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ILX511
2048-pixel CCD Linear Image Sensor (B/W)
Description
The ILX511 is a rectangular reduction-type CCD linear
image sensor designed for bar code POS hand scanner
and optical measuring equipment use. A built-in timing
generator and clock drivers ensure single 5V power
supply for easy use.
Features
• Number of effective pixels:
• Pixel size:
•
•
•
•
•
2048 pixels
14µm x 200µm
(14µm pitch)
22 -pin DIP (CERDIP)
Pin Configuration (Top View)
Single 5V power supply
Ultra-high sensitivity
Built-in timing generator and clock-drivers
Built-in sample-and-hold circuit
Maximum clock frequency:
2MHz
Absolute Maximum Ratings
• Supply voltage
VDD
• Operating temperature
• Storage temperature
6
–10 to +60
–30 to +80
VOUT
1
22
VDD
1
V
°C
°C
GND
2
21
VDD
GND
3
20
VDD
SHSW
4
19
GND
øCLK
5
18
VGG
VDD
6
17
GND
NC
7
16
GND
NC
8
15
VDD
VDD
9
14
NC
NC 10
13
NC
12
GND
øROG 11
2048
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication
or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony
cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E94108–TE
1
18
V OUT
VGG
20
21
22
13
14
15
16
17
S3
S2
S1
D32
D14
D13
–2–
7
NC
6
VDD
3
GND
GND
9
VDD
8
NC
øCLK
5
Clock Pulse Generator/
Sample-and-hold Pulse Generator
NC
10
Clock Drivers
19
SHSW GND
4
Mode Selector
CCD Analog Shift Register
Readout Gate
NC
NC
V DD
GND
GND
12
GND
øROG
11
Readout Gate
Pulse Generator
D38
D37
D36
D35
D34
D33
S2048
S2047
S2046
2
Internal Structure
Output Amplifier
S/H Circuit
V DD
VDD
V DD
ILX511
Block Diagram
ILX511
Pin Description
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Symbol
VOUT
GND
GND
SHSW
øCLK
VDD
NC
NC
VDD
NC
øROG
GND
NC
NC
VDD
GND
GND
VGG
GND
VDD
VDD
VDD
Description
Signal output
GND
GND
Switch (with S/H or without S/H)
Clock pulse input
5V power supply
NC
NC
5V power supply
NC
Readout gate pulse input
GND
NC
NC
5V power supply
GND
GND
Output circuit gate bias
GND
5V power supply
5V power supply
5V power supply
Mode Description
Recommended Voltage
Mode in Use
With S/H
Without S/H
Pin 4 (SHSW)
GND
VDD
Item
VDD
Min.
4.5
Typ.
5.0
Max.
5.5
Input Clock Voltage Condition (Note)
Item
VIH
VIL
Min.
4.5
0
Typ.
5.0
—
Max.
5.5
0.5
Unit
V
V
Note) This is applied to the all pulses applied externally (øCLK,
øROG).
Input Pin Capacity
Item
Input capacity of øCLK pin
Input capacity of øROG pin
Symbol
CøCLK
CøROG
Min.
—
—
–3–
Typ.
10
10
Max.
—
—
Unit
pF
pF
Unit
V
ILX511
Electro-optical Characteristics
(Ta = +25°C, VDD = 5V, Clock Frequency: 1MHz, Light Source = 3200K, IR Cut Filter: CM-500S (t = 1.0mm),
Without S/H Mode)
Item
Symbol
Min.
Typ.
Max.
Unit
Remarks
R1
R2
PRNU
VSAT
VDRK
DSNU
IL
DR
SE
I VDD
TTE
ZO
VOS
150
—
—
0.6
—
—
—
—
—
—
92.0
—
—
200
1800
5.0
0.8
3.0
6.0
1
267
0.004
5.0
98.0
250
2.8
250
—
10.0
—
6.0
12.0
—
—
—
10.0
—
—
—
V/(lx • s)
V/(lx • s)
%
V
mV
mV
%
—
lx • s
mA
%
Ω
V
Note 1
Note 2
Note 3
—
Note 4
Note 4
Note 5
Note 6
Note 7
—
—
—
Note 8
Sensitivity 1
Sensitivity 2
Sensitivity nonuniformity
Saturation output voltage
Dark voltage average
Dark signal nonuniformity
Image lag
Dynamic range
Saturation exposure
5V current consumption
Total transfer efficiency
Output impedance
Offset level
Notes:
1. For the sensitivity test light is applied with a uniform intensity of illumination.
2. Light source: LED λ = 660nm
3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 1.
PRNU =
4.
5.
6.
7.
8.
(VMAX-VMIN)/2
VAVE
x 100 (%)
The maximum output of all the valid pixels is set to V MAX , the minimum output to V MIN and the average
output to VAVE.
Integration time is 10ms.
Typical value is used for clock pulse and readout pulse. VOUT = 500mV.
DR = V SAT /V DRK . When optical integration time is shorter, the dynamic range sets wider because dark
voltage is in proportion to optical integration time.
SE = VSAT/R1
VOS is defined as indicated below.
D30
D31
D32
S1
V OUT
Vos
GND
–4–
*VOUT
øCLK
0
5
2
–5–
D11
D10
D5
D4
1
D1
D30
D14
D13
S2048
S2047
S2045
S3
S2
Effective Picture Elements
Signal (2048 pixels)
S4
D32
S1
D31
*Without S/H Mode (4-pin → V DD )
1-line Output Period (2086 pixels)
Optical Black
(18 pixels)
S2046
D12
2088 or more clock pulses are required.
Dummy Signal (32 pixels)
D2
0
3
D3
øROG
2086
D37
D36
D35
D34
Dummy Signal
(6 pixels)
D38
5
ILX511
Clock Timing Diagram (Without S/H Mode)
1
D33
V OUT
øCLK
0
5
2
–6–
D9
D10
D5
D4
D3
D30
D13
D12
S2047
S2046
S3
S2
S1
Effective Picture Elements
Signal (2048 pixels)
S4
D32
D31
1-line Output Period (2087 pixels)
Optical Black
(18 pixels)
S2045
D11
2088 or more clock pulses are required.
Dummy Signal (33 pixels)
D1
1
D0
0
3
D2
øROG
2086
D36
D35
D34
Dummy Signal
(6 pixels)
D37
5
ILX511
Clock Timing Diagram (With S/H Mode)
1
D38
S2048
D33
0
ILX511
øCLK Timing (For All Modes)
t1
t2
øCLK
t4
t3
Item
øCLK pulse rise/fall time
øCLK pulse duty (Note 1)
Symbol
t1, t2
—
Min.
0
40
Typ.
10
50
Max.
100
60
Unit
ns
%
Typ.
3000
3000
10
5000
Max.
—
—
—
—
Unit
Note 1) 100 x t4 / (t3 + t4)
øROG, øCLK Timing
øROG
t6
t8
t7
øCLK
t9
t5
Item
øROG,øCLK pulse timing 1
øROG,øCLK pulse timing 2
øROG pulse rise/fall time
øROG pulse period
Symbol
t5
t9
t6, t8
t7
Min.
0
1000
0
3000
–7–
ns
ILX511
øCLK, VOUT Timing (Note 1)
(Note 3)
øCLK
t10
t11
VOUT
VOUT *
(Note 2)
t12
Item
øCLK-VOUT 1
øCLK-VOUT 2
øCLK-VOUT* (with S/H)
Symbol
t10
t11
t12
Min.
40
55
10
Notes:
1) fck = 1MHz, øCLK pulse duty = 50%, øCLK pulse rise/fall time = 10ns
2) Output waveform when internal S/H is in use.
3) • indicates the correspondence of clock pulse and data period.
–8–
Typ.
115
120
165
Max.
280
205
240
Unit
ns
ILX511
Spectral Sensitivity (typ.) (Ta = +25°C)
1.0
Relative Sensitivity
0.8
0.6
0.4
0.2
0
400
500
600
700
800
Wavelength (nm)
Spatial Frequency (cycles/mm)
7.1
14.3
21.4
28.6
1000
Dark Voltage Rate vs. Ambient Temperature (typ.)
MTF of main scanning direction (typ.)
0
900
35.7
1.0
10.0
Dark Voltage Rate
H — MTF
0.8
0.6
0.4
1.00
0.2
0
0.10
0
0.2
0.4
0.6
0.8
1
0
Normalized Spatial Frequency τ = 560nm
–9–
10
20
30
40
50
Ta — Ambient Temperature (°C)
60
ILX511
Current Consumption Rate vs. Clock Frequency (typ.)
Output Voltage Rate vs. Integration Time (typ.)
2.0
Current Consumption Rate
Output Voltage Rate
5
1
1.5
1.0
0.5
0.1
0
1
10
50
0
τ int — Integration Time (ms)
1.5
2.0
Offset Level vs. Ambient Temperature (typ.)
3.2
VOS — Offset Level (V)
3.2
VOS — Offset Level (V)
1.0
Clock Frequency (MHz)
Offset Level vs. V DD (typ.)
3.0
2.8
2.6
2.4
4.5
0.5
4.75
5
VDD (V)
5.25
5.5
3.0
2.8
2.6
2.4
–10–
0
20
40
Ta — Ambient Temperature (°C)
60
ILX511
Application Circuit (Without S/H Mode (Note))
10µ/16V
5V
+
22
21
20
19
18
17
16
15
14
13
12
VDD
VDD
VDD
GND
VGG
GND
GND
V DD
NC
NC
GND
VOUT
GND
GND
SHSW øCLK
VDD
NC
NC
V DD
NC
øROG
1
2
3
6
7
8
9
10
11
4
5
+
3KΩ
øCLK
øROG
0.01µ
22µ/10V
Output Signal
2SA1175
Note) This circuit diagram is the case when internal S/H is not used.
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems
arising out of the use of these circuits or for any infringement of third party and other right due to same.
–11–
ILX511
c) Be aware that any of the following can cause the
glass to crack because the upper and lower ceramic
layers are shielded by low-melting glass:
(1) Applying repetitive bending stress to the external
leads.
(2) Applying heat to the external leads for an
extended period of time with a soldering iron.
(3) Rapid cooling or heating.
(4) Applying a load or impact to a limited portion of
the low-melting glass with a small-tipped tool such
as tweezers.
(5) Prying the upper or lower ceramic layers away
at a support point of the low-melting glass.
Note that the preceding notes should also be
observed when removing a component from a board
after it has already been soldered.
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static
discharge. Before handling, be sure to take the
following protective measures:
a) Either handle bare handed or use non-chargeable
gloves, clothes or material. Also use conductive
shoes.
b) When handling directly use a grounding band.
c) Install a conductive mat on the floor or working
table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when
handling CCD image sensors.
e) For the shipment of mounted substrates use
cartons treated for the prevention of static charges.
2) Notes on handling CCD CERDIP package
The following points should be observed when
handling and installing this package:
a) (1) Compressive strength: 39N/surface (do not
apply any load more than 0.7mm inside the outer
perimeter of the glass portion)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
b) In addition, if a load is applied to the entire
surface by a hard component, bending stress may be
generated and the package may fracture, etc.,
depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load,
such as a spring plate, or an adhesive.
Upper Ceramic Layer
Lower Ceramic Layer
39N
(1)
Low-Melting Glass
3) Soldering
a) Make sure the package temperature does not
exceed +80°C.
b) Solder dipping in a mounting furnace causes
damage to the glass and other defects. Use a
grounded 30W soldering iron and solder each pin in
less than 2 seconds. For repairs and remount, cool
sufficiently.
c) To dismount image sensors, do not use solder
suction equipment. When using an electric
desoldering tool, ground the controller. For the control
system, use a zero cross type.
29N
29N
(2)
(3)
–12–
0.9Nm
(4)
ILX511
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not touch glass plates by hand or have any
object come in contact with glass surfaces.
Should dirt stick to a glass surface blow it off with an
air blower. (For dirt stuck through static
electricity, ionized air is recommended.)
c) Clean with a cotton swab and ethyl alcohol if the
glass surface is grease stained. Be careful not to
scratch the glass.
d) Keep in case to protect from dust and dirt. To
prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
Package Outline
5) Exposure to high temperature or humidity will affect
the characteristics. Accordingly, avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment
that should not be subjected to mechanical shocks.
7) Make sure the input pulse should not be –1V or
below.
8) Normal output signal is not obtained immediately
after device switch on. Use the output signal added
22500 pulses or above to øCLK clock pulse.
Unit: mm
22-pin DIP (400mil)
PACKAGE STRUCTURE
PACKAGE MATERIAL
CERDIP
LEAD TREATMENT
TIN PLATING
LEAD MATERIAL
42ALLOY
PACKAGE WEIGHT
5.2g
1. Distance of the first pixel: (H, V) = (6.46 ± 0.8mm, 5.0 ± 0.5mm)
2. The height from the bottom to the sensor surface is 2.45 ± 0.3mm
3. The thickness of the cover glass is 0.8mm and the refractive index is 1.5
–13–