Download Data Sheet

Survey
yes no Was this document useful for you?
   Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Document related concepts
no text concepts found
Transcript
Data Sheet
150mA RF ULDO REGULATOR
AP2202
General Description
Features
The AP2202 is a 150mA ULDO regulator which provides very low noise, ultra low dropout voltage
(typically 165mV at 150mA), very low standby current
(1µA maximum) and excellent power supply ripple
rejection (PSRR 75dB at 100Hz) in battery powered
applications, such as handsets and PDAs and in noise
sensitive applications, such as RF electronics.
·
·
·
Up to 150mA Output Current
Low Standby Current
Low Dropout Voltage: VDROP=165mV at 150mA
·
·
High Output Accuracy: ± 1%
Good Ripple Rejection Ability: 75dB at 100Hz
and IOUT=100µA
The AP2202 also features logic compatible enable/
shutdown control inputs, a low power shutdown mode
for extended battery life, over current protection, over
temperature protection, as well as reversed-battery protection.
·
·
·
·
·
·
Tight Load and Line Regulation
Low Temperature Coefficient
Over Current Protection
Thermal Protection
Reverse-battery Protection
Logic-controlled Enable
The AP2202 has adjustable, 2.5V, 2.6V, 2.8V, 3.0V and
3.3V versions.
Applications
The AP2202 is available in space saving SOT-23-5 and
SOT-89 packages.
·
·
·
·
·
·
·
SOT-23-5
Cellular Phones
Cordless Phones
Digital Still Cameras
Wireless Communicators
PDAs / Palmtops
PC Mother Board
Consumer Electronics
SOT-89
Figure 1. Package Types of AP2202
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
1
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Pin Configuration
K Package
(SOT-23-5)
VIN
1
GND
2
EN
3
5
4
VIN
1
GND
2
EN
3
VOUT
BYP
5
VOUT
4
ADJ
R Package
(SOT-89)
1
2
3
VOUT GND VIN
(TAB)
Figure 2. Pin Configuration of AP2202 (Top View)
Pin Description
Pin Number
SOT-89
1
3
VIN
2
2
GND
3
EN
4
BYP/ADJ
5
1
Function
Pin Name
SOT-23-5
VOUT
Input voltage
Ground (TAB for SOT-89)
Enable input: CMOS or TTL compatible input. Logic high=enable, logic
low=shutdown
Bypass capacitor for low noise operation/Adjust output
Regulated output voltage
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
2
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Functional Block Diagram
VIN
BYP
5 (1)
1 (3)
VOUT
4
+
Bandgap
Ref.
EN
3
A (B)
A for SOT-23-5
B for SOT-89
Current Limit
Thermal Shutdown
2 (2)
GND
Fixed Regulator
VIN
1
5
4
+
EN
VOUT
ADJ
Bandgap
Ref.
3
Current Limit
Thermal Shutdown
2
GND
Adjustable Regulator
Figure 3. Functional Block Diagram of AP2202
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
3
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Ordering Information
AP2202
E1: Lead Free
G1: Green
Circuit Type
TR: Tape and Reel
Package
ADJ: Adjustable Output
2.5: Fixed Output 2.5V
2.6: Fixed Output 2.6V
2.8: Fixed Output 2.8V
3.0: Fixed Output 3.0V
3.3: Fixed Output 3.3V
K: SOT-23-5
R: SOT-89
Package
SOT-23-5
SOT-89
Temperature
Range
-40 to 125oC
-40 to 125oC
Part Number
Marking ID
Packing Type
Lead Free
Green
Lead Free
Green
AP2202K-ADJTRE1
AP2202K-ADJTRG1
E2C
G2C
Tape & Reel
AP2202K-2.5TRE1
AP2202K-2.5TRG1
E2D
G2D
Tape & Reel
AP2202K-2.6TRE1
AP2202K-2.6TRG1
E2E
G2E
Tape & Reel
AP2202K-2.8TRE1
AP2202K-2.8TRG1
E2G
G2G
Tape & Reel
AP2202K-3.0TRE1
AP2202K-3.0TRG1
E2I
G2I
Tape & Reel
AP2202K-3.3TRE1
AP2202K-3.3TRG1
E2L
G2L
Tape & Reel
AP2202R-3.3TRE1
AP2202R-3.3TRG1
E22B
G22B
Tape & Reel
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with
"G1" suffix are available in green packages.
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
4
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Value
Unit
Supply Input Voltage
VIN
15
V
Enable Input Voltage
VEN
15
V
PD
Internally Limited (Thermal Protection)
W
TLEAD
260
o
Junction Temperature
TJ
150
o
Storage Temperature
TSTG
-65 to 150
oC
200
V
Power Dissipation
Lead Temperature (Soldering, 10sec)
ESD (Machine Model)
Thermal Resistance (No Heatsink)
θJA
C
C
SOT-23-5
200
SOT-89
165
o
C/W
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.
Recommended Operating Conditions
Parameter
Symbol
Min
Max
Unit
Supply Input Voltage
VIN
2.5
13.2
V
Enable Input Voltage
VEN
0
13.2
V
TJ
-40
125
oC
Operating Junction Temperature
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
5
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics
AP2202-ADJ Electrical Characteristics
VIN=VOUT+1V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC
(note 2), unless otherwise specified.
Parameter
Symbol
Output Voltage Accuracy
∆VOUT/VOUT
Output Voltage
Temperature Coefficient
(Note 3)
∆VOUT/∆T
Conditions
Variation from specified
VOUT
Min
Typ
-1
1
-2
2
120
Line Regulation
VRLINE
VIN=VOUT+1V to 13.2V
0.004
Load Regulation
(Note 4)
VRLOAD
IOUT=0.1mA to 150mA
0.02
Dropout Voltage (Note 5)
Standby Current
Ground Pin Current
(Note 6)
IGND
Unit
%
µV/oC
0.012
0.05
%/V
0.2
%
0.5
IOUT=100µA
15
IOUT=50mA
110
IOUT=100mA
140
IOUT=150mA
165
VEN≤0.4V (shutdown)
0.01
150
230
250
mV
300
275
350
VEN≤0.18V (shutdown)
95
VEN≥2.0V, IOUT=100µA
98
VEN≥2.0V, IOUT=50mA
350
VEN≥2.0V, IOUT=100mA
600
VEN≥2.0V, IOUT=150mA
1300
ILIMIT
VOUT=0V
320
260
Regulator shutdown
µA
1000
1900
2500
Current Limit
VIL
600
1500
75
Enable Input Logic-Low
Voltage
140
800
frequency=100Hz, IOUT=100µA
eno
130
160
PSRR
Output Noise
µA
150
Ripple Rejection
IOUT=50mA, COUT=2.2µF,
100pF from BYP to GND
1
5
VEN≥2.0V, IOUT=0µA
Jul. 2011 Rev. 2. 2
50
70
VDROP
ISTD
Max
dB
550
mA
nV / Hz
0.4
0.18
V
BCD Semiconductor Manufacturing Limited
6
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-ADJ Electrical Characteristics
VIN=VOUT+1V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC
(note 2), unless otherwise specified.
Parameter
Symbol
Conditions
Enable Input
Voltage
Logic-High
VIH
Regulator enabled
Enable Input
Current
Logic-Low
IIL
VIL≤0.4V
Enable Input
Current
Logic-High
Thermal Resistance
IIH
θJC
Min
Typ
V
0.01
SOT-89
1
2
5
VIH≥2.0V
SOT-23-5
Unit
2.0
VIL≤0.18V
VIH≥2.0V
Max
20
25
63.4
50
µA
µA
oC/W
Note 2: Specifications in bold type are limited to -40oC≤TJ≤125oC. Limits over temperature are guaranteed by design, but not
tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oC≤TJ≤125oC) below its nominal value measured at 1V differential.
Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
7
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-2.5 Electrical Characteristics
VIN=3.5V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Variation from specified
VOUT
Min
Typ
Max
-1
1
-2
2
Unit
Output Voltage Accuracy
∆VOUT/VOUT
Output Voltage
Temperature Coefficient
(Note 3)
∆VOUT/∆T
120
µV/oC
(∆VOUT/VOUT)/∆T
48
ppm/oC
Line Regulation
VRLINE
VIN=3.5V to 13.2V
1
Load Regulation
(Note 4)
VRLOAD
IOUT=0.1mA to 150mA
1
Dropout Voltage (Note 5)
Standby Current
Ground Pin Current
(Note 6)
IGND
5
13
IOUT=100µA
15
50
IOUT=50mA
110
150
IOUT=100mA
140
IOUT=150mA
165
VEN≤0.4V (shutdown)
0.01
230
mV
250
mV
300
275
350
VEN≤0.18V (shutdown)
95
VEN≥2.0V, IOUT=100µA
98
VEN≥2.0V, IOUT=50mA
350
VEN≥2.0V, IOUT=100mA
600
VEN≥2.0V, IOUT=150mA
1300
ILIMIT
VOUT=0V
320
260
Regulator shutdown
µA
1000
1900
2500
Current Limit
VIL
600
1500
75
Enable Input Logic-Low
Voltage
140
800
frequency=100Hz, IOUT=100µA
eno
130
160
PSRR
Output Noise
µA
150
Ripple Rejection
IOUT=50mA, COUT=2.2µF,
100pF from BYP to GND
1
5
VEN≥2.0V, IOUT=0µA
Jul. 2011 Rev. 2. 2
mV
70
VDROP
ISTD
3
13
%
dB
550
mA
nV / Hz
0.4
0.18
V
BCD Semiconductor Manufacturing Limited
8
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-2.5 Electrical Characteristics
VIN=3.5V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Enable Input
Voltage
Logic-High
VIH
Regulator enabled
Enable Input
Current
Logic-Low
IIL
VIL≤0.4V
Enable Input
Current
Logic-High
Thermal Resistance
IIH
θJC
Min
Typ
V
0.01
SOT-89
1
2
5
VIH≥2.0V
SOT-23-5
Unit
2.0
VIL≤0.18V
VIH≥2.0V
Max
20
25
63.4
50
µA
µA
oC/W
Note 2: Specifications in bold type are limited to -40oC≤TJ≤125oC. Limits over temperature are guaranteed by design, but not
tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oC≤TJ≤125oC) below its nominal value measured at 1V differential.
Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
9
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-2.6 Electrical Characteristics
VIN=3.6V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Variation from specified
VOUT
Min
Typ
Max
-1
1
-2
2
Unit
Output Voltage Accuracy
∆VOUT/VOUT
Output Voltage
Temperature Coefficient
(Note 3)
∆VOUT/∆T
120
µV/oC
(∆VOUT/VOUT)/∆T
46
ppm/oC
Line Regulation
VRLINE
VIN=3.6V to 13.2V
1
Load Regulation
(Note 4)
VRLOAD
IOUT=0.1mA to 150mA
1
Dropout Voltage (Note 5)
Standby Current
Ground Pin Current
(Note 6)
IGND
6
14
IOUT=100µA
15
50
IOUT=50mA
110
150
IOUT=100mA
140
250
IOUT=150mA
165
275
VEN≤0.4V (shutdown)
0.01
230
mV
mV
300
350
VEN≤0.18V (shutdown)
1
5
VEN≥2.0V, IOUT=0µA
95
VEN≥2.0V, IOUT=100µA
98
VEN≥2.0V, IOUT=50mA
350
VEN≥2.0V, IOUT=100mA
600
1000
VEN≥2.0V, IOUT=150mA
1300
1900
ILIMIT
VOUT=0V
320
260
VIL
Regulator shutdown
µA
2500
Current Limit
Enable Input Logic-Low
Voltage
600
1500
75
eno
140
800
frequency=100Hz, IOUT=100µA
Output Noise
130
160
PSRR
IOUT=50mA, COUT=2.2µF,
100pF from BYP to GND
µA
150
Ripple Rejection
Jul. 2011 Rev. 2. 2
mV
70
VDROP
ISTD
3
13
%
dB
550
mA
nV / Hz
0.4
0.18
V
BCD Semiconductor Manufacturing Limited
10
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-2.6 Electrical Characteristics
VIN=3.6V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Enable Input
Voltage
Logic-High
VIH
Regulator enabled
Enable Input
Current
Logic-Low
IIL
VIL≤0.4V
Enable Input
Current
Logic-High
Thermal Resistance
IIH
θJC
Min
Typ
V
0.01
SOT-89
1
2
5
VIH≥2.0V
SOT-23-5
Unit
2.0
VIL≤0.18V
VIH≥2.0V
Max
20
25
63.4
50
µA
µA
oC/W
Note 2: Specifications in bold type are limited to -40oC≤TJ≤125oC. Limits over temperature are guaranteed by design, but not
tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oC≤TJ≤125oC) below its nominal value measured at 1V differential.
Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
11
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-2.8 Electrical Characteristics
VIN=3.8V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Variation from specified
VOUT
Min
Typ
Max
-1
1
-2
2
Unit
Output Voltage Accuracy
∆VOUT/VOUT
Output Voltage
Temperature Coefficient
(Note 3)
∆VOUT/∆T
120
µV/oC
(∆VOUT/VOUT)/∆T
42.8
ppm/oC
Line Regulation
VRLINE
VIN=3.8V to 13.2V
1
Load Regulation
(Note 4)
VRLOAD
IOUT=0.1mA to 150mA
1
Dropout Voltage (Note 5)
Standby Current
Ground Pin Current
(Note 6)
IGND
6
14
IOUT=100µA
15
50
IOUT=50mA
110
150
IOUT=100mA
140
IOUT=150mA
165
VEN≤0.4V (shutdown)
0.01
230
mV
250
mV
300
275
350
VEN≤0.18V (shutdown)
1
5
VEN≥2.0V, IOUT=0µA
95
VEN≥2.0V, IOUT=100µA
98
VEN≥2.0V, IOUT=50mA
350
VEN≥2.0V, IOUT=100mA
600
1000
VEN≥2.0V, IOUT=150mA
1300
1900
ILIMIT
VOUT=0V
320
260
VIL
Regulator shutdown
µA
2500
Current Limit
Enable Input Logic-Low
Voltage
600
1500
75
eno
140
800
frequency=100Hz, IOUT=100µA
Output Noise
130
160
PSRR
IOUT=50mA, COUT=2.2µF,
100pF from BYP to GND
µA
150
Ripple Rejection
Jul. 2011 Rev. 2. 2
mV
70
VDROP
ISTD
4
14
%
dB
550
mA
nV / Hz
0.4
0.18
V
BCD Semiconductor Manufacturing Limited
12
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-2.8 Electrical Characteristics
VIN=3.8V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Enable Input
Voltage
Logic-High
VIH
Regulator enabled
Enable Input
Current
Logic-Low
IIL
VIL≤0.4V
Enable Input
Current
Logic-High
Thermal Resistance
IIH
θJC
Min
Typ
V
0.01
SOT-89
1
2
5
VIH≥2.0V
SOT-23-5
Unit
2.0
VIL≤0.18V
VIH≥2.0V
Max
20
25
63.4
50
µA
µA
oC/W
Note 2: Specifications in bold type are limited to -40oC≤TJ≤125oC. Limits over temperature are guaranteed by design, but not
tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oC≤TJ≤125oC) below its nominal value measured at 1V differential.
Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
13
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-3.0 Electrical Characteristics
VIN=4V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Variation from specified
VOUT
Min
Typ
Max
-1
1
-2
2
Unit
Output Voltage Accuracy
∆VOUT/VOUT
Output Voltage
Temperature Coefficient
(Note 3)
∆VOUT/∆T
120
µV/oC
(∆VOUT/VOUT)/∆T
40
ppm/oC
Line Regulation
VRLINE
VIN=4V to 13.2V
1
Load Regulation
(Note 4)
VRLOAD
IOUT=0.1mA to 150mA
1
Dropout Voltage (Note 5)
Standby Current
Ground Pin Current
(Note 6)
IGND
7
15
IOUT=100µA
15
50
IOUT=50mA
110
150
IOUT=100mA
140
IOUT=150mA
165
VEN≤0.4V (shutdown)
0.01
230
mV
250
mV
300
275
350
VEN≤0.18V (shutdown)
1
5
VEN≥2.0V, IOUT=0µA
95
VEN≥2.0V, IOUT=100µA
98
140
VEN≥2.0V, IOUT=50mA
350
600
VEN≥2.0V, IOUT=100mA
600
1000
VEN≥2.0V, IOUT=150mA
1300
1900
800
2500
75
Current Limit
ILIMIT
VOUT=0V
320
260
eno
Enable Input Logic-Low
Voltage
VIL
Regulator shutdown
µA
1500
frequency=100Hz, IOUT=100µA
Output Noise
130
160
PSRR
IOUT=50mA, COUT=2.2µF,
100pF from BYP to GND
µA
150
Ripple Rejection
Jul. 2011 Rev. 2. 2
mV
70
VDROP
ISTD
4
14
%
dB
550
mA
nV / Hz
0.4
0.18
V
BCD Semiconductor Manufacturing Limited
14
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-3.0 Electrical Characteristics
VIN=4V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Enable Input
Voltage
Logic-High
VIH
Regulator enabled
Enable Input
Current
Logic-Low
IIL
VIL≤0.4V
Enable Input
Current
Logic-High
Thermal Resistance
IIH
θJC
Min
Typ
V
0.01
SOT-89
1
2
5
VIH≥2.0V
SOT-23-5
Unit
2.0
VIL≤0.18V
VIH≥2.0V
Max
20
25
63.4
50
µA
µA
oC/W
Note 2: Specifications in bold type are limited to -40oC≤TJ≤125oC. Limits over temperature are guaranteed by design, but not
tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oC≤TJ≤125oC) below its nominal value measured at 1V differential.
Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
15
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-3.3 Electrical Characteristics
VIN=4.3V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Variation from specified
VOUT
Min
Typ
Max
-1
1
-2
2
Unit
Output Voltage Accuracy
∆VOUT/VOUT
Output Voltage
Temperature Coefficient
(Note 3)
∆VOUT/∆T
120
µV/oC
(∆VOUT/VOUT)/∆T
36.3
ppm/oC
Line Regulation
VRLINE
VIN=4.3V to 13.2V
1
Load Regulation
(Note 4)
VRLOAD
IOUT=0.1mA to 150mA
1
Dropout Voltage (Note 5)
Standby Current
Ground Pin Current
(Note 6)
IGND
8
17
IOUT=100µA
15
50
IOUT=50mA
110
150
IOUT=100mA
140
IOUT=150mA
165
VEN≤0.4V (shutdown)
0.01
230
mV
250
mV
300
275
350
VEN≤0.18V (shutdown)
1
5
VEN≥2.0V, IOUT=0µA
95
130
VEN≥2.0V, IOUT=100µA
98
140
VEN≥2.0V, IOUT=50mA
350
VEN≥2.0V, IOUT=100mA
600
VEN≥2.0V, IOUT=150mA
1300
160
Current Limit
ILIMIT
VOUT=0V
320
260
Enable Input Logic-Low
Voltage
VIL
Regulator shutdown
1000
1900
2500
75
eno
µA
1500
frequency=100Hz, IOUT=100µA
Output Noise
600
800
PSRR
IOUT=50mA, COUT=2.2µF,
100pF from BYP to GND
µA
150
Ripple Rejection
Jul. 2011 Rev. 2. 2
mV
70
VDROP
ISTD
5
15
%
dB
550
mA
nV / Hz
0.4
0.18
V
BCD Semiconductor Manufacturing Limited
16
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Electrical Characteristics (Continued)
AP2202-3.3 Electrical Characteristics
VIN=4.3V, IOUT=100µA, CIN=1.0µF, COUT=2.2µF, VEN≥2.0V, TJ=25oC, Bold typeface applies over -40oC≤TJ≤125oC (note 2),
unless otherwise specified.
Parameter
Symbol
Conditions
Enable Input
Voltage
Logic-High
VIH
Regulator enabled
Enable Input
Current
Logic-Low
IIL
VIL≤0.4V
Enable Input
Current
Logic-High
Thermal Resistance
IIH
θJC
Min
Typ
V
0.01
SOT-89
1
2
5
VIH≥2.0V
SOT-23-5
Unit
2.0
VIL≤0.18V
VIH≥2.0V
Max
20
25
63.4
50
µA
µA
oC/W
Note 2: Specifications in bold type are limited to -40oC≤TJ≤125oC. Limits over temperature are guaranteed by design, but not
tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oC≤TJ≤125oC) below its nominal value measured at 1V differential.
Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
17
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Typical Performance Characteristics
350
2.875
AP2202-2.8
VIN=3.8V, IOUT=10mA
2.850
CIN=1.0µF, COUT=2.2µF
IOUT=50mA
300
Dropout Voltage (mV)
Output Voltage (V)
2.900
2.825
2.800
2.775
2.750
250
IOUT=100mA
IOUT=150mA
CIN=1.0µF, COUT=2.2µF
200
150
100
50
2.725
2.700
-60
-40
-20
0
20
40
60
80
100
120
0
-60
140
-40
-20
o
20
40
60
80
100
120
140
Junction Temperature ( C)
Figure 4. Output Voltage vs. Junction Temperature
Figure 5. Dropout Voltage vs. Junction Temperature
5000
6
o
5
TA=25 C
4
CIN=1.0µF, COUT=2.2µF
4000
AP2202-2.8
IOUT=50mA
IOUT=100mA
Ground Pin Current (µA)
Ground Pin Current (mA)
0
o
Junction Temperature ( C)
3
2
1
0
-1
IOUT=150mA
3000
VIN=3.8V,VEN=2.0V
2000
CIN=1.0µF, COUT=2.2µF
1000
0
-2
-1000
-3
-4
0
10
20
30
40
50
60
70
80
-2000
-60
90 100 110 120 130 140 150
Output Current (mA)
-40
-20
0
20
40
60
80
100
120
140
o
Junction Temperature ( C)
Figure 6. Ground Pin Current vs. Output Current
Figure 7. Ground Pin Current vs. Junction Temperature
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
18
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Typical Performance Characteristics (Continued)
2.0
20
AP2202-2.8
Enable Current (µA)
16
1.9
VEN=2.0V
1.8
VIN=3.8V, CIN=1.0µF
12
COUT=2.2µF, IOUT=100µA
10
AP2202-2.8
VEN=on
VEN=off
1.7
VEN=3.0V
VEN=4.0V
14
Enable Voltage (V)
18
VEN=1.8V
8
6
1.6
CIN=1.0µF,COUT=2.2µF
1.5
VIN=3.8V,IOUT=5mA
1.4
1.3
1.2
1.1
1.0
0.9
4
0.8
2
0
-60
0.7
-40
-20
0
20
40
60
80
100
120
0.6
-60
140
-40
-20
0
20
60
80
100
120
140
Junction Temperature ( C)
Junction Temperature ( C)
Figure 8. Enable Current vs. Junction Temperature
Figure 9. Enable Voltage vs. Junction Temperature
200
10
AP2202-2.8
CIN=1.0µF, COUT=2.2µF, CBYP=100pF
IOUT=10mA
CIN=1.0µF, COUT=2.2µF
Output Noise ( µV/ Hz )
Noise Measurement Filter: DIN Noise
150
Noise (µVrms)
40
o
o
100
50
0
10
100
1000
0.1
0.01
0.001
10
10000
Bypass Capacitor (pF)
VIN=4.5V, IOUT=10mA
1
100
1k
10k
100k
1M
10M
Frequency (Hz)
Figure 10. Noise vs. Bypass Capacitor
Figure 11. Output Noise vs. Frequency
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
19
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Typical Performance Characteristics (Continued)
5.8
150
AP2202-2.8
VIN (v)
IOUT (mA)
4.8
AP2202-2.8
100
50
3.8
2.8
0
20
∆VOUT (mV)
∆VOUT (mV)
50
0
-50
0
10
20
30
40
50
60
70
80
-40
0
90 100
20
40
60
80
100 120 140 160 180 200
Time (µs)
Time (µs)
Figure 12. Load Transient
(Conditions: VIN=3.8V, CBYP=100pF, VEN=2V,
IOUT=5mA to 50mA, CIN=1.0µF, COUT=2.2µF)
Figure 13. Line Transient
(Conditions: VIN=3.8V to 4.8V, VEN=2V, IOUT=100µA
CBYP=100pF, COUT=10µF)
4
100
AP2202-2.8
2
AP2202-2.8
VIN=3.8V, VRIPPLE=1VPP
90
80
0
IOUT=10mA, COUT=2.2µF
70
3
PSRR (dB)
VEN (V)
-20
-60
-100
2
1
VOUT (V)
0
50
40
30
0
20
10
-1
-2
60
0
10
0
100
200 300 400
500
600 700
800 900 1000
100
1k
10k
100k
1M
Frequency (Hz)
Time (µs)
Figure 14. VEN(on) vs. VOUT
(Conditions: VEN=0V to 2V, VIN=3.8V, IOUT=30mA,
CBYP=open, CIN=1.0µF, COUT=2.2µF)
Jul. 2011 Rev. 2. 2
Figure 15. PSRR vs. Frequency
BCD Semiconductor Manufacturing Limited
20
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Typical Performance Characteristics (Continued)
0.8
0.8
SOT-23-5 Package
No Heatsink
SOT-89 Package
No Heatsink
0.7
0.6
0.6
Power Dissipation (W)
Power Dissipation (W)
0.7
0.5
0.4
0.3
0.2
0.5
0.4
0.3
0.2
0.1
0.1
0.0
25
50
75
100
125
0.0
25
150
50
o
75
100
Figure 17. Power Dissipation vs. Ambient Temperature
100
100
COUT=1.0µF
10
COUT=2.2µF
10
No Bypass Capacitor
1
No Bypass Capacitor
ESR (Ω)
ESR (Ω)
150
Ambient Temperature ( C)
Figure 16. Power Dissipation vs. Ambient Temperature
Stable Area
0.1
0.01
125
o
Ambient Temperature ( C)
Stable Area
1
0.1
0
25
50
75
100
125
0.01
150
0
25
50
75
100
125
150
Output Current (mA)
Output Current (mA)
Figure 18. ESR vs. Output Current
Figure 19. ESR vs. Output Current
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
21
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Typical Performance Characteristics (Continued)
100
COUT=4.7µF
ESR (Ω)
10
No Bypass Capacitor
1
Stable Area
0.1
0.01
0
25
50
75
100
125
150
Output Current (mA)
Figure 20. ESR vs. Output Current
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
22
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Typical Application
AP2202-2.8
VIN=3.8V
VIN
VIN
VOUT
VOUT=2.8V
VOUT
EN
CIN
GND
COUT
BYP
1.0µF
2.2µF
CBYP
100pF
VIN
VIN
AP2202-ADJ
VOUT
VOUT
R1
CIN
EN
GND
ADJ
1.0 µF
CBYP
COUT
R2
2.2 µ F
optional
VOUT=1.25* (1+R2/R1)
Figure 21. Typical Application of AP2202 (Note 7)
Note 7: Dropout voltage is 165mV when TA=25oC. In order to obtain a normal output voltage, VOUT+0.165V is the minimum
input voltage which will result a low PSRR, imposing a bad influence on system. Therefore, the recommended input voltage
is VOUT+0.5V to 13.2V. For AP2202-2.8 version, its input voltage can be set from 3.3V(VOUT+0.5V) to 13.2V. For that of
Adj version, any value from VOUT+0.5V to 13.2V is available. R1 and R2 must be correctly selected when setting the output
voltage. For example, if 3.0V output voltage is required, R1 and R2 can be set to 10kΩ and 14kΩ respectively. For Adj version, we recommend 2.3V as minimum output voltage.
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
23
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Application Information
Input Capacitor
A 1µF minimum capacitor is recommended to be
placed between VIN and GND.
To determine if the power dissipated in the regulator
reaches the maximum power dissipation (see figure
16,17), using:
TJ = PD*θJA + TA
PD=(VIN-VOUT)*IOUT+VIN*IGND
Output Capacitor
It is required to prevent oscillation. 1.0µF minimum
is recommended when CBYP is unused. 2.2µF minimum is recommended when CBYP is 100pF. The output capacitor may be increased to improve transient
response.
Where: TJ≤TJ(max), TJ(max) is absolute maximum ratings for the junction temperature; VIN*IGND can be
ignored due to its small value.
TJ(max) is 150oC, θJA is 200oC/W for SOT-23-5 pack-
Noise Bypass Capacitor
Bypass capacitor is connected to the internal voltage
reference. A 100pF capacitor connected from BYP to
GND make this reference quiet, resulting in a
significant reduction in output noise, but the ESR
stable area will be narrowed.
age and 165oC/W for SOT-89 package, no heatsink is
required since the package alone will dissipate
enough heat to satisfy these requirements unless the
calculated value for power dissipation exceeds the
limit.
Example: For 2.8V version packaged in SOT-23-5,
IOUT=150mA, TA=50oC, VIN(Max) is:
The start-up speed of the AP2202 is inversely
proportional to the value of reference bypass
capacitor. In some cases, if output noise is not a
major concern and rapid turn-on is necessary, omit
CBYP and leave BYP open.
(150oC-50oC)/(0.15A*200oC/W)+2.8V=6.133V
Therefore, for good performance, please make sure
that input voltage is less than 6.133V without heatsink when TA=50oC.
Power Dissipation
Thermal shutdown may take place if exceeding the
maximum power dissipation in application. Under all
possible operating conditions, the junction temperature must be within the range specified under absolute maximum ratings to avoid thermal shutdown.
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
24
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Mechanical Dimensions
SOT-23-5
Unit: mm(inch)
0.300(0.012)
0.600(0.024)
1.500(0.059)
1.700(0.067)
0.100(0.004)
0.200(0.008)
2.950(0.116)
2.650(0.104)
2.820(0.111)
3.020(0.119)
0.200(0.008)
0.700(0.028)
REF
0.300(0.012)
0.400(0.016)
0°
8°
1.800(0.071)
2.000(0.079)
0.000(0.000)
MAX
1.450(0.057)
0.950(0.037)
TYP
0.150(0.006)
0.900(0.035)
1.300(0.051)
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
25
www.BDTIC.com/DIODES
Data Sheet
150mA RF ULDO REGULATOR
AP2202
Mechanical Dimensions (Continued)
SOT-89
1.550(0.061)REF
Unit: mm(inch)
4.400(0.173)
4.600(0.181)
1.400(0.055)
1.600(0.063)
1.030(0.041)REF
45
2.300(0.091)
2.600(0.102)
3.950(0.156)
4.250(0.167)
2.060(0.081)REF
3
0.900(0.035)
1.100(0.043)
0.320(0.013)
0.520(0.020)
0.480(0.019)
0.320(0.013)
0.520(0.020)
10
0.350(0.014)
0.450(0.018)
3.000(0.118)
TYP
1.500(0.059)
1.800(0.071)
0.320(0.013)REF
3
2.210(0.087)REF
1.620(0.064)REF
R0.150(0.006)
10
Jul. 2011 Rev. 2. 2
BCD Semiconductor Manufacturing Limited
26
www.BDTIC.com/DIODES
BCD Semiconductor Manufacturing Limited
http://www.bcdsemi.com
IMPORTANT
IMPORTANT NOTICE
NOTICE
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited reserves
reserves the
the right
right to
to make
make changes
changes without
without further
further notice
notice to
to any
any products
products or
or specifispecifiBCD
cations herein.
herein. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not assume
assume any
any responsibility
responsibility for
for use
use of
of any
any its
its products
products for
for any
any
cations
particular
purpose, nor
nor does
does BCD
BCD Semiconductor
particular purpose,
Semiconductor Manufacturing
Manufacturing Limited
Limited assume
assume any
any liability
liability arising
arising out
out of
of the
the application
application or
or use
use
of
circuits. BCD
of any
any its
its products
products or
or circuits.
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not convey
convey any
any license
license under
under its
its patent
patent rights
rights or
or
other
rights of
of others.
others.
other rights
rights nor
nor the
the rights
MAIN
SITE
MAIN SITE
- Headquarters
BCD
Semiconductor Manufacturing Limited
BCD
Semiconductor
Manufacturing Limited
- Wafer
Fab
No.
1600, Zi
Xing Road,
Shanghai ZiZhu
Science-basedLimited
Industrial Park, 200241, China
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Tel:
Fax: +86-21-24162277
800,+86-21-24162266,
Yi Shan Road, Shanghai
200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
REGIONAL SALES OFFICE
Shenzhen OfficeSALES OFFICE
REGIONAL
- Wafer
FabSemiconductor Manufacturing Limited
BCD
Shanghai
SIM-BCD
Semiconductor Manufacturing Co., Ltd.
- IC Design
Group
800 Yi
Shan Road,
Shanghai
200233,
China Corporation
Advanced
Analog
Circuits
(Shanghai)
Tel: +86-21-6485
1491,YiFax:
0008200233, China
8F, Zone B, 900,
Shan+86-21-5450
Road, Shanghai
Tel: +86-21-6495 9539, Fax: +86-21-6485 9673
Taiwan Office
Shanghai
Semiconductor Manufacturing Co., Ltd., Shenzhen Office
BCD Taiwan
Semiconductor
Shenzhen SIM-BCD
Office
Office (Taiwan) Company Limited
Unit
A Room
1203, Skyworth
Bldg., Gaoxin
Ave.1.S., Nanshan
Shenzhen,
4F, 298-1,
Guang Road,(Taiwan)
Nei-Hu District,
Taipei,
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Co., Ltd.District,
Shenzhen
Office
BCDRui
Semiconductor
Company
Limited
China
Taiwan
Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
Tel:
+86-755-8826
Tel: +886-2-2656
2808
Room
E, 5F, Noble 7951
Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China
Taiwan
Fax:
+86-755-88267951
7865
Fax: +886-2-2656
28062808
Tel: +86-755-8826
Tel: +886-2-2656
Fax: +86-755-8826 7865
Fax: +886-2-2656 2806
USA Office
BCD Office
Semiconductor Corp.
USA
30920Semiconductor
Huntwood Ave.Corporation
Hayward,
BCD
CA 94544,
USA Ave. Hayward,
30920
Huntwood
Tel :94544,
+1-510-324-2988
CA
U.S.A
Fax:: +1-510-324-2988
+1-510-324-2788
Tel
Fax: +1-510-324-2788
www.BDTIC.com/DIODES
Related documents