Download High Voltage Latch-Up Proof, 4-/8-Channel Multiplexers ADG5408/ADG5409

High Voltage Latch-Up Proof,
4-/8-Channel Multiplexers
ADG5408/ADG5409
FEATURES
FUNCTIONAL BLOCK DIAGRAMS
Latch-up proof
8 kV human body model (HBM) ESD rating
Low on resistance (13.5 Ω)
±9 V to ±22 V dual-supply operation
9 V to 40 V single-supply operation
48 V supply maximum ratings
Fully specified at ±15 V, ±20 V, +12 V, and +36 V
VSS to VDD analog signal range
Qualified for automotive products
ADG5408
ADG5409
S1
S1A
DA
S4A
D
S1B
DB
S8
S4B
Relay replacement
Automatic test equipment
Data acquisition
Instrumentation
Avionics
Audio and video switching
Communication systems
1-OF-4
DECODER
A0 A1 A2 EN
A0
A1
EN
09206-001
1-OF-8
DECODER
APPLICATIONS
Figure 1.
GENERAL DESCRIPTION
The ADG5408/ADG5409 are monolithic CMOS analog multiplexers comprising eight single channels and four differential
channels, respectively. The ADG5408 switches one of eight
inputs to a common output, as determined by the 3-bit binary
address lines, A0, A1, and A2. The ADG5409 switches one of
four differential inputs to a common differential output, as
determined by the 2-bit binary address lines, A0 and A1.
The ADG5408/ADG5409 do not have VL pins; rather, the logic
power supply is generated internally by an on-chip voltage
generator.
An EN input on both devices enables or disables the device.
When EN is disabled, all channels switch off. The on-resistance
profile is very flat over the full analog input range, which ensures
good linearity and low distortion when switching audio signals.
High switching speed also makes the parts suitable for video
signal switching.
2.
3.
Each switch conducts equally well in both directions when on,
and each switch has an input signal range that extends to the
power supplies. In the off condition, signal levels up to the
supplies are blocked.
PRODUCT HIGHLIGHTS
1.
4.
5.
6.
Trench isolation guards against latch-up. A dielectric trench
separates the P and N channel transistors thereby preventing
latch-up even under severe overvoltage conditions.
Low RON.
Dual-supply operation. For applications where the analog
signal is bipolar, the ADG5408/ADG5409 can be operated
from dual supplies up to ±22 V.
Single-supply operation. For applications where the analog
signal is unipolar, the ADG5408/ADG5409 can be operated
from a single rail power supply up to 40 V.
3 V logic compatible digital inputs: VINH = 2.0 V, VINL = 0.8 V.
No VL logic power supply required.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2010–2011 Analog Devices, Inc. All rights reserved.
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ADG5408/ADG5409
TABLE OF CONTENTS
Features .............................................................................................. 1
ESD Caution...................................................................................9
Applications....................................................................................... 1
Pin Configurations and Function Descriptions ......................... 10
Functional Block Diagrams............................................................. 1
Typical Performance Characteristics ........................................... 12
General Description ......................................................................... 1
Test Circuits..................................................................................... 16
Product Highlights ........................................................................... 1
Terminology .................................................................................... 18
Specifications..................................................................................... 3
Trench Isolation.............................................................................. 19
±15 V Dual Supply ....................................................................... 3
Applications Information .............................................................. 20
±20 V Dual Supply ....................................................................... 4
Outline Dimensions ....................................................................... 21
12 V Single Supply........................................................................ 5
Ordering Guide .......................................................................... 22
36 V Single Supply........................................................................ 6
Automotive Products ................................................................. 22
Continuous Current per Channel, Sx or D............................... 8
Absolute Maximum Ratings............................................................ 9
REVISION HISTORY
6/11—Rev. 0 to Rev. A
Change to Features Section ............................................................. 1
Change to ISS Parameter, Table 2..................................................... 5
Changes to Figure 3........................................................................ 10
Changes to Figure 5........................................................................ 11
Updated Outline Dimensions ....................................................... 21
Changes to Ordering Guide .......................................................... 21
Added Automotive Products Section .......................................... 21
7/10—Revision 0: Initial Version
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Rev. A | Page 2 of 24
ADG5408/ADG5409
SPECIFICATIONS
±15 V DUAL SUPPLY
VDD = +15 V ± 10%, VSS = −15 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
On-Resistance Match Between
Channels, ∆RON
On-Resistance Flatness, RFLAT (ON)
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
Drain Off Leakage, ID (Off )
Channel On Leakage, ID (On), IS (On)
25°C
13.5
15
0.3
0.8
1.8
2.2
±0.05
±0.25
±0.1
±0.4
±0.1
±0.4
−40°C to +85°C
−40°C to +125°C
Unit
Test Conditions/Comments
VDD to VSS
V
Ω typ
Ω max
Ω typ
VS = ±10 V, IS = −10 mA; see Figure 26
VDD = +13.5 V, VSS = −13.5 V
VS = ±10 V, IS = −10 mA
18
22
1.3
1.4
2.6
3
±1
±7
±4
±30
±4
±30
Ω max
Ω typ
Ω max
nA typ
nA max
nA typ
nA max
nA typ
nA max
VS = ±10 V, IS = −10 mA
VDD = +16.5 V, VSS = −16.5 V
VS = ±10 V, VD = m 10 V; see Figure 29
VS = ±10 V, VD = m 10 V; see Figure 29
VS = VD = ±10 V; see Figure 25
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
2.0
0.8
0.002
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS 1
Transition Time, tTRANSITION
3
V min
V max
μA typ
μA max
pF typ
VIN = VGND or VDD
Break-Before-Make Time Delay, tD
170
217
140
175
130
161
50
Charge Injection, QINJ
115
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
Off Isolation
−60
dB typ
Channel-to-Channel Crosstalk
−60
dB typ
Total Harmonic Distortion + Noise
0.01
% typ
−3 dB Bandwidth
ADG5408
ADG5409
Insertion Loss
50
87
0.9
MHz typ
MHz typ
dB typ
15
pF typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Figure 31
VS = 0 V, f = 1 MHz
102
50
pF typ
pF typ
VS = 0 V, f = 1 MHz
VS = 0 V, f = 1 MHz
tON (EN)
tOFF (EN)
258
292
213
242
183
198
16
CS (Off )
CD (Off )
ADG5408
ADG5409
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 34
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 34
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 10 V; see Figure 33
VS = 0 V, RS = 0 Ω, CL = 1 nF;
see Figure 35
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see
Figure 28
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see
Figure 27
RL = 1 kΩ, 15 V p-p, f = 20 Hz to 20 kHz;
see Figure 30
RL = 50 Ω, CL = 5 pF; see Figure 31
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Rev. A | Page 3 of 24
ADG5408/ADG5409
Parameter
CD (On), CS (On)
ADG5408
ADG5409
POWER REQUIREMENTS
IDD
25°C
−40°C to +85°C
133
81
45
55
0.001
ISS
Unit
Test Conditions/Comments
pF typ
pF typ
VS = 0 V, f = 1 MHz
VS = 0 V, f = 1 MHz
VDD = +16.5 V, VSS = −16.5 V
Digital inputs = 0 V or VDD
μA typ
μA max
μA typ
μA max
V min/V max
Digital inputs = 0 V or VDD
−40°C to +125°C
Unit
Test Conditions/Comments
VDD to VSS
V
Ω typ
Ω max
Ω typ
VS = ±15 V, IS = −10 mA; see Figure 26
VDD = +18 V, VSS = −18 V
VS = ±15 V, IS = −10 mA
70
1
±9/±22
VDD/VSS
1
−40°C to +125°C
GND = 0 V
Guaranteed by design; not subject to production test.
±20 V DUAL SUPPLY
VDD = +20 V ± 10%, VSS = −20 V ± 10%, GND = 0 V, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
25°C
On-Resistance Match Between
Channels, ∆RON
On-Resistance Flatness, RFLAT (ON)
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
Drain Off Leakage, ID (Off )
Channel On Leakage, ID (On), IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
12.5
14
0.3
0.8
2.3
2.7
±0.1
±0.25
±0.15
±0.4
±0.15
±0.4
−40°C to +85°C
17
21
1.3
1.4
3.1
3.5
±1
±7
±4
±30
±4
±30
2.0
0.8
0.002
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS 1
Transition Time, tTRANSITION
3
nA typ
nA max
nA typ
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
Charge Injection, QINJ
155
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
Off Isolation
−60
dB typ
Channel-to-Channel Crosstalk
−60
dB typ
tON (EN)
tOFF (EN)
Break-Before-Make Time Delay, tD
160
207
140
165
133
153
38
Ω max
Ω typ
Ω max
237
262
194
218
174
189
11
VS = ±15 V, IS = −10 mA
VDD = +22 V, VSS = −22 V
VS = ±15 V, VD = m 15 V; see Figure 29
VS = ±15 V, VD = m 15 V; see Figure 29
VS = VD = ±15 V; see Figure 25
VIN = VGND or VDD
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 34
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 34
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 10 V; see Figure 33
VS = 0 V, RS = 0 Ω, CL = 1 nF; see
Figure 35
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see
Figure 28
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 27
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Rev. A | Page 4 of 24
ADG5408/ADG5409
Parameter
Total Harmonic Distortion + Noise
−3 dB Bandwidth
ADG5408
ADG5409
Insertion Loss
CS (Off )
CD (Off )
ADG5408
ADG5409
CD (On), CS (On)
ADG5408
ADG5409
POWER REQUIREMENTS
IDD
ISS
25°C
0.012
−40°C to +85°C
Unit
% typ
Test Conditions/Comments
RL = 1 kΩ, 20 V p-p, f = 20 Hz to 20 kHz;
see Figure 30
RL = 50 Ω, CL = 5 pF; see Figure 31
50
88
0.8
MHz typ
MHz typ
dB typ
17
pF typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 31
VS = 0 V, f = 1 MHz
98
48
pF typ
pF typ
VS = 0 V, f = 1 MHz
VS = 0 V, f = 1 MHz
128
80
pF typ
pF typ
VS = 0 V, f = 1 MHz
VS = 0 V, f = 1 MHz
VDD = +22 V, VSS = −22 V
Digital inputs = 0 V or VDD
50
70
0.001
μA typ
μA max
μA typ
μA max
V min/V max
Digital inputs = 0 V or VDD
−40°C to +125°C
Unit
Test Conditions/Comments
0 V to VDD
V
Ω typ
110
1
±9/±22
VDD/VSS
1
−40°C to +125°C
GND = 0 V
Guaranteed by design; not subject to production test.
12 V SINGLE SUPPLY
VDD = 12 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 3.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
On-Resistance Match Between
Channels, ∆RON
On-Resistance Flatness, RFLAT (ON)
25°C
−40°C to +85°C
26
30
0.3
36
42
Ω max
Ω typ
1
5.5
6.5
1.5
1.6
VS = 0 V to 10 V, IS = −10 mA
8
12
Ω max
Ω typ
Ω max
nA typ
VDD = 13.2 V, VSS = 0 V
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 29
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
±0.02
±0.25
±0.05
±1
Drain Off Leakage, ID (Off )
±0.4
±0.05
±0.4
±4
±30
±4
±30
Channel On Leakage, ID (On), IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
±7
2.0
0.8
0.002
±0.1
Digital Input Capacitance, CIN
VS = 0 V to 10 V, IS = −10 mA; see
Figure 26
VDD = 10.8 V, VSS = 0 V
VS = 0 V to 10 V, IS = −10 mA
3
nA max
nA typ
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 29
nA max
nA typ
nA max
VS = VD = 1 V/10 V; see Figure 25
V min
V max
μA typ
μA max
pF typ
VIN = VGND or VDD
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Rev. A | Page 5 of 24
ADG5408/ADG5409
Parameter
DYNAMIC CHARACTERISTICS 1
Transition Time, tTRANSITION
25°C
−40°C to +85°C
−40°C to +125°C
388
430
345
397
187
209
Test Conditions/Comments
RL = 300 Ω, CL = 35 pF
VS = 8 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS = 8 V; see Figure 34
RL = 300 Ω, CL = 35 pF
VS = 8 V; see Figure 34
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 8 V; see Figure 33
VS = 6 V, RS = 0 Ω, CL = 1 nF; see
Figure 35
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 28
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 27
RL = 1 kΩ, 6 V p-p, f = 20 Hz to 20 kHz;
see Figure 30
RL = 50 Ω, CL = 5 pF; see Figure 31
Break-Before-Make Time Delay, tD
230
321
215
276
134
161
118
Charge Injection, QINJ
45
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
Off Isolation
−60
dB typ
Channel-to-Channel Crosstalk
−60
dB typ
Total Harmonic Distortion + Noise
0.1
% typ
−3 dB Bandwidth
ADG5408
ADG5409
Insertion Loss
35
74
−1.8
MHz typ
MHz typ
dB typ
22
pF typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 31
VS = 6 V, f = 1 MHz
119
59
pF typ
pF typ
VS = 6 V, f = 1 MHz
VS = 6 V, f = 1 MHz
146
86
pF typ
pF typ
VS = 6 V, f = 1 MHz
VS = 6 V, f = 1 MHz
VDD = 13.2 V
Digital inputs = 0 V or VDD
tON (EN)
tOFF (EN)
55
CS (Off )
CD (Off )
ADG5408
ADG5409
CD (On), CS (On)
ADG5408
ADG5409
POWER REQUIREMENTS
IDD
40
50
65
9/40
VDD
1
Unit
μA typ
μA max
V min/V max
GND = 0 V, VSS = 0 V
Guaranteed by design; not subject to production test.
36 V SINGLE SUPPLY
VDD = 36 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 4.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
25°C
−40°C to +85°C
−40°C to +125°C
Unit
0 V to VDD
V
Ω typ
14.5
On-Resistance Match Between
Channels, ∆RON
On-Resistance Flatness, RFLAT (ON)
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
Test Conditions/Comments
VS = 0 V to 30 V, IS = −10 mA; see
Figure 26
VDD = 32.4 V, VSS = 0 V
VS = 0 V to 30 V, IS = −10 mA
16
0.3
19
23
Ω max
Ω typ
0.8
3.5
4.3
1.3
1.4
VS = 0 V to 30 V, IS = −10 mA
5.5
6.5
Ω max
Ω typ
Ω max
nA typ
VDD =39.6 V, VSS = 0 V
VS = 1 V/30 V, VD = 30 V/1 V; see
Figure 29
±0.1
±0.25
±1
±7
nA max
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Rev. A | Page 6 of 24
ADG5408/ADG5409
Parameter
Drain Off Leakage, ID (Off )
Channel On Leakage, ID (On), IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
25°C
±0.15
−40°C to +85°C
−40°C to +125°C
Unit
nA typ
±0.4
±0.15
±0.4
±4
±30
VS = VD = 1 V/30 V; see Figure 25
±4
±30
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
VIN = VGND or VDD
2.0
0.8
0.002
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS 1
Transition Time, tTRANSITION
3
Break-Before-Make Time Delay, tD
187
242
160
195
147
184
53
Charge Injection, QINJ
150
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
Off Isolation
−60
dB typ
Channel-to-Channel Crosstalk
−60
dB typ
Total Harmonic Distortion + Noise
0.4
% typ
−3 dB Bandwidth
ADG5408
ADG5409
Insertion Loss
45
76
−1
MHz typ
MHz typ
dB typ
18
pF typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 31
VS = 18 V, f = 1 MHz
120
60
pF typ
pF typ
VS = 18 V, f = 1 MHz
VS = 18 V, f = 1 MHz
137
80
pF typ
pF typ
VS = 18 V, f = 1 MHz
VS = 18 V, f = 1 MHz
VDD = 39.6 V
Digital inputs = 0 V or VDD
tON (EN)
tOFF (EN)
257
281
219
237
184
190
17
CS (Off )
CD (Off )
ADG5408
ADG5409
CD (On), CS (On)
ADG5408
ADG5409
POWER REQUIREMENTS
IDD
80
100
VDD
1
Test Conditions/Comments
VS = 1 V/30 V, VD = 30 V/1 V; see
Figure 29
130
9/40
μA typ
μA max
V min/V max
RL = 300 Ω, CL = 35 pF
VS = 18 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS = 18 V; see Figure 34
RL = 300 Ω, CL = 35 pF
VS = 18 V; see Figure 34
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 18 V; see Figure 33
VS = 18 V, RS = 0 Ω, CL = 1 nF;
see Figure 35
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 28
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 27
RL = 1 kΩ, 18 V p-p, f = 20 Hz to 20 kHz;
see Figure 30
RL = 50 Ω, CL = 5 pF; see Figure 31
GND = 0 V, VSS = 0 V
Guaranteed by design; not subject to production test.
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Rev. A | Page 7 of 24
ADG5408/ADG5409
CONTINUOUS CURRENT PER CHANNEL, Sx OR D
Table 5. ADG5408
Parameter
CONTINUOUS CURRENT, Sx OR D
VDD = +15 V, VSS = −15 V
TSSOP (θJA = 112.6°C/W)
LFCSP (θJA = 30.4°C/W)
VDD = +20 V, VSS = −20 V
TSSOP (θJA = 112.6°C/W)
LFCSP (θJA = 30.4°C/W)
VDD = 12 V, VSS = 0 V
TSSOP (θJA = 112.6°C/W)
LFCSP (θJA = 30.4°C/W)
VDD = 36 V, VSS = 0 V
TSSOP (θJA = 112.6°C/W)
LFCSP (θJA = 30.4°C/W)
25°C
85°C
125°C
Unit
100
170
44
54
16
16
mA maximum
mA maximum
106
178
45
55
16
16
mA maximum
mA maximum
81
140
39
51
15
16
mA maximum
mA maximum
104
175
44
55
16
16
mA maximum
mA maximum
25°C
85°C
125°C
Unit
75
130
37
49
15
16
mA maximum
mA maximum
79
136
38
50
15
16
mA maximum
mA maximum
60
105
32
44
14
16
mA maximum
mA maximum
78
133
38
50
15
16
mA maximum
mA maximum
Table 6. ADG5409
Parameter
CONTINUOUS CURRENT, Sx OR D
VDD = +15 V, VSS = −15 V
TSSOP (θJA = 112.6°C/W)
LFCSP (θJA = 30.4°C/W)
VDD = +20 V, VSS = −20 V
TSSOP (θJA = 112.6°C/W)
LFCSP (θJA = 30.4°C/W)
VDD = 12 V, VSS = 0 V
TSSOP (θJA = 112.6°C/W)
LFCSP (θJA = 30.4°C/W)
VDD = 36 V, VSS = 0 V
TSSOP (θJA = 112.6°C/W)
LFCSP (θJA = 30.4°C/W)
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Rev. A | Page 8 of 24
ADG5408/ADG5409
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 7.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog Inputs1
Rating
48 V
−0.3 V to +48 V
+0.3 V to −48 V
VSS − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
VSS − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Digital Inputs1
Peak Current, Sx or D Pins
ADG5408
ADG5409
Continuous Current, Sx or D2
Temperature Range
Operating
Storage
Junction Temperature
Thermal Impedance, θJA
16-Lead TSSOP (4-Layer
Board)
16-Lead LFCSP (4-Layer
Board)
Reflow Soldering Peak
Temperature, Pb Free
370 mA (pulsed at 1 ms, 10%
duty cycle maximum)
275 mA (pulsed at 1 ms, 10%
duty cycle maximum)
Data + 15%
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any
one time.
ESD CAUTION
−40°C to +125°C
−65°C to +150°C
150°C
112.6°C/W
30.4°C/W
260(+0/−5)°C
1
Overvoltages at the Ax, EN, Sx, and D pins are clamped by internal diodes.
Limit current to the maximum ratings given.
2
See Table 5.
www.BDTIC.com/ADI
Rev. A | Page 9 of 24
ADG5408/ADG5409
GND
ADG5408
VSS 1
S1 4
13
S1 2
ADG5408
11 VDD
S2 5
TOP VIEW
(Not to Scale)
VDD
12
S5
S2 3
TOP VIEW
(Not to Scale)
10 S5
S3 6
11
S6
S3 4
S4 7
10
S7
D 8
9
S8
12 GND
S7 8
S8 7
D 6
9 S6
S4 5
3
09206-002
VSS
NOTES
1. THE EXPOSED PAD IS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, VSS.
Figure 2. ADG5408 Pin Configuration (TSSOP)
09206-003
A2
14
14 A1
A1
13 A2
16
15
15 A0
A0 1
EN 2
16 EN
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. ADG5408 Pin Configuration (LFCSP)
Table 8. ADG5408 Pin Function Descriptions
Pin No.
TSSOP
LFCSP
1
15
2
16
Mnemonic
A0
EN
3
1
VSS
4
5
6
7
8
9
10
11
12
13
14
15
16
2
3
4
5
6
7
8
9
10
11
12
13
14
EP
S1
S2
S3
S4
D
S8
S7
S6
S5
VDD
GND
A2
A1
Exposed Pad
Description
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off. When high,
Ax logic inputs determine on switches.
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected
to ground.
Source Terminal 1. This pin can be an input or an output.
Source Terminal 2. This pin can be an input or an output.
Source Terminal 3. This pin can be an input or an output.
Source Terminal 4. This pin can be an input or an output.
Drain Terminal. This pin can be an input or an output.
Source Terminal 8. This pin can be an input or an output.
Source Terminal 7. This pin can be an input or an output.
Source Terminal 6. This pin can be an input or an output.
Source Terminal 5. This pin can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG5408 Truth Table
A2
X
0
0
0
0
1
1
1
1
A1
X
0
0
1
1
0
0
1
1
A0
X
0
1
0
1
0
1
0
1
EN
0
1
1
1
1
1
1
1
1
On Switch
None
1
2
3
4
5
6
7
8
www.BDTIC.com/ADI
Rev. A | Page 10 of 24
ADG5409
13
S1B
S2A
5
TOP VIEW
(Not to Scale)
12
S2B
S3A
6
11
S3B
S4A
7
10
S4B
DA 8
9
DB
VSS 1
14 A1
13 GND
S1A 2
ADG5409
S2A 3
TOP VIEW
(Not to Scale)
S3A 4
12 VDD
11 S1B
10 S2B
9 S3B
NOTES
1. THE EXPOSED PAD IS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, VSS.
09206-005
4
S4B 8
S1A
15 A0
VDD
3
DB 7
GND
14
VSS
DA 6
A1
S4A 5
16
15
09206-004
A0 1
EN 2
16 EN
ADG5408/ADG5409
Figure 5. ADG5409 Pin Configuration (LFCSP)
Figure 4. ADG5409 Pin Configuration (TSSOP)
Table 10. ADG5409 Pin Function Descriptions
Pin No.
TSSOP LFCSP
1
15
2
16
Mnemonic
A0
EN
3
1
VSS
4
5
6
7
8
9
10
11
12
13
14
15
16
2
3
4
5
6
7
8
9
10
11
12
13
14
EP
S1A
S2A
S3A
S4A
DA
DB
S4B
S3B
S2B
S1B
VDD
GND
A1
Exposed
Pad
Description
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off. When high,
Ax logic inputs determine on switches.
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected
to ground.
Source Terminal 1A. This pin can be an input or an output.
Source Terminal 2A. This pin can be an input or an output.
Source Terminal 3A. This pin can be an input or an output.
Source Terminal 4A. This pin can be an input or an output.
Drain Terminal A. This pin can be an input or an output.
Drain Terminal B. This pin can be an input or an output.
Source Terminal 4B. This pin can be an input or an output.
Source Terminal 3B. This pin can be an input or an output.
Source Terminal 2B. This pin can be an input or an output.
Source Terminal 1B. This pin can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
The exposed pad is connected internally. For increased reliability of the solder joints and maximum
thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 11. ADG5409 Truth Table
A1
X
0
0
1
1
A0
X
0
1
0
1
EN
0
1
1
1
1
On Switch Pair
None
1
2
3
4
www.BDTIC.com/ADI
Rev. A | Page 11 of 24
ADG5408/ADG5409
TYPICAL PERFORMANCE CHARACTERISTICS
25
16
TA = 25°C
20
12
VDD = +11V
VSS = –11V
15
10
VDD = +13.5V
VSS = –13.5V
VDD = +15V
VSS = –15V
VDD = +16.5V
VSS = –16.5V
5
TA = 25°C
14
ON RESISTANCE (Ω)
ON RESISTANCE (Ω)
VDD = +10V
VSS = –10V
VDD = +9V
VSS = –9V
10
VDD = 32.4V
VSS = 0V
8
VDD = 39.6V
VSS = 0V
VDD = 36V
VSS = 0V
6
4
–14
–10
–6
–2
2
6
10
14
18
VS, VD (V)
0
09206-028
0
–18
0
5
10
15
20
25
30
35
40
45
VS, VD (V)
09206-027
2
Figure 9. RON as a Function of VS, VD (Single Supply)
Figure 6. RON as a Function of VS, VD (Dual Supply)
25
16
TA = 25°C
14
ON RESISTANCE (Ω)
ON RESISTANCE (Ω)
20
VDD = +18V
VSS = –18V
12
10
8
VDD = +22V
VSS = –22V
VDD = +20V
VSS = –20V
6
TA = +125°C
15
TA = +85°C
TA = +25°C
10
TA = –40°C
4
–20
–15
–10
–5
0
5
10
15
20
VS, VD (V)
25
VDD = +15V
VSS = –15V
0
–15
–10
09206-029
0
–25
VDD = 10.8V
VSS = 0V
VDD = 9V
VSS = 0V
ON RESISTANCE (Ω)
–20
–15
VDD = 13.2V
VSS = 0V
–10
VDD = 12V
VSS = 0V
10
15
VDD = +20V
VSS = –20V
20
–25
VDD = 11V
VSS = 0V
TA = +125°C
15
TA = +85°C
TA = +25°C
10
TA = –40°C
5
0
0
–2
–4
–6
–8
VS, VD (V)
–10
–12
–14
0
–20
–15
–10
–5
0
5
10
15
20
VS, VD (V)
Figure 11. RON as a Function of VS (VD) for Different Temperatures,
±20 V Dual Supply
Figure 8. RON as a Function of VS, VD (Single Supply)
www.BDTIC.com/ADI
Rev. A | Page 12 of 24
09206-024
–5
09206-023
ON RESISTANCE (Ω)
–30
VDD = 10V
VSS = 0V
5
Figure 10. RON as a Function of VS (VD) for Different Temperatures,
±15 V Dual Supply
25
TA = 25°C
0
VS, VD (V)
Figure 7. RON as a Function of VS, VD (Dual Supply)
–35
–5
09206-030
5
2
ADG5408/ADG5409
1
VDD = +20V
VSS = –20V
VBIAS = +15V/–15V
35
TA = +85°C
25
20
TA = +25°C
15
TA = –40°C
10
5
VDD = 12V
VSS = 0V
0
2
4
6
8
10
12
VS, VD (V)
ID (OFF) + –
–2
0
0.5
VDD = 36V
VSS = 0V
25
50
75
100
125
VDD = 12V
VSS = 0V
VBIAS = 1V/10V
ID, IS (ON) + +
IS (OFF) + –
0
LEAKAGE CURRENT (nA)
ON RESISTANCE (Ω)
ID, IS (ON) – –
Figure 15. Leakage Currents vs. Temperature, ±20 V Dual Supply
20
TA = +125°C
15
TA = +85°C
TA = +25°C
10
TA = –40°C
5
ID (OFF) – +
–0.5
IS (OFF) – +
ID, IS (ON) – –
–1.0
ID (OFF) + –
–1.5
0
5
10
15
20
25
30
35
40
–2.0
09206-032
0
–1
TEMPERATURE (°C)
Figure 12. RON as a Function of VS (VD) for Different Temperatures,
12 V Single Supply
25
ID (OFF) – +
IS (OFF) – +
–3
09206-031
0
0
VS, VD (V)
VDD = +15V
VSS = –15V
VBIAS = +10V/–10V
25
50
75
100
125
TEMPERATURE (°C)
Figure 16. Leakage Currents vs. Temperature, 12 V Single Supply
Figure 13. RON as a Function of VD (VS) for Different Temperatures,
36 V Single Supply
0.5
0
09206-033
ON RESISTANCE (Ω)
LEAKAGE CURRENT (nA)
TA = +125°C
30
ID, IS (ON) + +
IS (OFF) + –
09206-035
40
1
ID, IS (ON) + +
VDD = +36V
VSS = 0V
VBIAS = 1V/30V
IS (OFF) + –
ID, IS (ON) + +
IS (OFF) + –
LEAKAGE CURRENT (nA)
IS (OFF) – +
–0.5
ID (OFF) – +
ID, IS (ON) – –
–1.0
ID (OFF) + –
0
IS (OFF) – +
ID (OFF) – +
–1
ID, IS (ON) – –
ID (OFF) + –
–2
–2.0
0
25
50
75
100
125
TEMPERATURE (°C)
–3
0
25
50
75
100
125
TEMPERATURE (°C)
Figure 17. Leakage Currents vs. Temperature, 36 V Single Supply
Figure 14. Leakage Currents vs. Temperature, ±15 V Dual Supply
www.BDTIC.com/ADI
Rev. A | Page 13 of 24
09206-036
–1.5
09206-034
LEAKAGE CURRENT (nA)
0
ADG5408/ADG5409
0
–10
–20
–20
–30
–30
ACPSRR (dB)
TA = 25°C
V = +15V
–10 VDD = –15V
SS
–50
–60
–60
–80
–80
–90
–90
–100
–100
100k
1M
10M
100M
1G
FREQUENCY (Hz)
DECOUPLING
CAPACITORS
–50
–70
10k
NO DECOUPLING
CAPACITORS
–40
–70
1k
TA = 25°C
VDD = +15V
VSS = –15V
1k
0.12
TA = 25°C
VDD = +15V
VSS = –15V
VDD = 12V, VSS = 0V, VS = 6V p-p
0.10
–30
LOAD = 1kΩ
TA = 25°C
0.08
–40
THD + N (%)
–50
–60
0.06
VDD = 36V, VSS = 0V, VS = 18V p-p
0.04
–70
–80
VDD = 15V, VSS = 15V, VS = 15V p-p
0.02
–90
VDD = 20V, VSS = 20V, VS = 20V p-p
100k
1M
10M
100M
1G
FREQUENCY (Hz)
0
09206-026
–100
10k
0
TA = 25°C
15
1G
0
TA = 25°C
V = +15V
–0.5 VDD = –15V
SS
VDD = +20V
VSS = –20V
200
INSERTION LOSS (dB)
–1.0
VDD = +36V
VSS = 0V
150
100
VDD = +12V
VSS = 0V
50
ADG5409
–1.5
ADG5408
–2.0
–2.5
–3.0
–3.5
–4.0
VDD = +15V
VSS = –15V
–4.5
0
10
20
30
VS (V)
40
09206-019
10
20
Figure 22. THD + N vs. Frequency
250
0
20
10
FREQUENCY (kHz)
Figure 19. Crosstalk vs. Frequency, ±15 V Dual Supply
300
5
09206-025
CROSSTALK (dB)
10M
Figure 21. ACPSRR vs. Frequency, ±15 V Dual Supply
–20
CHARGE INJECTION (pC)
1M
09206-020
0
100k
FREQUENCY (Hz)
Figure 18. Off Isolation vs. Frequency, ±15 V Dual Supply
–10
10k
09206-022
–40
09206-021
OFF ISOLATION (dB)
0
–5.0
1k
10k
100k
1M
10M
FREQUENCY (Hz)
Figure 23. Bandwidth
Figure 20. Charge Injection vs. Source Voltage
www.BDTIC.com/ADI
Rev. A | Page 14 of 24
100M
ADG5408/ADG5409
400
350
300
VDD = +12V, VSS = 0V
VDD = +36V, VSS = 0V
200
VDD = +15V, VSS = –15V
150
VDD = +20V, VSS = –20V
100
50
0
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
120
09206-018
TIME (ns)
250
Figure 24. tTRANSITION Times vs. Temperature
www.BDTIC.com/ADI
Rev. A | Page 15 of 24
ADG5408/ADG5409
TEST CIRCUITS
Dx
ID (ON)
IS (OFF)
A
A
NC = NO CONNECT
VD
Sx
D
ID (OFF)
A
VS
VD
09206-007
Figure 29. Off Leakage
Figure 25. On Leakage
VDD
VSS
0.1µF
0.1µF
VDD
AUDIO PRECISION
VSS
RS
IDS
Sx
IN
V1
VIN
D
GND
09206-006
VS
RON = V1/IDS
Figure 30. THD + Noise Figure
Figure 26. On Resistance
VDD
VSS
0.1µF
NETWORK
ANALYZER
VOUT
VDD
0.1µF
VDD
S1
VSS
0.1µF
0.1µF
VSS
RL
50Ω
VDD
D
NETWORK
ANALYZER
VSS
Sx
S2
VS
VOUT
RL
10kΩ
09206-015
Sx
VS
V p-p
D
RL
50Ω
50Ω
VS
D
RL
50Ω
GND
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
09206-014
GND
VOUT
VS
INSERTION LOSS = 20 log
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
Figure 31. Bandwidth
Figure 27. Channel-to-Channel Crosstalk
VSS
VDD
0.1µF
0.1µF
VDD
NETWORK
ANALYZER
VSS
50Ω
Sx
50Ω
VS
D
OFF ISOLATION = 20 log
VOUT
VS
VOUT
09206-013
RL
50Ω
GND
Figure 28. Off Isolation
www.BDTIC.com/ADI
Rev. A | Page 16 of 24
VOUT
09206-017
Sx
09206-008
NC
ADG5408/ADG5409
3V
ADDRESS
DRIVE (VIN)
50%
50%
tr < 20ns
tf < 20ns
VDD
VSS
VDD
VSS
A0
0V
VIN
S1
A1
50Ω
A2
tTRANSITION
VS1
S2 TO S7
tTRANSITION
VS8
S8
90%
ADG5408*
2.4V
OUTPUT
OUTPUT
D
EN
300Ω
GND
35pF
09206-009
90%
*SIMILAR CONNECTION FOR ADG5409.
Figure 32. Address to Output Switching Times, tTRANSITION
3V
ADDRESS
DRIVE (VIN)
VDD
VSS
VDD
VSS
A0
VIN
0V
S1
A1
50Ω
VS
S2 TO S7
A2
S8
80%
ADG5408*
80%
OUTPUT
2.4V
OUTPUT
D
EN
300Ω
GND
35pF
09206-010
tD
*SIMILAR CONNECTION FOR ADG5409.
Figure 33. Break-Before-Make Delay, tD
3V
50%
VSS
VDD
VSS
A0
50%
S1
A1
0V
S2 TO S8
A2
tON (EN)
ADG5408*
tOFF (EN)
0.9VO
0.9VO
OUTPUT
VS
VIN
50Ω
OUTPUT
D
EN
35pF
300Ω
GND
09206-011
ENABLE
DRIVE (VIN)
VDD
*SIMILAR CONNECTION FOR ADG5409.
Figure 34. Enable Delay, tON (EN), tOFF (EN)
3V
VDD
VSS
VDD
VSS
A0
A1
VIN
A2
ADG5408*
VOUT
RS
∆VOUT
QINJ = CL × ∆VOUT
Sx
D
EN
VS
GND
VOUT
CL
1nF
*SIMILAR CONNECTION FOR ADG5409.
Figure 35. Charge Injection
www.BDTIC.com/ADI
Rev. A | Page 17 of 24
09206-012
VIN
ADG5408/ADG5409
TERMINOLOGY
IDD
IDD represents the positive supply current.
CIN
CIN represents digital input capacitance.
ISS
ISS represents the negative supply current.
tON (EN)
tON (EN) represents the delay time between the 50% and 90%
points of the digital input and switch on condition.
VD, VS
VD and VS represent the analog voltage on Terminal D and
Terminal S, respectively.
tOFF (EN)
tOFF (EN) represents the delay time between the 50% and 90%
points of the digital input and switch off condition.
RON
RON is the ohmic resistance between Terminal D and
Terminal S.
tTRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
ΔRON
ΔRON represents the difference between the RON of any two
channels.
tD
RFLAT (ON)
The difference between the maximum and minimum value of
on resistance as measured over the specified analog signal range
is represented by RFLAT (ON).
IS (Off)
IS (Off) is the source leakage current with the switch off.
ID (Off)
ID (Off) is the drain leakage current with the switch off.
ID (On), IS (On)
ID (On) and IS (On) represent the channel leakage currents with
the switch on.
VINL
VINL is the maximum input voltage for Logic 0.
tD represents the off time measured between the 80% point of
both switches when switching from one address state to
another.
Off Isolation
Off isolation is a measure of unwanted signal coupling through
an off channel.
Charge Injection
Charge injection is a measure of the glitch impulse transferred
from the digital input to the analog output during switching.
Crosstalk
Crosstalk is a measure of unwanted signal that is coupled
through from one channel to another as a result of parasitic
capacitance.
Bandwidth
Bandwidth is the frequency at which the output is attenuated
by 3 dB.
VINH
VINH is the minimum input voltage for Logic 1.
IINL, IINH
IINL and IINH represent the low and high input currents of the
digital inputs.
On Response
On response is the frequency response of the on switch.
CD (Off)
CD (Off) represents the off switch drain capacitance, which is
measured with reference to ground.
Total Harmonic Distortion + Noise (THD + N)
The ratio of the harmonic amplitude plus noise of the signal to
the fundamental is represented by THD + N.
CS (Off)
CS (Off) represents the off switch source capacitance, which is
measured with reference to ground.
AC Power Supply Rejection Ratio (ACPSRR)
ACPSRR is a measure of the ability of a part to avoid coupling
noise and spurious signals that appear on the supply voltage pin
to the output of the switch. The dc voltage on the device is
modulated by a sine wave of 0.62 V p-p. The ratio of the
amplitude of signal on the output to the amplitude of the
modulation is the ACPSRR.
CD (On), CS (On)
CD (On) and CS (On) represent on switch capacitances, which
are measured with reference to ground.
www.BDTIC.com/ADI
Rev. A | Page 18 of 24
ADG5408/ADG5409
TRENCH ISOLATION
In the ADG5408/ADG5409, an insulating oxide layer (trench)
is placed between the NMOS and the PMOS transistors of each
CMOS switch. Parasitic junctions, which occur between the
transistors in junction isolated switches, are eliminated, and the
result is a completely latch-up proof switch.
PMOS
P-WELL
N-WELL
TRENCH
BURIED OXIDE LAYER
HANDLE WAFER
Figure 36. Trench Isolation
www.BDTIC.com/ADI
Rev. A | Page 19 of 24
09206-016
In junction isolation, the N and P wells of the PMOS and
NMOS transistors form a diode that is reverse-biased under
normal operation. However, during overvoltage conditions, this
diode can become forward-biased. A silicon controlled rectifier
(SCR) type circuit is formed by the two transistors causing a
significant amplification of the current that, in turn, leads to
latch-up. With trench isolation, this diode is removed, and the
result is a latch-up proof switch.
NMOS
ADG5408/ADG5409
APPLICATIONS INFORMATION
The ADG54xx family switches and multiplexers provide a
robust solution for instrumentation, industrial, automotive,
aerospace, and other harsh environments that are prone to
latch-up, which is an undesirable high current state that can
lead to device failure and persist until the power supply is
turned off. The ADG5408/ADG5409 high voltage switches
allow single-supply operation from 9 V to 40 V and dual-supply
operation from ±9 V to ±22 V. The ADG5408/ADG5409 (as
well as select devices within the same family) achieve an 8 kV
human body model ESD rating that provides a robust solution
eliminating the need for separate protect circuitry designs in some
applications.
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Rev. A | Page 20 of 24
ADG5408/ADG5409
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
6.40
BSC
1
8
PIN 1
1.20
MAX
0.15
0.05
0.30
0.19
0.65
BSC
COPLANARITY
0.10
0.20
0.09
0.75
0.60
0.45
8°
0°
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 37. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.35
0.30
0.25
0.65
BSC
16
13
PIN 1
INDICATOR
12
1
EXPOSED
PAD
4
2.70
2.60 SQ
2.50
9
0.80
0.75
0.70
SEATING
PLANE
0.45
0.40
0.35
8
5
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
0.20 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
08-16-2010-C
TOP VIEW
Figure 38. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-17)
Dimensions shown in millimeters
www.BDTIC.com/ADI
Rev. A | Page 21 of 24
ADG5408/ADG5409
ORDERING GUIDE
Model1, 2
ADG5408BRUZ
ADG5408BRUZ-REEL7
ADG5408WBRUZ
ADG5408WBRUZ-REEL7
ADG5408BCPZ-REEL7
ADG5409BRUZ
ADG5409BRUZ-REEL7
ADG5409BCPZ-REEL7
1
2
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Package Option
RU-16
RU-16
RU-16
RU-16
CP-16-17
RU-16
RU-16
CP-16-17
Z = RoHS Compliant Part.
W = Qualified for automotive applications.
AUTOMOTIVE PRODUCTS
The ADG5408W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
www.BDTIC.com/ADI
Rev. A | Page 22 of 24
ADG5408/ADG5409
NOTES
www.BDTIC.com/ADI
Rev. A | Page 23 of 24
ADG5408/ADG5409
NOTES
©2010–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09206-0-6/11(A)
www.BDTIC.com/ADI
Rev. A | Page 24 of 24