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FQD9N25 / FQU9N25 N-Channel QFET® MOSFET 250 V, .4 A, PΩ Description Features This N-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor’s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, active power factor correction (PFC), and electronic lamp ballasts. • 7.4 A, 250 V, RDS(on) = 420 mΩ (Max.) @VGS = 10 V, ID = 3.7 A • Low Gate Charge (Typ. 15.5 nC) • Low Crss (Typ. 15 pF) • 100% Avalanche Tested D D G S I-PAK D-PAK G D G S S Absolute Maximum Ratings T Symbol , o C = 25 C unless otherwise noted. FQD9N25TM FQD9N25TM_F080 FQU9N25TU )*+ Parameter 5 , 2.)*63 5 , :, < 7(! < 5 < 2.0++63 !$ 7 7 Unit , &' ( '& ( )8 9 ( ±;+ , 09* = (! &' ( -!(! < 7>-!!$ 7 2 .)*63? ** ** )* = ,$ @ ** + '' **A0*+ @ @$6 6 ;++ 6 7 2.)*63 "!)*6 - B 0$C* Thermal Characteristics Symbol RJC RJA FQD9N25TM FQD9N25TM_F080 FQU9N25TU 2.27 Parameter Thermal Resistance, Junction to Case, Max. Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max. 2 Thermal Resistance, Junction to Ambient (*1 in pad of 2 oz copper), Max. ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 1 110 Unit oC/W 50 www.fairchildsemi.com FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET October 2013 Part Number FQD9N25TM Top Mark FQD9N25 Package D-PAK Packing Method Tape and Reel Reel Size 330 mm Tape Width 16 mm Quantity 2500 units FQD9N25TM_F080 FQD9N25 D-PAK Tape and Reel 330 mm 16 mm 2500 units FQU9N25TU FQU9N25 I-PAK Tube N/A N/A 70 units Electrical Characteristics T o C = 25 C unless otherwise noted. )*+ , ,$6 D, D> , ,.+,5.)*+µ( ∆D, $∆ D> , 5.)*+µ(- )*6 +) ,.)*+,,.+, 0 µ( ,.)++,.0)*6 0+ µ( 5 E:, 5 :D1> ,.;+,,.+, 0++ ( 5 :D1> -! ,.;+,,.+, 0++ ( ;+ *+ , , :, ,.,5.)*+µ( - - ,.0+,5.; &( + ;; + ') Ω ,.*+,5.; &( 9C 5 *'+ &++ 00+ 0'* ,.)*,,.+, .0 +F# -! 0* )+ - G : G : G : ,.0)*,5.8 '( -.)*Ω ,.)++,5.8.'( ,.0+, 0; ;* 0+* ))+ )* 9+ '* 0++ 0* * )+ ;C C* 5 B &' ( 5 )8 9 ( , B7 ,.+,5.& '( , 0* , -!-! 0*+ G -!-! +C µ ,.+,5.8 '( 5$.0++($µ 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 4.8 mH, IAS = 7.4 A, VDD = 50 V, RG = 25 Ω, Starting TJ = 25oC 3. ISD ≤ 9.4 A, di/dt ≤ 300 A/μs, VDD ≤ BVDSS, Starting TJ = 25oC 4. Essentially independent of operating temperature ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 2 www.fairchildsemi.com FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET Package Marking and Ordering Information ' %#& RDS(ON) [Ω], Drain-Source On-Resistance !"# ! " #$ ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 3 www.fairchildsemi.com FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET ! #! $% 01( # " -.! #$ / #$ $%&'&'&(% &)&&*+, µ µ -.&'/ !" ()*$$"&+ ',)*$$ #$ ! " # $ % & ' ( ZJC(t), Thermal Response [oC/W] " ! ! ''##$ ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 4 www.fairchildsemi.com FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET ! FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET 50KΩ 200nF 12V VGS Same Type as DUT Qg 10V 300nF VDS VGS Qgs Qgd DUT IG = const. 3mA Charge Figure 12. Gate Charge Test Circuit & Waveform VDS RG RL VDS 90% VDD VGS VGS DUT V 10V GS 10% td(on) tr td(off) t on t off tf Figure 13. Resistive Switching Test Circuit & Waveforms VDS BVDSS 1 EAS = ---- L IAS2 -------------------2 BVDSS - VDD L BVDSS IAS ID RG V 10V GS GS VDD ID (t) VDS (t) VDD DUT tp Time tp Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 5 www.fairchildsemi.com + VDS _ I SD L Driver RG VGS VGS ( Driver ) I SD ( DUT ) Same Type as DUT VDD • dv/dt controlled by RG • ISD controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt VSD VDD Body Diode Forward Voltage Drop Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 6 www.fairchildsemi.com FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET DUT FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET Mechanical Dimensions TO-252 3L (DPAK) FQD9N25TM Figure 16. TO252 (D-PAK), Molded, 3 Lead, Option AA&AB Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT252-003. Dimension in Millimeters ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 7 www.fairchildsemi.com FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET Mechanical Dimensions TO-252 3L (DPAK) FQD9N25TM_F080 Figure 17. 3LD, TO-252, Jedec TO-252 VAR. AB, Surface Mount Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO252-003. Dimension in Millimeters ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 8 www.fairchildsemi.com FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET Mechanical Dimensions TO-251 3L (IPAK) Figure 18. TO251 (IPAK) Molded 3 Lead Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO251-003. Dimension in Millimeters ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 9 www.fairchildsemi.com tm *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used here in: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I66 ©2000 Fairchild Semiconductor Corporation FQD9N25 / FQU9N25 Rev. C1 10 www.fairchildsemi.com FQD9N25 / FQU9N25 — N-Channel QFET® MOSFET TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Sync-Lock™ F-PFS™ AccuPower™ ® FRFET® AX-CAP®* ®* ® SM BitSiC™ Global Power Resource PowerTrench GreenBridge™ PowerXS™ Build it Now™ TinyBoost® Green FPS™ Programmable Active Droop™ CorePLUS™ TinyBuck® ® Green FPS™ e-Series™ QFET CorePOWER™ TinyCalc™ QS™ Gmax™ CROSSVOLT™ TinyLogic® Quiet Series™ GTO™ CTL™ TINYOPTO™ RapidConfigure™ IntelliMAX™ Current Transfer Logic™ TinyPower™ ISOPLANAR™ DEUXPEED® ™ TinyPWM™ Dual Cool™ Marking Small Speakers Sound Louder TinyWire™ EcoSPARK® Saving our world, 1mW/W/kW at a time™ and Better™ TranSiC™ EfficentMax™ SignalWise™ MegaBuck™ TriFault Detect™ ESBC™ SmartMax™ MICROCOUPLER™ TRUECURRENT®* SMART START™ MicroFET™ ® SerDes™ Solutions for Your Success™ MicroPak™ SPM® MicroPak2™ Fairchild® STEALTH™ MillerDrive™ Fairchild Semiconductor® UHC® SuperFET® MotionMax™ FACT Quiet Series™ ® Ultra FRFET™ SuperSOT™-3 mWSaver FACT® UniFET™ SuperSOT™-6 OptoHiT™ FAST® VCX™ SuperSOT™-8 OPTOLOGIC® FastvCore™ VisualMax™ OPTOPLANAR® SupreMOS® FETBench™ VoltagePlus™ SyncFET™ FPS™ XS™