Download FSA850 Audio 3-Pole / 4-Pole MIC-GND Switch FSA8

FSA850
Audio 3-Pole / 4-Pole MIC-GND Switch
Description
Features
Switch Type
VCC
THD (MIC)
ESD
IEC 61000-4-2 (Air Gap)
IEC 61000-4-2 (Contact)
HBM (All Pins)
GNDnA/GNDnB to GND
Power to GND
CDM
Operating Temperature
RON Maximum (GND1n)
RON Maximum (SENSE)
The FSA850 is a 3-pole or 4-pole audio jack microphone
GND switch for accessories with General-Purpose Input /
Output (GPIO) control signals. The FSA850 also has the
ability to perform 4-pole cross-point switching to support
Open Mobile Terminal Platform (OMTP) 4-pole headset
plugs. The architecture is designed to replace discrete
MOSFET solutions and allow common third-party
headphones to be used for listening to music or playing
video from mobile handsets, personal media players, and
portable peripheral devices.
3-Pole/4-Pole MIC - GND
2.3 to 4.5 V
0.001% Typical
15 kV
8 kV
3 kV
8 kV
10 kV
2 kV
-40°C to 85°C
0.08 Ω
1Ω
 Supports 4-Pole OMTP Cross Point Switching for GND
Connection
 Integrates a MIC switch for 3- or 4-Pole Configuration
Headset Plugs
 Reduces “Pop and Click” Caused by Microphone Bias
Applications
Related Resources
 3.5 mm and 2.5 mm Audio Jacks
 Cellular Phones, Smart Phones
 MP3 and PMP (Portable Media Player)
 For samples and questions, please contact:
[email protected].
Typical Application
FSA850
SENSE
VCC
Charge
Pump,
Oscillator &
POR
01
00/10
MIC/GND2A
MIC
11
Audio
CODEC
MIC Bias
10/11
RMIC
MIC/GND2B
MIC +
MIC L SPKR
To Audio Plug
Detection
Block
00
CMIC
MIC/GND1A
S0
R SPKR
S1
Baseband
Processor
GPIO
Switch &
Charge
Pump
Control
Logic
10/11
00/10
MIC/GND1B
3-Pole
4-Pole
GND
GPIO1
GPIO2
Figure 1. Typical Mobile Application
© 2011 Fairchild Semiconductor Corporation
FSA850 • Rev. 1.0.1
www.fairchildsemi.com
FSA850 — Audio 3-Pole / 4-Pole MIC-GND Switch
September 2013
FSA850 — Audio 3-Pole / 4-Pole MIC-GND Switch
Physical Dimensions
0.03 C
E
2X
F
A
0.80
B
1.20
0.40
PIN 1 AREA
D
(Ø0.200)
Cu Pad
(Ø0.300)
Solder Mask
0.40
0.03 C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.378±0.018
0.208±0.021
0.625
0.547
0.05 C
C
SEATING PLANE
D
SIDE VIEWS
0.005
0.80
0.40
1.20
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
D
C
B
A
0.40
C A B
Ø0.260±0.02
12X
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
(Y)±0.018
F
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
1 2 3
(X)±0.018
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
BOTTOM VIEW
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: MKT-UC012ACrev1.
Figure 4. 12-Bump, Wafer-Level Chip Scale Package (WLCSP), 1.2mmx1.6mm, 0.4mm Pitch
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/UC/UC012AC.pdf
Ordering Information
Part
Number
Operating
Temperature
Range
Top
Mark
Package
FSA850UCX
-40 to +85°C
M5
12-Ball, Wafer-Level Chip-Scale Package
(WLCSP), 3x4 Array, 0.4mm Pitch,
250 µm Ball
© 2011 Fairchild Semiconductor Corporation
FSA850 • Rev. 1.0.1
D
E
X
Y
1.16 mm 1.56 mm 0.18 mm 0.18 mm
www.fairchildsemi.com
6
FSA850 — Audio 3-Pole / 4-Pole MIC-GND Switch
© 2011 Fairchild Semiconductor Corporation
FSA850 • Rev. 1.0.1
www.fairchildsemi.com
7