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Download MAX13170E +5V Multiprotocol, 3Tx/3Rx, Software- Selectable Clock/Data Transceiver General Description
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19-3800; Rev 0; 5/08 KIT ATION EVALU E L B AVAILA +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver Features ♦ The MAX13170E/MAX13172E/MAX13174E Chipset is a Pin-for-Pin Upgrade to the MXL1544/MAX3175/ MXL1543/MXL1543B Chipset Applications Ordering Information Data Networking PCI Cards CSU and DSU Telecommunications Equipment Data Routers ♦ Supports RS-232, RS-449, EIA-530, EIA-530A, V.35, V.36, and X.21 ♦ Software-Selectable Cable Termination Using the MAX13174E ♦ Complete DTE or DCE Port with the MAX13172E/MAX13174E ♦ Fail-Safe Receivers ♦ +5V Single-Supply Operation ♦ 0.5µA No-Cable Mode ♦ TUV-Certified NET1/NET2 and TBR1/TBR2Compliant (Pending) ♦ Extended ESD Protection for All the Transmitter Outputs and Receivers Inputs to GND ±13kV Using the Human Body Model ±8kV Using the Contact Method Specified in IEC 61000-4-2 ±5kV Using the Air-Gap Discharge Method Specified in IEC 61000-4-2 PART TEMP RANGE MAX13170ECAI+ 0°C to +70°C T4 CTS DSR R4 R3 R2 DCD R1 MAX13172E T3 28 SSOP +Denotes a lead-free package. Pin Configuration appears at end of data sheet. LL PIN-PACKAGE Typical Operating Circuit DTR RTS T2 T1 RXD RXC R3 R2 TXC R1 MAX13170E T3 SCTE TXD T2 T1 MAX13174E 18 13 5 10 8 22 6 23 20 19 4 1 7 16 3 9 17 12 15 11 24 14 2 TXD A (103) TXD B SCTE A (113) SCTE B TXC A (114) TXC B RXC A (115) RXC B RXD A (104) RXD B SG (102) SHIELD (101) RTS A (105) RTS B DTR A (108) DTR B DCD A (107) DCD B DSR A (109) DSR B CTS A (106) CTS B LL A (141) DB-25 CONNECTOR ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. www.BDTIC.com/maxim MAX13170E General Description The MAX13170E is a three-driver/three-receiver multiprotocol transceiver that operates from a +5V single supply. The MAX13170E, along with the MAX13172E and the MAX13174E, form a complete software-selectable data terminal equipment (DTE) or data communication equipment (DCE) interface port that supports the V.28 (RS-232), V.10/V.11 (RS-449/V.36, EIA-530, EIA-530A, X.21), and V.35 protocols. The MAX13170E transceivers carry the high-speed clock and data signals, while the MAX13172E carry the control signals. The MAX13170E can be terminated by the MAX13174E software-selectable resistor termination network or by discrete termination networks. The MAX13170E has an internal charge pump and a proprietary low-dropout transmitter output stage that allows V.11-, V.28-, and V.35-compliant operation from a +5V single supply. The MAX13170E features a nocable mode that reduces supply current to 0.5µA, and disables all (high-impedance) transmitter and receiver outputs. Short-circuit current limiting and thermal shutdown circuitry protect the receiver and transmitter outputs against excessive power dissipation. The MAX13170E has extended ESD protection for all the transmitter outputs and receivers inputs. The MAX13170E is available in a 5.3mm x 10.2mm, 28-pin SSOP package and operates over the 0°C to +70°C commercial temperature range. MAX13170E +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver ABSOLUTE MAXIMUM RATINGS Receiver Inputs R_IN_T3OUT_/R1IN_ ..........................................-15V to +15V R_INA to R_INB, T3OUT/R1INA to T3OUT/R1INB................................................-15V to +15V Continuous Power Dissipation (TA = +70°C) 28-Pin SSOP (derate 9.5mW/°C above +70°C) ...........762mW Junction-to-Case Thermal Resistance (θJC) (Note 1) 28-Pin SSOP ................................................................25°C/W Junction-to-Ambient Thermal Resistance (θJA) (Note 1) 28-Pin SSOP ................................................................67°C/W Operating Temperature Range ................................0°C to 70°C Junction Temperature .......................................................150°C Storage Temperature Range ............................-65°C to +150°C Lead Temperature (soldering, 10s) ................................+300°C (All voltages referenced to GND, unless otherwise noted.) Supply Voltages VCC .......................................................................-0.3V to +6V Charge-Pump Output Voltages VDD ....................................................................-0.3V to +7.1V VEE.....................................................................+0.3V to -7.1V VDD to VCC .............................................................-0.6 to +6V Logic Input Voltages M0, M1, M2, DCE/DTE, T_IN ................................-0.3V to +6V Logic Output Voltages R_OUT ....................................................-0.3V to (VCC + 0.3V) Transmitter Outputs T_OUT_, T3OUT_/R1IN_ (No Cable Mode or V.28) ..........................................................-15V to +15V Short-Circuit Duration to GND...............................Continuous Note 1: Package thermal resistances were obtained using the method described in JESD51-7, using a 4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = 4.5V to 5.5V, C3 = C4 = C5 = 4.7µF, C1 = C2 = 1µF, TA = TMIN to TMAX. Typical values are at VCC = 5V, and TA = +25°C.) (Note 2) PARAMETER VCC Operating Range VCC Supply Current (DCE Mode) (Digital Inputs = GND or VCC) (Transmitter Outputs Static) Internal Power Dissipation (DCE Mode) SYMBOL CONDITIONS VCC ICC PD MIN Negative Charge-Pump Output Voltage VEE Thermal Shutdown Protection 2 THSD V 15 28 133 180 V.35 mode, no load 21 38 V.35 mode, full load 153 195 V.28 mode, no load 16 30 V.28 mode, full load 29 40 No cable mode 0.5 10 V.11 mode, full load 200 V.35 mode, full load 750 mA µA mW 100 6.5 6.9 V.28, V.35 modes, with load, IDD = 10mA 5.6 6.9 V.11 mode 5.15 5.3 7.1 5.7 V.11 mode, VDD variation, IDD = 0mA to 25mA 0.01 V.28, V.35 modes, no load -6.9 V.28, V.35 modes, with load, IEE = 10mA (Note 3) -6.7 -5.4 -4.5 -4.16 V.11 mode (Note 3) Charge-Pump Enable Time UNITS 5.5 V.11 mode, full load V.28, V.35 modes, no load VDD MAX V.11 mode, no load V.28 mode, full load Positive Charge-Pump Output Voltage (Note 3) TYP 4.5 -4.84 V V V.11 mode, VEE variation, IEE = 0mA to 25mA 0.01 Time it takes for both VDD and VEE to reach specified range <1 ms 145 °C _______________________________________________________________________________________ www.BDTIC.com/maxim +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver (VCC = 4.5V to 5.5V, C3 = C4 = C5 = 4.7µF, C1 = C2 = 1µF, TA = TMIN to TMAX. Typical values are at VCC = 5V, and TA = +25°C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS LOGIC INPUTS (M0, M1, M2, DCE/DTE, T1IN, T2IN, T3IN) Input High Voltage VIH Input Low Voltage VIL Logic-Input Current IIN Pullup Resistor RPUIN 0.66 x VCC V 0.33 x VCC T1IN, T2IN, T3IN -1 M0, M1, M2, DCE/DTE to VCC 50 100 V +1 µA 170 kΩ LOGIC OUTPUTS (R1OUT, R2OUT, R3OUT) Output High Voltage Output Low Voltage Output Pullup Resistor Transmitter Output Leakage Current VOH ISOURCE = 4mA VOL ISINK = 4mA RPUY 0.66 x VCC V 0.33 x VCC No-cable mode (to VCC) 71.4 V kΩ IZ -0.25V < VOUT < +0.25V, VCC = 0 or no-cable mode Open-Circuit Differential Output Voltage VODO Open circuit, R = 1.95kΩ, Figure 1 Loaded Differential Output Voltage (Note 4) VODL Change in Magnitude of Output Differential Voltage ΔVOD R = 50Ω, Figure 1 0.2 V Common-Mode Output Voltage VOC R = 50Ω, Figure 1 3.0 V Change in Magnitude of Common-Mode Output Voltage ΔVOC R = 50Ω, Figure 1 0.2 V +5 0.2 µA +VCC V V.11 TRANSMITTER R = 50Ω, Figure 1 R = 50Ω, Figure 1 -VCC 0.5 x VODO V |2| Short-Circuit Current ISC VOUT = GND 150 mA Rise Time tR Figures 2, 6 4.5 10 ns Fall Time tF Figures 2, 6 6.5 10 ns Transmitter Input-to-Output Prop Delay tPHL, tPLH Figures 2, 6 16 22 ns Data Skew |tPHL-tPLH| Figures 2, 6 (Note 3) 3 ns 2.5 ns Output-to-Output Skew tSKEWT Figures 2, 6 (Notes 3, 5) V.11 RECEIVER Differential Threshold Voltage VTH -7V ≤ VCM ≤ +7V Input Hysteresis ΔVTH -7V ≤ VCM ≤ +7V -200 Receiver Input Current IIN -10V ≤ VA,B ≤ +10V -0.66 Receiver Input Resistance RIN -10V ≤ VA,B ≤ +10V 15 Rise or Fall Time t R , tF Figures 2, 7 -50 13 mV mV +0.66 mA 30 kΩ 3 ns Receiver Input-to-Output Delay tPHL, tPLH Figures 2, 7 23 ns Data Skew |tPHL-tPLH| Figures 2, 7 ( Note 3) 3 ns 2.5 ns Output-to-Output Skew tSKEWR (Notes 3, 5) _______________________________________________________________________________________ www.BDTIC.com/maxim 3 MAX13170E ELECTRICAL CHARACTERISTICS (continued) MAX13170E +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver ELECTRICAL CHARACTERISTICS (continued) (VCC = 4.5V to 5.5V, C3 = C4 = C5 = 4.7µF, C1 = C2 = 1µF, TA = TMIN to TMAX. Typical values are at VCC = 5V, and TA = +25°C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ±0.44 ±0.55 ±0.66 V V.35 TRANSMITTER Differential Output Voltage VOD With load, -4V < VCM < +4V, Figure 3 Output High Current IOH VA,B = 0 -13 -11 -9 mA Output Low Current IOL VA,B = 0 9 11 13 mA Rise or Fall Time Transmitter Input-to-Output Delay Data Skew t R , tF Figures 3, 6 5 tPLH, tPHL Figures 3, 6 19 ns |tPLH - tPHL| Figures 3, 6, (Note 3) Output-to-Output Skew tSKEWT Figures 3, 6, (Notes 3, 5) 35 ns 3 ns 3 ns -50 mV V.35 RECEIVER Differential Threshold Voltage VTH -2V ≤ VCM ≤ +2V Input Hysteresis ΔVTH -2V ≤ VCM ≤ +2V -200 15 Receiver Input Current IIN -10V ≤ VA,B ≤ +10V -0.66 Receiver Input Resistance RIN -10V ≤ VA,B ≤ +10V 15 Rise or Fall Time t R , tF Figures 3, 7 mV +0.66 30 mA kΩ 3 ns Receiver Input-to-Output Delay tPHL, tPLH Figures 3, 7 (Note 3) 23 ns Data Skew |tPHL-tPLH| Figures 3, 7 (Note 3) 3 ns (Notes 3, 5) 2.5 ns Open circuit (output high) VDD Output-to-Output Skew tSKEWR V.28 TRANSMITTER Output Voltage Swing VOD Open circuit (output low) RL = 3kΩ Short-Circuit Current Output Slew Rate Output high VEE 5 Output low V 6.8 -6.8 -5 |ISC| SRR/F RL = 3kΩ, CL = 2500pF, Figures 4, 8 Transmitter Input-to-Output Delay from Low to High tPHL RL = 3kΩ, CL = 2500pF, Figures 4, 8 Transmitter Input-to-Output Delay from High to Low tPLH RL = 3kΩ, CL = 2500pF, Figures 4, 8 85 mA 30 V/µs 1 2 µs 1 2 µs 2 V 4 V.28 RECEIVER Input Threshold Low VIL Input Threshold High VIH Input Hysteresis 0.8 VHYST 0.25 -15V ≤ VIN ≤ +15V Input Resistance RIN Rise or Fall Time t R , tF Figures 5, 9 tPHL, tPLH Figures 5, 9 Receiver Input-to-Output Delay 4 V 3 V 5 7 kΩ 150 ns 3 ns _______________________________________________________________________________________ www.BDTIC.com/maxim +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver (VCC = 4.5V to 5.5V, C3 = C4 = C5 = 4.7µF, C1 = C2 = 1µF, TA = TMIN to TMAX. Typical values are at VCC = 5V, and TA = +25°C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ESD PROTECTION (T_OUT_, T_OUT_/R_OUT_, R_IN_ to GND) Contact Discharge IEC61000-4-2 ESD Protection Note 2: Note 3: Note 4: Note 5: +8 Air-Gap Discharge IEC61000-4-2 ±5 Human Body Model ±13 kV All devices are 100% production tested at TA = +70°C and are guaranteed by design for TA = 0°C to +70°C as specified. Guaranteed by design, not production tested. VODL is guaranteed at both 0.5 x VODO and |2V|. Ouput-to-output skews are evaluated as a difference of propagation delays between different channels in the same condtion and for the same polarity (LH or HL). Typical Operating Characteristics (VCC = +5.0V, C1 = C2 =1µF, C3 = C4 = C5 = 4.7µF, (Figure 10), TA = TMIN to TMAX, TA = +25°C, unless otherwise noted.) 150 100 40 20 50 0 1 10 100 1,000 10,000 100,000 250 200 150 100 50 0 0 0.1 0 50 100 150 200 0.1 250 1 10 100 1,000 10,000 100,000 DATA RATE (kbps) DATA RATE (kbps) DATA RATE (kbps) V.11 DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs. TEMPERATURE V.28 OUTPUT VOLTAGE vs. TEMPERATURE V.35 OUTPUT VOLTAGE vs. TEMPERATURE DCE MODE, R = 50Ω 0 -1 -2 -3 2 0 -2 -4 VOUT- 20 30 40 200 DCE MODE, VCM = 0, FULL LOAD 0 -200 -400 VOL -600 -10 10 VOH 400 -8 -5 0 600 50 TEMPERATURE (°C) 60 70 MAX13170E toc06 VOUT+ 4 -6 VOUT- -4 6 OUTPUT VOLTAGE (V) 2 DCE MODE, RL = 3kΩ 8 OUTPUT VOLTAGE (mV) VOUT+ 3 1 10 MAX13170E toc05 4 MAX13170E toc04 5 DRIVER DIFFERENTIAL OUTPUT VOLTAGE (V) 60 DCE MODE, FULLY LOADED, ALL TRANSMITTERS OPERATING AT THE SPECIFIED DATA RATE 300 SUPPLY CURRENT (mA) 200 DCE MODE, ALL TRANSMITTERS OPERATING AT THE SPECIFIED DATA RATE, RL = 3kΩ, CL = 2500pF 80 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) 250 350 MAX13170E toc02 DCE MODE, R = 50Ω, ALL TRANSMITTERS OPERATING AT THE SPECIFIED DATA RATE 300 100 MAX13170E toc01 350 V.35 SUPPLY CURRENT vs. DATA RATE V.28 SUPPLY CURRENT vs. DATA RATE MAX13170E toc03 V.11 SUPPLY CURRENT vs. DATA RATE 0 10 20 30 40 50 TEMPERATURE (°C) 60 70 0 10 20 30 40 50 60 70 TEMPERATURE (°C) _______________________________________________________________________________________ www.BDTIC.com/maxim 5 MAX13170E ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (continued) (VCC = +5.0V, C1= C2 = C4 =1µF, C3 = C5 = 4.7µF (Figure 10), TA = +25°C, unless otherwise noted.) |VOD| 545 540 535 R1IN_ 200 100 R2IN_, R3IN_ 0 -100 -200 -4 -3 -2 -1 0 1 2 3 4 DTE MODE 2.0 1.5 1.0 0.5 0 -0.5 -1.0 -300 -1.5 -400 -2.0 -500 530 2.5 INPUT CURRENT (mA) 550 DTE MODE 300 INPUT CURRENT (μA) 555 400 V.28 RECEIVER INPUT CURRENT vs. INPUT VOLTAGE MAX13170E toc08 500 MAX13170E toc07 560 V.11/V.35 RECEIVER INPUT CURRENT vs. INPUT VOLTAGE MAX13170E toc09 V.35 LOADED DIFFERENTIAL OUTPUT VOLTAGE vs. COMMON-MODE VOLTAGE DIFFERENTIAL OUTPUT VOLTAGE (mV) -2.5 -10 -8 -6 -4 -2 0 2 4 6 8 10 -10 -8 -6 -4 INPUT VOLTAGE (V) COMMON-MODE VOLTAGE (V) -2 0 V.28 LOOPBACK OPERATION MAX13170E toc10 MAX13170E toc11 R = 50Ω RL = 3kΩ, CL = 2500pF TIN 5V/div TIN 5V/div TOUT/RIN 5V/div TOUT/RIN 5V/div ROUT 5V/div ROUT 5V/div 1μs/div V.35 LOOPBACK OPERATION V.28 SLEW RATE vs. LOAD CAPACITANCE MAX13170E toc12 35 TIN MAX13170E toc13 10ns/div FULL LOAD RL = 3kΩ 30 5V/div 25 TOUT/RIN 5V/div SRF 20 15 SRR 10 ROUT 5V/div 5 0 10ns/div 0 500 1K 1.5K 2K 2.5K 3K 3.5K 4K 4.5K 5K LOAD CAPACITANCE (pF) 6 2 4 INPUT VOLTAGE (V) V.11 LOOPBACK OPERATION SLEW RATE (V/μs) MAX13170E +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver _______________________________________________________________________________________ www.BDTIC.com/maxim 6 8 10 +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver tPHL 12 tPLH 8 tPHL 6 4 4 tPLH 30 25 10 20 30 40 50 60 70 tPLH 15 10 5 0 0 0 tPHL 20 2 0 MAX13170E toc16 MAX13170E toc15 8 PROPAGATION DELAY (ns) 16 PROPAGATION DELAY (ns) 10 MAX13170E toc14 20 V.35 TRANSMITTER PROPAGATION DELAY vs. TEMPERATURE V.11/V.35 RECEIVER PROPAGATION DELAY vs. TEMPERATURE PROPAGATION DELAY (ns) V.11 TRANSMITTER PROPAGATION DELAY vs. TEMPERATURE 0 10 TEMPERATURE (°C) 20 30 40 50 60 0 70 10 20 30 40 50 60 70 TEMPERATURE (°C) TEMPERATURE (°C) Test Circuits 100pF T R B B R 100Ω A A VOD 15pF VOC R 100pF Figure 1. V.11 DC Test Circuit Figure 2. V.11 AC Test Circuit 50Ω T B 125Ω 50Ω VCM 125Ω B VOD R A 50Ω 50Ω A 15pF Figure 3. V.35 Transmitter/Receiver Test Circuit _______________________________________________________________________________________ www.BDTIC.com/maxim 7 MAX13170E Typical Operating Characteristics (continued) (VCC = +5.0V, C1= C2 = C4 =1µF, C3 = C5 = 4.7µF (Figure 10), TA = +25°C, unless otherwise noted.) MAX13170E +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver Test Circuits (continued) T A T A VO CL R 15pF RL Figure 4. V.28 Transmitter Test Circuit Figure 5. V.28 Receiver Test Circuit Timing Diagrams VCC TIN_ f = 1MHz: tR, tF ≤ 1ns VCC/2 0 VCC/2 tPHL tPLH V0 A-B 90% 10% 50% -V0 90% 50% 10% tF tR Figure 6. V.11, V.35 Transmitter Propagation Delays +1V f = 1MHz: tR, tF ≤ 1ns 0 A -B INPUT 0 -1V tPLH tPHL V0H 90% VCC/2 R 90% OUTPUT 10% V0L VCC/2 10% tF tR Figure 7. V.11, V.35 Receiver Propagation Delays VCC TIN_ 0 tR, tF ≤ 10ns VCC/2 VCC/2 tPHL tPLH V0 3V 3V 0 0 A -3V -3V -V0 SRF = 6/tF tF tR SRF = 6/tF Figure 8. V.28 Transmitter Propagation Delays VIH A VIL tR, tF ≤ 10ns 1.3V tPLH tPHL V0H R V0L 1.7V 90% VCC/2 10% tF 90% 10% VCC/2 tR Figure 9. V.28 Receiver Propagation Delays 8 _______________________________________________________________________________________ www.BDTIC.com/maxim +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver PIN NAME FUNCTION 1 C1- VDD Charge-Pump Flying-Capacitor Negative Terminal. Connect a 1µF ceramic capacitor between C1+ and C1- as close as possible to the device. 2 C1+ VDD Charge-Pump Flying-Capacitor Positive Terminal. Connect a 1µF ceramic capacitor between C1+ and C1- as close as possible to the device. 3 VDD Charge-Pump Positive-Supply Output. Connect a 4.7µF ceramic capacitor from VDD to ground as close as possible to the device. 4 VCC Device Supply Voltage. Bypass VCC with a 4.7µF capacitor to ground as close as possible to the device. 5 T1IN Transmitter 1 Logic Input 6 T2IN Transmitter 2 Logic Input 7 T3IN Transmitter 3 Logic Input 8 R1OUT 9 R2OUT Receiver 2 Logic Output. Internally pull up to VCC. 10 R3OUT Receiver 3 Logic Output. Internally pull up to VCC. 11 M0 12 M1 Mode Select 1 Input. Internally pull up to VCC. 13 M2 Mode Select 2 Input. Internally pull up to VCC. 14 DCE/DTE 15 R3INB Receiver 3 Noninverting Input 16 R3INA Receiver 3 Inverting Input 17 R2INB Receiver 2 Noninverting Input 18 R2INA Receiver 2 Inverting Input 19 T3OUTB/ R1INB Transmitter 3 Noninverting Output/Receiver 1 Noninverting Input 20 T3OUTA/ R1INA Transmitter 3 Inverting Output/Receiver 1 Inverting Input 21 T2OUTB Transmitter 2 Noninverting Output 22 T2OUTA Transmitter 2 Inverting Output 23 T1OUTB Transmitter 1 Noninverting Output 24 T1OUTA Transmitter 1 Inverting Output 25 GND Ground 26 VEE Charge-Pump Negative Supply Output. Connect a 4.7µF ceramic capacitor from VEE to ground as close as possible to the device. 27 C2- VEE Charge-Pump Flying-Capacitor Negative Terminal. Connect a 1µF ceramic capacitor between C2+ and C2- as close as possible to the device. 28 C2+ VEE Charge-Pump Flying-Capacitor Positive Terminal. Connect a 1µF ceramic capacitor between C2+ and C2- as close as possible to the device. Receiver 1 Logic Output. Internally pull up to VCC. Mode Select 0 Input. Internally pull up to VCC. DCE/DTE Mode-Select Input. Internally pull up to VCC. _______________________________________________________________________________________ www.BDTIC.com/maxim 9 MAX13170E Pin Description MAX13170E +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver Detailed Description The MAX13170E is a three-driver/three-receiver, multiprotocol transceiver that operates from a single +5V supply. The MAX13170E, along with the MAX13172E and MAX13174E, form a complete software-selectable DTE or DCE interface port that supports the V.28 (RS232), V.10/V.11 (RS-449/V.36, EIA-530, EIA-530A, X.21), and V.35 protocols. The MAX13170E transceivers carry the high-speed clock and data signals, while the MAX13172E transceivers carry serial-interface control signaling. The MAX13170E can be terminated by the MAX13174E software-selectable resistor termination network or by a discrete termination network. The MAX13170E features a 0.5µA no-cable mode, failsafe operation, and thermal shutdown circuitry. Thermal shutdown protects the drivers against excessive power dissipation. When activated, the thermal shutdown circuitry places the receiver and transmitter outputs into a high-impedance state. Mode Selection The state of the mode-select inputs M0, M1, and M2 determines which serial interface protocol is selected (Table 1). The state of the DCE/DTE input determines whether the transceiver is configured as a DTE or DCE serial port. When the DCE/DTE input is logic-high, driver T3 is activated and receiver R1 is disabled. When the DCE/DTE input is logic-low, driver T3 is disabled and receiver R1 is activated (Table 1). M0, M1, M2, and DCE/DTE are internally pulled up to VCC to ensure a logic-high if left unconnected. No-Cable Mode The MAX13170E enters no-cable mode when the mode-select inputs are left unconnected or connected high (M0 = M1 = M2 = 1). In this mode, the multiprotocol drivers and receivers are disabled and the supply current drops to 0.5µA. The receivers’ outputs enter a high-impedance state in no-cable mode, allowing these output lines to be shared with other receivers’ outputs, (the receivers’ outputs have internal pullup resistors to pull the outputs high if not driven). Also, in no-cable mode, the transmitter outputs enter a high-impedance state so that these output lines can be shared with other devices. Dual Charge-Pump Voltage Converter The MAX13170E internal power supply consists of a regulated dual charge pump that provides positive and negative output voltages from a +5V supply. The charge pump operates in discontinuous mode. If the output voltage is less than the regulated voltage, the charge pump is enabled. If the output voltage exceeds the regulated voltage, the charge pump is disabled. Each charge pump requires a flying capacitor (C1, C2) and a reservoir capacitor (C3, C5) to generate the VDD and VEE supplies. Figure 10 shows charge-pump connections. Table 1. Mode Selection MAX13170E MODE NAME M2 M1 M0 DCE/ DTE T1 T2 T3 R1 R2 R3 Not Used (Default V.11) 0 0 0 0 V.11 V.11 Z V.11 V.11 V.11 RS-530A 0 0 1 0 V.11 V.11 Z V.11 V.11 V.11 RS-530 0 1 0 0 V.11 V.11 Z V.11 V.11 V.11 X.21 0 1 1 0 V.11 V.11 Z V.11 V.11 V.11 V.35 1 0 0 0 V.35 V.35 Z V.35 V.35 V.35 RS-449/V.36 1 0 1 0 V.11 V.11 Z V.11 V.11 V.11 V.28/RS-232 1 1 0 0 V.28 V.28 Z V.28 V.28 V.28 No Cable 1 1 1 0 Z Z Z Z Z Z Not Used (Default V.11) 0 0 0 1 V.11 V.11 V.11 Z V.11 V.11 RS-530A 0 0 1 1 V.11 V.11 V.11 Z V.11 V.11 RS-530 0 1 0 1 V.11 V.11 V.11 Z V.11 V.11 X.21 0 1 1 1 V.11 V.11 V.11 Z V.11 V.11 V.35 1 0 0 1 V.35 V.35 V.35 Z V.35 V.35 RS-449/V.36 1 0 1 1 V.11 V.11 V.11 Z V.11 V.11 V.28/RS-232 1 1 0 1 V.28 V.28 V.28 Z V.28 V.28 No Cable 1 1 1 1 Z Z Z Z Z Z 10 ______________________________________________________________________________________ www.BDTIC.com/maxim +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver MAX13170E C3 4.7μF C1 1μF 5V C4 4.7μF VDD C2+ C1+ C2- C1- VEE VCC GND C2 1μF C5 4.7μF Figure 10. Charge Pump CHARGE-CURRENT LIMIT RESISTOR HIGHVOLTAGE DC SOURCE Cs 100pF MAX13170E RC 1MΩ RD 1500Ω DISCHARGE RESISTANCE DEVICE UNDER TEST STORAGE CAPACITOR Figure 11a. Human Body ESD Test Model Fail-Safe Receivers The MAX13170E guarantees a logic-high receiver output when the receiver inputs are shorted, or when they are connected to a terminated transmission line with all the drivers disabled. This is done by setting the receivers’ threshold between -50mV and -200mV in the V.11 and V.35 modes. If the differential receiver input voltage (B - A) is ≥ -50mV, R_OUT is logic-high. If (B - A) is ≤ -200mV, R_OUT is logic-low. In the case of a terminated bus with all transmitters disabled, the receiver’s differential input voltage is pulled to zero by the termination. With the receiver thresholds of the MAX13170E, this results in a logic-high with a 50mV minimum noise margin. ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results. Human Body Model Figure 11a shows the Human Body Model, and Figure 11b shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5kΩ resistor. ESD Protection As with all Maxim devices, a minimum of ±2kV-to-GND ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. The driver outputs and receiver inputs of the MAX13170E have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±13kV without damage (HBM). The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, the MAX13170E keeps working without latchup or damage. ESD protection can be tested in various ways. The transmitter outputs and receiver inputs of the MAX13170E are characterized for protection to the following limits: • • • IP 100% 90% IR PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) AMPS 36.8% 10% 0 0 tRL TIME tDL CURRENT WAVEFORM Figure 11b. Human Body Current Waveform ±13kV using the Human Body Model ±8kV using the Contact Method specified in IEC 61000-4-2 ±5kV using the Air-Gap Discharge Method specified in IEC 61000-4-2 ______________________________________________________________________________________ www.BDTIC.com/maxim 11 IEC 61000-4-2 The IEC 61000-4-2 standard covers ESD testing and performance of finished equipment. However, it does not specifically refer to integrated circuits. The MAX13170E help equipment designs to meet IEC 61000-4-2, without the need for additional ESD-protection components. RC 50MΩ TO 100MΩ CHARGE-CURRENT LIMIT RESISTOR HIGHVOLTAGE DC SOURCE Cs 150pF The major difference between tests done using the Human Body Model and IEC 61000-4-2 is higher peak current in IEC 61000-4-2 because series resistance is lower in the IEC 61000-4-2 model. Hence, the ESD withstand voltage measured to IEC 61000-4-2 is generally lower than that measured using the Human Body Model. Figure 11c shows the IEC 61000-4-2 model, and Figure 11d shows the current waveform for the IEC 61000-4-2 ESD Contact Discharge test. I 100% 90% RD 330Ω DISCHARGE RESISTANCE STORAGE CAPACITOR IPEAK MAX13170E +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver DEVICE UNDER TEST 10% tR = 0.7ns TO 1ns t 30ns 60ns Figure 11c. IEC 61000-4-2 ESD Test Model 12 Figure 11d. IEC 61000-4-2 ESD Generator Current Waveform ______________________________________________________________________________________ www.BDTIC.com/maxim +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver MAX13170E C6 C7 C8 100pF 100pF 100pF 3 8 VCC 5V 11 12 13 MAX13174E 14 27 26 CHARGE PUMP 2 4 25 C4 4.7μF DTE_TXD/DCE_RXD 5 DTE_SCTE/DCE_RXC 6 T2 7 5 4 6 7 9 10 16 15 18 17 19 20 22 23 24 1 VCC DTE 2 TXD A 14 TXD B 24 SCTE A 11 SCTE B 15 12 17 9 18 17 16 15 R2 10 DTE_RXD/DCE_TXD C12 1μF 20 19 R1 9 DTE_RXC/DCE_SCTE VEE DCE RXD A RXD B RXC A RXC B T3 8 DTE_TXC/DCE_TXC 2 C5 4.7μF 24 23 22 21 T1 21 M0 1 C1 1μF LATCH C2 1μF DCE/DTE M2 M1 C3 4.7μF C13 1μF 28 3 VCC R3 3 16 7 MAX13170E M0 M1 13 M2 14 DCE/DTE TXC A TXC B TXC A TXC B RXC A SCTE A RXC B SCTE B RXD A TXD A RXD B TXD B SG 11 12 NC 1 SHIELD DB-25 CONNECTOR C9 1μF VCC 1 C10 1μF 2 3 DTE_RTS/DCE_CTS 4 DTE_DTR/DCE_DSR 5 6 DTE_DCD/DCE_DCD 7 DTE_DSR/DCE_DTR 8 DTE_CTS/DCE_RTS 10 9 28 VCC VEE VDD GND T1 T2 27 26 25 24 23 C11 1μF 25 DCE/DTE 21 M1 18 M0 4 RTS A CTS A 19 RTS B CTS B 20 DTR A DSR A 23 DTR B DSR B T3 R1 R2 R3 R4 22 21 20 19 18 17 8 DCD A 10 DCD B 6 DSR A 22 DSR B 5 CTS A 13 CTS B DCD A DCD B DTR A DTR B RTS A RTS B 16 T4 MAX13172E M0 12 M1 13 M2 14 15 DCE/DTE INVERT 11 NC Figure 12. Cable-Selectable Multiprotocol DTE/DCE Port ______________________________________________________________________________________ www.BDTIC.com/maxim 13 MAX13170E +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver BALANCED INTERCONNECTING CABLE GENERATOR IZ 3.25mA LOAD CABLE TERMINATION RECEIVER -10V -3V VZ +10V A′ A +3V 100Ω MIN B B′ C C′ GND GND Figure 13. Typical V.11 Interface Applications Information -3.25mA Figure 14. Receiver Input Impedance pulled high by the internal pullups on the MAX13170E. The serial interface protocol of the MAX13170E, MAX13172E, and MAX13174E is selected based on the cable that is connected to the DB-25 interface. Capacitor Selection V.11 Interface The capacitors used for the charge pumps, as well as for supply bypassing, should have a low equivalent series resistance (ESR) and low temperature coefficient. Multilayer ceramic capacitors with an X7R dielectric offer the best combination of performance, size, and cost. The flying capacitors (C1, C2) should have a value of 1µF, while the reservoir capacitors (C3, C5) and the bypass capacitor (C4) should have a minimum value of 4.7µF (Figure 10). To reduce the ripple present on the transmitter outputs, capacitors C3, C4, and C5 can be increased. The values of C1 and C2 should not be increased. As shown in Figure 13, the V.11 protocol is a fully balanced differential interface. The V.11 driver generates a minimum of ±2V between nodes A and B when a 100Ω (min) resistance is presented at the load. The V.11 receiver is sensitive to ±200mV differential signals at receiver inputs A’ and B’. The V.11 receiver rejects common-mode signals developed across the cable (referenced from C to C’) of up to ±7V, allowing for error-free reception in noisy environments. The receiver inputs must comply with the impedance curve shown in Figure 14. For high-speed data transmission, the V.11 specification recommends terminating the cable at the receiver with a 100Ω resistor. This resistor, although not required, prevents reflections from corrupting transmitted data. In Figure 15, the MAX13174E is used to terminate the V.11 receiver. Internal to the MAX13174E, S1 is closed and S2 is open to present a 100Ω minimum differential resistance. The MAX13170E’s internal V.28 termination is disabled by opening S3. Bypassing For best performance of the charge pumps, connect C3, C4, and C5 closer the device than C1 and C2. Cable Termination The MAX13174E software-selectable resistor network is designed to be used with the MAX13170E. The MAX13174E multiprotocol termination network provides V.11- and V.35-compliant termination, while V.28 receiver termination is internal to the MAX13170E. These cable termination networks provide compatibility with V.11, V.28, and V.35 protocols. Using the MAX13174E termination networks provide the advantage of not having to build expensive termination networks out of resistors and relays, manually changing termination modules, or building custom termination networks. Cable-Selectable Mode A cable-selectable multiprotocol interface is shown in Figure 12. The mode control lines M0, M1, and DCE/DTE are wired to the DB-25 connector. To select the serial interface mode, the appropriate combination of M0, M1, and DCE/DTE are grounded within the cable wiring. The control lines that are not grounded are 14 V.35 Interface Figure 16 shows a fully-balanced, differential standard V.35 interface. The generator and the load must both present a 100Ω ±10Ω differential impedance and a 150Ω ±15Ω common-mode impedance as shown by the resistive T networks in Figure 15. The V.35 driver generates a current output (±11mA, typ) that develops an output voltage of ±550mV across the generator and load termination networks. The V.35 receiver is sensitive to ±200mV differential signals at receiver inputs A’ and B’. The V.35 receiver rejects common-mode signals developed across the cable (referenced from C to C’) of up to ±4V, allowing for error-free reception in noisy environments. ______________________________________________________________________________________ www.BDTIC.com/maxim +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver MAX13170E A′ A MAX13170E R5 55kΩ R1 52Ω R8 5kΩ MAX13174E RECEIVER S3 S1 S2 R6 11kΩ R3 124Ω + 1.4V R7 11kΩ R2 52Ω B′ R4 55kΩ B S1 S2 C′ GND Figure 15. V.11 Termination and Internal Resistance Networks BALANCED INTERCONNECTING CABLE GENERATOR LOAD A′ A 50Ω CABLE TERMINATION 125Ω 125Ω 50Ω RECEIVER 50Ω 50Ω B B′ C C′ GND GND Figure 16. Typical V.35 Interface A′ A MAX13170E R5 55kΩ R1 52Ω R8 5kΩ MAX13174E RECEIVER S3 S1 S2 R6 11kΩ R3 124Ω + 1.4V R7 11kΩ R2 52Ω B′ R4 55kΩ B S1 S2 C′ GND Figure 17. V.35 Termination and Internal Resistance Networks ______________________________________________________________________________________ www.BDTIC.com/maxim 15 MAX13170E +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver UNBALANCED INTERCONNECTING CABLE GENERATOR LOAD CABLE TERMINATION A A′ C C′ GND RECEIVER GND Figure 18. Typical V.28 Interface A′ A MAX13170E R5 55kΩ R1 52Ω R8 5kΩ MAX13174E S1 S2 R6 11kΩ RECEIVER S3 R3 124Ω + 1.4V R7 11kΩ R2 52Ω B′ R4 55kΩ B S1 S2 C′ GND Figure 19. V.28 Termination and Internal Resistance Networks In Figure 17, the MAX13174E is used to implement the resistive T network that is needed to properly terminate the V.35 driver and receiver. Internal to the MAX13174E, S1 and S2 are closed to connect the T-network resistors to the circuit. The V.28 termination resistor (internal to the MAX13170E) is disabled by opening S3 to avoid interference with the T-network impedance. V.28 Interface The V.28 interface is an unbalanced single-ended interface (Figure 18). The V.28 driver generates a minimum of ±5V across a 3kΩ load impedance between A’ and C’. The V.28 receiver has a single-ended input. To aid in rejecting system noise, the MAX13170E’s V.28 receiver has a typical hysteresis of 0.05V. 16 Figure 19 shows the MAX13174E’s termination network disabled by opening S1 and S2. The MAX13170E’s internal 5kΩ V.28 termination is enabled by closing S3. DTE vs. DCE Operation Figure 20 shows a DCE or DTE controller-selectable interface. DCE/DTE (pin 14) switches the port’s mode of operation. See Table 1. This application requires only one DB-25 connector, but separate cables for DCE or DTE signal routing. See Figure 20 for complete signal routing in DCE and DTE modes. ______________________________________________________________________________________ www.BDTIC.com/maxim +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver MAX13170E C6 C7 C8 100pF 100pF 100pF 3 8 VCC 5V 11 12 13 MAX13174E 14 27 26 CHARGE PUMP 2 4 25 C4 4.7μF DTE_TXD/DCE_RXD 5 DTE_SCTE/DCE_RXC 6 T2 7 5 4 6 7 9 10 16 15 18 17 19 20 22 23 24 1 DTE 2 TXD A 14 TXD B 24 SCTE A 11 SCTE B 15 12 17 9 18 17 16 15 R2 10 DTE_RXD/DCE_TXD VEE C12 1μF 20 19 R1 9 DTE_RXC/DCE_SCTE 21 DCE RXD A RXD B RXC A RXC B T3 8 DTE_TXC/DCE_TXC 2 C5 4.7μF 24 23 22 21 T1 LATCH C2 1μF M0 1 C1 1μF VCC DCE/DTE M2 M1 C3 4.7μF C13 1μF 28 3 R3 3 16 7 MAX13170E M0 M1 13 M2 14 DCE/DTE TXC A TXC B TXC A TXC B RXC A SCTE A RXC B SCTE B RXD A TXD A RXD B TXD B SG 11 12 1 SHIELD DB-25 CONNECTOR C9 1μF VCC C10 1μF 1 2 DTE_RTS/DCE_CTS DTE_DTR/DCE_DSR 3 4 5 DTE_DCD/DCE_DCD DTE_DSR/DCE_DTR DTE_CTS/DCE_RTS DTE_LL/DCE_LL 6 7 8 10 9 28 VCC VEE VDD GND T1 T2 27 C11 1μF 26 25 24 23 4 RTS A 19 RTS B 20 DTR A 23 DTR B 22 21 20 19 18 17 8 DCD A 10 DCD B 6 DSR A 22 DSR B 5 CTS A 13 CTS B 16 18 CTS A CTS B DSR A DSR B T3 R1 R2 R3 R4 LLA DCD A DCD B DTR A DTR B RTS A RTS B LLA T4 MAX13172E M0 12 15 M1 INVERT 13 M2 14 DCE/DTE 11 DCE/DTE M2 M1 M0 Figure 20. Multiprotocol DCE/DTE Port ______________________________________________________________________________________ www.BDTIC.com/maxim 17 MAX13170E +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver DTE SERIAL CONTROLLER MAX13170E DCE MAX13174E MAX13174E TXD T1 TXD SCTE T2 SCTE T3 TXC R3 RXC R2 RXD R1 104Ω 104Ω MAX13170E SERIAL CONTROLLER R3 TXD R2 SCTE R1 104Ω 104Ω 104Ω TXC T1 TXC RXC T2 RXC RXD T3 RXD MAX13172E MAX13172E RTS T1 RTS R3 RTS DTR T2 DTR R2 DTR T3 R1 DCD R1 DCD T3 DCD DSR R2 DSR T2 DSR CTS R3 CTS T1 CTS LL D4 T4 LL R4 LL T4 Figure 21. DCE-to-DTE X.21 Interface Complete Multiprotocol X.21 Interface Compliance Testing A complete DTE-to-DCE interface operating in X.21 mode is shown in Figure 21. The MAX13170E is used to generate the clock and data signals, and the MAX13172E generates the control signals and local loopback (LL). The MAX13174E is used to terminate the clock and data signals to support the V.11 protocol for cable termination. The control signals do not need external termination. A European Standard EN 45001 test report is pending for the MAX13170E/MAX13172E/MAX13174E chipset. A copy of the test report will be available from Maxim upon completion. 18 ______________________________________________________________________________________ www.BDTIC.com/maxim +5V Multiprotocol, 3Tx/3Rx, SoftwareSelectable Clock/Data Transceiver Chip Information TRANSISTOR COUNT: 2619 PROCESS: BiCMOS TOP VIEW C1- 1 28 C2+ C1+ 2 27 C2- VDD 3 26 VEE VCC 4 25 GND T1IN 5 T2IN 6 24 T1OUTA MAX13170E 23 T1OUTB T3IN 7 22 T2OUTA R1OUT 8 21 T2OUTB R2OUT 9 20 T3OUTA/R1INA R3OUT 10 19 T3OUTB/R1INB M0 11 18 R2INA M1 12 17 R2INB M2 13 16 R3INA DCE/DTE 14 15 R3INB SSOP Package Information For the latest package outline information, go to www.maxim-ic.com/packages. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 28 SSOP A28-2 21-0056 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 19 © 2008 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc. www.BDTIC.com/maxim MAX13170E Pin Configuration