Download MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch

EVALUATION KIT AVAILABLE
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
General Description
The MAX9995 dual, high-linearity, downconversion
mixer provides 6.1dB gain, +25.6dBm IIP3, and 9.8dB
NF for WCDMA, TD-SCDMA, LTE, TD-LTE, and
GSM/EDGE base-station applications.
This device integrates baluns in the RF and LO ports, a
dual-input LO selectable switch, an LO buffer, two doublebalanced mixers, and a pair of differential IF output amplifiers. The MAX9995 requires a typical LO drive of 0dBm
and supply current is guaranteed to be below 380mA.
These devices are available in a compact 36-pin TQFN
package (6mm × 6mm) with an exposed pad. Electrical
performance is guaranteed over the extended temperature range, from TC = -40°C to +100°C.
Applications
WCDMA, TD-SCDMA,
and cdma2000® 3G
Base Stations
PHS/PAS Base Stations
LTE and TD-LTE
Base Stations
Wireless Local Loop
GSM/EDGE
Base Stations
Military Systems
Fixed Broadband
Wireless Access
Features
o 1700MHz to 2700MHz RF Frequency Range
o 1400MHz to 2600MHz LO Frequency Range
o 40MHz to 350MHz IF Frequency Range
o
o
o
o
6.1dB Conversion Gain
+25.6dBm Input IP3
9.8dB Noise Figure
66dBc 2RF - 2LO Spurious Rejection at
PRF = -10dBm
o Dual Channels Ideal for Diversity Receiver
Applications
o Integrated LO Buffer
o Integrated RF and LO Baluns for Single-Ended
Inputs
o Low -3dBm to +3dBm LO Drive
o Built-In SPDT LO Switch with 50dB LO1 - LO2
Isolation and 50ns Switching Time
o 44dB Channel-to-Channel Isolation
Private Mobile Radio
RFMAIN
29 LO_ADJ_M
1
MAX9995
27
LO2
TAPMAIN
2
26
GND
GND
3
25
GND
VCC
4
24
GND
GND
5
23
LOSEL
VCC
6
22
GND
GND
7
21
VCC
TAPDIV
8
20
GND
RFDIV
9
19
LO1
13
14
15
16
17
18
IND_EXTD
VCC
LO_ADJ_D
N.C.
12
GND
IFD-
11
IFD_SET
IFD+
10
VCC
EXPOSED
PAD*
6mm x 6mm TQFN
*EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
Ordering Information
PART
28 N.C.
30 VCC
31 IND_EXTM
33 IFM+
32 IFM-
34 GND
36 VCC
TOP VIEW
35 IFM_SET
Pin Configuration/
Functional Diagram
TEMP RANGE
PIN-PACKAGE
MAX9995ETX+
TC* = -40°C to +100°C 36 TQFN-EP**
MAX9995ETX+T
TC* = -40°C to +100°C 36 TQFN-EP**
+Denotes a lead(PB)-free and RoHS-compliant package.
*TC = Case temperature.
**EP = Exposed pad.
T = Tape and reel.
cdma2000 is a registered trademark of Telecommunications
Industry Association.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-3383; Rev 2; 12/12
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
VCC ........................................................................-0.3V to +5.5V
LO1, LO2 to GND ...............................................................±0.3V
IFM_, IFD_, IFM_SET, IFD_SET, LOSEL,
LO_ADJ_M, LO_ADJ_D to GND.............-0.3V to (VCC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ..........................+20dBm
RFMAIN, RFDIV Current
(RF is DC shorted to GND through balun) ......................50mA
Continuous Power Dissipation (Note 1) .............................6.75W
Operating Temperature Range (Note 2) ...TC = -40°C to +100°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Ambient Thermal Resistance (θJA)
(Note 3, 4) ....................................................................38°C/W
Junction-to-Board Thermal Resistance (θJB)................12.2°C/W
Junction-to-Case Thermal Resistance (θJC)
(Note 1, 4) ...................................................................7.4°C/W
Note 3: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, no input RF or LO signals applied, VCC = 4.75V to 5.25V, TC = -40°C to +85°C. Typical values are at VCC
= 5.0V, TC = +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
SYMBOL
CONDITIONS
VCC
MIN
TYP
MAX
UNITS
4.75
5
5.25
V
332
380
Total supply current
Supply Current
LOSEL Input High Voltage
LOSEL Input Low Voltage
LOSEL Input Current
ICC
VCC (pin 16)
82
90
VCC (pin 30)
97
110
IFM+/IFM- (total of both)
70
90
IFD+/IFD- (total of both)
70
90
VIH
2
V
VIL
IIL and IIH
mA
-10
0.8
V
+10
µA
RECOMMENDED AC OPERATING CONDITIONS
MAX
UNITS
RF Frequency Range
PARAMETER
fRF
(Note 5)
1700
2700
MHz
LO Frequency Range
fLO
(Note 5)
1400
2600
MHz
IF Frequency Range
fIF
(Note 5)
40
350
MHz
PLO
(Note 5)
-3
+3
dBm
LO Drive Level
2
SYMBOL
CONDITIONS
MIN
TYP
Maxim Integrated
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
AC ELECTRICAL CHARACTERISTICS—fRF = 1700MHz TO 2200MHz
(Typical Application Circuit, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50Ω sources, PLO = -3dBm to +3dBm, fRF =
1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, with fRF > fLO, TC = -40°C to +85°C. Typical values are at VCC =
5.0V, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, and TC = +25°C, unless otherwise noted.) (Notes 6, 7)
PARAMETER
SYMBOL
CONDITIONS
MIN
fRF = 1710MHz to 1875MHz
Conversion Gain
GC
VCC = 5.0V,
TC = +25°C,
PLO = 0dBm,
PRF = -10dBm
Gain Variation from Nominal
fRF = 1850MHz to 1910MHz
6.2
TC = +100°C
4.6
6.1
fRF = 1710MHz to 1875MHz
±0.5
±1
fRF = 1850MHz to 1910MHz
±0.5
±1
fRF = 2110MHz to 2170MHz
±0.5
±1
Input Third-Order Intercept Point
fRF = 1710MHz to 1875MHz
9.7
fRF = 1850MHz to 1910MHz
9.8
fRF = 2110MHz to 2170MHz
9.9
8dBm blocker tone applied to RF port at
2000MHz, fRF = 1900MHz, fLO = 1710MHz,
PLO = -3dBm
Noise Figure (with Blocker)
Input 1dB Compression Point
No blockers
present
P1dB
IIP3
2RF - 2LO Spur Rejection
2x2
12.6
23
25.6
26.1
PRF = -10dBm, TC = +100°C
73.3
PRF = -5dBm
61
PRF = -10dBm
3RF - 3LO Spur Rejection
3x3
dBm
66
PRF =-5dBm, TC = +100°C
fRF = 1900MHz,
fLO = 1700MHz,
fSPUR = 1766.7MHz
dB
dBm
9.5
PRF = -10dBm
dB
dB
(Notes 8, 9)
TC = +100°C, Note 9
dB
22
(Note 8)
fRF = 1900MHz,
fLO = 1700MHz,
fSPUR = 1800MHz
UNIT
dB
fRF = 2110MHz to 2170MHz
±0.75
NF
MAX
6
Gain Variation with Temperature
Noise Figure
TYP
68.3
70
PRF = -10dBm, TC = +100°C
PRF = -5dBm
dBc
88
84.5
60
PRF =-5dBm, TC = +100°C
78
dBc
74.5
Maximum LO Leakage at RF Port
fLO = 1400MHz to 2000MHz
-29
dBm
Maximum 2LO Leakage at RF Port
fLO = 1400MHz to 2000MHz
-17
dBm
fLO = 1400MHz to 2000MHz
-25
Maximum LO Leakage at IF Port
Minimum RF-to-IF Isolation
TC = +100°C
fRF = 1700MHz to 2200MHz, fIF = 200MHz
37
TC = +100°C
44
LO1 - LO2 Isolation
PLO1 = 0dBm, PLO2 = 0dBm (Note 10)
Minimum Channel-to-Channel
Isolation
PRF = -10dBm, RFMAIN (RFDIV)
power measured at IFDIV (IFMAIN),
relative to IFMAIN (IFDIV),
all unused ports terminated at 50Ω
LO Switching Time
50% of LOSEL to IF settled to within 2°
Maxim Integrated
-50.4
TC =
+100°C
40
50.5
40
44
dBm
dB
dB
dB
54.7
50
ns
3
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
AC ELECTRICAL CHARACTERISTICS—fRF = 2540MHz
(Typical Application Circuit, RF and LO ports are driven from 50Ω sources, fRF > fLO, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF =
2540MHz, fLO = 2400MHz, fIF = 140MHz, TC = +25°C, unless otherwise noted.) (Note 7)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
RF Return Loss
MAX
14
LO Return Loss
IF Return Loss
Conversion Gain
GC
Input Third-Order Intercept Point
IIP3
2RF - 2LO Spurious Response
2x2
3RF - 3LO Spurious Response
3x3
UNITS
dB
LO port selected
18
LO port unselected
21
LO driven at 0dBm, RF terminated into 50Ω
(Note 11)
21
dB
5.2
dB
24.6
dBm
Two tones: fRF1 = 2540MHz, fRF2 = 2541MHz,
PRF = -5dBm/tone
PRF = -10dBm
58
PRF = -5dBm
63
PRF = -10dBm
72
PRF = -5dBm
82
dB
dBc
dBc
LO Leakage at IF Port
-45
dBm
RF-to-IF Isolation
49
dB
48
dB
PRF = -10dBm, RFMAIN (RFDIV) power
measured at IFDIV (IFMAIN), relative to IFMAIN
(IFDIV), all unused ports terminated at 50Ω
Channel-to-Channel Isolation
Note 5: Operation outside this frequency band is possible but has not been characterized. See the Typical Operating Characteristics.
Note 6: Guaranteed by design and characterization.
Note 7: All limits reflect losses of external components. Output measurements taken at IF outputs of Typical Application Circuit.
Note 8: Production tested.
Note 9: Two tones 3MHz spacing, -5dBm per tone at RF port.
Note 10: Measured at IF port at IF frequency. fLO1 and fLO2 are offset by 1MHz.
Note 11: IF return loss can be optimized by external matching components.
Typical Operating Characteristics
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.)
6.0
TC = +25°C
5.5
5.0
TC = +85°C
4.5
6.4
6.2
6.1
6.0
5.9
5.8
6.2
6.1
6.0
5.9
5.7
5.7
5.6
5.6
1900
2000
RF FREQUENCY (MHz)
2100
2200
VCC = 5.25V
5.5
5.5
1800
VCC = 5.0V
5.8
3.5
1700
VCC = 4.75V
6.3
4.0
3.0
4
6.3
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
6.5
PLO = -3dBm, 0dBm, +3dBm
6.4
CONVERSION GAIN (dB)
TC = -20°C
7.0
6.5
MAX9995 toc02
MAX9995 toc01
7.5
CONVERSION GAIN vs. RF FREQUENCY
CONVERSION GAIN vs. RF FREQUENCY
6.5
MAX9995 toc03
CONVERSION GAIN vs. RF FREQUENCY
8.0
1700
1800
1900
2000
RF FREQUENCY (MHz)
2100
2200
1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
Maxim Integrated
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.)
INPUT IP3 vs. RF FREQUENCY
26.2
TC = -20°C
TC = +25°C
25.2
25.8
PLO = -3dBm
25.2
1800
1900
2000
2100
1800
TC = +85°C
2100
2200
1700
PRF = -5dBm
PLO = -3dBm
64
TC = +25°C
TC = -20°C
50
45
60
PLO = 0dBm
58
PLO = +3dBm
56
52
50
50
2200
1700
FUNDAMENTAL FREQUENCY (MHz)
PRF = -5dBm
TC = -20°C
PRF = -5dBm
86
PLO = 0dBm
PLO = -3dBm
82
80
78
TC = +85°C
76
74
72
70
1900
2000
2100
FUNDAMENTAL FREQUENCY (MHz)
Maxim Integrated
2200
1900
2000
2100
2200
3RF - 3LO vs. FUNDAMENTAL FREQUENCY
88
86
PRF = -5dBm
VCC = 5.0V
84
82
PLO = +3dBm
80
78
82
80
VCC = 5.25V
78
76
76
74
74
VCC = 4.75V
72
72
1800
1800
FUNDAMENTAL FREQUENCY (MHz)
84
TC = +25°C
1700
1700
2200
3RF - 3LO vs. FUNDAMENTAL FREQUENCY
3RF - 3LO (dBc)
84
2100
3RF - 3LO (dBc)
86
2000
88
MAX9995 toc10
88
1900
FUNDAMENTAL FREQUENCY (MHz)
3RF - 3LO vs. FUNDAMENTAL FREQUENCY
90
1800
MAX9995 toc11
2100
VCC = 5.0V
56
35
2000
VCC = 5.25V
58
54
1900
VCC = 4.75V
60
52
1800
2200
62
54
1700
2100
PRF = -5dBm
64
40
30
2000
2RF - 2LO vs. FUNDAMENTAL FREQUENCY
2RF - 2LO (dBc)
60
1900
66
62
55
1800
RF FREQUENCY (MHz)
2RF - 2LO vs. FUNDAMENTAL FREQUENCY
2RF - 2LO (dBc)
2RF - 2LO (dBc)
65
3RF - 3LO (dBc)
2000
66
MAX9995 toc07
PRF = -5dBm
70
1900
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
2RF - 2LO vs. FUNDAMENTAL FREQUENCY
VCC = 5.0V
24.6
1700
2200
MAX9995 toc08
1700
VCC = 4.75V
25.0
25.4
24.4
25.8
25.4
25.6
24.8
75
26.2
26.0
MAX9995 toc09
25.6
PLO = +3dBm
IIP3 (dBm)
IIP3 (dBm)
IIP3 (dBm)
26.0
PRF = -5dBm/TONE
VCC = 5.25V
26.6
MAX9995 toc06
PRF = -5dBm/TONE
PLO = 0dBm
26.4
27.0
MAX9995 toc12
MAX9995 toc04
PRF = -5dBm/TONE
TC = +85°C
26.4
INPUT IP3 vs. RF FREQUENCY
26.6
MAX9995 toc05
INPUT IP3 vs. RF FREQUENCY
26.8
1700
1800
1900
2000
2100
FUNDAMENTAL FREQUENCY (MHz)
2200
1700
1800
1900
2000
2100
2200
FUNDAMENTAL FREQUENCY (MHz)
5
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.)
INPUT P1dB vs. RF FREQUENCY
13.6
13.2
13.5
13.4
13.3
13.2
TC = -20°C
2000
2100
1800
LO SWITCH ISOLATION vs. LO FREQUENCY
TC = -20°C
52
51
50
TC = +25°C
48
2100
2200
1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
LO SWITCH ISOLATION vs. LO FREQUENCY
53
PLO = -3dBm
52
PLO = 0dBm
51
PLO = +3dBm
50
49
54
VCC = 4.75V, 5.0V, 5.25V
53
52
51
50
49
TC = +85°C
48
48
46
45
47
47
1500
1600
1700
1800
1900
2000
1400
1500
LO FREQUENCY (MHz)
1800
1900
TC = -20°C
40
PLO = 0dBm
PLO = +3dBm
70
60
PLO = -3dBm
50
1900
2000
RF FREQUENCY (MHz)
2100
2200
1800
1900
2000
CHANNEL ISOLATION vs. RF FREQUENCY
80
VCC = 4.75V
VCC = 5.0V
70
60
VCC = 5.25V
50
30
30
20
1700
40
40
30
1600
90
MAX9995 toc20
80
CHANNEL ISOLATION (dB)
60
1800
1500
LO FREQUENCY (MHz)
90
MAX9995 toc19
TC = +25°C
70
1700
1400
2000
CHANNEL ISOLATION vs. RF FREQUENCY
CHANNEL ISOLATION vs. RF FREQUENCY
50
1700
LO FREQUENCY (MHz)
80
TC = +85°C
1600
CHANNEL ISOLATION (dB)
1400
MAX9995 toc21
47
CHANNEL ISOLATION (dB)
2000
LO SWITCH ISOLATION vs. LO FREQUENCY
LO SWITCH ISOLATION (dB)
LO SWITCH ISOLATION (dB)
54
6
1900
54
MAX9995 toc16
55
49
VCC = 4.75V
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
53
13.2
12.4
1700
2200
LO SWITCH ISOLATION (dB)
1900
MAX9995 toc17
1800
13.4
12.6
12.9
1700
13.6
12.8
13.0
12.4
VCC = 5.0V
13.8
13.0
PLO = +3dBm
13.1
12.8
14.0
MAX9995 toc18
13.6
PLO = -3dBm
VCC = 5.25V
14.2
INPUT P1dB (dBm)
INPUT P1dB (dBm)
INPUT P1dB (dBm)
14.0
PLO = 0dBm
13.7
INPUT P1dB vs. RF FREQUENCY
14.4
MAX9995 toc14
MAX9995 toc13
TC = +85°C
TC = +25°C
13.8
MAX9995 toc15
INPUT P1dB vs. RF FREQUENCY
14.4
1700
1800
1900
2000
RF FREQUENCY (MHz)
2100
2200
1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
Maxim Integrated
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.)
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
-30
TC = -20°C
-35
-40
-45
TC = +25°C
TC = +85°C
-50
-30
PLO = -3dBm
-35
-40
-45
PLO = +3dBm
-50
-55
VCC = 5.25V
-35
VCC = 4.75V
-40
-45
1700
1800
1900
1400
2000
1500
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
TC = -20°C
-35
-40
TC = +25°C
TC = +85°C
-50
1800
1900
2000
1400
-25
-30
PLO = +3dBm
-35
-40
-45
PLO = -3dBm
1700
1800
1900
2000
VCC = 4.75V, 5.0V, 5.25V
MAX9995 toc28
42
41
TC = +25°C
TC = -20°C
1500
1600
1700
1800
1900
38
2000
RF FREQUENCY (MHz)
Maxim Integrated
1400
1500
2100
1600
1700
1800
1900
2000
LO FREQUENCY (MHz)
PLO = -3dBm, 0dBm, +3dBm
44
43
42
41
40
39
RF-TO-IF ISOLATION vs. RF FREQUENCY
43.0
42.5
VCC = 5.25V
42.0
41.5
41.0
VCC = 4.75V
VCC = 5.0V
40.5
40.0
39.5
36
1900
-50
2000
37
1800
-45
38
39
1700
-40
-55
PLO = 0dBm
RF-TO-IF ISOLATION (dB)
43
40
45
RF-TO-IF ISOLATION (dB)
TC = +85°C
44
-35
RF-TO-IF ISOLATION vs. RF FREQUENCY
46
2000
-30
LO FREQUENCY (MHz)
RF-TO-IF ISOLATION vs. RF FREQUENCY
1900
-60
1400
LO FREQUENCY (MHz)
45
1800
-25
MAX9995 toc29
1600
1700
-20
-50
1500
1600
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
-55
1400
1500
LO FREQUENCY (MHz)
MAX9995 toc26
-25
-45
1700
-20
LO LEAKAGE AT RF PORT (dBm)
MAX9995 toc25
-20
-30
1600
LO FREQUENCY (MHz)
MAX9995 toc27
1600
LO FREQUENCY (MHz)
MAX9995 toc30
1500
-50
LO LEAKAGE AT RF PORT (dBm)
1400
LO LEAKAGE AT RF PORT (dBm)
-30
VCC = 5.0V
-55
-60
RF-TO-IF ISOLATION (dB)
PLO = 0dBm
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
-25
MAX9995 toc24
MAX9995 toc23
LO LEAKAGE AT IF PORT (dBm)
MAX9995 toc22
LO LEAKAGE AT IF PORT (dBm)
-25
-25
LO LEAKAGE AT IF PORT (dBm)
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
-20
2200
1700
1800
1900
2000
RF FREQUENCY (MHz)
2100
2200
1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
7
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.)
NOISE FIGURE vs. RF FREQUENCY
TC = +25°C
11
10
9
8
10.0
9.9
9.8
PLO = +3dBm
VCC = 5.25V
10.3
10.2
VCC = 5.0V
10.1
10.0
9.9
9.8
TC = -20°C
9.7
9.7
7
VCC = 4.75V
9.6
6
9.6
1700
1800
1900
2000
2100
2200
9.5
1700
1800
1900
2000
2100
2200
1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF RETURN LOSS vs. RF FREQUENCY
IF RETURN LOSS vs. IF FREQUENCY
LO RETURN LOSS vs. LO FREQUENCY
(LO INPUT SELECTED)
10
15
20
0
15
20
25
30
5
35
25
MAX9995 toc36
10
IF RETURN LOSS (dB)
5
5
LO RETURN LOSS (dB)
PLO = -3dBm, 0dBm, +3dBm
MAX9995 toc35
0
MAX9995 toc34
0
RF RETURN LOSS (dB)
PLO = 0dBm
10.4
NOISE FIGURE (dB)
TC = +85°C
PLO = -3dBm
10.1
NOISE FIGURE (dB)
12
NOISE FIGURE vs. RF FREQUENCY
10.5
MAX9995 toc32
MAX9995 toc31
13
NOISE FIGURE (dB)
10.2
MAX9995 toc33
NOISE FIGURE vs. RF FREQUENCY
14
10
PLO = +3dBm
PLO = 0dBm
15
20
PLO = -3dBm
40
45
30
1800
1900
2000
2100
25
40
2200
80
120 160 200 240 280 320 360
1500
PLO = -3dBm, 0dBm, +3dBm
360
355
SUPPLY CURRENT (mA)
5
1700
1800
1900
2000
SUPPLY CURRENT vs. TEMPERATURE (TC)
365
MAX9995 toc37
0
1600
LO FREQUENCY (MHz)
LO RETURN LOSS vs. LO FREQUENCY
(LO INPUT UN SELECTED)
LO RETURN LOSS (dB)
1400
IF FREQUENCY (MHz)
RF FREQUENCY (MHz)
10
15
20
25
MAX9995 toc38
1700
350
VCC = 5.25V
345
340
VCC = 5.0V
335
330
325
VCC = 4.75V
320
30
315
35
310
1400
1500
1600
1700
1800
LO FREQUENCY (MHz)
8
1900
2000
-20
-5
10
25
40
55
TEMPERATURE (°C)
70
85
Maxim Integrated
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
Pin Description
PIN
NAME
1
RFMAIN
FUNCTION
Main Channel RF Input. Internally matched to 50Ω. Requires an input DC-blocking capacitor.
2
TAPMAIN
3, 5, 7, 12, 20, 22,
24, 25, 26, 34
GND
Ground
4, 6, 10, 16, 21, 30,
36
VCC
Power Supply. Connect bypass capacitors as close as possible to the pin (see the Typical
Application Circuit).
8
TAPDIV
9
RFDIV
11
IFD_SET
13, 14
IFD+, IFD-
Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC
(see the Typical Application Circuit).
15
IND_EXTD
Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation.
17
LO Diversity Amplifier Bias Control. Connect a 392Ω resistor from this pin to ground to set the
LO_ADJ_D
bias current for the diversity LO amplifier.
18, 28
Main Channel Balun Center Tap. Connect a 0.033µF capacitor from this pin to the board ground.
Diversity Channel Balun Center Tap. Connect a 0.033µF capacitor from this pin to the ground.
Diversity Channel RF Input. Internally matched to 50Ω. Requires an input DC-blocking capacitor.
IF Diversity Amplifier Bias Control. Connect a 1.2kΩ resistor from this pin to ground to set the
bias current for the diversity IF amplifier.
N.C.
No Connection. Not internally connected.
19
LO1
Local Oscillator 1 Input. This input is internally matched to 50Ω. Requires an input DC-blocking
capacitor.
23
LOSEL
Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2.
27
LO2
Local Oscillator 2 Input. This input is internally matched to 50Ω. Requires an input DC-blocking
capacitor.
29
LO_ADJ_M
LO Main Amplifier Bias Control. Connect a 392Ω resistor from this pin to ground to set the bias
current for the main LO amplifier.
31
IND_EXTM
Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation.
32, 33
IFM-, IFM+
Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC
(see the Typical Application Circuit).
35
IFM_SET
—
EP
Maxim Integrated
IF Main Amplifier Bias Control. Connect a 1.2kΩ resistor from this pin to ground to set the bias
current for the main IF amplifier.
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses
multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These
multiple via grounds are also required to achieve the noted RF performance.
9
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
Detailed Description
The MAX9995 dual, high-linearity, downconversion
mixer provides 6.1dB gain and +25.6dBm IIP3, with a
9.8dB noise figure. Integrated baluns and matching circuitry allow 50Ω single-ended interfaces to the RF and
LO ports. A single-pole, double-throw (SPDT) LO
switch provides 50ns switching time between LO
inputs, with 50dB LO-to-LO isolation. Furthermore, the
integrated LO buffer provides a high drive level to the
mixer core, reducing the LO drive required at the
MAX9995’s inputs to -3dBm. The IF port incorporates a
differential output, which is ideal for providing
enhanced 2RF - 2LO performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in WCDMA, TD-SCDMA, LTE,
TD-LTE, and GSM/EDGE base stations. The MAX9995
is specified to operate over an RF input range of
1700MHz to 2700MHz, an LO range of 1400MHz to
2600MHz, and an IF range of 40MHz to 350MHz.
Operation beyond this is possible; however, performance is not characterized. This device is available in
a compact 6mm x 6mm, 36-pin TQFN package with an
exposed pad.
RF Input and Balun
The MAX9995’s two RF inputs (RFMAIN and RFDIV) are
internally matched to 50Ω, requiring no external matching components. DC-blocking capacitors are required
as the inputs are internally DC shorted to ground
through the on-chip baluns. Input return loss is typically
14dB over the entire RF frequency range of 1700MHz
to 2700MHz.
LO Input, Switch, Buffer, and Balun
The mixers can be used for either high-side or low-side
injection applications with an LO frequency range of
1400MHz to 2600MHz. As an added feature, the
MAX9995 includes an internal LO SPDT switch that can
be used for frequency-hopping applications. The
switch selects one of the two single-ended LO ports,
allowing the external oscillator to settle on a particular
frequency before it is switched in. LO switching time is
typically less than 50ns, which is more than adequate
for virtually all GSM applications. If frequency hopping
is not employed, set the switch to either of the LO
inputs. The switch is controlled by a digital input
(LOSEL): logic-high selects LO1, and logic-low selects
LO2. LO1 and LO2 inputs are internally matched to
50Ω, requiring only a 22pF DC-blocking capacitor.
10
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF outputs are integrated on-chip.
High-Linearity Mixers
The core of the MAX9995 is a pair of double-balanced,
high-performance passive mixers. Exceptional linearity
is provided by the large LO swing from the on-chip LO
buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2RF - 2LO rejection, and NF
performance is typically +25.6dBm, 66dBc, and 9.8dB,
respectively.
Differential IF Output Amplifiers
The MAX9995 mixers have an IF frequency range of
40MHz to 350MHz. The differential, open-collector IF
output ports require external pullup inductors to VCC.
Note that these differential outputs are ideal for providing enhanced 2RF - 2LO rejection performance. Singleended IF applications require a 4:1 balun to transform
the 200Ω differential output impedance to a 50Ω singleended output. After the balun, VSWR is typically 1.5:1.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω.
No matching components are required. Return loss at
each RF port is typically 14dB over the entire input
range (1700MHz to 2700MHz), and return loss at the
LO ports is typically 18dB (1400MHz to 2000MHz). RF
and LO inputs require only DC-blocking capacitors for
interfacing.
The IF output impedance is 200Ω (differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ω singleended output (see the Typical Application Circuit).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning the resistors (R1, R2, R4, and
R5). If reduced current is required at the expense of performance, contact the factory. If the ±1% bias resistor
values are not readily available, substitute standard ±5%
values.
Maxim Integrated
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
INDEXTM and INDEXTD Inductors
Short INDEXTM and INDEXTD to ground using 0Ω
resistors. For applications requiring improved RF-to-IF
and LO-to-IF isolation, use 10nH inductors (L3 and L6)
in place of the 0Ω resistors. However, to ensure stable
operation, the mixer IF ports must be presented with
low common-mode load impedance. Contact the factory for details. Since approximately 100mA flows through
INDEXTM and INDEXTD, it is important to use low-DCR
wire-wound inductors.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
For the best performance, route the ground pin traces
directly to the exposed pad under the package. The
PCB exposed pad MUST be connected to the ground
plane of the PCB. It is suggested that multiple vias be
used to connect this pad to the lower-level ground
planes. This method provides a good RF/thermal-conduction path for the device. Solder the exposed pad on
the bottom of the device package to the PCB. The
MAX9995 evaluation kit can be used as a reference for
board layout. Gerber files are available upon request at
www.maximintegrated.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin with a
capacitor as close as possible to the pin ( Typical
Application Circuit).
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX9995’s 36-pin TQFNEP package provides a low thermal-resistance path to
the die. It is important that the PCB on which the
MAX9995 is mounted be designed to conduct heat
from the EP. In addition, provide the EP with a lowinductance path to electrical ground. The EP MUST be
soldered to a ground plane on the PCB, either directly
or through an array of plated via holes.
Maxim Integrated
Table 1. Component Values
COMPONENT
VALUE
DESCRIPTION
C1, C8
4pF
Microwave capacitors (0402)
C2, C7
10pF
Microwave capacitors (0402)
C3, C6
0.033µF
Microwave capacitors (0603)
C4, C5, C14, C16
22pF
Microwave capacitors (0402)
C9, C13, C15,
C17, C18
0.01µF
Microwave capacitors (0402)
C10, C11, C12,
C19, C20, C21
150pF
Microwave capacitors (0603)
L1, L2, L4, L5
330nH
Wire-wound high-Q inductors
(0805)
L3, L6
10nH
Wire-wound high-Q inductors
(0603)
R1, R4
1.21kΩ
R2, R5
392Ω
±1% resistors (0402)
R3, R6
10Ω
±1% resistors (1206)
T1, T2
4:1
(200:50)
±1% resistors (0402)
IF baluns
Chip Information
PROCESS: SiGe BiCMOS
Lead-Free/RoHS Considerations
http://www.maximintegrated.com/emmi/faq.cfm
Reliability Information:
http://www.maximintegrated.com/reliability/product/
MAX9995.pdf
Package Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
36 TQFN-EP
T3666+2
21-0141
90-0049
11
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
Typical Application Circuit
C19
T1
L1
VCC
IF MAIN OUTPUT
C21
R3
L2
4:1
R1
C20
VCC
C1
RFMAIN
TAPMAIN
C3
C2
GND
VCC
VCC
C4
GND
VCC
VCC
C5
GND
C6
C7 TAPDIV
RFDIV
RF DIV INPUT
C17
28 N.C.
LO_ADJ_M
R2
29
30
31
VCC
IND_EXTM
IFM32
IFM+
33
GND
34
IFM_SET
35
36
VCC
C18
RF MAIN INPUT
VCC
L3
C16
27
1
MAX9995
2
26
3
25
4
24
5
23
22
6
21
7
EXPOSED
PAD
8
20
19
9
LO2
LO2
GND
GND
GND
LOSEL
LO SELECT
GND
VCC
VCC
C15
GND
LO1
LO1
C14
18
N.C.
17
LO_ADJ_D
VCC
16
15
14
IFD-
13
IFD+
12
GND
11
R4
IND_EXTD
C9
IFD_SET
VCC
VCC
10
C8
R5
VCC
C13
L6
C11
T2
L5
VCC
C12
R6
IF DIV OUTPUT
L4
4:1
C10
12
Maxim Integrated
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
Revision History
REVISION
NUMBER
REVISION
DATE
0
8/04
Initial release
1
3/11
Updated the band coverage throughout the data sheet
2
12/12
Updated the Electrical Characteristic table and Ordering Information; updated
Package Thermal Characteristics
DESCRIPTION
PAGES
CHANGED
—
1–13
1, 2, 3
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent
licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and
max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 ________________________________ 13
© 2012 Maxim Integrated Products, Inc.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.