Download CompactLogix 5370 L3 Programmable Controller

[PROJECT NUMBER]
[DATE]
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ROCKWELL AUTOMATION
PROCUREMENT SPECIFICATION
PROCUREMENT SPECIFICATION
Programmable Automation Controllers
CompactLogix 5370 L3
NOTICE: The specification guidelines in this document are intended to aid in the specification of
products. Specific installations have specific requirements, and Rockwell Automation does not
recommend or intend any specific application based solely upon the guidelines provided here.
Because of the variety of uses for this information, the user of, and those responsible for applying
this information, are responsible for ensuring the acceptability of each application and appropriate
use of the guidelines. In no event will Rockwell Automation be liable for misuse, misapplication or
reliance on these guidelines in connection with any specific application. Rockwell Automation also
disclaims indirect or consequential damages resulting from the use or application of this
information.
Note: To download or view a .doc file version of this procurement specification, please visit:
www.rockwellautomation.com/industries/procurement-specifications
Programmable Automation Controllers
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TABLE OF CONTENTS
PART 1 GENERAL ......................................................................................................................... 3
1.01 SUMMARY ....................................................................................................................... 3
1.02 RELATED DOCUMENTS ................................................................................................. 3
1.03 REFERENCES ................................................................................................................. 3
1.04 SUBMITTALS ................................................................................................................... 3
1.05 QUALITY ASSURANCE ................................................................................................... 4
1.06 DELIVERY, STORAGE AND HANDLING ......................................................................... 4
1.07 WARRANTY ..................................................................................................................... 4
1.08 MAINTENANCE ................................................................................................................ 4
PART 2 PRODUCTS ...................................................................................................................... 5
2.01 MANUFACTURERS ......................................................................................................... 5
2.02 CONSTRUCTION ............................................................................................................. 5
2.03 CPU .................................................................................................................................. 5
2.04 MEMORY ......................................................................................................................... 7
2.05 I/O CIRCUITRY ................................................................................................................ 7
2.06 PROGRAMMING ENVIRONMENT ................................................................................... 7
2.07 COMMUNICATION ........................................................................................................... 8
2.08 POWER SUPPLY ............................................................................................................. 8
2.09 RATINGS .......................................................................................................................... 9
PART 3 EXECUTION...................................................................................................................... 9
3.01 EXAMINATION ................................................................................................................. 9
3.02 INSTALLATION .............................................................................................................. 10
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SECTION XX XX XX
PROGRAMMABLE AUTOMATION CONTROLLER
PART 1 GENERAL
1.01 SUMMARY
A.
The Programmable Automation Controllers (PAC) shall meet the criteria of this
specification for control of process equipment, machinery and systems.
1.02 RELATED DOCUMENTS
A.
B.
Drawings and general provisions of the contract apply to this section.
The following sections contain requirements that relate to this section:
1.
2.
3.
4.
Section 40 90 00 – Process Control System General Requirements
Section 40 95 13 – Process Control Panels and Hardware
Section 01 33 00 – Submittal Procedures
Section _______________________________
1.03 REFERENCES
A.
The PAC shall be listed or recognized by the following registrations:
1.
2.
cULus Listed, Suitable for operation in Class 1 Division 2, Groups A, B, C, and D
Hazardous Locations
CE marked, compliant with:
a)
b)
c)
d)
3.
4.
C-Tick marked, compliant with AS/NZS CISPR 11; Industrial Emissions
Ex marked (ATEX), compliant with:
a)
b)
c)
5.
B.
EN 61326-1; Meas./Control/Lab., Industrial Requirements
EN 61000-6-2; Industrial Immunity
EN 61000-6-4; Industrial Emissions
EN 61131-2; Programmable Controllers (Clause 8, Zone A & B)
EN 60079-15; Potentially Explosive Atmospheres, Protection “n”
EN 60079-0; General Requirements
II3 G Ex nA IIC T5X
KC marked
The PAC shall meet Institute of Electrical and Electronics Engineers, Inc. (IEEE)
applicable standards.
1.04 SUBMITTALS
A.
B.
As specified in Section 01 33 00.
The supplier shall provide product data for the PAC and any component equipment,
including:
1.
Central Processing Unit (CPU) information
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a)
b)
c)
2.
Memory
Input/Output (I/O) capacity
Nonvolatile program and data retention
I/O Modules information
a)
b)
3.
4.
[PROJECT NAME]
[PROJECT LOCATION]
Type and rating
Standard wiring diagram
Bill of materials for supplied equipment
Spare parts list
1.05 QUALITY ASSURANCE
A.
The supplier shall provide PAC system components by a single manufacturer:
1.
2.
B.
Only communication modules for communication or network media functions that
are not provided by the PAC manufacturer may be produced by third-party sources.
Only PAC manufacturer-approved hardware, including cables, mounting hardware,
connectors, enclosures, racks, communication cables, splitters, terminators, taps
and removable media, may be used.
All PAC system components shall be new, free from defects and produced by
manufacturers regularly engaged in the manufacture of these products.
1.06 DELIVERY, STORAGE AND HANDLING
A.
The supplier shall deliver PAC components in packaging designed to prevent damage
from static electricity and physical damage.
B. The supplier shall store the equipment according to manufacturer requirements and in a
clean and dry space at an ambient temperature range of -40 °C to 85 °C (-40 °F to 185
°F).
C. The supplier shall protect the units from exposure to dirt, water, fumes, corrosive
substances and physical damage.
1.07 WARRANTY
A.
B.
The manufacturer shall provide their standard parts warranty for eighteen (18) months
from the date of shipment or twelve (12) months from the date of being energized,
whichever occurs first.
This warranty applies to PACs.
1.08 MAINTENANCE
A.
B.
As specified in Section 40 61 00.
Provisions shall meet the following installed-spare requirements:
1.
2.
I/O points – 25 percent spare I/O capacity for each type of I/O signal at every PAC
and remote I/O location. All spare I/O shall be wired to field terminal blocks.
PAC backplane – the greater of:
a)
b)
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25 percent spare capacity, or
3 spare backplane slots.
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PAC memory – 50 percent spare program volatile memory.
PART 2 PRODUCTS
2.01 MANUFACTURERS
A.
Allen-Bradley – CompactLogix 5370 L3 Programmable Automation Controller (No
substitutions)
2.02 CONSTRUCTION
A.
The programmable automation controller (PAC) shall be a modular design with
expansion capability. The available expansion shall be local I/O modules or distributed
(remote) I/O connected through a network.
1.
2.
3.
A single local chassis shall house CPU, memory and communications interface
options. A separate power supply shall supply necessary power to the local bank
that houses the chassis.
The PAC shall be DIN rail or panel mounted.
All system modules, and local and remote chassis shall be designed to operate in:
a)
b)
c)
4.
B.
An industrial environment with an ambient temperature of 0° to 60°C (32° to
140°F), and with a relative humidity range of 5% to 95%, non-condensing.
A free airflow environment (convection cooling only, no fans or other air moving
devices shall be required).
Conformal coating of the PAC shall be offered as an option for use in
corrosive/hazardous applications.
All system modules, and local and remote chassis shall be designed and tested to
operate in high electrical noise environments.
The system shall support up to 8 [16 or 30] local expansion modules in up to 3 banks,
along with remote I/O expansion via network.
1.
2.
3.
4.
5.
6.
Local expansion modules shall be installed in the local bank or in bank(s) vertically
or horizontally adjacent to the local bank.
The local expansion modules shall mechanically lock together by means of a tongue
and groove design and have an integrated communication bus that is connected
from module to module by a movable bus connector.
Each module shall have a built-in removable terminal block behind a door at the
front of the module with a finger-safe cover. I/O wiring shall be routed from beneath
the module to I/O sensors and actuators.
The manufacturer shall have available a variety of I/O modules, including AC digital,
DC digital, contact output, analog, RTD, thermocouple and high-speed counter.
Each bank in the system shall have its own power supply.
Expansion cables shall connect the banks (in multiple-bank installations).
2.03 CPU
A.
The CPU shall be a self-contained unit, and will be capable of providing control program
execution, supporting remote and local programming, controlling all I/O scanning and
inter-controller and peripheral communication and diagnostic functions.
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32 tasks (100 programs per task):
a)
b)
c)
2.
3.
[PROJECT NAME]
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Continuous – 1 allowed.
Periodic – Run via an interrupt at a user-defined interval in 1 µs increments
from 1 ms to 2000 s.
Event – Triggered by consumed tag or EVENT instruction.
256 controller connections
Network connections:
a)
b)
256 EtherNet/IP
120 TCP
B.
The PAC shall organize user applications as tasks, which can be specified as
continuous, periodic or event based. Tasks can be triggered by input point or instruction.
C. Programming instructions shall include the following:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
Relay-Type (bit)
High-Speed Counter
Counter and Timer
Data Comparison (for example: Equal, Greater than or Equal, Less than or Equal)
Data Manipulation (for example: Copy, Move)
Logical (for example: And, Not, Or)
Integer and Floating Point Math (for example: Add, Subtract, Multiply, Log 10)
Advanced Math and Trigonometric Functions (for example Sine, Cosine, Tangent)
Statistical
Matrix and Array (for example: COP, CSP, FIFO)
BCD Conversion
Program Flow Control (for example: Jump, Subroutine)
Application Specific (for example: Sequencer)
Diagnostic
Communication
Recipe
Proportional Integral and Derivative (PID)
Block Read and Write
Immediate I/O and Communication Update
D. The system must be capable of storing the following data:
1.
2.
3.
4.
5.
6.
7.
8.
9.
External Output Status
External Input Status
Timer Values
Counter Values
Boolean Values (0 or 1)
Short Integer Numbers (-128 to 127)
Integer Numbers (-32,768 to 32,767)
Double Integer Numbers (-2,147,483,648 to 2,147,483,647)
Floating Point Numbers to 8 significant digits (for 8+ digits, conversion to
exponential form from ±1.1754944 E -38 to ±3.402823 E +38)
10. Long Integer Numbers (-9,223,372,036,854,775,808 to 9,223,372,036,854,775,807)
11. Internal Processor Status Information
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E.
Data shall be distinguishable to the CPU by address and sub-element mnemonic.
1.
2.
3.
F.
[PROJECT NAME]
[PROJECT LOCATION]
Management of the data into memory subsections shall be an automatic function of
the CPU operating system.
Data can be displayed in ASCII, Binary, Octal, Hexadecimal or Decimal.
Function-specific data such as PID, Axis, Axis Group or Message shall have
dedicated displays available that annotate the meaning of specific control bits and
words within them and allow for selective control where appropriate.
When the main power supply is removed, the CPU shall have:
1.
2.
The ability to back up user program and all data, or
A non-energy storage option.
G. The front of the CPU shall have a USB port.
H. The front of the CPU shall have an integrated latching mechanism for securing the
Secure Digital (SD) memory card. The PAC shall operate with the memory card
removed.
I. The CPU shall have a Real Time Clock.
J. The processor module shall have green, red and yellow LED indicators with sequences
for OK (module status), Force, Run, SD, I/O (I/O status), NS (network status), Link 1 and
Link 2 (EtherNet/IP port status).
K. The processor module shall have mode switch positions for Remote, Program and Run.
2.04 MEMORY
A. The PAC shall have 1 [2 or 3] MB of user memory.
B. The program storage medium shall be a solid-state, non-volatile type.
C. The PAC shall include a 1GB (optional 2GB) SD memory card to store the user program
and the firmware of all other modules residing in the same chassis to protect against
memory loss. The card shall be rated for use in SIL 2 applications.
1.
2.
3.
When memory is restored, a user-selectable option to restore in Run mode or
Program mode shall be provided.
The PAC shall be able to be configured for automatic download from the card on
power-up.
The PAC shall be able to be manually triggered to save to or load from the card.
2.05 I/O CIRCUITRY
A.
B.
The system shall support 1 [2 or 3] bank(s) of up to 8 [16 or 30] local expansion
modules.
The supplier shall configure each expansion module to the optimum requested packet
interval (RPI) for the application.
2.06 PROGRAMMING ENVIRONMENT
A.
B.
Programming shall be through the USB 2.0 port or through the EtherNet/IP network.
The programming software shall run on Windows Server 2003, Windows Server 2008,
Windows XP Professional, Windows 7 Professional and Windows Vista environments
and the programming languages shall be:
1.
IEC 61131-3 compliant ladder diagram (LD)
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3.
4.
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Structured text (ST)
Function block diagram (FBD)
Sequential function chart (SFC)
2.07 COMMUNICATION
A.
The PAC shall have at a minimum:
1.
2.
USB 2.0 port to support upload and download, online edits, firmware updates and
bridging to other modules at full speed (12 Mbps).
EtherNet/IP switch and dual 10/100 Mbps EtherNet/IP ports with 1 IP address. The
interface shall support:
a)
b)
IEEE 802.3 Physical and Data Link Standard
Common Industrial Protocol (CIP), the protocol that provides real-time I/O
messaging and information/peer-to-peer messaging
c) Standard TCP/IP and UDP/IP communication
d) 10/100 Mbps auto sensing and auto switching
e) Standard Ethernet media
f) Subnet masking
g) BOOTP and DHCP support
h) Manual configuration using specified software
i) Programmable Automation Controller messaging to peer controllers and
workstations
j) I/O data, real-time interlocking and information
k) Full or half-duplex communication
l) Built-in Web access to diagnostics
m) I/O control
n) Device level ring (DLR)
o) Precision Time Protocol (CIP Sync, IEEE 1588)
3.
B.
Access to DeviceNet networks for communications and backup via a DeviceNet
scanner module.
The manufacturer shall have available:
1.
For serial communications connection –
a)
b)
2.
Module for an ASCII interface to RS-232, RS-422 and RS-485 devices.
Module for a Modbus RTU interface.
For Modbus TCP network communications –
a)
The PAC shall have connection capability through the embedded Ethernet port
with the execution of a ladder-logic routine.
2.08 POWER SUPPLY
A.
The PAC shall operate in compliance with electrical service of 85 to 265 VAC (120 to
220 VAC nominal), single phase, in the frequency range from 47 to 63 Hz, or 19.2 to
31.2 VDC (24 VDC nominal).
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B.
A single, main power supply shall be capable of supplying all necessary power to the
local bank housing the CPU and local I/O modules. Additional power supplies shall
provide power to other local and remote banks.
C. The power supply shall be capable of converting AC standard low voltage line power to
the DC power required to operate the PAC system.
D. The power supply shall include an easily viewed indicator to show status of the DC
power applied to the backplane.
E. The power supply shall provide electronic protection:
1.
2.
3.
4.
At the time of power-up, the power supply shall inhibit operation of the controller and
I/O modules until the DC voltages are within specifications.
The power supply shall automatically shut down the PAC when its output power
exceeds 125% of its rated power.
The power supply shall provide surge protection, isolation and outage carry-over of
up to 6 cycles of the AC line (120-240 VAC, 50/60 Hz) or 40 ms at 24 VDC.
The power supply shall be fused.
2.09 RATINGS
A.
The PAC shall be able to withstand conducted susceptibility tests as outlined in:
Temperature
Humidity
Vibration
Shock
Radiated Emissions
Conducted Emissions
Conducted Emissions - Telecomm
ESD Immunity
Radiated RF Immunity
EFT/B Immunity
Surge Immunity
Conducted RF Immunity
Magnetic Field Immunity
AC Voltage Variation
DC Voltage Variation
Oscillatory Waves
IEC 60068-2-1
IEC 60068-2-2
IEC 60068-2-14
IEC 60068-2-30
IEC 60068-2-6
IEC 60068-2-27
IEC 60068-2-32
CISPR 11: Group 1, Class A
CISPR 11/22: Group 1, Class A
EN 61000-6-4
EN 61000-4-2
EN 61000-4-3
EN 61000-4-4
EN 61000-4-5
EN 61000-4-6
EN 61000-4-8
EN 61000-4-11
EN 61000-4-29
EN 61000-4-18
PART 3 EXECUTION
3.01 EXAMINATION
A.
B.
The supplier shall verify that jobsite is ready to receive equipment.
The supplier shall verify that the jobsite environment can be maintained during and after
installation within the service conditions required by the manufacturer of the
programmable automation controller (PAC).
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3.02 INSTALLATION
A.
Installation shall be in compliance with all manufacturer requirements, instructions and
contract drawings, including:
1.
2.
3.
B.
Space surrounding the PAC to maintain adequate cooling.
Conditioning of space surrounding the PAC enclosure to maintain the
manufacturer’s ambient temperature and humidity ranges.
Accessibility of PAC diagnostic lights, communication ports and memory modules –
these components shall be free from obstructions at all times.
Control Panels
1.
2.
3.
As specified in Section 40 95 13 – Process Control Panels and Hardware.
The supplier shall provide all required cables and connectors to interface with other
control system equipment.
The supplier shall ensure that communication media, analog signals and discrete
I/O wiring are properly protected in accordance with manufacturer
recommendations.
END OF SECTION
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