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Problem #1
Put the following substances in order from lowest to highest boiling point.
C2H6, NH3, F2
Problem #2
The boiling point of argon is ­189.4ºC.
(a) Why is it so low?
(b) How does the boiling point help prove that London dispersion forces exist?
(c) The boiling point of xenon is ­119.9ºC. Why is it higher than that of argon?
Problem #3
Which would have a higher surface tension, H2O or C6H14? Why? Would the shape of the H2O meniscus in a glass tube be the same or different than C6H14?
Liquids
Several properties are related to intermolecular forces
1)
Surface tension
­ resistance of a liquid to increase surface area
­ molecules in a liquid are pulled in all directions by intermolecular forces; molecules at the surface are pulled downward and sideways; it pulls the molecules together and forms a skin
­ ex: water (polar) on a waxed car (nonpolar)
­ increased IMF, increased surface tension
2)
Capillary action / rise
­ rising of a liquid in a narrow tube
­ cohesion ­ attraction between like molecules (H2O & H2O)
­ adhesion ­ attraction between unlike molecules (H2O & glass)
­ adhesion > cohesion : liquid goes up (H2O/glass)
­ cohesion > adhesion : liquid goes down (Hg/
glass)
3)
Viscosity
­ fluids resistance to flow
­ higher IMF, higher viscosity
­ as temperature increases, viscosity decreases
Solids
Crystalline solids ­ ordered / regular arrangement of atoms
Amorphous solids ­ disorderly arrangement (glass)
Lattice ­ 3D system of points showing the centers of atoms
Unit cell ­ smallest repeating unit of a lattice
1) simple cubic
2) body­centered cubic
3) face­centered cubic
Crystalline solids
1)
Ionic
­ electrostatic attraction
­ NaCl, CaCO3
­ all ionic crystals are solids at room temperature
­ ions have a noble gas configuration, therefore no conductivity; as melted, it has good conductivity
­ excellent conductors as ions (aq)
2)
Molecular
­ dipole­dipole / LDF
­ S8, sugar, SO2(s)
­ low melting point, low boiling point
­ insulators; electrons not delocalized
­ not thermal conductors
3)
Atomic
a)
metallic
­ metallic bond
­ Cu, Na, Fe
­ good electrical conductors
­ excellent thermal conductors; electrons are the first particle to gain energy
­ medium melting point
­ solids at room temperature except mercury
b)
covalent
­ covalent bonds (network or planar covalent)
­ C (nonmetal)
­ diamond, quartz (network covalent) ­ sp3
­ graphite, mica (planar cov.) ­ sp2
­ extremely high melting point
­ melting point decreases down the table; increased bond length means less strength
c)
group 8A / noble gases
­ LDF
­ Ar
Closest Packing
­ most effecient arrangement of spheres
­ HCP
­ hexagonal closest packing
­ every other layer (ABA)
­ Mg, Zn, Cd
­ CCP
­ cubic closest packing
­ face­centered cubic
­ every third layer (ABC)
­ Ag, Al, Ni, Pb
Structure is determined by relative stability; it is governed by intermolecular forces
Alloys
­ solid solution of two or more metals
­ has metallic properties
1)
interstitial alloy
­ holes (interstices) in the closest packed structure are occupied by small atoms
2)
substitutional alloy
­ similar size metal atoms replace
Example:
Why are high­carbon steels interstitial alloys while brass is a substitutional alloy?
Answer:
An interstitial alloy is formed when holes in the closest packed metal structure are occupied by small atoms (in high carbon steels the iron holes are filled by carbon). A substitutional alloy contains similar­sized atoms of more than one element (the holes are not occupied). An example is the combination of copper and zinc to form the brass alloy.