processed full 3D sensors for CMS • Sensors with guard rings • Three geometries: 1E,2E,4E • 14 sensors per wafer • Thickness 200 microns • Sensors received from ATLAS 08 batch CMS 1E 1E 2E 1E 2E 1E_3 1E 1E_4 2E 2E_11 1E 4E 1E 4E 1E_6 1E 1E 4E FBK 3D sensors • Sensors bump bonded to PSI46v2 ROC in SELEX (In bumps) • 9 sensors received in 2011: 1E (6x), 2E (1x), 4E (2x) • Wire bonded and assembled on FPIX plaquettes • PSI test setup is used to fully calibrate FBK sensors in lab • ROC calibration • Noise • Charge collection with Sr-90 source Purdue setup for 3D testing FBK sensor plaquette IV measurements Lab tests @ V = -5 V : T=21 °C A sample summary report of a psi46v2 ROC calibration Noise tests T=21 °C Single pixel noise curve Noise distribution Error function fit Gaussian fit Noise map Higher noise due to long pixel on the sensor edges Noise scans @ T=21 °C 4E 2E 1E Charge collection tests @ T=21 °C • Sr-90 source: 1 mCi, Eβ = 0.546 ΜeV • Random trigger used Landau convoluted Gaussian fit 1 Vcal = 65 eMP = 14 ke- Charge collection scans @ T=21 °C • FBK_4E_13 has relatively lower charge collection • Gain calibration is problematic Summary & outlook • All 9 sensors were wire bonded and assembled at Purdue Lab characterization tests: • IV results: breakdown at Vbias < 40 V • Performed well with noises compatible with CMS planar pixels • Good bump bond quality • Charge collection with Sr-90 source for all sensors – 1E_3 sensor has irregular charge distributions at Vbias > 25 V • ROC calibration needs to be optimized Testbeam plans: • Testbeam at FNAL in October 2011 • Irradiation will be soon after the testbeam • Post-irradiation testbeam at FNAL in February 2012 3DC Czech Technical University, Fermilab, Purdue University, SINTEF, SLAC, University of Hawaii, University of Manchester BACK UP SLIDES FNAL testbeam SCINTILLATORS DUT PIXEL DETECTORS ACELLERATOR CLOCK • 120 GeV protons • No B field BEAM Meson Area Purdue 3D plaquette Plastic protection CLOCK AND TRIGGER DISTRIBUTION 3.7V POWER SUPPLY Cooling tubes CONTROL ROOM