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Small Feature Reproducibility
A Focus on Semiconductor Technology
Education
UC-SMART Major Program Award
D.B. Graves, T.J. King, and C.J. Spanos
Second Annual Workshop
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Agenda
8:30 – 9:00 Introductions, Overview / Spanos
9:00 – 10:15
10:15 – 10:45
10:45 – 12:00
12:00 – 1:00
1:00 – 2:15
2:15 – 2:45
2:45 – 3:30
3:30 – 3:45
3:45 – 5:30
5:30 – 7:30
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Lithography / Spanos, Neureuther, Bokor
Break
Sensor Integration / Poolla, Smith, Solgaard, Dunn
lunch, poster session begins
Plasma, TED / Graves, Lieberman, Cheung, Aydil, Haller
CMP / Dornfeld
Education / Graves, King, Spanos
Break
Steering Committee Meeting in room 775A / Lozes
Reception, Dinner / Heynes rm, Men’s Faculty Club
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Milestones
Year 1
 Conduct first Inter-campus seminar series and Industry
workshop.
 Modify UCB/EE143 for deployment in the fall of 1999.
 Design Equipment Laboratory.
Year 2
 Conduct second Inter-campus seminar series and Industry
workshop.
 Implement Equipment Laboratory for deployment in Spring
2000.
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EE 143: Processing and Design of IC’s
• Name changed to “Microfabrication Technology”
– course now covers MEMS as well as IC device technology
• Prerequisites changed to sophomore physics and electronics
(Phys 7B & EE 40 or equivalent)
– course is more accessible to students in ChE, ME, MSE, Physics, etc.
• New equipment to be purchased by Spring 2000
– will ease impact of increased enrollment (to 48 students per semester)
• Laboratory units on (1) oxidation and (2) lithography to be
shared with the new SMART equipment lab
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EE 143 Enrollment History
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40
30
20
10
0
Fall
1995
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Fall
1996
Sp
1997
Fall
1997
Sp
1998
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Fall
1998
Sp
1999
Fall
1999
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EE 143 Fall 1999 Enrollment Statistics
(46 students total)
NE (2%)
Physics
(6.5%)
Undergrads
(30%)
Graduates
(70%)
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ChE (6.5%)
MSE (6.5%)
ME (39%)
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EE (39%)
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Changes to EE 143 Implemented in Fall 1999
• Additional graduate-student instructors hired
– one extra laboratory section to accommodate 8 more students
– new weekly discussion sections (2) to supplement lectures
– design of new mask set
• Elimination of selected topics
– bipolar junction transistor & DRAM devices and technology
• Addition of new topics
– surface-micromachining technology
– mechanical properties of thin films
– MEMS device structures: operation and design, process integration
• Changes made in laboratory component
– elimination of bipolar junction transistor characterization
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Modifications to EE 143 Mask Set
(to be completed in Fall 1999)
• Improvements to existing test structures
e.g. increase # of contact holes, increase overlay error tolerance
– for improved device yield
• Addition of MEMS test structures:
– actuators
• thermal bimorphs (using poly-Si resistive heaters)
– sensors
• strain gauge (poly-Si piezoresistors)
– fold-up structure (Campanile)
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Further Changes to EE 143 Lab (Spring 2000)
• Deployment of new mask set
• Addition of thin-film device characterization work
• Installation of new equipment
– new wafer-probe station
– spin-rinse-dryer
– furniture
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SMART Lab Overview
• New joint EECS/ChE/ME/MSME course at UCB available to
B.S., M.S., and Ph.D. students.
• Important component in education/training plans.
• Focus on equipment and processes; existing labs focus on
device fabrication (e.g. UCB/EE143).
• Emphasis on chemical and physical processes occurring within
equipment, including transport, plasma and chemical kinetics,
materials science.
• This project has been accelerated.
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Smart Lab Outline
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SMART Lab Description
• 10 weeks lab; 5 weeks lectures/presentations
• Lectures taped, available for review
• Web component: equipment models, virtual equipment (e.g.
vacuum systems), readings
• 10-12 students/section; 4 sections/week
• Timing
Lab debugged in fall 1999
First class spring 2000
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SMART Lab Development Status
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Lab space renovation completed
Vacuum systems apparatus constructed and operating
Plasma etcher installed and working
CMP equipment installed
Electroplating experiment under consideration
Web page development begun, equipment model obtained (G.
Rubloff, U. Maryland), global plasma simulation development
begun
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Lab Space Renovation (1 Gilman Hall)
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Vacuum Systems Experiment
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Plasma Systems Experiment (I)
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Vacuum/Plasma Systems Apparatus
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Plasma Systems Experiment (II)
Plasma-Therm 500 Series
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Please Help!
Two 300W, 13.56 MHz RF power supplies with
matching networks and PC-compatible outputs are
needed for the SMART equipment lab.
We can also use “educational props” (i.e. pictures
videos, chip cutouts, demo wafers, etc.)
See David Graves if you can arrange for a donation.
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Student-Company Interactions: Web Page Links
• Company human resources
• Student resumes (on web site already)
• Posting for job/intern opportunities
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http://sfr.berkeley.edu Interactive Seminars
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Fall 99 On-line Seminars
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New Curricula in Semiconductor Manufacturing
• New EECS sample program in
semiconductor manufacturing at UCB
effective fall 1999
• Chemical Engineering option in electronic
materials processing at UCB will
incorporate new SMART lab
• List of suggested courses (Chem Eng,
EECS, IEOR, and MSE at UCB; EEC at
UCD) relevant to semiconductor
manufacturing posted on SMART web
site
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Summary
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Major restructure of senior IC processing course.
New semiconductor equipment laboratory course.
Student training at BS, MS, and Ph.D. levels
Possible ‘outreach’ programs: short courses/summer lab
programs.
• New curricula in semiconductor manufacturing.
• On-line seminars and workshops.
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2000-2002 Ideas
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Semiconductor Internships
Deployment of Short Courses
Distance learning on 143/123
Focus on other campus deployment: UCD, UCSB,
UCLA
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