Download BSS138K N-Channel Logic Level Enhancement Mode Field Effect Transistor BSS138K — N-Channel Logic

BSS138K
N-Channel Logic Level Enhancement Mode Field Effect
Transistor
Features
•
•
•
•
•
•
•
•
•
Low On-Resistance
D
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
S
Low Input/Output Leakage
G
Ultra-Small Surface Mount Package
SOT - 23
Marking : SK
Pb Free / RoHS Compliant
Green Compound
ESD HBM = 2000 V as per JEDEC A114A; ESD CDM = 2000 V as per JEDEC C101C
Absolute Maximum Ratings(1)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Value
Units
VDSS
Drain-Source Voltage
50
V
VGSS
Gate-Source Voltage
±12
V
Continuous
0.22
Pulsed
0.88
ID
Drain Current
TJ
Operating Junction Temperature Range
-55 to +150
°C
Storage Temperature Range
-55 to +150
°C
TSTG
A
Note:
1. These ratings are limiting values above which the serviceability of any semiconductor device maybe impaired.
Thermal Characteristics
Symbol
PD
RθJA
Parameter
Value
Units
Total Device Dissipation
350
mW
Derating above TA = 25°C
2.8
mW/°C
Thermal Resistance, Junction to Ambient(2)
350
°C/W
Note:
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch. Minimum land pad size.
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape Width
Quantity
SK
BSS138K
7”
8 mm
3000 units
© 2010 Fairchild Semiconductor Corporation
BSS138K Rev. 1.3.0
www.fairchildsemi.com
1
BSS138K — N-Channel Logic Level Enhancement Mode Field Effect Transistor
May 2013
Values are at TA = 25°C unless otherwise noted
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Units
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage VGS = 0 V, ID = 10 μA
BVDSS
TJ
Breakdown Voltage
Temperature Coefficient
ID = 250 μA, Referenced to 25°C
Zero Gate Voltage Drain Current
VDS = 50 V, VGS = 0 V
0.1
VGS = ±12 V, VDS = 0 V
±1
IDSS
IGSS
Gate-Body Leakage
50
V
0.11
V/°C
VGS = ±10 V, VDS = 0 V
±0.5
VGS = ±5 V, VDS = 0 V
±0.05
μA
μA
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250 μA
VGS(th)
TJ
Gate Threshold Voltage
Temperature Coefficient
ID = 1 mA, Referenced to 25°C
RDS(ON)
Static Drain-Source
On-Resistance
ID(ON)
gFS
0.6
1.2
-1.4
V
mV/°C
VGS = 1.8V, ID = 50 mA,
2.5
VGS = 2.5 V, ID = 50 mA
2.0
VGS = 5V, ID = 50 mA
1.6
Ω
On-State Drain Current
VGS = 10 V, VDS = 5 V
0.2
A
Forward Transconductance
VDS = 10 V, ID = 200 mA
200
mS
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
RG
Gate Resistance
58
VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
9.75
VDS = 5 V, VGS = 10 mV
281
pF
5.2
Ω
Switching Characteristics
tD(ON)
Turn-On Delay Time
tr
Turn-On Rise Time
tD(OFF)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Change
Qgs
Gate-Source Change
Qgd
Gate-Drain Change
5
VDD = 30 V, ID = 0.29 A,
VGS = 10 V, RGEN = 6 Ω
5
60
ns
35
2.4
VDS = 25 V, ID = 0.2 A,
VGS = 10 V, IG = 0.1 mA
0.5
nC
0.5
Drain-Source Diode Characteristics and Maximum Ratings
Vsd
Drain-Source Diode
Forward Voltage
VGS = 0 V, IS = 115 mA
© 2010 Fairchild Semiconductor Corporation
BSS138K Rev. 1.3.0
1.2
V
www.fairchildsemi.com
2
BSS138K — N-Channel Logic Level Enhancement Mode Field Effect Transistor
Electrical Characteristics
2.00
VGS = 10V
4V
5V
1.5
RDS(on), (Ω)
DRANI-SOURCE ON-RESISTANCE
ID. DRAIN-SOURCE CURRENT(A)
2.0
3V
1.0
2V
0.5
2
4
6
8
10
6V
5V
4.5V
1.50
4V
VGS = 3V
1.25
1.00
0.2
0.4
9V
8V
7V
0.75
0.0
0.0
0
1.75
0.6
10V
0.8
1.0
ID. DRAIN-SOURCE CURRENT(A)
VDS. DRAIN-SOURCE VOLTAGE (V)
Figure 2. On-Resistance Variation with Gate
Voltage and Drain Current
Figure 1. On-Region Characteristics
RDS(on) (Ω)
DRANI-SOURCE ON-RESISTANCE
2.5
VDS = 10V
ID = 500 mA
2.0
1.5
1.0
0.5
-50
0
50
100
150
o
TJ. JUNCTION TEMPERATURE( C)
Figure 4. On-Resistance Variation with Gate-Source
Voltage
Figure 3. On-Resistance Variation with Temperature
Vth, Gate-Source Threshold Voltage (V)
ID. DRAIN-SOURCE CURRENT(A)
3.0
VDS = 10V
2.5
o
25( C)
o
TJ = -25( C)
2.0
1.5
1.0
o
o
75( C)
0.5
2.0
2.5
3.0
3.5
4.0
4.5
o
125( C) 150( C)
5.0
5.5
VDS = VGS
1.0
ID = 1 mA
ID = 0.25 mA
0.5
0.0
-50
6.0
0
50
100
150
o
TJ. JUNCTION TEMPERATURE( C)
VGS. GATE-SOURCE VOLTAGE (V)
Figure 6. Gate Threshold Variation with Temperature
Figure 5. Transfer Characteristics
© 2010 Fairchild Semiconductor Corporation
BSS138K Rev. 1.3.0
1.5
www.fairchildsemi.com
3
BSS138K — N-Channel Logic Level Enhancement Mode Field Effect Transistor
Typical Performance Characteristics
BSS138K — N-Channel Logic Level Enhancement Mode Field Effect Transistor
Typical Performance Characteristics (Continue)
IS Reverse Drain Current, [mA]
VGS = 0 V
100
o
150 C
o
25 C
10
o
-55 C
1
0.0
0.2
0.4
0.6
0.8
1.0
VSD, Body Diode Forward Voltage [V]
Figure 7. Reverse Drain Current Variation with
Diode Forward Voltage and Temperature
© 2010 Fairchild Semiconductor Corporation
BSS138K Rev. 1.3.0
www.fairchildsemi.com
4
BSS138K — N-Channel Logic Level Enhancement Mode Field Effect Transistor
Physical Dimensions
SOT-23
0.95
2.92±0.20
3
1.40
1.30+0.20
-0.15
1
2.20
2
0.60
0.37
(0.29)
0.95
0.20
1.00
A B
1.90
1.90
LAND PATTERN
RECOMMENDATION
SEE DETAIL A
1.20 MAX
0.10
0.00
(0.93)
0.10
C
C
2.40±0.30
NOTES: UNLESS OTHERWISE SPECIFIED
GAGE PLANE
0.23
0.08
A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M - 1994.
E) DRAWING FILE NAME: MA03DREV10
0.25
0.20 MIN
(0.55)
SEATING
PLANE
SCALE: 2X
Figure 8. 3LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packaging/tr/SOT23-3L_tr.pdf.
© 2010 Fairchild Semiconductor Corporation
BSS138K Rev. 1.3.0
www.fairchildsemi.com
5
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
FPS¥
F-PFS¥
FRFET®
SM
Global Power Resource
GreenBridge¥
Green FPS¥
Green FPS¥ e-Series¥
Gmax¥
GTO¥
IntelliMAX¥
ISOPLANAR¥
Making Small Speakers Sound Louder
and Better™
MegaBuck¥
MICROCOUPLER¥
MicroFET¥
MicroPak¥
MicroPak2¥
MillerDrive¥
MotionMax¥
mWSaver¥
OptoHiT¥
OPTOLOGIC®
OPTOPLANAR®
2Cool¥
AccuPower¥
AX-CAP®*
BitSiC¥
Build it Now¥
CorePLUS¥
CorePOWER¥
CROSSVOLT¥
CTL¥
Current Transfer Logic¥
DEUXPEED®
Dual Cool™
EcoSPARK®
EfficientMax¥
ESBC¥
®
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series¥
FACT®
FAST®
FastvCore¥
FETBench¥
Sync-Lock™
®
PowerTrench®
PowerXS™
Programmable Active Droop¥
QFET®
QS¥
Quiet Series¥
RapidConfigure¥
¥
Saving our world, 1mW/W/kW at a time™
SignalWise¥
SmartMax¥
SMART START¥
Solutions for Your Success¥
SPM®
STEALTH¥
SuperFET®
SuperSOT¥-3
SuperSOT¥-6
SuperSOT¥-8
SupreMOS®
SyncFET¥
®*
TinyBoost¥
TinyBuck¥
TinyCalc¥
TinyLogic®
TINYOPTO¥
TinyPower¥
TinyPWM¥
TinyWire¥
TranSiC¥
TriFault Detect¥
TRUECURRENT®*
PSerDes¥
UHC®
Ultra FRFET¥
UniFET¥
VCX¥
VisualMax¥
VoltagePlus¥
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
intended for surgical implant into the body or (b) support or sustain
life, and (c) whose failure to perform when properly used in
cause the failure of the life support device or system, or to affect its
accordance with instructions for use provided in the labeling, can be
safety or effectiveness.
reasonably expected to result in a significant injury of the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors
are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical
and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.
Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Definition
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I64
© Fairchild Semiconductor Corporation
www.fairchildsemi.com