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North America Regional Standards
Committee (NA RSC)
December 2014
NARSC Report - December 2014
Outline
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Current Structure of NA Standards Committees
NARSC Fall 2014 Meeting
Upcoming Events
Overall TC/WG Updates
Regional Staff Contact Information
NARSC Report - December 2014
Current Structure of the NARSC [1/2]
NARSC
New!
Automated Test Equip
Gases
Ajay Khoche (Khoche Consulting)
Compounds
Jim Oliver (Northrup Grumman)
Russ Kremer (Freiberger)
EHS (NA)
Chris Evanston (Salus)
Sean Larsen (LAM Research)
Bert Planting (ASML)
Chair: Steve Lewis (DPS Engineering)
Chair: Chris Evanston (Salus Engineering)
Vice-Chair: David Busing (Consultant)
Vice-Chair: Brian Rubow (Cimetrix)
Tim Volin (Parker Hannifin)
Mohamed Saleem (Fujikin)
Microlithography
Traceability
Wes Erck (W.Erck & Associates)
Rick Silver (NIST)
Win Baylies (BayTech-Resor)
Yaw Obeng (NIST)
Information & Control
PIC
Jack Ghiselli (Consultant)
Lance Rist (Industry Consultant)
Brian Rubow (Cimetrix)
HB-LED
Stefan Radloff (Intel)
Matt Fuller (Entegris)
Iain Black (Philips)
Mike Feng (Silian)
Chris Moore (BayTech-Resor)
Bill Quinn (WEQ Consulting)
Liquid Chemicals
Frank Flowers (PeroxyChem)
Frank Parker (ICL Performance)
Facilities
MEMS / NEMS
Steve Lewis (DPS Engineering)
New!
Win Baylies (BayTech-Resor)
Steve Martell (Sonoscan)
Photovoltaic (PV)
Win Baylies (BayTech-Resor)
James Moyne (Univ of Michigan)
PV - Materials
Lori Nye (Brewer Science)
John Valley (Sun Edison)
Hugh Gotts (Air Liquide)
FPD (NA)
Bill Colbran (Engenuity)
Metrics
David Bouldin (Fab Consulting)
Mark Frankfurth (Cymer)
NARSC Report - December 2014
Silicon Wafer
Noel Poduje (SMS)
Dinesh Gupta (STA)
Mike Goldstein (Intel), vice-chair
3DS-IC
Sesh Ramaswami (AMAT)
Rich Allen (SEMATECH)
Chris Moore (BayTech-Resor)
Technical Architects
Board (TAB)
James Moyne (Univ of Michigan)
Yaw Obeng (NIST)
Current Structure of the NARSC [2/2]
NARSC
Chair: Steve Lewis (DPS Engineering)
Chair: Chris Evanston (Salus Engineering)
Vice-Chair: David Busing (Consultant)
Vice-Chair: Brian Rubow (Cimetrix)
EHS TC CFG (Korea)
FPD (Korea)
EHS (Taiwan)
PV (China)
Seoung Jong Ko (SK Hynix)
Kwansik Kim (Samsung Elec.)
Jong Seo Lee (Samsung Display)
Il-Ho Kim (LMS)
Shuh-Woei Yu (SAHTECH)
Fang-Ming Hsu (TSMC)
Guangchun Zhang (Canadiansolar)
Jun Liu (China Electronics
Standardization Institute)
HB-LED TC CFG (Korea)
FPD Metrology (Korea)
FPD (Taiwan)
HyungSoo Park (SEMES)
Jong Hyeob Baek (KOPTI)
Jong Seo Lee (Samsung Display)
Il-Ho Kim (LMS)
Tzeng-Yow Lin (ITRI)
Jia-Ming Liu (TDMDA)
Gases & Liquid Chemical
TC CFG (Korea)
Facilities (Korea)
I&C (Taiwan)
Kwang Sun Kim (KUT)
Robert Chien (TSMC)
I&C (Korea)
Photovoltaic (Taiwan)
TBD (---)
Chulhong Ahn (SK Hynix)
Gunwoo Lee (Miracom)
Hyungsu Kim (Consultant)
B.N. Chuang (CMS/ITRI)
J.S. Chen (TeraSolar)
Ray Sung (UL Taiwan)
3DS-IC (Taiwan)
Technical Committee (TC) Chapters
&
TC Chapter Formation Groups (CFG)
New!
NARSC Report - December 2014
Tzu-Kun Ku (ITRI)
Wendy Chen (King Yuan
Electronics)
Roger Hwang (ASE)
HB-LED (China)
Yong Ji (Guizhou Haotian
Optoelectronics Technology)
Weizhi Cai
(San’an Optoelectronics)
NARSC Meeting Information
• Last Meeting
– November 2 for the NA Fall 2014 Meetings
San Jose, California
• Next Meeting
– March 29 for the NA Spring 2015 Meetings
San Jose, California
NARSC Report - December 2014
NARSC Fall 2014 Meeting
• Discussed Regulations revision proposals.
• Leadership Changes
– NARSC
• Chris Evanston (Salus Engineering, NA EHS cochair) was appointed NARSC
cochair
• Sean Larsen (Lam Research) stepped down as NARSC cochair
– MEMS / NEMS
• Steve Martell (Sonoscan) was appointed cochair
– 3DS-IC
• [Taiwan] Roger Hwang (ASE) was appointed cochair
• [North America] Urmi Ray (Qualcomm) stepped down
– NARSC Member-at-Large (MAL)
• Sean Larsen (Lam Research) was appointed NARSC MAL
• Jackie Ferrell stepped down
NARSC Report - December 2014
NA Standards Fall 2014 Meetings
November 2 – 6
• Most Standards meetings were held
at SEMI Headquarters
(San Jose, CA)
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3DS-IC
EHS
Facilities & Gases
HB-LED
Information & Control
Liquid Chemicals
MEMS / NEMS
Metrics
NARSC
PV Materials
NARSC Report - December 2014
• Intel (Santa Clara)
hosted
– PIC
– Silicon Wafer
SEMI thanks Intel for
hosting these meetings.
NA Standards Fall 2014 Meetings
November 2 – 6
Sunday
2
Monday
Tuesday
3
4
Wednesday
5
Thursday
6
Friday
7
Saturday
8
3DS-IC
NARSC
EH&S
Schedule
at-a-glance
Facilities & Gases
HB-LED
Information & Control
Liquid Chemicals
MEMS/NEMS
Metrics
PV / PV Materials
PIC
Silicon Wafer
NARSC Report - December 2014
Meeting Locations:
SEMI
Intel
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
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NA 3DS-IC
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Last meeting: November 4, 2014
Leadership and Task Force Changes
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Approved Documents
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Thin Wafer Handling TF has been disbanded
Urmi Ray (Qualcomm) stepped down as NA 3DS-IC committee cochair
Doc. 5270, New Standard: Guide for Measuring Voids in Bonded Wafer Stacks
Doc. 5506A, New Standard: Guide for Measuring Flatness and Shape of Low Stiffness Wafers
Doc. 5616, Revision to SEMI 3D4, Guide for Metrology for Measuring Thickness, Total Thickness
Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
Doc. 5766, New Auxiliary Information: Round Robin Study of Method for Measurement of Voids in
Bonded Wafer Pairs of Silicon Wafers (supports Doc. 5270)
New Activities
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New Standard: Specification for Reference Material for Bonded Wafer Stack Void Metrology (#5822)
Revision to SEMI 3D2, Specification for Glass Carrier Wafers for 3DS-IC Applications (#5823)
NARSC Report - December 2014
Overall TC/WG Updates
• NA Automated Test Equipment (ATE)
– Future Standards activities anticipated from SEMI CAST (Collaborative
Alliance for Semiconductor Test) Special Interest Group. Target early 2015.
– Activities will focus on next generation standard test data format and test cell
communication.
• NA Compound Semiconductor Materials
– Last meeting: November 21, 2014 (teleconference/web meeting only)
• Agenda: Task force and liaison reports
– Next meeting: May 2015 for CS MANTECH Conference in Scottsdale,
Arizona
– Issued Ballots (C6-14)
• New Standard: Specification for Polished Monocrystalline C-Plane Gallium Nitride
Wafers [#4979A]
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
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NA Environmental Health and Safety (EHS)
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Last meeting: November 6, 2014
Leadership and Task Force Changes
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Global S23 TF
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S2 to Machinery Directive Mapping TF has been disbanded.
Approved Ballots
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Lauren Crane appointed as global TF co-leader
Doc.5623 (LIs 1, 2, 5, 7, & 9), S1 revision
Doc. 5760 (LIs 1 & 2), S7 revision
Doc. 4683D (LI 2 only), S2 revisions related to chemical exposure
Doc. 5591A (LIs 1 & 2), S2 revisions related fire protection
Doc. 5718A (LIs 1, 3 & 4 only), S10 revisions
New Activities
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Reapproval for SEMI E34-1110, Safety Guideline for Mass Flow Device Removal and Shipment (#5825)
Reapproval for SEMI S5-0310, Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gas
Cylinder Valves (#5827)
Reapproval for SEMI S27-0310, Safety Guideline for the Contents of Environmental, Safety, and Health
(ESH) Evaluation Reports (#5826)
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
• NA Facilities & Gases
– Last meeting: November 4, 2014
– New Activities
• Reapproval of SEMI C3.35, Specification for Hydrogen Chloride (HCI),
99.997% Quality (#5811)
• Reapproval of SEMI C3.6, Specification for Phosphine (PH3) in Cylinders,
99.98% Quality (#5812)
• Reapproval of SEMI E77, Test Method for Calculation of Conversion Factors
for a Mass Flow Controller Using Surrogate Gases (#5813)
• Reapproval of SEMI E80, Test Method for Determining Attitude Sensitivity of
Mass Flow Controllers (Mounting Position) (#5814)
• Reapproval of SEMI F28, Test Method for Measuring Particle Generation from
Process Panels (#5815)
• Reapproval of SEMI F30, Start-Up and Verification of Purifier Performance
Testing for Trace Gas Impurities and Particles at an Installation Site (#5816)
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
• NA HB-LED
– Last meeting: November 6, 2014
– Leadership Changes
• NA HB-LED TC Chapter
– Eric Armour (Veeco) was appointed as cochair
– Bill Quinn (WEQ Consulting) stepped down
• NA HB-LED Tablet WG
– Chris Moore (BayTech-Resor) was appointed WG leader
– Approved Ballots
• Doc. 5741 (LI 1), HB1 revision
– New Task Force
• HB-LED Source Materials TF
– Charter: To establish standards for the source materials used in HB-LED epitaxial growth
processes
– New Activities
• Line Items Revision to SEMI HB1, Specifications for Sapphire Wafers Intended for Use
for Manufacturing High Brightness-Light Emitting Diode Devices (#5818)
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
• NA Information & Control (I&C)
– Last meeting: November 5, 2014
– Approved Ballots
• Doc. 5619A, New Standard: Specification for SECS Equipment Data
Dictionary (SEDD)
• Doc. 5620A, New Standard: Specification for SECS-II Message Notation
(SMN)
– New Activities
• Revision to Specification for SECS Equipment Data Dictionary (SEDD)
[formerly SEMI Draft Document 5619A] (#5824)
– Revised SNARF
• (#5762) Revision to SEMI E132.1, Specification for Soap Binding for Equipment
Client Authentication and Authorization (ECA). Adding EDA freeze versions
to E132.1
– SNARF revised from E132 revision (Specification for Equipment Client Authentication
and Authorization) to E132.1 revision.
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
• NA Liquid Chemicals
– Last meeting: November 4, 2014
– Leadership Changes
• SEMI F40 Rewrite TF
– Don Hadder Jr. (Intel) was appointed TF leader
– Approved Ballots
• Doc. 5228, Revision to SEMI F39-0699, Guideline for Chemical Blending Systems with
title change to: Guide for Chemical Blending Systems
• Doc. 5641, Revision to SEMI C31-0708, Specification for Methanol
• Doc. 5675A, New Standard: Test Method for Determining Roughness Of Polymer
Surfaces Used In Ultrapure Water and Liquid Chemical Distribution Systems By Contact
Profilometry
– New Activities
• New Standard: Test Method for Testing PFA Materials Used In Liquid Chemical
Distribution Systems (#5810)
• Line item revision to SEMI C69-0611, Test Method for the Determination of Surface
Areas of Polymer Pellets (#5809)
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
• NA MEMS / NEMS
– Last meeting: November 3, 2014
– New Activity
• Reapproval of SEMI MS8, Guide to Evaluating Hermeticity of
MEMS Packages (#5808)
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
• NA Metrics
– Last meeting: November 5, 2014
– New Activities
• Reapproval of SEMI E114, Test Method for RF Cable Assemblies
Used in Semiconductor Processing Equipment RF Power Delivery
Systems (#5819)
• Reapproval of SEMI E115, Test Method for Determining the Load
Impedance and Efficiency of Matching Networks Used in
Semiconductor Processing Equipment RF Power Delivery Systems
(#5820)
NARSC Report - December 2014
Overall TC/WG Updates
• NA Microlithography
– Last meeting: July 9, 2013
• Did not meet during SEMICON West 2014 meetings
– Next meeting to be announced (likely SEMICON West
2015)
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
• NA PV Materials
– Last meeting: November 5, 2014
– New Activities
• New Standard: Guide for the Planning, Implementing and Analyzing data from
a Round Robin used to verify a Test Method (#5801)
• New Standard: Test Method for In-line, Noncontact Measurement of Saw
Marks on Silicon Wafers for PV Applications Using Laser Position Sensor
(#5802)
• New Standard: Test Method for In-line, Noncontact Measurement of
Thickness and Thickness Variation of Silicon Wafers for PV Applications Using
Laser Position Sensor (#5803)
– Discontinued Activity
• (#4825) New Standard: Test Methods for Hg Probe Measurements of
Crystalline Silicon PV Materials and Devices
– SNARF was abandoned.
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
• NA Physical Interfaces & Carriers (PIC)
– Last meeting: November 5, 2014
– Leadership Changes
• International Reticle SMIF Pod and Load Port Interoperability TF
– Jan Rothe (GLOBALFOUNDRIES) was appointed TF leader
– Astrid Gettel (GLOBALFOUNDRIES) and Koji Ohyama (Dainichi Shoji) stepped down
– Approved Documents
• Doc. 5759 (LIs 1&2), Line Item Revisions to SEMI E83-0714, Specification for PGV
Mechanical Docking Flange
• Doc. 5758, Revision to SEMI AUX023-0614, Overview Guide to SEMI Standards for 450
mm Wafers
– New Activity
• Revision to SEMI E72-0600 (Reapproved 0305), Specification and Guide for 300 mm
Equipment Footprint, Height, and Weight
with title change to: Specification and Guide for Equipment Footprint, Height, and
Weight (#5817)
NARSC Report - December 2014
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
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NA Silicon Wafer
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Last meeting: November 4, 2014
Leadership Changes
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Murray Bullis stepped down as Int’l Polished Wafer TF leader
Revised SNARFs
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(#5540) Line Item Revision to SEMI M1-1013, Specification for Polished Single Crystal Silicon Wafers
(Addition to Appendices 1 and 3: Illustration of Flatness and Shape Metrics for Silicon Wafers)
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(#5705) Revision of SEMI M67-1109 Practice for Determining Wafer Near-Edge Geometry from a
Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics with Title Change to
Test Method
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The SNARF was modified from Reapproval to Revision
(#5706) The SNARF was modified from Reapproval to Revision of SEMI M70-1109 Practice for
Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness with Title Change to Test
Method
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The SNARF was modified from New Auxiliary Information to Line Item Revision
The SNARF was modified from Reapproval to Revision
(#5746) Line Item Revision of SEMI ME1392-1109, Guide for Angle Resolved Optical Scatter
Measurements on Specular or Diffuse Surfaces
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NARSC Report - December 2014
The SNARF was revised from Reapproval to Line Item Revision
Overall TC/WG Updates
(from NA Fall 2014 Meetings)
• NA Silicon Wafer, cont’d
– New Activities
• Revision of SEMI M68, Practice for Determining Wafer Near-Edge Geometry
from a Measured Thickness Data Array Using a Curvature Metric, ZDD
(#5806)
– with title change from Practice to Test Method
• Revision for SEMI M77, Practice for Determining Wafer Near-edge Geometry
Using Roll-off Amount, ROA (#5807)
– with change of title from Practice to Test Method
• Line Item Revision of SEMI M53, Practice for Calibrating Scanning Surface
Inspection Systems Using Certified Depositions of Monodisperse Reference
Spheres on Unpatterned Semiconductor Wafer Surfaces (#5804)
• Line Item Revision of SEMI M50, Test Method for Determining Capture Rate
and False Count Rate for Surface Scanning Inspection Systems by the Overlay
Method (#5805)
NARSC Report - December 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Traceability
– Last meeting: July 10, 2014
– Previously Approved Ballots
• Doc. 5613, Reapproval of SEMI T11, Specification for Marking of Hard
Surface Reticle Substrates
• Doc. 5689, Line Item Revision of SEMI T5, Specification for
Alphanumeric Marking of Round Compound Semiconductor Wafers
– Line Item 1: Update table 1 by adding Back Surface for 150 mm wafer
– New Activity
• Revision of SEMI T7, Specification for Back Surface Marking of DoubleSide Polished Wafers with a Two-Dimensional Matrix Code Symbol
(#5752)
– To be adjudicated at the next Japan Traceability TC Chapter meeting in 2014,
pending GCS approval
NARSC Report - December 2014
NA Standards Spring 2015 Meetings
• March 30 – April 2
• SEMI Headquarters in San Jose, California
• Inviting local companies
willing and able to host
some of the meetings to
maintain one-week format.
SEMI
Headquarters
NARSC Report - December 2014
Upcoming NA Meetings – 2015
Event Name
Event Type
NA Standards Spring 2015
Meetings
Standards Meetings
NA Compound Semiconductor
Materials
Technical Committee
Meeting
NA Standards Meetings at
SEMICON West 2015
Standards Meetings
July 13-16, 2015
San Francisco, California
NA Standards Fall 2015
Meetings
Standards Meetings
November 2-5, 2015
SEMI HQ in San Jose, California
NARSC Report - December 2014
Date / Venue
March 30 – April 2, 2015
SEMI HQ in San Jose, California
CS MANTECH
May 20, 2015
Scottsdale, Arizona
Regional Staff
Contact Information
Name
Paul Trio
E-mail
[email protected]
Phone
+1.408.943.7041
Office Address
NARSC Report - December 2014
3081 Zanker Road
San Jose, CA 95134
U.S.A.
Thank you!
NARSC Report - December 2014
Back-up
NARSC Report - December 2014
NA Standards Staff Changes
North America
Paul Trio
Headquarters
Michael Tran
Kevin Nguyen
3DS-IC
ATE
EHS
Information & Control
NARSC
Compounds
Facilities
FPD
Gases
HB-LED
Liquid Chemicals
MEMS / NEMS
Metrics
Microlithography
PIC
Traceability
Silicon Wafer
PV/PV Materials
NA Operations
Meetings & Events Planning
Standards Programs/STEPs/WS
CAST SIG
Test Vision
Member Outreach
Sales Development
NA Standards Membership
NA Standards Web
HQ Operations
Standards Ballots
Regs SC
A&R SC
Regional Support
NARSC Report - December 2014