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Processor Specs (Continued)
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Package Type
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Package Type
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Form Factor and Package
• The term form factor applies to many
devices including processors. It refers to
their size and shape. And in the case of
processors it also includes how they connect
to the motherboard.
– The motherboard has a slot or socket.
• A related term is the “package” — an
enclosure for a chip (integrated circuit).
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Pinning
The pins or leads are how
a chip interfaces with the
outside world.
There are various ways to
arrange the pins on a chip.
Furthermore, several chips
can be brought together
into unit called a module
(common in memory).
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PGA/DIP/SIP
• PGA: pin grid array, chip in which the
pins are located on the bottom in concentric
squares.
– Used in some microprocessors.
• DIP: dual in-line package, rectangular
chip with two rows of pins, one on each
side.
• SIP: single in-line package, chip with pins
protruding from one side
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SEPP
An out-dated processor
packaging scheme.
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• Single-Edge Processor
Package
• With the S.E.P.P. form
factor, the processor is not
completely covered by the
black plastic (as in
S.E.C.C.and S.E.C.C.2).
• The circuit board
(substrate) can be seen
from the bottom side.
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SECC
Another out-dated processor
packaging scheme.
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• Single Edge Contact
Connector
• With the S.E.C.C. form
factor, processors have a
plastic shroud covering
with an active heatsink
and fan.
• Identifiable by the
goldfinger contacts which
in this case are inside of
the plastic housing.
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Heat
• Recall that in the history of processors the number
of transistors continues to grow (Moore’s Law)
while the relative size of the chip stays fixed.
With more transistors carrying current, more
heat is produced.
• Various developments have occurred to deal with
the issue of heat. One is a reduction in the
working voltage (5V  3.3V  2V). Another
has been the introduction of the heatsink and fan.
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Heat Sink
• The computer has had a fan for some time to deal
with heat. But starting with the 486, the processor
needed special consideration.
• A heat sink is an element designed to take heat
away from the processor.
• In this case, heat is dissipated mainly via
convection, the heat is transferred to the nearby
air and is carried away with the air as it moves.
– Convection is why a breeze feels nice on a hot summer
day.
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Desired Effects
• A heat sink should have a large surface area since
this is where the heat is transferred to the air.
• But the heat sink should not block the air flow
since this is how the heat is carried away.
• Heat sinks often have very strange shapes to try to
maximize these two competing effects.
– Typically made of Aluminum
– May have “fins”
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Heat Sinks
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Passive and Active
• All modern processors have a heat sink. Some also
require a fan.
– Without a fan: passive heat sink
– With a fan: active heat sink
• Because the heat sink’s purpose is to dissipate
heat, it is important that the heat can get from the
processor to the heat sink. The material “gluing”
the heat sink to the processor must conduct heat
well.
• A heat slug is a piece of metal that connects the
processor core to the processor package and/or
heatsink.
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SECC2
• As with SECC, with
SECC2 the processors
have a plastic housing
with an active heatsink
(means it has a fan).
• It is distinct from
SECC in that the
goldfinger contacts are
exposed.
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PPGA
• Plastic Pin Grid Array
• With PPGA the processors
have pins arranged in a
square pattern. They fit
into Socket 370
motherboards.
• Look for the square
pattern (Pin Grid Array)
on the bottom.
• Slot connectors do not
have pins.
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FC-PGA
• Flipped-Chip Pin Grid
Arrays
• The chip is designed so
that the “core” processor,
which is the part that gets
the hottest, is on top
(closer to the heat sink).
• Also fits into a socket 370
motherboard. But it must
be a FCPGA compliant
motherboard for FCPGA
processor to work.
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Pentium 4 Form Factors
• Pentium 4’s also come in a FCPGA form factor.
– The package uses 478 pins, which are 2.03 mm long
and .32 mm in diameter.
• FCBGA (Flip Chip Ball Grid Array)
– Instead of pins, FCBGA uses small balls, which acts as
contacts for the processor. Pins bend, ball don’t.
– The package uses 479 balls, which are .78 mm in
diameter.
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The LGA
• "Intel’s new LGA, or Land Grid Array, 775 processor
socket takes a step away from traditional implementations
in that the package no longer features pins, rather the
bottom of the LGA 775 processors only have small gold
contacts. With the LGA package, Intel has moved the pins
into the bottom portion of the processor socket, something
that will make installation of the processor easier in that
there is no need to watch for bent pins on the
package...although it will make it more difficult as well.
You no longer need to worry about bent or damaged pins
on the processor, rather now you have to worry twice as
much about bent pins within the processor socket itself."
•
http://rootprompt.org/article.php3?article=7115
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Intel Core MicroArchitecture
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Micro-architecture
• A processor’s architecture refers to its instruction
set, the number and type of registers, and memoryresident data structures (e.g. stacks) that are available
to a programmer (at least at the assembly level).
• A processor’s micro-architecture refers to the
hardware implementation of the architecture (the
transistors).
• Backward compatibility is within the architecture
(which is more of a logical level). The microarchitecture (implementation) may change
dramatically and is not necessarily compatible with
previous versions.
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Intel® Wide Dynamic Execution
• A combination of techniques (data flow
analysis, speculative execution, out of order
execution, and super scalar) that enables
the processor to execute more instructions
in parallel.
– Pipelining ideas
• Delivers more instructions per clock cycle
to improve execution time and energy
efficiency.
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Pipelining
• Recall that to execute an instruction, one must
fetch it, decode it, fetch any data required, execute
the instruction, write the answer to the appropriate
place and possibly look for an interrupt requests
that might have occurred during the previous.
• In pipelining a processor can begin executing a
second instruction before the first has been
completed.
• Thus, many instructions are in the pipeline at the
same, though at various processing stages.
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Pipelining
• The pipeline is divided into segments. Each
segment can perform its duty at the same time as
the other segments.
• When a segment completes its task, it passes the
result to the next segment and fetches the next
operation from the preceding segment.
• Once a feature of only high-end processors, now
pipelining is standard.
– A Pentium had up to six instruction in the pipeline.
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Hyper-Pipelined Technology
• Pentium 4’s Hyper-pipelined technology
uses a 20-stage pipeline.
• Having so many instructions in the works
can be a problem if the program branches
and one has the wrong instructions in the
pipeline.
• For long pipelines to be effective there must
be good “branch prediction.” BPU –
Branch Prediction Unit
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Intel® Wide Dynamic Execution (Cont.)
• Wider execution core allow each core to
fetch, dispatch, execute and retire up to four
full instructions simultaneously.
• More accurate branch prediction
• Deeper instruction buffers for greater
execution flexibility
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Intel® Advanced Smart Cache
• The Intel Advanced Smart Cache is a multicore optimized cache.
• Reduces latency to frequently used data
– Improves performance and efficiency by
increasing the probability that each execution
core can quickly access data.
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Intel® Smart Memory Access
• Intel Smart Memory Access optimizes the use of
the available data bandwidth from the memory
subsystem.
• Includes an important new capability called
"memory disambiguation,"
– which increases the efficiency of out-of-order
processing by providing the execution cores with the
built-in intelligence to speculatively load data for
instructions that are about to execute before all previous
store instructions are executed.
– (I.e. get what you need when you need it)
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Intel® Advanced Digital Media Boost
• Intel® Advanced Digital Media Boost is a feature
that significantly improves performance when
executing Intel® Streaming SIMD Extension
(SSE/SSE2/SSE3) instructions.
• Accelerate video, speech and image, photo
processing, encryption, financial, engineering and
scientific applications.
• Enables 128-bit instructions to be executed at a
throughput rate of one per clock cycle, doubling
the speed of previous generations.
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Internet Streaming SIMD
Extensions
• SSE is an acronym within an acronym: It stands
for Streaming SIMD Extensions, where SIMD is
Single Instruction Multiple Data
• SSE consists of 70 SIMD instructions for integer
and floating-point operations. It helps with high
resolution images, audio and video viewing,
speech recognition etc.
• Pentium 4 actually uses SSE2.
• SSE2 adds 144 new instructions.
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Intel® Virtualization Technology
• Intel® Virtualization Technology (Intel®
VT)¹ improves traditional software-based
virtualization solutions.
– “These integrated features give virtualization
software the ability to take advantage of
offloading workload to the system hardware,
enabling more streamlined virtualization
software stacks and ‘near native’ performance
characteristics.”
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Virtualization
• Using virtualization, one computer system can
function as multiple "virtual" systems.
– Can run multiple operating systems (simultaneously)
– One machine being used as a number of independent
virtual machines.
– Allows consolidate and balancing of multiple
workloads on one physical server system.
– Lowers hardware acquisition costs
– Improved data center performance efficiency.
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Execute Disable Bit
• Intel's Execute Disable Bit allows the
processor to distinguish between areas in
memory where an application can execute
and where it cannot.
• Can be used to disable certain worm
attacks.
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References
• PC Hardware in a Nutshell, Thompson and
Thompson
• http://www.webopedia.com
• http://www.intel.com
• http://www.anandtech.com
• http://www.mbreview.com/lga775.php
• http://www.intel.com/technology/architectu
re-silicon/core/
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