Download BCR162

BCR162
PNP Silicon Digital Transistor
• Switching circuit, inverter, interface circuit,
driver circuit
• Built in bias resistor (R1 = 4.7kΩ , R2 = 4.7kΩ )
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
BDTIC
BCR162
C
3
R1
R2
1
B
2
E
EHA07183
Type
Marking
BCR162
WUs
Pin Configuration
1=B
2=E
2=C
-
-
Package
-
SOT23
Maximum Ratings
Parameter
Symbol
Collector-emitter voltage
VCEO
50
Collector-base voltage
VCBO
50
Input forward voltage
Vi(fwd)
30
Input reverse voltage
Vi(rev)
10
Collector current
IC
100
mA
Total power dissipation-
Ptot
200
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
Thermal Resistance
Parameter
Junction - soldering point1)
Symbol
RthJS
Value
Unit
V
TS ≤ 102°C
1
-65 ... 150
Value
≤ 240
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Unit
K/W
2011-08-29
BCR162
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Values
Parameter
min.
typ. max.
DC Characteristics
Collector-emitter breakdown voltage
V(BR)CEO 50
Unit
V
IC = 100 µA, IB = 0
Collector-base breakdown voltage
V(BR)CBO
50
-
-
-
-
100
IC = 10 µA, IE = 0
Collector-base cutoff current
ICBO
nA
VCB = 40 V, IE = 0
BDTIC
Emitter-base cutoff current
IEBO
-
-
1.61
mA
hFE
20
-
-
-
-
-
0.3
V
Vi(off)
0.8
-
1.5
Vi(on)
1
-
2.5
VEB = 10 V, IC = 0
DC current gain2)
IC = 5 mA, VCE = 5 V
Collector-emitter saturation voltage2)
VCEsat
IC = 10 mA, IB = 0.5 mA
Input off voltage
IC = 100 µA, VCE = 5 V
Input on voltage
IC = 2 mA, VCE = 0.3 V
Input resistor
R1
3.2
4.7
6.2
kΩ
Resistor ratio
R1/R2
0.9
1
1.1
-
fT
-
200
-
MHz
Ccb
-
3
-
pF
AC Characteristics
Transition frequency
IC = 10 mA, VCE = 5 V, f = 100 MHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz
1For calculation of R
thJA please refer to Application Note AN077 (Thermal Resistance Calculation)
2Pulse
test: t < 300µs; D < 2%
2
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2011-08-29
BCR162
DC current gain hFE = ƒ(IC)
VCE = 5 V (common emitter configuration)
Collector-emitter saturation voltage
VCEsat = ƒ(IC ), IC/IB = 20
10 3
0.5
V
0.4
VCEsat
hFE
-40 °C
-25 °C
25 °C
85 °C
125 °C
10 2
0.35
0.3
-40 °C
-25 °C
25 °C
85 °C
125 °C
BDTIC
0.25
0.2
10
1
0.15
0.1
0.05
10 0 -4
10
10
-3
10
-2
A
10
0 -3
10
-1
-2
10
A
10
IC
IC
Input on Voltage Vi (on) = ƒ(IC)
VCE = 0.3V (common emitter configuration)
Input off voltage Vi(off) = ƒ(IC)
VCE = 5V (common emitter configuration)
10 1
10 2
V
-40 °C
-25 °C
25 °C
85 °C
125 °C
Vi(off)
Vi(on)
V
10 1
-1
-40 °C
-25 °C
25 °C
85 °C
125 °C
10 0
10 0
10 -1 -5
10
10
-4
10
-3
10
-2
A
10
10 -1 -5
10
-1
10
-4
10
-3
IC
10
-2
A
10
-1
IC
3
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2011-08-29
BCR162
Total power dissipation P tot = ƒ(TS)
Permissible Pulse Load RthJS = ƒ(tp)
BCR162
BCR162
10 3
300
mW
K/W
250
10 2
RthJS
Ptot
225
200
175
BDTIC
10 1
150
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D=0
125
100
10 0
75
50
25
0
0
15
30
45
60
90 105 120 °C
75
10 -1 -6
10
150
10
-5
10
-4
10
-3
TS
10
-2
s
10
0
tp
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp )
BCR162
Ptotmax / PtotDC
10 3
-
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 2
10 1
10 0 -6
10
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
4
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2011-08-29
Package SOT23
BCR162
0.4 +0.1
-0.05
1)
2
0.08...0.1
C
0.95
1.3 ±0.1
1
2.4 ±0.15
3
0.1 MAX.
10˚ MAX.
B
1 ±0.1
10˚ MAX.
2.9 ±0.1
0.15 MIN.
Package Outline
A
5
0...8˚
1.9
0.2
0.25 M B C
M
A
BDTIC
1) Lead width can be 0.6 max. in dambar area
Foot Print
0.8
0.9
1.3
0.9
0.8
1.2
Marking Layout (Example)
Manufacturer
EH s
2005, June
Date code (YM)
Pin 1
BCW66
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
8
2.13
2.65
0.9
Pin 1
1.15
3.15
5
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2011-08-29
BCR162
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
BDTIC
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
6
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2011-08-29