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Ultralow Noise VGAs with
Preamplifier and Programmable RIN
AD8331/AD8332/AD8334
FEATURES
VCM
HILO
3.5dB OR 15.5dB
VMID
–
48dB
ATTENUATOR
+
19dB
INH
LMD
VCM
BIAS
VGA BIAS AND
INTERPOLATOR
VOH
21dB
PA
VOL
GAIN
CONTROL
INTERFACE
GENERAL DESCRIPTION
The AD8331/AD8332/AD8334 are single-, dual-, and quadchannel, ultralow noise linear-in-dB, variable gain amplifiers
(VGAs). Optimized for ultrasound systems, they are usable as a
low noise variable gain element at frequencies up to 120 MHz.
Included in each channel are an ultralow noise preamp (LNA),
an X-AMP® VGA with 48 dB of gain range, and a selectable gain
postamp with adjustable output limiting. The LNA gain is 19 dB
with a single-ended input and differential outputs. Using a single
resistor, the LNA input impedance can be adjusted to match a
signal source without compromising noise performance.
The 48 dB gain range of the VGA makes these devices suitable
for a variety of applications. Excellent bandwidth uniformity is
maintained across the entire range. The gain control interface
provides precise linear-in-dB scaling of 50 dB/V for control
voltages between 40 mV and 1 V. Factory trim ensures excellent
part-to-part and channel-to-channel gain matching.
RCLMP
ENB
03199-001
AD8331/AD8332/AD8334
GAIN
Figure 1. Signal Path Block Diagram
60
VGAIN = 1V
50
HI GAIN
MODE
VGAIN = 0.8V
40
VGAIN = 0.6V
30
VGAIN = 0.4V
www.BDTIC.com/ADI
Ultrasound and sonar time-gain controls
High performance automatic gain control (AGC) systems
I/Q signal processing
High speed, dual ADC drivers
CLAMP
20
VGAIN = 0.2V
VGAIN = 0V
10
0
–10
100k
1M
10M
100M
03199-002
APPLICATIONS
VIN
LNA
GAIN (dB)
Ultralow noise preamplifier (preamp)
Voltage noise = 0.74 nV/√Hz
Current noise = 2.5 pA/√Hz
3 dB bandwidth
AD8331: 120 MHz
AD8332, AD8334: 100 MHz
Low power
AD8331: 125 mW/channel
AD8332, AD8334: 145 mW/channel
Wide gain range with programmable postamp
−4.5 dB to +43.5 dB in LO gain mode
+7.5 dB to +55.5 dB in HI gain mode
Low output-referred noise: 48 nV/√Hz typical
Active input impedance matching
Optimized for 10-bit/12-bit ADCs
Selectable output clamping level
Single 5 V supply operation
AD8332 and AD8334 available in lead frame chip scale package
FUNCTIONAL BLOCK DIAGRAM
LON LOP VIP
1G
FREQUENCY (Hz)
Figure 2. Frequency Response vs. Gain
Differential signal paths result in superb second- and thirdorder distortion performance and low crosstalk.
The low output-referred noise of the VGA is advantageous in
driving high speed differential ADCs. The gain of the postamp
can be pin selected to 3.5 dB or 15.5 dB to optimize gain range
and output noise for 12-bit or 10-bit converter applications. The
output can be limited to a user-selected clamping level, pre-venting
input overload to a subsequent ADC. An external resistor adjusts
the clamping level.
The operating temperature range is −40°C to +85°C. The
AD8331 is available in a 20-lead QSOP package, the AD8332 is
available in 28-lead TSSOP and 32-lead LFCSP packages, and
the AD8334 is available in a 64-lead LFCSP package.
Rev. F
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2008 Analog Devices, Inc. All rights reserved.
AD8331/AD8332/AD8334
TABLE OF CONTENTS
Features .............................................................................................. 1
AD8331 Evaluation board............................................................. 39
Applications....................................................................................... 1
General Description................................................................... 39
General Description ......................................................................... 1
User-Supplied Optional Components ..................................... 39
Functional Block Diagram .............................................................. 1
Measurement Setup.................................................................... 39
Revision History ............................................................................... 3
Board Layout............................................................................... 39
Specifications..................................................................................... 4
AD8331 Evaluation Board Schematics.................................... 40
Absolute Maximum Ratings............................................................ 7
AD8331 Evaluation Board PCB Layers ................................... 42
ESD Caution.................................................................................. 7
AD8331 Bill of Materials ........................................................... 43
Pin Configurations and Function Descriptions ........................... 8
AD8332 Evaluation Board ............................................................ 44
Typical Performance Characteristics ........................................... 12
General Description................................................................... 44
Test Circuits..................................................................................... 20
User-Supplied Optional Components ..................................... 44
Measurement Considerations................................................... 20
Measurement Setup.................................................................... 44
Theory of Operation ...................................................................... 24
Board Layout............................................................................... 44
Overview...................................................................................... 24
Evaluation Board Schematics ................................................... 45
Low Noise Amplifier (LNA) ..................................................... 25
AD8332 Evaluation Board PCB Layers ................................... 47
Variable Gain Amplifier ............................................................ 27
AD8332 Bill of Materials ........................................................... 48
Postamplifier ............................................................................... 28
AD8334 Evaluation Board ............................................................ 49
www.BDTIC.com/ADI
Applications Information .............................................................. 30
General Description................................................................... 49
LNA—External Components.................................................... 30
Configuring the Input Impedance ........................................... 50
Driving ADCs ............................................................................. 32
Measurement Setup.................................................................... 50
Overload ...................................................................................... 32
Board Layout............................................................................... 50
Optional Input Overload Protection ....................................... 32
Evaluation Board Schematics ................................................... 51
Layout, Grounding, and Bypassing.......................................... 33
AD8334 Evaluation Board PCB Layers ................................... 53
Multiple Input Matching ........................................................... 33
AD8334 Bill of Materials ........................................................... 54
Disabling the LNA...................................................................... 33
Outline Dimensions ....................................................................... 55
Ultrasound TGC Application ................................................... 34
Ordering Guide .......................................................................... 57
High Density Quad Layout ....................................................... 34
Rev. F | Page 2 of 60
AD8331/AD8332/AD8334
REVISION HISTORY
4/08—Rev. E to Rev. F
Changed RFB to RIZ Throughout .....................................................4
Changes to Figure 1...........................................................................1
Changes to Table 1, LNA and VGA Characteristics, Output
Offset Voltage, Conditions ...............................................................4
Changes to Quiescent Current per Channel and Power Down
Current Parameters...........................................................................6
Changes to Table 2 ............................................................................7
Changes to Table 3, Pin 1 Description ...........................................8
Changes to Table 4, Pin 1 and Pin 28 Descriptions ......................9
Changes to Table 5, Pin 4 and Pin 5 Descriptions ........................9
Changes to Table 6, Pin 2, Pin 15, and Pin 20 Descriptions......10
Changes to Table 6, Pin 61 Description .......................................11
Changes to Typical Performance Characteristics Section,
Default Conditions..........................................................................12
Changes to Figure 25 ......................................................................15
Changes to Figure 39 ......................................................................17
Changes to Figure 55 Through Figure 68 ...................................20
Changes to Theory of Operation, Overview Section .................24
Changes to Low Noise Amplifier Section and Figure 74 ...........25
Changes to Active Impedance Matching Section, Figure 75,
and Figure 77 ...................................................................................26
Changes to Figure 78 ......................................................................27
Changes to Equation 6, Table 7, Figure 81, and Figure 82.........30
Changes to Figure 83 ......................................................................31
Changes to Figure 88 ......................................................................32
Switched Figure 89 and Figure 90 .................................................33
Changes to Figure 89 ......................................................................33
Changes to Ultrasound TGC Application Section......................34
Incorporated AD8331-EVAL Data Sheet, Rev. A .......................39
Changes to User-Supplied Optional Components Section
and Measurement Setup Section...............................................39
Changes to Figure 95 ..................................................................39
Changes to Figure 97 ..................................................................41
Added Figure 98..........................................................................42
Incorporated AD8332-EVALZ Data Sheet, Rev. D.....................44
Incorporated AD8334-EVAL Data Sheet, Rev. 0 ........................49
Updated Outline Dimensions........................................................55
Changes to Ordering Guide...........................................................57
Changes to Figure 23 and Figure 24 .............................................14
Changes to Figure 25 through Figure 27......................................15
Changes to Figure 31 and Figure 33 through Figure 36 ............16
Changes to Figure 37 through Figure 42......................................17
Changes to Figure 43, Figure 44, and Figure 48..........................18
Changes to Figure 49, Figure 50, and Figure 54..........................19
Inserted Figure 56 and Figure 57 ..................................................20
Inserted Figure 58, Figure 59, and Figure 61...............................21
Changes to Figure 60 ......................................................................21
Inserted Figure 63 and Figure 65 ..................................................22
Changes to Figure 64 ......................................................................22
Moved Measurement Considerations Section ............................23
Inserted Figure 67 and Figure 68 ..................................................23
Inserted Figure 70 and Figure 71 ..................................................24
Change to Figure 72........................................................................24
Changes to Figure 73 and Low Noise Amplifier Section...........25
Changes to Postamplifier Section .................................................28
Changes to Figure 80 ......................................................................29
Changes to LNA—External Components Section......................30
Changes to Logic Inputs—ENB, MODE, and HILO Section ...31
Changes to Output Decoupling and Overload Sections............32
Changes to Layout, Grounding, and Bypassing Section............33
Changes to Ultrasound TGC Application Section .....................34
Added High Density Quad Layout Section .................................34
Inserted Figure 94 ...........................................................................38
Updated Outline Dimensions........................................................39
Changes to Ordering Guide...........................................................40
www.BDTIC.com/ADI
4/06—Rev. D to Rev. E
Added AD8334 ................................................................... Universal
Changes to Figure 1 and Figure 2....................................................1
Changes to Table 1 ............................................................................4
Changes to Table 2 ............................................................................7
Changes to Figure 7 through Figure 9 and Figure 12.................12
Changes to Figure 13, Figure 14, Figure 16, and Figure 18 .......13
3/06—Rev. C to Rev. D
Updated Format ................................................................. Universal
Changes to Features and General Description..............................1
Changes to Table 1 ............................................................................3
Changes to Table 2 ............................................................................6
Changes to Ordering Guide...........................................................34
11/03—Rev. B to Rev. C
Addition of New Part......................................................... Universal
Changes to Figures............................................................. Universal
Updated Outline Dimensions........................................................32
5/03—Rev. A to Rev. B
Edits to Ordering Guide.................................................................32
Edits to Ultrasound TGC Application Section ...........................25
Added Figure 71, Figure 72, and Figure 73..................................26
Updated Outline Dimensions........................................................31
2/03—Rev. 0 to Rev. A
Edits to Ordering Guide.................................................................32
Rev. F | Page 3 of 60
AD8331/AD8332/AD8334
SPECIFICATIONS
TA = 25°C, VS = 5 V, RL = 500 Ω, RS = RIN = 50 Ω, RIZ = 280 Ω, CSH = 22 pF, f = 10 MHz, RCLMP = ∞, CL = 1 pF, VCM pin floating,
−4.5 dB to +43.5 dB gain (HILO = LO), and differential output voltage, unless otherwise specified.
Table 1.
Parameter
LNA CHARACTERISTICS
Gain
Input Voltage Range
Input Resistance
Input Capacitance
Output Impedance
−3 dB Small Signal Bandwidth
Slew Rate
Input Voltage Noise
Input Current Noise
Noise Figure
Active Termination Match
Unterminated
Harmonic Distortion @ LOP1 or LOP2
HD2
HD3
Output Short-Circuit Current
LNA AND VGA CHARACTERISTICS
−3 dB Small Signal Bandwidth
AD8331
AD8332, AD8334
−3 dB Large Signal Bandwidth
AD8331
AD8332, AD8334
Slew Rate
AD8331
Conditions
Single-ended input to differential output
Input to output (single-ended)
AC-coupled
RIZ = 280 Ω
RIZ = 412 Ω
RIZ = 562 Ω
RIZ = 1.13 kΩ
RIZ = ∞
Min
Typ
Max
19
13
±275
50
75
100
200
6
13
5
130
650
0.74
2.5
dB
dB
mV
Ω
Ω
Ω
Ω
kΩ
pF
Ω
MHz
V/μs
nV/√Hz
pA/√Hz
3.7
2.5
dB
dB
−56
−70
165
dBc
dBc
mA
120
100
MHz
MHz
110
90
MHz
MHz
LO gain
HI gain
LO gain
HI gain
RS = 0 Ω, HI or LO gain, RIZ = ∞, f = 5 MHz
VGAIN = 1.0 V
RS = RIN = 50 Ω, f = 10 MHz, measured
RS = RIN = 200 Ω, f = 5 MHz, simulated
RS = 50 Ω, RIZ = ∞, f = 10 MHz, measured
RS = 200 Ω, RIZ = ∞, f = 5 MHz, simulated
300
1200
275
1100
0.82
V/μs
V/μs
V/μs
V/μs
nV/√Hz
4.15
2.0
2.5
1.0
dB
dB
dB
dB
VGAIN = 0.5 V, LO gain
VGAIN = 0.5 V, HI gain
VGAIN = 0.5 V, LO gain
VGAIN = 0.5 V, HI gain
DC to 1 MHz
48
178
40
150
1
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
Ω
Single-ended, either output
VOUT = 0.2 V p-p
RS = 0 Ω, HI or LO gain, RIZ = ∞, f = 5 MHz
RIZ = ∞, HI or LO gain, f = 5 MHz
f = 10 MHz, LOP output
RS = RIN = 50 Ω
RS = 50 Ω, RIZ = ∞
VOUT = 0.5 V p-p, single-ended, f = 10 MHz
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AD8332, AD8334
Input Voltage Noise
Noise Figure
Active Termination Match
Unterminated
Output-Referred Noise
AD8331
AD8332, AD8334
Output Impedance, Postamplifier
Unit 1
Pin LON, Pin LOP
VOUT = 0.2 V p-p
VOUT = 2 V p-p
Rev. F | Page 4 of 60
AD8331/AD8332/AD8334
Parameter
Output Signal Range, Postamplifier
Differential
Output Offset Voltage
AD8331
AD8332, AD8334
Output Short-Circuit Current
Harmonic Distortion
AD8331
HD2
HD3
HD2
HD3
AD8332, AD8334
HD2
HD3
HD2
HD3
Input 1 dB Compression Point
Two-Tone Intermodulation Distortion (IMD3)
AD8331
Conditions
RL ≥ 500 Ω, unclamped, either pin
Min
Typ
VCM ± 1.125
4.5
Max
Unit 1
V
V p-p
Differential, VGAIN = 0.5 V
Common mode
Differential, 0.05 V ≤ VGAIN ≤ 1.0 V
Common mode
−50
−125
−20
−125
±5
−25
±5
–25
45
+50
+100
+20
+100
mV
mV
mV
mV
mA
VGAIN = 0.5 V, VOUT = 1 V p-p, HI gain
f = 1 MHz
−88
−85
−68
−65
dBc
dBc
dBc
dBc
VGAIN = 0.25 V, VOUT = 1 V p-p, f = 1 MHz to 10 MHz
−82
−85
−62
−66
1
dBc
dBc
dBc
dBc
dBm
VGAIN = 0.72 V, VOUT = 1 V p-p, f = 1 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 10 MHz
VGAIN = 0.72 V, VOUT = 1 V p-p, f = 1 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 10 MHz
−80
−72
−78
−74
dBc
dBc
dBc
dBc
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 1 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 10 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 1 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 10 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 1 MHz
VGAIN = 1.0 V, VIN = 50 mV p-p/1 V p-p, f = 10 MHz
5 MHz < f < 50 MHz, full gain range
38
33
35
32
−98
5
±2
dBm
dBm
dBm
dBm
dB
ns
ns
f = 10 MHz
f = 1 MHz
f = 10 MHz
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AD8332, AD8334
Output Third-Order Intercept
AD8331
AD8332, AD8334
Channel-to-Channel Crosstalk (AD8332, AD8334)
Overload Recovery
Group Delay Variation
ACCURACY
Absolute Gain Error 2
Gain Law Conformance 3
Channel-to-Channel Gain Matching
GAIN CONTROL INTERFACE (Pin GAIN)
Gain Scaling Factor
Gain Range
Input Voltage (VGAIN) Range
Input Impedance
Response Time
COMMON-MODE INTERFACE (PIN VCMx)
Input Resistance 4
Output CM Offset Voltage
Voltage Range
0.05 V < VGAIN < 0.10 V
0.10 V < VGAIN < 0.95 V
0.95 V < VGAIN < 1.0 V
0.1 V < VGAIN < 0.95 V
0.1 V < VGAIN < 0.95 V
−1
−1
−2
+0.5
±0.3
−1
±0.2
±0.1
+2
+1
+1
dB
dB
dB
dB
dB
0.10 V < VGAIN < 0.95 V
LO gain
HI gain
48.5
50
−4.5 to +43.5
7.5 to 55.5
0 to 1.0
10
500
51.5
dB/V
dB
dB
V
MΩ
ns
48 dB gain change to 90% full scale
Current limited to ±1 mA
VCM = 2.5 V
VOUT = 2.0 V p-p
Rev. F | Page 5 of 60
−125
30
−25
1.5 to 3.5
+100
Ω
mV
V
AD8331/AD8332/AD8334
Parameter
ENABLE INTERFACE
(PIN ENB, PIN ENBL, PIN ENBV)
Logic Level to Enable Power
Logic Level to Disable Power
Input Resistance
Power-Up Response Time
HILO GAIN RANGE INTERFACE (PIN HILO)
Logic Level to Select HI Gain Range
Logic Level to Select LO Gain Range
Input Resistance
OUTPUT CLAMP INTERFACE (PIN RCLMP; HI OR
LO GAIN)
Accuracy
HILO = LO
HILO = HI
MODE INTERFACE (PIN MODE)
Logic Level for Positive Gain Slope
Logic Level for Negative Gain Slope
Input Resistance
POWER SUPPLY (PIN VPS1, PIN VPS2,
PIN VPSV, PIN VPSL, PIN VPOS)
Supply Voltage
Quiescent Current per Channel
AD8331
AD8332
AD8334
Power Dissipation per Channel
AD8331
AD8332, AD8334
Power-Down Current
AD8331
AD8332
AD8334
LNA Current
AD8331 (ENBL)
AD8332, AD8334 (ENBL)
VGA Current
AD8331 (ENBV)
AD8332, AD8334 (ENBV)
PSRR
Conditions
Min
Max
Unit 1
5
1.0
V
V
kΩ
kΩ
kΩ
μs
ms
5
1.0
50
V
V
kΩ
±50
±75
mV
mV
Typ
2.25
0
Pin ENB
Pin ENBL
Pin ENBV
VINH = 30 mV p-p
VINH = 150 mV p-p
25
40
70
300
4
2.25
0
RCLMP = 2.74 kΩ, VOUT = 1 V p-p (clamped)
RCLMP = 2.21 kΩ, VOUT = 1 V p-p (clamped)
0
2.25
1.0
5
200
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4.5
5.0
5.5
20
25
27
25
27.5
29.5
32
34
V
V
kΩ
V
mA
mA
No signal
125
138
mW
mW
VGA and LNA disabled
Each channel
Each channel
VGAIN = 0 V, f = 100 kHz
1
All dBm values are referred to 50 Ω.
The absolute gain refers to the theoretical gain expression in Equation 1.
3
Best-fit to linear-in-dB curve.
4
The current is limited to ±1 mA typical.
2
Rev. F | Page 6 of 60
50
50
50
240
300
600
400
600
1200
μA
μA
μA
7.5
7.5
11
12
15
15
mA
mA
7.5
7.5
14
17
−68
20
20
mA
mA
dB
AD8331/AD8332/AD8334
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 2.
Parameter
Voltage
Supply Voltage (VPSn, VPSV, VPSL, VPOS)
Input Voltage (INHx)
ENB, ENBL, ENBV, HILO Voltage
GAIN Voltage
Power Dissipation
AR Package 1 (AD8332)
CP-32 Package (AD8332)
RQ Package1 (AD8331)
CP-64 Package (AD8334)
Temperature
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering 60 sec)
θJA
AR Package1 (AD8332)
CP-32 Package22 (AD8332)
RQ Package1 (AD8331)
CP-64 Package3 (AD8334)
1
Rating
5.5 V
VS + 200 mV
VS + 200 mV
2.5 V
ESD CAUTION
0.96 W
1.97 W
0.78 W
0.91 W
−40°C to +85°C
−65°C to +150°C
300°C
68°C/W
33°C/W
83°C/W
24.2°C/W
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Four-layer JEDEC board (2S2P).
Exposed pad soldered to board, nine thermal vias in pad—JEDEC, four-layer
board J-STD-51-9.
3
Exposed pad soldered to board, 25 thermal vias in pad—JEDEC, four-layer
board J-STD-51-9.
2
Rev. F | Page 7 of 60
AD8331/AD8332/AD8334
20
COMM
19
ENBL
3
18
ENBV
LON
4
17
COMM
LOP
5
16
VOL
COML
6
15
VOH
VIP
7
14
VPOS
VIN
8
13
HILO
MODE
9
12
RCLMP
GAIN 10
11
VCM
LMD
1
INH
2
VPSL
PIN 1
INDICATOR
AD8331
TOP VIEW
(Not to Scale)
03199-003
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. 20-Lead QSOP Pin Configuration (AD8331)
Table 3. 20-Lead QSOP Pin Function Description (AD8331)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Mnemonic
LMD
INH
VPSL
LON
LOP
COML
VIP
VIN
MODE
GAIN
VCM
RCLMP
HILO
VPOS
VOH
VOL
COMM
ENBV
ENBL
COMM
Description
VCM Bias for the LNA
LNA Input
LNA 5 V Supply
LNA Inverting Output
LNA Noninverting Output
LNA Ground
VGA Noninverting Input
VGA Inverting Input
Gain Slope Logic Input
Gain Control Voltage
Common-Mode Voltage
Output Clamping Level
Gain Range Select (HI or LO)
VGA 5 V Supply
Noninverting VGA Output
Inverting VGA Output
VGA Ground
VGA Enable
LNA Enable
VGA Ground
www.BDTIC.com/ADI
Rev. F | Page 8 of 60
LMD1
4
LMD2
5
6
VIN2
8
21
VIN1
VCM2
9
20
VCM1
GAIN
10
19
HILO
INH2
RCLMP 11
18
ENB
VPS2
7
VOH2 12
17
VOH1
LON2
8
VOL2 13
16
VOL1
COMM 14
15
VPSV
TOP VIEW
(Not to Scale)
03199-004
7
ENBL
ENBV
29
28
27
26
25
24
COMM
23
VOH1
22
VOL1
AD8332
21
VPSV
TOP VIEW
(Not to Scale)
20
NC
19
VOL2
18
VOH2
17
COMM
9
10
11
NC = NO CONNECT
12
13
14
15
16
03199-005
3
VIP2
AD8332
30
GAIN
2
INH1
6
31
PIN 1
INDICATOR
RCLMP
VIP1
VPS1
COM1
5
HILO
22
LOP1
LOP2
COM2
VCM1
23
1
MODE
24
32
LON1
VIN1
LON1
VIN2
25
VCM2
4
VIP1
VPS1
LON2
COM1
26
VPS2
PIN 1
INDICATOR
VIP2
INH1
3
2
LOP2
LMD1
27
1
INH2
COM2
28
LMD2
LOP1
AD8331/AD8332/AD8334
Figure 4. 28-Lead TSSOP Pin Configuration (AD8332)
Figure 5. 32-Lead LFCSP Pin Configuration (AD8332)
Table 4. 28-Lead TSSOP Pin Function Description (AD8332)
Table 5. 32-Lead LFCSP Pin Function Description (AD8332)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Mnemonic
LMD2
INH2
VPS2
LON2
LOP2
COM2
VIP2
VIN2
VCM2
GAIN
RCLMP
VOH2
VOL2
COMM
VPSV
VOL1
VOH1
ENB
HILO
VCM1
VIN1
VIP1
COM1
LOP1
LON1
VPS1
INH1
LMD1
Description
VCM Bias for CH2 LNA
CH2 LNA Input
CH2 Supply LNA 5 V
CH2 LNA Inverting Output
CH2 LNA Noninverting Output
CH2 LNA Ground
CH2 VGA Noninverting Input
CH2 VGA Inverting Input
CH2 Common-Mode Voltage
Gain Control Voltage
Output Clamping Resistor
CH2 Noninverting VGA Output
CH2 Inverting VGA Output
VGA Ground (Both Channels)
VGA Supply 5 V (Both Channels)
CH1 Inverting VGA Output
CH1 Noninverting VGA Output
Enable—VGA/LNA
VGA Gain Range Select (HI or LO)
CH1 Common-Mode Voltage
CH1 VGA Inverting Input
CH1 VGA Noninverting Input
CH1 LNA Ground
CH1 LNA Noninverting Output
CH1 LNA Inverting Output
CH1 LNA Supply 5 V
CH1 LNA Input
VCM Bias for CH1 LNA
Mnemonic
LON1
VPS1
INH1
LMD1
LMD2
INH2
VPS2
LON2
LOP2
COM2
VIP2
VIN2
VCM2
MODE
GAIN
RCLMP
COMM
VOH2
VOL2
NC
VPSV
VOL1
VOH1
COMM
ENBV
ENBL
HILO
VCM1
VIN1
VIP1
COM1
LOP1
Description
CH1 LNA Inverting Output
CH1 LNA Supply 5 V
CH1 LNA Input
VCM Bias for CH1 LNA
VCM Bias for CH2 LNA
CH2 LNA Input
CH2 LNA Supply 5 V
CH2 LNA Inverting Output
CH2 LNA Noninverting Output
CH2 LNA Ground
CH2 VGA Noninverting Input
CH2 VGA Inverting Input
CH2 Common-Mode Voltage
Gain Slope Logic Input
Gain Control Voltage
Output Clamping Level Input
VGA Ground
CH2 Noninverting VGA Output
CH2 Inverting VGA Output
No Connect
VGA Supply 5 V
CH1 Inverting VGA Output
CH1 Noninverting VGA Output
VGA Ground
VGA Enable
LNA Enable
VGA Gain Range Select (HI or LO)
CH1 Common-Mode Voltage
CH1 VGA Inverting Input
CH1 VGA Noninverting Input
CH1 LNA Ground
CH1 LNA Noninverting Output
www.BDTIC.com/ADI
Rev. F | Page 9 of 60
VCM2
VCM1
EN34
EN12
CLMP12
GAIN12
VPS1
VIN1
VIP1
LOP1
LON1
COM1X
LMD1
INH1
COM1
COM2
AD8331/AD8332/AD8334
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
INH2
1
LMD2
2
COM2X
48
COM12
47
VOH1
3
46
VOL1
LON2
4
45
VPS12
LOP2
5
44
VOL2
VIP2
6
43
VOH2
VIN2
7
42
COM12
VPS2
8
41
MODE
VPS3
9
40
NC
VIN3
10
39
COM34
VIP3
11
38
VOH3
LOP3
12
37
VOL3
LON3
13
36
VPS34
COM3X
14
35
VOL4
LMD3
15
34
VOH4
INH3
16
33
COM34
PIN 1
INDICATOR
AD8334
TOP VIEW
(Not to Scale)
03199-006
NC
VCM3
VCM4
HILO
CLMP34
GAIN34
VPS4
VIN4
VIP4
LOP4
LON4
COM4X
LMD4
INH4
COM4
COM3
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
NC = NO CONNECT
Figure 6. 64-Lead LFCSP Pin Configuration (AD8334)
Table 6. 64-Lead LFCSP Pin Function Description (AD8334)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Mnemonic
INH2
LMD2
COM2X
LON2
LOP2
VIP2
VIN2
VPS2
VPS3
VIN3
VIP3
LOP3
LON3
COM3X
LMD3
INH3
COM3
COM4
INH4
LMD4
COM4X
LON4
LOP4
VIP4
VIN4
VPS4
GAIN34
CLMP34
Description
CH2 LNA Input
VCM Bias for CH2 LNA
CH2 LNA Ground Shield
CH2 LNA Feedback Output (for RIZ)
CH2 LNA Output
CH2 VGA Positive Input
CH2 VGA Negative Input
CH2 LNA Supply 5 V
CH3 LNA Supply 5 V
CH3 VGA Negative Input
CH3 VGA Positive Input
CH3 LNA Positive Output
CH3 LNA Feedback Output (for RIZ)
CH3 LNA Ground Shield
VCM Bias for CH3 LNA
CH3 LNA Input
CH3 LNA Ground
CH4 LNA Ground
CH4 LNA Input
VCM Bias for CH4 LNA
CH4 LNA Ground Shield
CH4 LNA Feedback Output (for RIZ)
CH4 LNA Positive Output
CH4 VGA Positive Input
CH4 VGA Negative Input
CH4 LNA Supply 5 V
Gain Control Voltage for CH3 and CH4
Output Clamping Level Input for CH3 and CH4
www.BDTIC.com/ADI
Rev. F | Page 10 of 60
AD8331/AD8332/AD8334
Pin No.
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
Mnemonic
HILO
VCM4
VCM3
NC
COM34
VOH4
VOL4
VPS34
VOL3
VOH3
COM34
NC
MODE
COM12
VOH2
VOL2
VPS12
VOL1
VOH1
COM12
VCM2
VCM1
EN34
EN12
CLMP12
GAIN12
VPS1
VIN1
VIP1
LOP1
LON1
COM1X
LMD1
INH1
COM1
COM2
Description
Gain Select for Postamp 0 dB or 12 dB
CH4 Common-Mode Voltage—AC Bypass
CH3 Common-Mode Voltage—AC Bypass
No Connect
VGA Ground CH3 and CH4
CH4 Positive VGA Output
CH4 Negative VGA Output
VGA Supply 5 V CH3 and CH4
CH3 Negative VGA Output
CH3 Positive VGA Output
VGA Ground CH3 and CH4
No Connect
Gain Control Slope, Logic Input, 0 = Positive
VGA Ground CH1 and CH2
CH2 Positive VGA Output
CH2 Negative VGA Output
CH2 VGA Supply 5 V CH1 and CH2
CH1 Negative VGA Output
CH1 Positive VGA Output
VGA Ground CH1 and CH2
CH2 Common-Mode Voltage—AC Bypass
CH1 Common-Mode Voltage—AC Bypass
Shared LNA/VGA Enable CH3 and CH4
Shared LNA/VGA Enable CH1 and CH2
Output Clamping Level Input CH1 and CH2
Gain Control Voltage CH1 and CH2
CH1 LNA Supply 5 V
CH1 VGA Negative Input
CH1 VGA Positive Input
CH1 LNA Positive Output
CH1 LNA Feedback Output (for RIZ)
CH1 LNA Ground Shield
VCM Bias for CH1 LNA
CH1 LNA Input
CH1 LNA Ground
CH2 LNA Ground
www.BDTIC.com/ADI
Rev. F | Page 11 of 60
AD8331/AD8332/AD8334
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, VS = 5 V, RL = 500 Ω, RS = RIN = 50 Ω, RIZ = 280 Ω, CSH = 22 pF, f = 10 MHz, RCLMP = ∞, CL = 1 pF, VCM pin floating,
−4.5 dB to +43.5 dB gain (HILO = LO), and differential output voltage, unless otherwise specified.
50
60
50
PERCENT OF UNITS (%)
30
20
10
HILO = LO
0
0
0.2
0.4
0.6
20
10
ASCENDING GAIN MODE
DESCENDING GAIN MODE
(WHERE AVAILABLE)
03199-007
–10
30
0.8
1.0
0
–0.5
1.1
03199-010
GAIN (dB)
40
HILO = HI
40
SAMPLE SIZE = 80 UNITS
VGAIN = 0.5V
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
GAIN ERROR (dB)
VGAIN (V)
Figure 10. Gain Error Histogram
Figure 7. Gain vs. VGAIN and MODE (MODE Available on AC Package)
25
2.0
20
1.5
SAMPLE SIZE = 50 UNITS
VGAIN = 0.2V
15
GAIN ERROR (dB)
–40°C
0.5
0
PERCENT OF UNITS (%)
www.BDTIC.com/ADI
1.0
+25°C
–0.5
+85°C
–1.0
10
5
0
25
20
VGAIN = 0.7V
15
03199-008
0.2
0.4
0.6
0.8
1.0
0
1.1
VGAIN (V)
CHANNEL TO CHANNEL GAIN MATCH (dB)
Figure 8. Absolute Gain Error vs. VGAIN at Three Temperatures
Figure 11. Gain Match Histogram for VGAIN = 0.2 V and 0.7 V
2.0
50
1.5
1.0
VGAIN = 0.8V
30
VGAIN = 0.6V
GAIN (dB)
0.5
1MHz
0
10MHz
30MHz
VGAIN = 0.4V
10
VGAIN = 0.2V
50MHz
70MHz
0
0.2
0.4
0.6
0.8
1.0
VGAIN = 0V
–10
–20
100k
1.1
03199-012
–1.5
–2.0
20
0
–1.0
03199-009
GAIN ERROR (dB)
VGAIN = 1V
40
–0.5
0.19
0.21
0
5
–0.17
–0.15
–0.13
–0.11
–0.09
–0.07
–0.05
–0.03
–0.01
0.01
0.03
0.05
0.07
0.09
0.11
0.13
0.15
0.17
–2.0
03199-011
10
–1.5
1M
10M
100M
FREQUENCY (Hz)
VGAIN (V)
Figure 12. Frequency Response for Various Values of VGAIN
Figure 9. Absolute Gain Error vs. VGAIN at Various Frequencies
Rev. F | Page 12 of 60
500M
AD8331/AD8332/AD8334
0
VGAIN = 1V
50
VGAIN = 0.8V
40
VGAIN = 0.6V
30
VGAIN = 0.4V
20
VGAIN = 0.2V
VOUT = 1V p-p
–20
VGAIN = 1.0V
CROSSTALK (dB)
GAIN (dB)
60
AD8332
VGAIN = 0.7V
–40
AD8334
VGAIN = 0.4V
–60
–80
10
VGAIN = 0V
03199-013
–10
100k
1M
10M
100M
03199-016
–100
0
–120
100k
500M
1M
FREQUENCY (Hz)
Figure 13. Frequency Response for Various Values of VGAIN, HILO = HI
50
VGAIN = 0.5V
RIN = RS = 75Ω
20
GROUP DELAY (ns)
RIN = RS = 100Ω
RIN = RS = 200Ω
0
RIN = RS = 500Ω
0.1µF
COUPLING
35
30
1µF
COUPLING
25
20
www.BDTIC.com/ADI
RIN = RS = 1kΩ
1M
10M
100M
5
0
100k
500M
1M
FREQUENCY (Hz)
10M
100M
FREQUENCY (Hz)
Figure 14. Frequency Response for Various Matched Source Impedances
Figure 17. Group Delay vs. Frequency for Two Values of AC Coupling
20
30
VGAIN = 0.5V
RIZ = ∞
T = +85°C
T = +25°C
T = –40°C
HI GAIN
10
OFFSET VOLTAGE (mV)
20
10
0
–10
0
–10
–20
20
LO GAIN
10
0
–20
–30
100k
1M
10M
100M
T = +85°C
T = +25°C
T = –40°C
–10
03199-015
GAIN (dB)
03199-017
10
03199-014
–30
100k
15
–20
500M
FREQUENCY (Hz)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
03199-018
GAIN (dB)
45
RIN = RS = 50Ω
40
10
–20
100M
Figure 16. Channel-to-Channel Crosstalk vs.
Frequency for Various Values of VGAIN
30
–10
10M
FREQUENCY (Hz)
0.9
1.0
1.1
VGAIN (V)
Figure 18. Representative Differential Output Offset Voltage vs.
VGAIN at Three Temperatures
Figure 15. Frequency Response, Unterminated LNA, RS = 50 Ω
Rev. F | Page 13 of 60
AD8331/AD8332/AD8334
50j
30
SAMPLE SIZE = 100
0.2V < VGAIN < 0.7V
RIN = 50Ω,
RIZ = 270Ω
25
RIN = 6kΩ,
RIZ = ∞
f = 100kHz
20
0Ω
17Ω
15
10
RIN = 75Ω,
RIZ = 412Ω
0
03199-019
5
49.6
49.7
49.8
49.9
50.0
50.1
50.2
50.3
50.4
RIN = 100Ω,
RIZ = 549Ω
50.5
RIN = 200Ω,
RIZ = 1.1kΩ
–25j
–100j
03199-022
GAIN SCALING FACTOR
–50j
Figure 19. Gain Scaling Factor Histogram
100
Figure 22. Smith Chart, S11 vs. Frequency,
0.1 MHz to 200 MHz for Various Values of RIZ
20
SINGLE ENDED, PIN VOH OR PIN VOL
RL = ∞
VIN = 10mV p-p
RIN = 50Ω
RIN = 200Ω
www.BDTIC.com/ADI
GAIN (dB)
1
5
RIN = 500Ω
0
RIN = 1kΩ
–5
0.1
100k
–10
1M
10M
RIN = 75Ω
–15
100k
100M
1M
FREQUENCY (Hz)
10M
100M
500M
FREQUENCY (Hz)
Figure 23. LNA Frequency Response, Single-Ended, for Various Values of RIN
Figure 20. Output Impedance vs. Frequency
20
10k
15
RIZ = ∞
10
GAIN (dB)
1k
100
0
RIZ = ∞, CSH = 0pF
RIZ = 6.65kΩ, CSH = 0pF
RIZ = 3.01kΩ, CSH = 0pF
RIZ = 1.1kΩ, CSH = 1.2pF
1M
RIZ = 549Ω, CSH = 8.2pF
RIZ = 412Ω, CSH = 12pF
RIZ = 270Ω, CSH = 22pF
10M
–10
–15
100k
100M
03199-024
10
100k
5
–5
03199-021
INPUT IMPEDANCE (Ω)
RIN = 100Ω
10
10
03199-020
OUTPUT IMPEDANCE (Ω)
15
03199-023
% TOTAL
100j
25j
35
1M
10M
100M
500M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 24. Frequency Response for Unterminated LNA, Single-Ended
Figure 21. LNA Input Impedance vs.
Frequency for Various Values of RIZ and CSH
Rev. F | Page 14 of 60
AD8331/AD8332/AD8334
500
1.00
RS = 0, RIZ = ∞,
0.95 VGAIN = 1V, f = 10MHz
300
HI GAIN
AD8332
AD8334
LO GAIN
AD8331
200
100
0
0
0.2
0.4
0.6
0.8
0.90
0.85
0.80
0.75
0.70
0.65
0.60
03199-028
INPUT-REFERRED NOISE (nV/ Hz)
400
03199-025
0.55
0.50
–50
1.0
–30
–10
VGAIN (V)
Figure 25. Output-Referred Noise vs. VGAIN
10
INPUT-REFERRED NOISE (nV/ Hz)
RS = 0, RIZ = ∞, VGAIN = 1V,
HILO = LO OR HI
2.0
1.5
70
90
f = 5MHz, RIZ = ∞,
VGAIN = 1V
1
www.BDTIC.com/ADI
0.5
100k
1M
10M
RS THERMAL NOISE
ALONE
0.1
100M
1
FREQUENCY (Hz)
100
10
100
1k
SOURCE RESISTANCE (Ω)
Figure 26. Short-Circuit, Input-Referred Noise vs. Frequency
Figure 29. Input-Referred Noise vs. RS
7
RS = 0, RIZ = ∞,
HILO = LO OR HI, f = 10MHz
INCLUDES NOISE OF VGA
NOISE FIGURE (dB)
6
10
1
5
4
3
2
RIN = 50Ω
RIN = 75Ω
RIN = 100Ω
RIN = 200Ω
RIZ = ∞
0.1
1
03199-027
INPUT-REFERRED NOISE (nV/ Hz)
50
03199-029
1.0
30
Figure 28. Short-Circuit, Input-Referred Noise vs. Temperature
03199-026
INPUT-REFERRED NOISE (nV/ Hz)
2.5
10
TEMPERATURE (°C)
0
0.2
0.4
0.6
0.8
SIMULATED RESULTS
0
50
100
1.0
VGAIN (V)
SOURCE RESISTANCE (Ω)
Figure 30. Noise Figure vs. RS for Various Values of RIN
Figure 27. Short-Circuit, Input-Referred Noise vs. VGAIN
Rev. F | Page 15 of 60
03199-030
OUTPUT-REFERRED NOISE (nV/ Hz)
f = 10MHz
1k
AD8331/AD8332/AD8334
35
PREAMP LIMITED
–30
f = 10MHz, RS = 50Ω
f = 10MHz,
VOUT = 1V p-p
25
20
15
10
HILO
HILO
HILO
HILO
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
–60
–70
HILO = HI, HD3
0
200
400
600
800
VGAIN (V)
Figure 34. Harmonic Distortion vs. RLOAD
30
–40
20
15
f = 10MHz, RS = 50Ω
0
10
–50
HILO = LO, HD2
HILO = LO, HD3
–60
HILO = HI, HD2
–70
www.BDTIC.com/ADI
03199-032
NOISE FIGURE (dB)
f = 10MHz,
VOUT = 1V p-p
= LO, RIN = 50Ω
= LO, RFB = ∞
= HI, RIN = 50Ω
= HI, RFB = ∞
HARMONIC DISTORTION (dBc)
HILO
HILO
HILO
HILO
25
5
15
20
25
30
35
40
45
50
55
HILO = HI, HD3
–80
–90
60
0
10
20
GAIN (dB)
HILO = LO, HD2
HILO = LO, HD3
–50
–60
HILO = HI, HD2
–70
HILO = HI, HD3
–80
10M
–40
HILO = LO, HD3
HILO = LO, HD2
–60
HILO = HI, HD2
–100
100
HILO = HI, HD3
–80
03199-036
HARMONIC DISTORTION (dBc)
f = 10MHz,
GAIN = 30dB
–30
–90
1M
50
–20
G = 30dB,
VOUT = 1V p-p
–20
–40
40
Figure 35. Harmonic Distortion vs. CLOAD
03199-033
HARMONIC DISTORTION (dBc)
–10
30
CLOAD (pF)
Figure 32. Noise Figure vs. Gain
0
1000 1200 1400 1600 1800 2000
RLOAD (Ω)
Figure 31. Noise Figure vs. VGAIN
10
HILO = LO, HD3
–80
–90
1.1
HILO = LO, HD2
HILO = HI, HD2
03199-035
5
= LO, RIN = 50Ω
= LO, RIZ = ∞
= HI, RIN = 50Ω
= HI, RIz = ∞
–50
03199-034
HARMONIC DISTORTION (dBc)
–40
03199-031
NOISE FIGURE (dB)
30
0
1
2
3
4
VOUT (V p-p)
FREQUENCY (Hz)
Figure 36. Harmonic Distortion vs. Differential Output Voltage
Figure 33. Harmonic Distortion vs. Frequency
Rev. F | Page 16 of 60
AD8331/AD8332/AD8334
0
0
VOUT = 1V p-p
VOUT = 1V p-p COMPOSITE (f1 + f2)
G = 30dB
–10
–20
–30
HILO = LO, HD3
IMD3 (dBc)
–40
HILO = LO, HD2
–60
–80
–50
–70
HILO = HI, HD3
HILO = HI, HD2
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
–80
HILO = HI
–90
1M
1.0
10M
VGAIN (V)
Figure 40. IMD3 vs. Frequency
0
40
10MHz HILO = HI
VOUT = 1V p-p
35
1MHz HILO = LO
–40
30
HILO = LO, HD2
INPUT RANGE
LIMITED WHEN
HILO = LO
OUTPUT IP3 (dBm)
HILO = LO, HD3
–60
1MHz HILO = HI
20
15
www.BDTIC.com/ADI
HILO = HI, HD3
10
HILO = HI, HD2
5
03199-038
–120
10MHz HILO = LO
25
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
03199-041
DISTORTION (dBc)
–20
–100
100M
FREQUENCY (Hz)
Figure 37. Harmonic Distortion vs. VGAIN, f = 1 MHz
–80
03199-040
–100
–120
HILO = LO
–40
–60
03199-037
DISTORTION (dBc)
–20
INPUT RANGE
LIMITED WHEN
HILO = LO
VOUT = 1V p-p COMPOSITE (f1 + f2)
0
1.0
0
0.1
VGAIN (V)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
VGAIN (V)
Figure 41. Output Third-Order Intercept vs. VGAIN
Figure 38. Harmonic Distortion vs. VGAIN, f = 10 MHz
10
100
0
f = 10MHz
90
HILO = LO
HILO = HI
–10
–20
10
–40
50mV
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
10ns
1.0
VGAIN (V)
Figure 39. IP1dB Compression vs. VGAIN
Figure 42. Small Signal Pulse Response, G = 30 dB,
Top: Input, Bottom: Output Voltage, HILO = HI or LO
Rev. F | Page 17 of 60
03199-042
0
–30
03199-039
IP1dB COMPRESSION (dBm)
2mV
AD8331/AD8332/AD8334
5.0
20mV
4.5
100
4.0
90
HILO = HI
VOUT (V p-p)
3.5
HILO = LO
3.0
2.5
2.0
1.5
10
0
10ns
03199-046
03199-043
1.0
500mV
0.5
0
0
5
10
15
20
25
30
35
40
50
45
RCLMP (kΩ)
Figure 43. Large Signal Pulse Response, G = 30 dB,
HILO = HI or LO, Top: Input, Bottom: Output Voltage
2
4
CL = 0pF
CL = 10pF
CL = 22pF
CL = 47pF
G = 30dB
1
Figure 46. Clamp Level vs. RCLMP
INPUT
G = 40dB
RCLMP = 48.1kΩ
RCLMP = 16.5kΩ
3
2
INPUT
VOUT (V)
0
0
RCLMP = 7.15kΩ
RCLMP = 2.67kΩ
–1
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–1
–2
–40
–30
–20
–10
0
10
20
30
40
–4
–30
50
–20
TIME (ns)
–10
0
10
20
30
40
50
60
03199-047
–2
–50
–3
03199-044
INPUT IS NOT TO SCALE
70
80
TIME (ns)
Figure 44. Large Signal Pulse Response for Various Capacitive Loads,
CL = 0 pF, 10 pF, 20 pF, 50 pF
Figure 47. Clamp Level Pulse Response for Four Values of RCLMP
500mV
200mV
100
90
10
200mV
400ns
03199-045
0
100ns
03199-048
VOUT (V)
1
Figure 48. LNA Overdrive Recovery, VINH 0.05 V p-p to 1 V p-p Burst,
VGAIN = 0.27 V VGA Output Shown
Figure 45. Pin GAIN Transient Response,
Top: VGAIN, Bottom: Output Voltage
Rev. F | Page 18 of 60
AD8331/AD8332/AD8334
1V
2V
100
90
10
1V
1ms
03199-052
100ns
03199-049
0
Figure 52. Enable Response, Large Signal,
Top: VENB, Bottom: VOUT, VINH = 150 mV p-p
Figure 49. VGA Overdrive Recovery, VINH 4 mV p-p to 70 mV p-p Burst,
VGAIN = 1 V VGA Output Shown Attenuated by 24 dB
0
VPS1, VGAIN = 0.5V
1V
–10
100
–20
90
PSRR (dB)
VPSV, VGAIN = 0.5V
–40
–50
VPS1, VGAIN = 0V
10
–60
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–70
–80
100k
1M
03199-053
100ns
03199-050
0
–30
10M
100M
FREQUENCY (Hz)
Figure 50. VGA Overdrive Recovery, VINH 4 mV p-p to 275 mV p-p Burst,
VGAIN = 1 V VGA Output Shown Attenuated by 24 dB
Figure 53. PSRR vs. Frequency (No Bypass Capacitor)
140
QUIESCENT SUPPLY CURRENT (mA)
1ms
03199-051
200mV
130
VGAIN = 0.5V
AD8334
120
110
100
90
80
70
AD8332
60
50
40
AD8331
30
20
–40
–20
0
20
40
03199-054
2V
60
80
TEMPERATURE (°C)
Figure 51. Enable Response, Top: VENB, Bottom: VOUT, VINH = 30 mV p-p
Rev. F | Page 19 of 60
Figure 54. Quiescent Supply Current vs. Temperature
100
AD8331/AD8332/AD8334
TEST CIRCUITS
dividing the output noise by the numerical gain between Point A
and Point B and accounting for the noise floor of the spectrum
analyzer. The gain should be measured at each frequency of
interest and with low signal levels because a 50 Ω load is driven
directly. The generator is removed when noise measurements
are made.
MEASUREMENT CONSIDERATIONS
Figure 55 through Figure 68 show typical measurement
configurations and proper interface values for measurements
with 50 Ω conditions.
Short-circuit input noise measurements are made as shown in
Figure 62. The input-referred noise level is determined by
NETWORK ANALYZER
50Ω
OUT
50Ω
IN
18nF 270Ω
0.1µF
0.1µF
237Ω
28Ω
INH
1:1
DUT
22pF
0.1µF
237Ω
0.1µF
28Ω
LMD
*FERRITE BEAD
03199-055
FB*
120nH
Figure 55. Test Circuit—Gain and Bandwidth Measurements
NETWORK ANALYZER
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50Ω
OUT
50Ω
IN
18nF 10kΩ
0.1µF
0.1µF
INH
237Ω
28Ω
1:1
DUT
22pF
0.1µF
237Ω
LMD
0.1µF
*FERRITE BEAD
28Ω
VGN
03199-056
FB*
10kΩ 120nH
Figure 56. Test Circuit—Frequency Response for Various Matched Source Impedances
NETWORK ANALYZER
50Ω
50Ω
0.1µF
FB*
120nH
0.1µF
INH
22pF
*FERRITE BEAD
237Ω
28Ω
1:1
DUT
0.1µF
LMD
0.1µF
IN
VGN
237Ω
28Ω
03199-057
OUT
Figure 57. Test Circuit—Frequency Response for Unterminated LNA, RS = 50 Ω
Rev. F | Page 20 of 60
AD8331/AD8332/AD8334
NETWORK ANALYZER
50Ω
50Ω
18nF 10kΩ
0.1µF
OR
1µF
FB*
120nH
INH
IN
0.1µF
OR
1µF
0.1µF 237Ω
LNA
28Ω
VGA
1:1
22pF
LMD
0.1µF
*FERRITE BEAD
237Ω
0.1µF
OR
1µF
0.1µF
28Ω
03199-058
OUT
Figure 58. Test Circuit—Group Delay vs. Frequency for Two Values of AC Coupling
18nF 270Ω
NETWORK
ANALYZER
0.1µF
50Ω
OUT
FB*
120nH
0.1µF
INH
237Ω
28Ω
DUT
1:1
50Ω
22pF
LMD
03199-059
0.1µF 237Ω
0.1µF
28Ω
*FERRITE BEAD
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Figure 59. Test Circuit—LNA Input Impedance vs. Frequency in Standard and Smith Chart (S11) Formats
NETWORK ANALYZER
OUT
50Ω
50Ω
IN
0.1µF
0.1µF
237Ω
0.1µF
0.1µF
28Ω
INH
LNA
1:1
VGA
22pF
LMD
0.1µF
237Ω
0.1µF
0.1µF
*FERRITE BEAD
03199-060
FB*
120nH
28Ω
Figure 60. Test Circuit—Frequency Response for Unterminated LNA, Single-Ended
NETWORK
ANALYZER
18nF 270Ω
0.1µF
INH
0.1µF
1:1
IN
50Ω
28Ω
DUT
22pF
237Ω
0.1µF 0.1µF
*FERRITE BEAD
237Ω
LMD
28Ω
Figure 61. Test Circuit—Short-Circuit, Input-Referred Noise
Rev. F | Page 21 of 60
03199-061
FB*
120nH
AD8331/AD8332/AD8334
SPECTRUM
ANALYZER
B
A
GAIN
0.1µF
49.9Ω
DUT
1:1
22pF
1Ω
50Ω
INH
0.1µF
0.1µF
SIGNAL GENERATOR
TO MEASURE GAIN
DISCONNECT FOR
NOISE MEASUREMENT
50Ω
IN
03199-062
FERRITE
BEAD
0.1µF 120nH
LMD
Figure 62. Test Circuit—Noise Figure
SPECTRUM
ANALYZER
18nF
270Ω
AD8332
0.1µF
INH
–6dB
LPF
0.1µF
1kΩ
1kΩ
0.1µF
28Ω
0.1µF
03199-063
LMD
SIGNAL
GENERATOR
IN
28Ω
DUT
22pF
50Ω
50Ω
–6dB
1:1
Figure 63. Test Circuit—Harmonic Distortion vs. Load Resistance
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SPECTRUM
ANALYZER
18nF
270Ω
0.1µF
AD8332
237Ω
0.1µF
50Ω
28Ω
–6dB
LPF
IN
–6dB
1:1
DUT
22pF
237Ω
LMD
50Ω
0.1µF
0.1µF
28Ω
03199-064
SIGNAL
GENERATOR
Figure 64. Test Circuit—Harmonic Distortion vs. Load Capacitance
SPECTRUM
ANALYZER
+22dB –6dB
18nF 274Ω
50Ω
+22dB –6dB
0.1µF
INH
0.1µF
237Ω
28Ω
DUT
22pF
1:1
237Ω
0.1µF 0.1µF
50Ω
LMD
SIGNAL
GENERATORS
–6dB
INPUT
50Ω
*FERRITE BEAD
Figure 65.Test Circuit—IMD3 vs. Frequency
Rev. F | Page 22 of 60
28Ω
03199-065
COMBINER
–6dB
FB*
120nH
AD8331/AD8332/AD8334
OSCILLOSCOPE
18nF 270Ω
0.1µF
0.1µF
50Ω
IN
28Ω
INH
DUT
1:1
22pF
50Ω
237Ω
237Ω
LMD
0.1µF
0.1µF
28Ω
03199-066
FB*
120nH
*FERRITE BEAD
Figure 66. Test Circuit—Pulse Response Measurements
OSCILLOSCOPE
18nF 270Ω
0.1µF
FB*
120nH
0.1µF
DIFF
PROBE
255Ω
INH
CH1 CH2
DUT
22pF
LMD
0.1µF
255Ω
0.1µF
9.5dB
50Ω
TO PIN GAIN
OR PIN ENxx
*FERRITE BEAD
PULSE
GENERATOR
03199-067
50Ω
RF
SIGNAL
GENERATOR
Figure 67. Test Circuit—Gain and Enable Transient Response
NETWORK
ANALYZER
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TO POWER
PINS
OUT 50Ω
50Ω
IN
18nF 270Ω
0.1µF
FB*
120nH 0.1µF
255Ω
INH
DIFF
PROBE
PROBE POWER
DUT
50Ω
RF
SIGNAL
GENERATOR
LMD
0.1µF
0.1µF
255Ω
*FERRITE BEAD
Figure 68. Test Circuit—PSRR vs. Frequency
Rev. F | Page 23 of 60
03199-068
22pF
AD8331/AD8332/AD8334
THEORY OF OPERATION
LON1 LOP1 VIP1 VIN1 EN12
OVERVIEW
The AD8331/AD8332/AD8334 operate in the same way. Figure
69, Figure 70, and Figure 71 are functional block diagrams of
the three devices
LON LOP VIP
VIN
VCM
–
+
LNA
–
LMD
+
ATTENUATOR
–48dB
VCM
BIAS
LMD2
INH2
VOH
VGA BIAS AND
INTERPOLATOR
CLAMP
AD8331
GAIN12
HILO
VOL2
21dB
PA2
VOH2
VIP2
RCLMP
MODE
03199-069
ENBV
ENBL
GAIN
INT
LOP2
VOL
GAIN INT
PA1
VOL1
+ ATTENUATOR
–48dB
–
VIN2
VCM
BIAS
21dB
LNA 2
LON2
PA
CLMP12
CLAMP
VOH1
– ATTENUATOR
–48dB
+
VGA BIAS AND
INTERPOLATOR
3.5dB/
15.5dB
21dB
VMID1
LNA 1
LMD1
HILO
VMID
INH
INH1
VCM1
GAIN
GAIN UP/
DOWN
MODE
VMID2
VCM2
VMID3
VCM3
VIN3
VIP3
VOH3
– ATTENUATOR
–48dB
LOP3
21dB
+
LON3
PA3
VOL3
Figure 69. AD8331 Functional Block Diagram
INH3
VCM1
HILO
LMD3
VCM
BIAS
LMD4
LNA 2
PA4
VOH4
AD8334
LNA 4
CLAMP
CLMP34
VMID4
PA1
VOL1
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VCM BIAS
LMD2
INH4
VOH1
21dB
21dB
03199-071
LMD1
INH2
– ATTENUATOR
–48dB
+
LNA 1
VGA BIAS AND
INTERPOLATOR
+ ATTENUATOR
–48dB
–
LON2 LOP2 VIP2 VIN2
GAIN
INT
LON4
GAIN
VOH1
21dB
PA2
VOL1
AD8332
VMID
ENB
VCM2
CLAMP
Figure 70. AD8332 Functional Block Diagram
LOP4
VIP4 VIN4
EN34
VCM4
Figure 71. AD8334 Functional Block Diagram
RCLMP
03199-070
INH1
GAIN34
VOL4
+ ATTENUATOR
–48dB
–
3.5dB/
15.5dB
VMID
+19dB
GAIN
INT
Each channel contains an LNA that provides user-adjustable input
impedance termination, a differential X-AMP VGA, and a programmable gain postamp with adjustable output voltage limiting.
Figure 72 shows a simplified block diagram with external
components.
HILO
LON
VIN
SIGNAL PATH
PREAMPLIFIER
19dB
INH
VOH
48dB
ATTENUATOR
LNA
POSTAMP
3.5dB/15.5dB
21dB
VOL
VMID
LMD
LOP
VCM
BIAS
VIP
BIAS AND
INTERPOLATOR
VCM
GAIN
INTERFACE
GAIN
Figure 72. Simplified Block Diagram
Rev. F | Page 24 of 60
CLAMP
RCLMP
03199-072
LON1 LOP1 VIP1 VIN1
VGA BIAS AND
INTERPOLATOR
LNA 3
AD8331/AD8332/AD8334
The linear-in-dB gain-control interface is trimmed for slope
and absolute accuracy. The gain range is 48 dB, extending from
−4.5 dB to +43.5 dB in LO gain and +7.5 dB to +55.5 dB in HI
gain mode. The slope of the gain control interface is 50 dB/V,
and the gain control range is 40 mV to 1 V. Equation 1 and
Equation 2 are the expressions for gain.
LOW NOISE AMPLIFIER (LNA)
GAIN (dB) = 50 (dB/V) × VGAIN − 6.5 dB, (HILO = LO)
A simplified schematic of the LNA is shown in Figure 74. INH
is capacitively coupled to the source. A bias generator
establishes dc input bias voltages of 3.25 V and centers the
output common-mode levels at 2.5 V. A capacitor CLMD (can be
the same value as the input coupling capacitor CINH) is
connected from the LMD pin to ground.
or
GAIN (dB) = 50 (dB/V) × VGAIN + 5.5 dB, (HILO = HI)
(2)
The ideal gain characteristics are shown in Figure 73.
60
CIZ
50
TO
VGA
HILO = HI
40
VPOS
LOP
GAIN (dB)
RIZ
LON
2.5V
30
2.5V
I0
20
I0
–a
10
0
0.2
0.4
0.6
03199-073
ASCENDING GAIN MODE
DESCENDING GAIN MODE
(WHERE AVAILABLE)
0
–10
CINH
HILO = LO
0.8
1.0
RS
INH
3.25V
–a
Q1
3.25V
VCM
BIAS
I0
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VGAIN (V)
Figure 73. Ideal Gain Control Characteristics
Figure 74. Simplified LNA Schematic
The gain slope is negative with MODE pulled high (where
available), as follows:
GAIN (dB) = −50 (dB/V) × VGAIN + 45.5 dB, (HILO = LO)
(3)
or
GAIN (dB) = −50 (dB/V) × VGAIN + 57.5 dB, (HILO = HI)
LMD
CLMD
CSH
I0
1.1
Q2
03199-074
(1)
Good noise performance in the AD8331/AD8332/AD8334
relies on a proprietary ultralow noise preamplifier at the beginning
of the signal chain, which minimizes the noise contribution in the
following VGA. Active impedance control optimizes noise performance for applications that benefit from input matching.
(4)
The LNA converts a single-ended input to a differential output
with a voltage gain of 19 dB. If only one output is used, the gain
is 13 dB. The inverting output is used for active input impedance
termination. Each of the LNA outputs is capacitively coupled to
a VGA input. The VGA consists of an attenuator with a range of
48 dB followed by an amplifier with 21 dB of gain for a net gain
range of −27 dB to +21 dB. The X-AMP gain-interpolation
technique results in low gain error and uniform bandwidth, and
differential signal paths minimize distortion.
The final stage is a logic programmable amplifier with gains of
3.5 dB or 15.5 dB. The LO and HI gain modes are optimized for
12-bit and 10-bit ADC applications, in terms of output-referred
noise and absolute gain range. Output voltage limiting can be
programmed by the user.
The LNA supports differential output voltages as high as 5 V p-p,
with positive and negative excursions of ±1.25 V, about a
common-mode voltage of 2.5 V. Because the differential gain
magnitude is 9, the maximum input signal before saturation is
±275 mV or +550 mV p-p. Overload protection ensures quick
recovery time from large input voltages. Because the inputs are
capacitively coupled to a bias voltage near midsupply, very large
inputs can be handled without interacting with the ESD protection.
Low value feedback resistors and the current-driving capability
of the output stage allow the LNA to achieve a low input-referred
voltage noise of 0.74 nV/√Hz. This is achieved with a current
consumption of only 11 mA per channel (55 mW). On-chip
resistor matching results in precise single-ended gains of 4.5×
(9× differential), critical for accurate impedance control. The
use of a fully differential topology and negative feedback
minimizes distortion. Low HD2 is particularly important in
second harmonic ultrasound imaging applications. Differential
signaling enables smaller swings at each output, further
reducing third-order distortion.
Rev. F | Page 25 of 60
AD8331/AD8332/AD8334
UNTERMINATED
Active Impedance Matching
The LNA supports active impedance matching through an external
shunt feedback resistor from Pin LON to Pin INH. The input
resistance, RIN, is given in Equation 5, where A is the singleended gain of 4.5, and 6 kΩ is the unterminated input impedance.
RIZ
6 kΩ × RIZ
6 kΩ =
1+ A
33 kΩ + RIZ
VIN
VOUT
+
–
RESISTIVE TERMINATION
(5)
RS
CIZ is needed in series with RIZ because the dc levels at Pin LON
and Pin INH are unequal. Expressions for choosing RIZ in terms
of RIN and for choosing CIZ are found in the Applications
Information section. CSH and the ferrite bead enhance stability at
higher frequencies, where the loop gain is diminished, and
prevent peaking. Frequency response plots of the LNA are shown
in Figure 23 and Figure 24. The bandwidth is approximately
130 MHz for matched input impedances of 50 Ω to 200 Ω and
declines at higher source impedances. The unterminated
bandwidth (when RIZ = ∞) is approximately 80 MHz.
VIN
RIN
+
RS
VOUT
–
ACTIVE IMPEDANCE MATCH - RS = RIN
RIZ
RS
VIN
RIN
VOUT
+
–
RIN =
RIZ
1 + 4.5
Figure 75. Input Configurations
7
INCLUDES NOISE OF VGA
6
NOISE FIGURE (dB)
Each output can drive external loads as low as 100 Ω in addition
to the 100 Ω input impedance of the VGA (200 Ω differential).
Capacitive loading up to 10 pF is permissible. All loads should
be ac-coupled. Typically, Pin LOP output is used as a singleended driver for auxiliary circuits, such as those used for
Doppler ultrasound imaging. Pin LON drives RIZ. Alternatively,
a differential external circuit can be driven from the two
outputs in addition to the active feedback termination. In both
cases, important stability considerations discussed in the
Applications Information section should be carefully observed.
RIN
03199-075
RIN =
RS
RESISTIVE TERMINATION
(RS = RIN)
5
4
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The impedance at each LNA output is 5 Ω. A 0.4 dB reduction
in open-circuit gain results when driving the VGA, and a 0.8 dB
reduction results with an additional 100 Ω load at the output.
The differential gain of the LNA is 6 dB higher. If the load is less
than 200 Ω on either side, a compensating load is recommended
on the opposite output.
3
ACTIVE IMPEDANCE MATCH
2
SIMULATION
0
50
100
03199-076
1
UNTERMINATED
1k
RS (Ω)
Figure 76. Noise Figure vs. RS for Resistive,
Active Match, and Unterminated Inputs
7
LNA Noise
INCLUDES NOISE OF VGA
6
NOISE FIGURE (dB)
5
4
3
2
RIN = 50Ω
RIN = 75Ω
RIN = 100Ω
RIN = 200Ω
RIZ = ∞
1
03199-077
The input-referred voltage noise sets an important limit on
system performance. The short-circuit input voltage noise of
the LNA is 0.74 nV/√Hz or 0.82 nV/√Hz (at maximum gain),
including the VGA noise. The open-circuit current noise is
2.5 pA/√Hz. These measurements, taken without a feedback
resistor, provide the basis for calculating the input noise and
noise figure performance of the configurations in Figure 75.
Figure 76 and Figure 77 show simulations extracted from these
results and the 4.1 dB noise figure (NF) measurement with the
input actively matched to a 50 Ω source. Unterminated (RIZ =
∞) operation exhibits the lowest equivalent input noise and
noise figure. Figure 76 shows the noise figure vs. source
resistance, rising at low RS, where the LNA voltage noise is large
compared to the source noise, and again at high RS due to
current noise. The VGA input-referred voltage noise of 2.7
nV/√Hz is included in all of the curves.
(SIMULATED RESULTS)
0
50
100
1k
RS (Ω)
Figure 77. Noise Figure vs. RS for Various Fixed Values of RIN, Actively Matched
Rev. F | Page 26 of 60
AD8331/AD8332/AD8334
The primary purpose of input impedance matching is to
improve the system transient response. With resistive termination,
the input noise increases due to the thermal noise of the
matching resistor and the increased contribution of the LNA
input voltage noise generator. With active impedance matching,
however, the contributions of both are smaller than they would
be for resistive termination by a factor of 1/(1 + LNA Gain).
Figure 76 shows their relative NF performance. In this graph,
the input impedance is swept with RS to preserve the match at
each point. The noise figures for a source impedance of
50 Ω are 7.1 dB, 4.1 dB, and 2.5 dB, respectively, for the
resistive, active, and unterminated configurations. The noise
figures for 200 Ω are 4.6 dB, 2.0 dB, and 1.0 dB, respectively.
Figure 77 is a plot of NF vs. RS for various values of RIN, which is
helpful for design purposes. The plateau in the NF for actively
matched inputs mitigates source impedance variations. For
comparison purposes, a preamp with a gain of 19 dB and noise
spectral density of 1.0 nV/√Hz, combined with a VGA with
3.75 nV/√Hz, yields a noise figure degradation of approximately
1.5 dB (for most input impedances), significantly worse than
the AD8331/AD8332/AD8334 performance.
The equivalent input noise of the LNA is the same for singleended and differential output applications. The LNA noise figure
improves to 3.5 dB at 50 Ω without VGA noise, but this is
exclusive of noise contributions from other external circuits
connected to LOP. A series output resistor is usually recommended for stability purposes when driving external circuits on
a separate board (see the Applications Information section). In
low noise applications, a ferrite bead is even more desirable.
X-AMP VGA
The input of the VGA is a differential R-2R ladder attenuator
network with 6 dB steps per stage and a net input impedance of
200 Ω differential. The ladder is driven by a fully differential
input signal from the LNA and is not intended for single-ended
operation. LNA outputs are ac-coupled to reduce offset and
isolate their common-mode voltage. The VGA inputs are biased
through the center tap connection of the ladder to VCM, which
is typically set to 2.5 V and is bypassed externally to provide a
clean ac ground.
The signal level at successive stages in the input attenuator
falls from 0 dB to −48 dB in 6 dB steps. The input stages of the
X-AMP are distributed along the ladder, and a biasing interpolator,
controlled by the gain interface, determines the input tap point.
With overlapping bias currents, signals from successive taps
merge to provide a smooth attenuation range from 0 dB to
−48 dB. This circuit technique results in excellent linear-in-dB
gain law conformance and low distortion levels and deviates
±0.2 dB or less from the ideal. The gain slope is monotonic with
respect to the control voltage and is stable with variations in
process, temperature, and supply.
The X-AMP inputs are part of a gain-of-12 feedback amplifier
that completes the VGA. Its bandwidth is 150 MHz. The input
stage is designed to reduce feedthrough to the output and to
ensure excellent frequency response uniformity across gain
setting (see Figure 12 and Figure 13).
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VARIABLE GAIN AMPLIFIER
The differential X-AMP VGA provides precise input attenuation
and interpolation. It has a low input-referred noise of 2.7 nV/√Hz
and excellent gain linearity. A simplified block diagram is shown
in Figure 78.
GAIN
GAIN INTERPOLATOR
(BOTH CHANNELS)
+
POSTAMP
6dB
R
200Ω
48dB
2R
POSTAMP
03199-078
VIN
–
Position along the VGA attenuator is controlled by a singleended analog control voltage, VGAIN, with an input range of
40 mV to 1.0 V. The gain control scaling is trimmed to a slope
of 50 dB/V (20 mV/dB). Values of VGAIN beyond the control
range saturate to minimum or maximum gain values. Both
channels of the AD8332 are controlled from a single gain
interface to preserve matching. Gain can be calculated using
Equation 1 and Equation 2.
Gain accuracy is very good because both the scaling factor and
absolute gain are factory trimmed. The overall accuracy relative
to the theoretical gain expression is ±1 dB for variations in
temperature, process, supply voltage, interpolator gain ripple,
trim errors, and tester limits. The gain error relative to a best-fit
line for a given set of conditions is typically ±0.2 dB. Gain
matching between channels is better than 0.1 dB (Figure 11
shows gain errors in the center of the control range). When
VGAIN < 0.1 or > 0.95, gain errors are slightly greater.
gm
VIP
Gain Control
Figure 78. Simplified VGA Schematic
Rev. F | Page 27 of 60
AD8331/AD8332/AD8334
The gain slope can be inverted, as shown in Figure 73 (except
for the AD8332 AR models). The gain drops with a slope of
−50 dB/V across the gain control range from maximum to
minimum gain. This slope is useful in applications such as
automatic gain control, where the control voltage is proportional to the measured output signal amplitude. The inverse
gain mode is selected by setting the MODE pin to HI gain mode.
Gain control response time is less than 750 ns to settle within 10%
of the final value for a change from minimum to maximum gain.
VGA Noise
In a typical application, a VGA compresses a wide dynamic
range input signal to within the input span of an ADC. While
the input-referred noise of the LNA limits the minimum resolvable
input signal, the output-referred noise, which depends primarily
on the VGA, limits the maximum instantaneous dynamic range
that can be processed at any one particular gain control voltage.
This limit is set in accordance with the quantization noise floor
of the ADC.
Output and input-referred noise as a function of VGAIN are plotted
in Figure 25 and Figure 27 for the short-circuited input conditions. The input noise voltage is simply equal to the output noise
divided by the measured gain at each point in the control range.
The output-referred noise is flat over most of the gain range
because it is dominated by the fixed output-referred noise of the
VGA. Values are 48 nV/√Hz in LO gain mode and 178 nV/√Hz
in HI gain mode. At the high end of the gain control range, the
noise of the LNA and the noise of the source prevail. The inputreferred noise reaches its minimum value near the maximum
gain control voltage, where the input-referred contribution of
the VGA becomes very small.
Gain control noise is a concern in very low noise applications.
Thermal noise in the gain control interface can modulate the
channel gain. The resultant noise is proportional to the output
signal level and usually only evident when a large signal is
present. Its effect is observable only in LO gain mode where the
noise floor is substantially lower. The gain interface includes an
on-chip noise filter, which reduces this effect significantly at
frequencies above 5 MHz. Care should be taken to minimize
noise impinging at the GAIN input. An external RC filter can be
used to remove VGAIN source noise. The filter bandwidth should be
sufficient to accommodate the desired control bandwidth.
Common-Mode Biasing
An internal bias network connected to a midsupply voltage
establishes common-mode voltages in the VGA and postamp.
An externally bypassed buffer maintains the voltage. The bypass
capacitors form an important ac ground connection because the
VCM network makes a number of important connections
internally, including the center tap of the VGA differential input
attenuator, the feedback network of the VGA fixed gain
amplifier, and the feedback network of the postamp in both
gain settings. For best results, use a 1 nF capacitor and a 0.1 μF
capacitor in parallel, with the 1 nF capacitor nearest to the VCM
pin. Separate VCM pins are provided for each channel. For dc
coupling to a 3 V ADC, the output common-mode voltage is
adjusted to 1.5 V by biasing the VCM pin.
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POSTAMPLIFIER
The final stage has a selectable gain of 3.5 dB (×1.5) or 15.5 dB
(×6), set by the HILO logic pin. Figure 79 is a simplified block
diagram.
+
At lower gains, the input-referred noise, and thus noise figure,
increases as the gain decreases. The instantaneous dynamic
range of the system is not lost, however, because the input
capacity increases with it. The contribution of the ADC noise
floor has the same dependence as well. The important
relationship is the magnitude of the VGA output noise floor
relative to that of the ADC.
The preceding noise performance discussion applies to a
differential VGA output signal. Although the LNA noise
performance is the same in single-ended and differential
applications, the VGA performance is not. The noise of the
VGA is significantly higher in single-ended usage because the
contribution of its bias noise is designed to cancel in the differential
signal. A transformer can be used with single-ended applications
when low noise is desired.
VOH
Gm1
F2
F1
VCM
Gm2
VOL
–
Gm1
03199-079
With its low output-referred noise levels, these devices ideally
drive low voltage ADCs. The converter noise floor drops 12 dB
for every two bits of resolution and drops at lower input fullscale voltages and higher sampling rates. ADC quantization
noise is discussed in the Applications Information section.
Gm2
Figure 79. Postamplifier Block Diagram
Separate feedback attenuators implement the two gain settings.
These are selected in conjunction with an appropriately scaled
input stage to maintain a constant 3 dB bandwidth between the
two gain modes (~150 MHz). The slew rate is 1200 V/μs in HI
gain mode and 300 V/μs in LO gain mode. The feedback
networks for HI and LO gain modes are factory trimmed to
adjust the absolute gains of each channel.
Rev. F | Page 28 of 60
AD8331/AD8332/AD8334
Although the quantization noise floor of an ADC depends on a
number of factors, the 48 nV/√Hz and 178 nV/√Hz levels are
well suited to the average requirements of most 12-bit and 10-bit
converters, respectively. An additional technique, described in
the Applications Information section, can extend the noise floor
even lower for possible use with 14-bit ADCs.
Output Clamping
Outputs are internally limited to a level of 4.5 V p-p differential
when operating at a 2.5 V common-mode voltage. The postamp
implements an optional output clamp engaged through a resistor
from RCLMP to ground. Table 8 shows a list of recommended
resistor values.
The accuracy of the clamping levels is approximately ±5% in LO
or HI mode. Figure 80 illustrates the output characteristics for a
few values of RCLMP.
5.0
4.5
RCLMP = ∞
4.0
8.8kΩ
3.5
3.5kΩ
3.0
2.5
RCLMP = 1.86kΩ
2.0
3.5kΩ
1.5
8.8kΩ
1.0
0.5
0
–3
RCLMP = ∞
–2
–1
03199-080
The topology of the postamp provides constant input-referred
noise with the two gain settings and variable output-referred
noise. The output-referred noise in HI gain mode increases
(with gain) by four. This setting is recommended when driving
converters with higher noise floors. The extra gain boosts the
output signal levels and noise floor appropriately. When driving
circuits with lower input noise floors, the LO gain mode optimizes
the output dynamic range.
Output clamping can be used for ADC input overload
protection, if needed, or postamp overload protection when
operating from a lower common-mode level, such as 1.5 V. The
user should be aware that distortion products increase as output
levels approach the clamping levels, and the user should adjust
the clamp resistor accordingly. For additional information, see
the Applications Information section.
VOH, VOL (V)
Noise
0
1
2
VINH (V)
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Figure 80. Output Clamping Characteristics
Rev. F | Page 29 of 60
3
AD8331/AD8332/AD8334
APPLICATIONS INFORMATION
CLMD
0.1µF
The LMD pin (connected to the bias circuitry) must be bypassed to
ground and signal sourced to the INH pin, which is capacitively
coupled using 2.2 nF to 0.1 μF capacitors (see Figure 81).
1
2
+5V
The unterminated input impedance of the LNA is 6 kΩ. The
user can synthesize any LNA input resistance between 50 Ω and
6 kΩ. RIZ is calculated according to Equation 6 or selected from
Table 7.
RIZ (Nearest STD 1% Value, Ω)
280
412
562
1.13 k
3.01 k
∞
5
6
(6)
7
0.1µF
Table 7. LNA External Component Values for Common
Source Impedances
RIN (Ω)
50
75
100
200
500
6k
4
1nF
9
VGAIN
1nF
CSH (pF)
22
12
8
1.2
None
None
When active input termination is used, a decoupling capacitor
(CIS) is required to isolate the input and output bias voltages of
the LNA.
8
10
11
0.1µF
1nF
12
13
14
LMD1
INH2
INH1
VPS2
VPS1
LON2
LON1
LOP2
LOP1
COM2
COM1
VIP2
VIP1
VIN2
VIN1
VCM2
VCM1
GAIN
HILO
RCLMP
ENB
VOH2
VOL2
COMM
VOH1
VOL1
VPSV
28
0.1µF
CSH*
27
5V
CIZ*
26
RIZ* 1nF
25
0.1µF
LNA OUT
24
23
22
0.1µF
21
20
19
5V 1nF
18
0.1µF
5V
17
*
16
*
VGA OUT
VGA OUT
15
5V
1nF
0.1µF
*SEE TEXT
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Figure 81. Basic Connections for a Typical Channel (AD8332 Shown)
RIZ
The shunt input capacitor, CSH, reduces gain peaking at higher
frequencies where the active termination match is lost due to
the gain roll-off of the LNA at high frequencies. The value of
CSH diminishes as RIN increases to 500 Ω, at which point no
capacitor is required. Suggested values for CSH for 50 Ω ≤ RIN ≤
200 Ω are shown in Table 7.
VIP
5Ω
100Ω
VCM
2.5V
TO EXT
CIRCUIT
50Ω
LON
3.25V
LNA
2.5V
CSH
3.25V
When a long trace to Pin INH is unavoidable, or if both LNA
outputs drive external circuits, a small ferrite bead (FB) in series
with Pin INH preserves circuit stability with negligible effect on
noise. The bead shown is 75 Ω at 100 MHz (Murata BLM21 or
equivalent). Other values can prove useful.
Figure 82 shows the interconnection details of the LNA output.
Capacitive coupling between the LNA outputs and the VGA
inputs is required because of the differences in their dc levels
and the need to eliminate the offset of the LNA. Capacitor
values of 0.1 μF are recommended. There is a 0.4 dB loss in gain
between the LNA output and the VGA input due to the 5 Ω
output resistance. Additional loading at the LOP and LON
outputs affects LNA gain.
LNA
DECOUPLING
RESISTOR
5Ω
100Ω
LOP
50Ω
VIN
LNA
DECOUPLING
RESISTOR
TO EXT
CIRCUIT
03199-082
33 kΩ × (RIN )
RIZ =
6 kΩ – (RIN )
3
LMD2
LNA
SOURCE
FB
03199-081
LNA—EXTERNAL COMPONENTS
Figure 82. Interconnections of the LNA and VGA
Both LNA outputs are available for driving external circuits.
Pin LOP should be used in those instances when a single-ended
LNA output is required. The user should be aware of stray
capacitance loading of the LNA outputs, in particular LON. The
LNA can drive 100 Ω in parallel with 10 pF. If an LNA output is
routed to a remote PC board, it tolerates a load capacitance up
to 100 pF with the addition of a 49.9 Ω series resistor or ferrite
75 Ω/100 MHz bead.
Rev. F | Page 30 of 60
AD8331/AD8332/AD8334
Gain Input
Optional Output Voltage Limiting
The GAIN pin is common to both channels of the AD8332. The
input impedance is nominally 10 MΩ, and a bypass capacitor
from 100 pF to 1 nF is recommended.
The RCLMP pin provides the user with a means to limit the
output voltage swing when used with loads that have no
provisions for prevention of input overdrive. The peak-to-peak
limited voltage is adjusted by a resistor to ground (see Table 8
for a list of several voltage levels and corresponding resistor
values). Unconnected, the default limiting level is 4.5 V p-p.
If gain control noise in LO gain mode becomes a factor, maintaining ≤15 nV/√Hz noise at the GAIN pin ensures satisfactory
noise performance. Internal noise prevails below 15 nV/√Hz at
the GAIN pin. Gain control noise is negligible in HI gain mode.
VCM Input
The common-mode voltage of Pin VCM, Pin VOL, and Pin VOH
defaults to 2.5 V dc. With output ac-coupled applications, the
VCM pin is unterminated; however, it must still be bypassed in
close proximity for ac grounding of internal circuitry. The VGA
outputs can be dc connected to a differential load, such as an
ADC. Common-mode output voltage levels between 1.5 V and
3.5 V can be realized at Pin VOH and Pin VOL by applying the
desired voltage at Pin VCM. DC-coupled operation is not
recommended when driving loads on a separate PC board.
The voltage on the VCM pin is sourced by an internal buffer
with an output impedance of 30 Ω and a ±2 mA default output
current (see Figure 83). If the VCM pin is driven from an
external source, its output impedance should be <<30 Ω, and its
current drive capability should be >>2 mA. If the VCM pins of
several devices are connected in parallel, the external buffer
should be capable of overcoming their collective output currents.
When a common-mode voltage other than 2.5 V is used, a
voltage-limiting resistor, RCLMP, is needed to protect against
overload.
Note that third harmonic distortion increases as waveform
amplitudes approach clipping. For lowest distortion, the clamp
level should be set higher than the converter input span. A
clamp level of 1.5 V p-p is recommended for a 1 V p-p linear
output range, 2.7 V p-p for a 2 V p-p range, or 1 V p-p for
a 0.5 V p-p operation. The best solution is determined
experimentally. Figure 84 shows third harmonic distortion
as a function of the limiting level for a 2 V p-p output signal.
A wider limiting level is desirable in HI gain mode.
–20
VGAIN = 0.75V
–30
–40
HD3 (dBc)
Parallel connected devices can be driven by a common voltage
source or DAC. Decoupling should take into account any
bandwidth considerations of the drive waveform, using the total
distributed capacitance.
–50
www.BDTIC.com/ADI
30Ω
VCM
100pF
RO << 30Ω
NEW VCM
0.1µF
AC GROUNDING FOR
INTERNAL CIRCUITRY
03199-083
2mA MAX
INTERNAL
CIRCUITRY
Figure 83. VCM Interface
Logic Inputs—ENB, MODE, and HILO
The input impedance of all enable pins is nominally 25 kΩ and
can be pulled up to 5 V (a pull-up resistor is recommended) or
driven by any 3 V or 5 V logic families. The enable pin, ENB,
powers down the VGA; when pulled low, the VGA output voltages
are near ground. Multiple devices can be driven from a common
source. Consult Table 3, Table 4, Table 5, and Table 6 for information about circuit functions controlled by the enable pins.
Pin HILO is compatible with 3 V or 5 V CMOS logic families. It
is either connected to ground or pulled up to 5 V, depending on
the desired gain range and output noise.
HILO = LO
–60
–80
1.5
2.0
2.5
3.0
3.5
4.0
03199-084
HILO = HI
–70
4.5
5.0
CLAMP LIMIT LEVEL (V p-p)
Figure 84. HD3 vs. Clamping Level for 2 V p-p Differential Input
Table 8. Clamp Resistor Values
Clamp Level (V p-p)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.4
Clamp Resistor Value (kΩ)
HILO = LO
HILO = HI
1.21
2.74
2.21
4.75
4.02
7.5
6.49
11
9.53
16.9
14.7
26.7
23.2
49.9
39.2
100
73.2
Output Decoupling
When driving capacitive loads greater than about 10 pF, or long
circuit connections on other boards, an output network of
resistors and/or ferrite beads can be useful to ensure stability.
These components can be incorporated into a Nyquist filter
such as the one shown in Figure 81. In Figure 81, the resistor
value is 84.5 Ω. For example, all the evaluation boards for this
series incorporate 100 Ω in parallel with a 120 nH bead. Lower
value resistors are permissible for applications with nearby loads
Rev. F | Page 31 of 60
AD8331/AD8332/AD8334
or with gains less than 40 dB. The exact values of these
components can be selected empirically.
An antialiasing noise filter is typically used with an ADC. Filter
requirements are application dependent.
When the ADC resides on a separate board, the majority of
filter components should be placed nearby to suppress noise
picked up between boards and to mitigate charge kickback from
the ADC inputs. Any series resistance beyond that required for
output stability should be placed on the ADC board. Figure 85
shows a second-order, low-pass filter with a bandwidth of
20 MHz. The capacitor is chosen in conjunction with the 10 pF
input capacitance of the ADC.
OPTIONAL
BACKPLANE
1.5µH
158Ω
43.5
18pF
ADC
X-AMP
OVERLOAD
15mV
POSTAMP
OVERLOAD
25mV
56.5
4mV
X-AMP
OVERLOAD
25mV
41dB
29dB
The output drive accommodates a wide range of ADCs. The
noise floor requirements of the VGA depend on a number of
application factors, including bit resolution, sampling rate, fullscale voltage, and the bandwidth of the noise/antialias filter. The
output noise floor and gain range can be adjusted by selecting
HI or LO gain mode.
24.5dB
LO GAIN
MODE
LNA OVERLOAD
DRIVING ADCs
GAIN (dB)
Figure 85. 20 MHz Second-Order, Low-Pass Filter
24.5dB
HI GAIN
MODE
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4V p-p DIFF,
48nV/ Hz
187Ω
2:1
VOL
187Ω
374Ω
LPF
ADC
AD6644
03199-086
VOH
2V p-p DIFF,
24nV/ Hz
7.5
10m
0.1 0.275
1
1m
INPUT AMPLITUDE (V)
10m
0.1 0.275
INPUT AMPLITUDE (V)
1
Figure 87. Overload Gain and Signal Conditions
The clamp interface mentioned in the Output Clamping section
controls the maximum output swing of the postamp and its
overload response . When the clamp feature is not used, the
output level defaults to approximately 4.5 V p-p differential
centered at 2.5 V common mode. When other common-mode
levels are set through the VCM pin, the value of RCLMP should be
selected for graceful overload. A value of 8.3 kΩ or less is
recommended for 1.5 V or 3.5 V common-mode levels (7.2 kΩ
for HI gain mode). This limits the output swing to just above
2 V p-p differential.
OPTIONAL INPUT OVERLOAD PROTECTION
Applications in which high transients are applied to the LNA
input can benefit from the use of clamp diodes. A pair of backto-back Schottky diodes can reduce these transients to manageable
levels. Figure 88 illustrates how such a diode-protection scheme
can be connected.
OPTIONAL
SCHOTTKY
OVERLOAD
CLAMP FB
Figure 86. Adjusting the Noise Floor for 14-Bit ADCs
OVERLOAD
RSH
3
These devices respond gracefully to large signals that overload
its input stage and to normal signals that overload the VGA
when the gain is set unexpectedly high. Each stage is designed
for clean-limited overload waveforms and fast recovery when
gain setting or input amplitude is reduced.
Rev. F | Page 32 of 60
COMM 20
0.1µF
CSH
2
CIZ
RIZ
INH
ENBL 19
3 VPSL
4 LON
2
1
BAS40-04
Figure 88. Input Overload Clamping
03199-088
The relative noise and distortion performance of the two gain
modes can be compared in Figure 25 and Figure 31 through
Figure 41. The 48 nV/√Hz noise floor of the LO gain mode is
suited to converters with higher sampling rates or resolutions
(such as 12 bits). Both gain modes can accommodate ADC fullscale voltages as high as 4 V p-p. Because distortion performance
remains favorable for output voltages as high as 4 V p-p (see
Figure 36), it is possible to lower the output-referred noise even
further by using a resistive attenuator (or transformer) at the
output. The circuit in Figure 86 has an output full-scale range of
2 V p-p, a gain range of −10.5 dB to +37.5 dB, and an output
noise floor of 24 nV/√Hz, making it suitable for some 14-bit
ADC applications.
–4.5
1m
03199-087
0.1µF
POSTAMP
OVERLOAD
158Ω
LNA OVERLOAD
1.5µH
GAIN (dB)
84.5Ω
0.1µF
Both stages of the VGA are susceptible to overload. Postamplifier limiting is more common and results in the clean-limited
output characteristics found in Figure 49. Recovery is fast in all
cases. The graph in Figure 87 summarizes the combinations of
input signal and gain that lead to the different types of overload.
03199-085
84.5Ω
Signals larger than ±275 mV at the LNA input are clipped to
5 V p-p differential prior to the input of the VGA. Figure 48
shows the response to a 1 V p-p input burst. The symmetric
overload waveform is important for applications, such as CW
Doppler ultrasound, where the spectrum of the LNA outputs
during overload is critical. The input stage is also designed to
accommodate signals as high as ±2.5 V without triggering the
slow-settling ESD input protection diodes.
AD8331/AD8332/AD8334
ADG736
When selecting overload protection, the important parameters
are forward and reverse voltages and trr (or τrr). The Infineon
BAS40-04 series shown in Figure 88 has a τrr of 100 ps and a VF
of 310 mV at 1 mA. Many variations of these specifications can
be found in vendor catalogs.
1.13kΩ
SELECT RIZ
280Ω
LON
18nF
LAYOUT, GROUNDING, AND BYPASSING
5Ω
200Ω
INH
LNA
LMD
50Ω
5Ω
LOP
03199-090
Due to their excellent high frequency characteristics, these
devices are sensitive to their PCB environments. Realizing
expected performance requires attention to detail critical to
good high speed board design.
0.1µF
AD8332
A multilayer board with power and ground planes is recommended with blank areas in the signal layers filled with ground
plane. Be certain that the power and ground pins provided for
robust power distribution to the device are connected.
Decouple the power supply pins with surface-mount capacitors
as close as possible to each pin to minimize impedance paths to
ground. Decouple the LNA power pins from the VGA supply
using ferrite beads. Together with the capacitors, ferrite beads
eliminate undesired high frequencies without reducing the
headroom. Use a larger value capacitor for every 10 chips to
20 chips to decouple residual low frequency noise. To minimize
voltage drops, use a 5 V regulator for the VGA array.
Figure 89. Accommodating Multiple Sources
DISABLING THE LNA
Where accessible, connection of the LNA enable pin to ground
powers down the LNA, resulting in a current reduction of about
half. In this mode, the LNA input and output pins can be left
unconnected; however, the power must be connected to all the
supply pins for the disabling circuit to function. Figure 90
illustrates the connections using AD8331 as an example.
Several critical LNA areas require special care. The LON and
LOP output traces must be as short as possible before connecting
to the coupling capacitors connected to Pin VIN and Pin VIP.
RIZ must be placed near the LON pin as well. Resistors must be
placed as close as possible to the VGA output pins, VOL and
VOH, to mitigate loading effects of connecting traces. Values
are discussed in the Output Decoupling section.
NC
1
LMD
COMM
20
AD8331
NC
2
INH
ENBL
19
www.BDTIC.com/ADI
+5V
3
NC
Signal traces must be short and direct to avoid parasitic effects.
Wherever there are complementary signals, symmetrical layout
should be employed to maintain waveform balance. PCB traces
should be kept adjacent when running differential signals over a
long distance.
NC
4
5
VPSL
ENBV
LON
COMM
LOP
VOL
18
+5V
17
16
VOUT
6
COML
VOH
15
MULTIPLE INPUT MATCHING
Matching of multiple sources with dissimilar impedances can be
accomplished as shown in Figure 89. A relay and low supply
voltage analog switch can be used to select between multiple
sources and their associated feedback resistors. An ADG736
dual SPDT switch is shown in this example; however, multiple
switches are also available and users are referred to the Analog
Devices Selection Guide for switches and multiplexers.
0.1µF
VIN
0.1µF
MODE
7
8
9
VIP
VPOS
VIN
HILO
MODE
RCLMP
14
13
+5V
HILO
12
RCLMP
10
GAIN
VCM
11
VCM
03199-089
GAIN
Figure 90. Disabling the LNA
Rev. F | Page 33 of 60
AD8331/AD8332/AD8334
ULTRASOUND TGC APPLICATION
HIGH DENSITY QUAD LAYOUT
The AD8332 ideally meets the requirements of medical and
industrial ultrasound applications. The TGC amplifier is a key
subsystem in such applications because it provides the means
for echolocation of reflected ultrasound energy.
The AD8334 is the ideal solution for applications with limited
board space. Figure 94 represents four channels routed to and
away from this very compact quad VGA. Note that none of the
signal paths crosses and that all four channels are spaced apart
to eliminate crosstalk.
Figure 91 through Figure 93 are schematics of a dual, fully
differential system using the AD8332 and the AD9238 12-bit
high speed ADC with conversion speeds as high as 65 MSPS.
In this example, all of the components shown are Size 0402;
however, the same layout is executable at the expense of slightly
more board area. The sketch also assumes that both sides of the
printed circuit board are available for components and that the
bypass and power supply decoupling circuitry is located on the
wiring side of the board.
www.BDTIC.com/ADI
Rev. F | Page 34 of 60
AD8331/AD8332/AD8334
S3
EIN2
TP5
AD8332ARU
C50
0.1µF
TP3
(RED)
LMD2
LMD1
28
2
+5V
CFB2
18nF
+
C80
22pF
RFB2
274Ω
C41
0.1µF
3
C74
1nF
L6
120nH FB +5VLNA
5
6
7
VCM1
VPS1
C79
22pF
26
8
LON2
LON1
LOP2
LOP1
COM2
COM1
VIP2
VIP1
VIN2
VIN1
C60
0.1µF
S1
EIN1
CFB1
18nF
RFB1
274Ω
+5VLNA
4
C53
0.1µF
VPS2
L13
120nH FB
27
JP6
IN1
L7
120nH FB +5VGA
C51
0.1µF
INH1
JP5
IN2
+5VLNA
C46
1µF
INH2
TP6
C70
0.1µF
L12
120nH FB
TB1
+5V
TP4
(BLACK)
TB2
GND
1
C49
0.1µF
25
24
C42
0.1µF
23
C59
0.1µF
22
21
VCM1
JP13
C48
0.1µF
C78
1nF
9
20
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VCM2
VCM1
C77
1nF
R3
(RCLMP)
OPTIONAL 4-POLE LOW-PASS
FILTER
VIN+B
C66
SAT
VIN–B
11
C69
0.1µF
C68
1nF
R27
100Ω
L19
SAT
L17
SAT
C54
0.1µF
L11
120nH FB
C67
L20 SAT
SAT
L18 JP12
SAT
C55
0.1µF
L10
120nH FB
JP7
DC2L
HILO
HI GAIN
JP10
LO GAIN
+5VGA
12
JP8
DC2H
GAIN
C83
1nF
+5VGA
19
13
14
RCLMP
VOH2
ENB
VOH1
VOL2
VOL1
COMM
VPSV
18
ENABLE
JP16
DISABLE
17
R24
100Ω
16
15
JP9
OPTIONAL 4-POLE LOW-PASS
FILTER
L9
120nH FB
C58
0.1µF
L1
SAT
L15
SAT
L8
120nF FB
JP17
C56
0.1µF
L14
SAT
C64
SAT L16
SAT
VIN+A
C65
SAT
VIN–A
R26
100Ω
+5VGA
C45
0.1µF
R25
100Ω
C85
1nF
JP10
Figure 91. Schematic, TGC, VGA Section Using an AD8332 and AD9238
Rev. F | Page 35 of 60
03199-091
TP2 GAIN
TP7 GND
10
C43
0.1µF
AD8331/AD8332/AD8334
+5V
+
2
C22
0.1µF
C31
0.1µF
1
L4
120nH FB
IN OUT GND
C30
0.1µF
OUT
TAB
L3
120nH FB
R5
33Ω
VIN+_A
L2
120nH FB
1
2
3
R6
33Ω
R4
C18
1.5kΩ C17
1nF
C33 0.1µF
10µF
6.3V
+
C40
0.1µF
R12
1.5kΩ
C35
0.1µF
C1
0.1µF
C36
0.1µF
4
5
6
C52
10nF
TP9
C32 +
0.1µF
VREF
C34
10µF
6.3V
C38
0.1µF
8
C12
10µF
6.3V
9
C57
10nF
C39
10µF
C37
0.1µF
VIN–_B
S2
EXT CLOCK
R17
49.9Ω
C15
1nF
13
14
C62
18pF
VIN+_B
15
R7
33Ω
16
AGND
AVDD
64
VIN+_A
CLK_A
63
VIN–_A
SHARED_REF
62
AGND
MUX_SELECT
61
AVDD
PDWN_A
60
R11
100Ω
R10
JP2
0Ω SHARED
REF
Y
N
R14
4.7kΩ
R15 +3.3VADDIG
0Ω
59
REFT_A
OEB_A
REFB_A
OTR_A
58
OTR_A
D11_A (MSB)
57
D11_A
56
D10_A
55
D9_A
54
D8_A
VREF
D10_A
SENSE
D9_A
REFB_B
REFT_B
AVDD
AGND
VIN–_B
VIN+_B
D8_A
DRGND
DRVDD 52
D7_A
D6_A
+3.3VADDIG
53
51
50
49
C23
0.1µF
C25
1nF
D7_A
D6_A
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R18
499Ω
C63
0.1µF
17
C20
0.1µF
R16
5kΩ
C19
1nF
18
19
R19
499Ω
JP3
JP11
R20
4.7kΩ
R41
4.7kΩ
20
21
22
+3.3VCLK
ADCLK
+
C86
0.1µF
11
12
1.5kΩ
+3.3VCLK
7
10
C16
1.5kΩ
0.1µF
R8
33Ω
ADCLK
+
C61
18pF
VIN–_A
C29
0.1µF
C2
10µF
6.3V
C21
1nF
4
1
VDD OE
20MHz
3
OUT
GND
2
U6
SG-636PCE
C47
10µF
6.3V
ADCLK
JP4
2
1
INT
3
4
U5
74VHC04
5
6
TP 12
1
R9
0Ω
2
U5
74VHC04
9
TP 13
DATA
CLK
U5
74VHC04
13
12
11
10
U5
74VHC04
D0_B
D1_B
D2_B
2
24
25
26
27
28
3
8
1
JP1
SPARES
DNC
U5
74VHC04
U5
74VHC04
EXT
3
DNC
23
29
D3_B
30
D4_B
31
D5_B
32
AGND
AVDD
CLK_B
D3_A
D1_A
DFS
D0_A
PDWN_B
DNC
OEB_B
DNC
DNC
DNC
DRVDD
D0_B
DRGND
D1_B
OTR_B
D2_B
D11_B (MSB)
DRGND
D10_B
DRVDD
D9_B
D3_B
D8_B
D4_B
D5_B
C24
1nF
Figure 92. Converter Schematic, TGC Using an AD8332 and AD9238
Rev. F | Page 36 of 60
D4_A
D2_A
DCS
+3.3VADDIG
C26
0.1µF
D5_A
D7_B
D6_B
48
47
46
45
44
43
42
D5_A
D4_A
D3_A
D2_A
D1_A
D0_A
DNC
DNC
41
40
39
38
37
36
35
34
33
C13
1nF
C14 +
0.1µF
C11
10µF
6.3V
OTR_B
D11_B
D10_B
D9_B
D8_B
D7_B
D6_B
03199-092
3
+3.3VAVDD
L5
120nH FB
U1 A/D CONVERTER AD9238
VR1
ADP3339AKC-3.3
C44
1µF
AD8331/AD8332/AD8334
DATACLKA
1
OTR_A
D11_A
D10_A
D9_A
D7_A
D6_A
RP 9
8
7
20
U10 VCC
74VHC541
19
10
G2
GND
2
18
A1
Y1
3
17
Y2
A2
16
4
Y3
A3
3
6
4
5
5
8
6
7
7
3
6
8
4
5
1
2
22 × 4
RP 10
9
G1
A4
Y4
A5
Y5
A6
Y6
A7
A8
Y7
Y8
+
C3
0.1µF
C28
10µF
6.3V
2
1
8
4
3
7
6
5
3
6
8
7
15
4
5
10
9
14
1
22 × 4
8
12
11
13
2
RP2
7
14
13
12
3
6
16
11
4
5
18
1
2
+3.3VDVDD
1
U7 VCC 20
74VHC541
10
G2
GND
2
18
A1
Y1
3
17
A2
Y2
G1
D4_A
D3_A
D2_A
D1_A
D0_A
DNC
DNC
1
2
22 × 4
RP 11
8
7
6
3
4
4
5
1
22 × 4
2
RP 12
5
8
6
7
7
3
6
8
4
5
9
A3
Y3
A4
Y4
A5
Y5
A6
Y6
A7
Y7
A8
Y8
C10 +
0.1µF
C8
0.1µF
19
D5_A
R40
22Ω
+3.3VDVDD
C76
10µF
6.3V
16
22 × 4
RP 1
1
22 × 4
8
20
2
RP 3
7
22
3
6
24
4
5
26
HEADER UP MALE NO SHROUD
D8_A
2
22 × 4
1
15
17
19
21
23
25
1
22 × 4
8
28
2
RP 4
7
30
29
3
6
32
31
4
5
34
33
36
35
38
37
40
39
15
14
13
12
27
SAM080UPM
11
www.BDTIC.com/ADI
+3.3VDVDD
1
OTR_B
D11_B
D10_B
D9_B
D7_B
D6_B
D5_B
RP 13
8
7
3
6
4
5
1
2
22 × 4
RP 14
3
8
7
6
4
1
U2
G1
VCC
74VHC541
10
GND
G2
2
18
A1
Y1
3
17
A2
Y2
16
4
Y3
A3
5
15
A4
Y4
6
14
A5
Y5
7
13
A6
Y6
12
8
A7
Y7
9
11
A8
Y8
5
22 × 4
+
C7
0.1µF
19
8
+
C9
0.1µF
C27
10µF
6.3V
+3.3VDVDD
1
RP 15
20
U3 VCC
74VHC541
10
GND
G2
2
18
Y1
A1
G1
19
D4_B
D3_B
D2_B
D1_B
D0_B
DNC
DNC
2
7
3
6
4
1
2
5
22 × 4
RP 16
8
7
3
4
5
6
3
6
7
4
5
8
9
A2
Y2
A3
Y3
A4
Y4
A5
Y5
A6
Y6
A7
Y7
A8
Y8
C4
0.1µF
C5
0.1µF
C6 +
0.1µF
C75
10µF
6.3V
17
16
15
41
44
43
1
22 × 4
8
46
45
2
RP 5
7
48
47
3
6
50
49
4
5
52
51
53
1
22 × 4
8
54
2
RP 6
7
56
3
6
58
4
5
60
1
22 × 4
8
62
2
RP 7
7
64
3
6
66
4
5
68
55
57
59
61
63
65
67
1
22 × 4
8
70
69
2
RP 8
7
72
71
3
6
74
73
4
5
76
75
78
77
80
79
14
13
12
R39
22Ω
11
DATACLK
Figure 93. Interface Schematic, TGC Using an AD8332 and AD9238
Rev. F | Page 37 of 60
42
HEADER UP MALE NO SHROUD
D8_B
2
22 × 4
20
SAM080UPM
03199-093
1
AD8331/AD8332/AD8334
CH2 LNA INPUT
CH3 LNA INPUT
CH1 LNA INPUT
CH4 LNA INPUT
61
60
57
56
54
53
52
51
49
VCM2
50
NC
COM34
VOH4
VOL4
VPS34
VOL3
VOH3
COM34
NC
MODE
COM12
VOH2
VOL2
VPS12
VOL1
VOH1
COM12
VCM1
55
32
VCM3
58
31
EN34
30
VCM4
29
EN12
59
28
HILO
62
27
CLMP12
CLMP34
63
INH4
64
COM4X
1
LMD4
INH2
26
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
CH1 DIFFERENTIAL
OUTPUT
CH2 DIFFERENTIAL
OUTPUT
CH3 DIFFERENTIAL
OUTPUT
CH4 DIFFERENTIAL
OUTPUT
Figure 94. Compact Signal Path and Board Layout for the AD8334
LMD2
COM2X
AD8334
25
03199-094
2
3
4
LON2
LOP2
24
Rev. F | Page 38 of 60
5
23
POWER SUPPLY DECOUPLING
LOCATED ON WIRING SIDE
GAIN12
GAIN34
6
22
VPS1
VPS4
VIP2
COM1X
21
VIN1
VIN4
7
LMD1
20
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VIP1
VIP4
VIN2
INH1
19
LOP1
LOP4
VPS2
VPS3
VIN3
VIP3
LOP3
LON3
COM3X
LMD3
INH3
18
LON1
LON4
8
9
10
11
12
13
14
15
16
17
COM1
COM4
COM2
COM3
AD8331/AD8332/AD8334
AD8331 EVALUATION BOARD
GENERAL DESCRIPTION
The AD8331 evaluation board is a platform for testing and
evaluating the AD8331 variable gain amplifier (VGA). The
board is provided completely assembled and tested; the user
simply connects an input signal, VGAIN sources, and a 5 V power
supply. The AD8331-EVALZ is lead free and RoHS compliant.
USER-SUPPLIED OPTIONAL COMPONENTS
As shown in the schematic in Figure 96, the board provides for
optional components. The components shown in black are for
typical operation, and the components shown in gray are
installed at the user’s discretion.
03199-195
As shipped, the LNA input impedance of the AD8331-EVALZ is
configured for 50 Ω to accommodate most signal generators
and network analyzers. Input impedances up to 6 kΩ are
realized by changing the values of RFB and CSH. Refer to the
Theory of Operation section for details on this circuit feature.
See Table 9 for typical values of input impedance and corresponding components.
Table 9. LNA External Component Values for Common
Source Impedances
RIN (Ω)
50
75
100
200
500
6k
Figure 95. AD8331-EVALZ Top View
MEASUREMENT SETUP
www.BDTIC.com/ADI
RFB (Ω, Nearest 1% Value)
274
412
562
1.13 k
3.01 k
∞
CSH (pF)
22
12
8
1.2
None
None
The basic board connection for measuring bandwidth is shown
in Figure 97. A 5 V, 100 mA minimum power supply and a low
noise, voltage reference supply for GAIN are required. Table 10
lists jumpers, and Figure 97 shows their functions and positions.
The board is designed for Size 0603 surface-mount
components. Back-to-back diodes can be installed at Location
D3 if desired.
To evaluate the LNA as a standalone amplifier, install optional
SMA connectors LON and LOP and capacitors C1 and C2;
typical values are 0.1 μF or smaller. At R4 and R8, 0 Ω resistors
are installed unless capacitive loads larger than 10 pF are
connected to the SMA connectors LON and LOP (such as
coaxial cables). In that event, small value resistors (68 Ω to 100 Ω)
must be installed at R4 and R8 to preserve the stability of the
amplifier.
A resistor can be inserted at RCLMP if output clamping is
desired. Refer to Table 8 for appropriate values.
The preferred signal detection method is a differential probe
connected to VO, as shown in Figure 97. Single-ended loads can
be connected using the board edge SMA connector, VOH. Be sure
to take into account the 25.8 dB attenuation incurred when using
the board in this manner. For connection to an ADC, the 270 Ω
series resistors can be replaced with 0 Ω or other appropriate
values.
Table 10. Jumper Functions
Jumper
ENBL
ENBV
W5, W6
Mode
Function
Enables the LNA when inserted in the top position
Enables the VGA when inserted in the top position
Connects the AD8331 outputs to the SMA connectors
Bottom, gain increases with VGAIN; top, gain decreases
with VGAIN
HI_LO
Top, HI gain; bottom, LO gain (shown in HI gain position)
BOARD LAYOUT
The evaluation board circuitry uses four conductor layers. The
two inner layers are grounded, and all interconnecting circuitry
is located on the outer layers. Figure 99 to Figure 102 illustrate
the copper patterns. Table 11 provides a parts list.
Rev. F | Page 39 of 60
AD8331/AD8332/AD8334
AD8331 EVALUATION BOARD SCHEMATICS
GND1 GND2 GND +5V
GND3 GND4
+C3
10µF
10V
INH
L1
120nH FB
CLMD
0.1µF
1
LON
CSH
22pF
CFB
0.018µF
RFB
274Ω
3
+5V
L2
120nH FB
R4
20
+5V
2
1
COMM
CINH
0.1µF
3 D2 PROBE
2
LMD
INH
ENBL
19
EN
LNA
DIS
+5V
DUT
AD8331ARQ
VPS
ENBV
LON
COMM
VGA
18
EN
DIS
C6
0.1µF
C1
4
17
L3
120nH FB
LO
R8
5
LOP
VOL
R44
100Ω
C2
LOP
6
C16
0.1µF
COML
VOH
W5
16
15
VO
R43
100Ω
C24
0.1µF R16
237Ω
C26
0.1µF
L4
120nH FB
7
VIP
VPOS
VOH
R20
237Ω
W6
C14
0.1µF
T1
1:1
L5
120nH FB
14
+5V
C32
0.1µF
+5V
HI
www.BDTIC.com/ADI
8
VIN
HILO
13
HI_LO
LO
+5V
DOWN
9
MODE
MODE
CLMP
12
C35
0.1µF
UP
GAIN
10
C34
1nF
GAIN
VCM
RCLMP
11
VCM
C18
0.1µF
NOTES
1. COMPONENTS IN GREY ARE OPTIONAL AND USER SUPPLIED.
Figure 96. Schematic of the AD8331 Evaluation Board
Rev. F | Page 40 of 60
03199-196
W1
AD8331/AD8332/AD8334
4395 A ANALYZER
GND
1103 TEKPROBE
POWER SUPPLY
ENABLE
LNA
ENABLE
VGA
E3631 A
POWER SUPPLY
+5 V
GND
DIFFERENTIAL PROBE
TO VO PINS
DP8200 PRECISION VOLTAGE REFERENCE
(FOR VGAIN)
SELECT UP OR
DOWN GAIN
SLOPE
HI/LO GAIN
SELECT GAIN
www.BDTIC.com/ADI
Figure 97. AD8331—Typical Board Test Connections
Rev. F | Page 41 of 60
03199-197
INSERT JUMPERS W5 AND W6
TO USE OUTPUT TRANSFORMER
AND VOH SMA
AD8331/AD8332/AD8334
03199-198
03199-201
AD8331 EVALUATION BOARD PCB LAYERS
Figure 101. Internal Layer Ground
Figure 98. AD8331-EVALZ Assembly
03199-202
03199-199
www.BDTIC.com/ADI
Figure 99. Primary Side Copper
03199-203
03199-200
Figure 102. Power Plane
Figure 100. Secondary Side Copper
Figure 103. Top Silkscreen
Rev. F | Page 42 of 60
AD8331/AD8332/AD8334
AD8331 BILL OF MATERIALS
Table 11.
Qty
5
1
2
2
1
10
1
1
4
Reference Designator
L1, L2, L3, L4, L5
RFB
R16, R20
R43, R44
CFB
C6, C14, C16, C18, C24,
C26, C32, C35, CINH, CLMD
C34
C3
HI_LO (HI), MODE (UP), ENBL (EN),
ENBV (EN), W5, W6
CSH
T1
Four corners of the board
1
3
4
2
1
5
1
DUT
VO, W5, W6
ENBL, ENBV, HI_LO, MODE fixed
INH, VOH
+5 V
GND, GND1, GND2, GND3, GND4
VCM fixed
1
1
6
1
Description
Ferrite bead, 120 nH, 0603 inductor
SM, 274 Ω, 1%, 1/10 W, 0603 resistor
SM, 237 Ω, 1%, 1/10 W, 0603 resistor
SM, 100 Ω, 1%, 1/10 W, 0603 resistor
0.018 μF, 10%, X7R, 0603 capacitor
0.1 μF, 50 V, 0603 capacitor
Manufacturer
Murata
Panasonic
Panasonic
Panasonic
Panasonic
Kemet
Manufacturer
Part Number
BLM18BA750SN1D
ERJ-3EKF2740V
ERJ-3EKF2370V
ERJ-3EKF1000V
ECJ-1VB1E183K
C0603C104K4RAC
1000 pF, 50 V, 0603 capacitor
10 μF, 10 V tantalum capacitor
Mini-jump jumper/shunt
Panasonic
Nichicon
FCI1
ECJ-1VB2A102K
F931A106MAA
65474-001
22 pF, 50 V, 0603 capacitor
RF, 0.015 MHz to 300 MHz transformer
Bumper used as feet, mounted on wiring side
of the board
Integrated circuit, variable gain amplifier
2-pin header/connector
3-pin header/connector
SMA, right angle PC mount/connector
0.125” diameter, red loop test point
0.125” diameter, black loop test point
0.125” diameter, purple loop test point
Panasonic
Mini-Circuits
3M
ECJ-1VC1H220J
T1-6T KK81
SJ-67A11
Analog Devices
FCI1
Molex
Amphenol
Components Corp.
Components Corp.
Components Corp.
AD8331ARQZ
69157-102
22-11-2032
901-143-6RFX
TP-104-01-02
TP-104-01-00
TP-104-01-07
www.BDTIC.com/ADI
FCI = Framatome Connectors International
Rev. F | Page 43 of 60
AD8331/AD8332/AD8334
AD8332 EVALUATION BOARD
GENERAL DESCRIPTION
The AD8332-EVALZ is a platform for the testing and evaluation
of the AD8332 variable gain amplifier (VGA). The board is shipped
assembled and tested, and users need only connect the signal and
VGAIN sources to a single 5 V power supply. Figure 104 is a
photograph of the component side of the board, and Figure 105
shows the schematic. The AD8332-EVALZ is lead free and
RoHS compliant.
Table 12. LNA External Component Values for Common
Source Impedances
RIN (Ω)
50
75
100
200
500
6k
RFB1, RFB2 (Ω Std 1% Value)
274
412
562
1.13 k
3.01 k
∞
CSH1, CSH2 (pF)
22
12
8
1.2
None
None
SMA connectors, S2, S3, S6, and S7, are provided for access to
the LNA outputs or the VGA inputs. If the LNA is used alone,
0.1 μF coupling capacitors can be installed at the C5, C9, C23,
and C24 locations. Resistors of 68 Ω to 100 Ω may be required
if the load capacitances, as seen by the LNA outputs, are larger
than approximately 10 pF.
A resistor can be inserted at RCLMP if output clamping is desired.
The peak-to-peak clamping level is adjusted by installing one of
the standard 1% resistor values listed in Table 8.
A high frequency differential probe connected to the 2-pin headers,
VOx, is the preferred method to observe a waveform at the
VGA output. A typical setup is shown in Figure 106. Singleended loads can be connected directly via the board edge SMA
connectors. Note that the AD8332 output amplifier is buffered with
237 Ω resistors; therefore, be sure to compensate for attenuation if
low impedances are connected to the output SMAs.
www.BDTIC.com/ADI
03199-095
MEASUREMENT SETUP
The basic board connections for measuring bandwidth are
shown in Figure 106. A 5 V, 100 mA (minimum) power supply
is required, and a low noise voltage reference supply is required
for VGAIN.
Figure 104. AD8332-EVALZ Top View
USER-SUPPLIED OPTIONAL COMPONENTS
The board is built and tested using the components shown in
black in Figure 105. Provisions are made for optional components (shown in gray) that can be installed for testing at user
discretion. The default LNA input impedance is 50 Ω to match
various signal generators and network analyzers. Input impedances
up to 6 kΩ are realized by changing the values of RFBx and CSHx.
For reference, Table 12 lists the common input impedance
values and corresponding adjustments. The board is designed
for Size 0603 surface-mount components.
BOARD LAYOUT
The evaluation board circuitry uses four conductor layers.
The two inner layers are power and ground planes, and all
interconnecting circuitry is located on the outer layers. Figure 108
to Figure 111 illustrate the copper patterns.
Rev. F | Page 44 of 60
AD8331/AD8332/AD8334
EVALUATION BOARD SCHEMATICS
+5V
C25
10µF
GND GND1 GND2 GND3 GND4
+
1
C2
0.1µF
C4
0.1µF
L1
120nH FB
LNA2
CSH2
22pF
2
INH2
LMD1
INH1
28
C1
0.1µF
CFB1
18nF
3
+5V
+5VLNA
C6
0.1µF
RFB2
274Ω
C9
C3
0.1µF
CSH1
22pF
27
CFB2
18nF
CAL2
L8
120nH FB
S6
LON2
LMD2
VPS2
VPS1
4
LON2
LON1
+5VLNA
C7
0.1µF
RFB1
274Ω
C23
25
S2
LON1
R9
R10
W8
5
LOP2
LOP1
W9
24
C5
S7
LOP2
LNA1
CAL1
26
AD8332ARUZ
L2
120nH FB
C24
R12
6
C16
0.1µF
COM2
COM1
C14
0.1µF
C13
0.1µF
7
VIP2
VIP1
S3
LOP1
R11
23
C15
0.1µF
22
www.BDTIC.com/ADI
8
C10
0.1µF
VCM2
9
VIN2
VIN1
VCM2
VCM1
21
20
VCM1
C17
0.1µF
10
GAIN
GAIN
HILO
19
TP3
CLAMP
L3
120nH FB
VOH2
T2
1:1
R13
237Ω
C11
0.1µF W12
W6
VO2
W13
R14
237Ω
C12
0.1µF
12
RCLMP
VOH2
ENB
VOH1
18
+5V
ENABLE
W4
DISABLE
17
R7
100Ω
L6
120nH FB
R5
100Ω
13
R8
100Ω
L4
120nH FB
LO
14
VOL2
COMM
VOL1
VPSV
16
R6
100Ω
15
W10
C19
0.1µF
W11
C18
0.1µF
W7
VO1
R15
237Ω
T1
1:1 VOH1
R16
237Ω
L5
120nH FB
L7
120nH FB
COMPONENTS IN GRAY ARE
OPTIONAL AND USER SUPPLIED.
+5V
C22
0.1µF
Figure 105. Schematic of the AD8332 Evaluation Board
Rev. F | Page 45 of 60
03199-096
RCLMP
11
C20
0.1µF
HI
W5
C8
1nF
+5V
AD8331/AD8332/AD8334
NETWORK
ANALYZER
1103 TEKPROBE
POWER SUPPLY
SUPPLY FOR
VGAIN
DIFFERENTIAL
PROBE
03199-097
www.BDTIC.com/ADI
Figure 106. AD8332—Typical Board Test Connections
Rev. F | Page 46 of 60
AD8331/AD8332/AD8334
03199-098
03199-101
AD8332 EVALUATION BOARD PCB LAYERS
Figure 110. Ground Plane
Figure 107. AD8332-EVALZ Assembly
03199-099
03199-102
www.BDTIC.com/ADI
Figure 111. Power Plane
03199-103
03199-100
Figure 108. Primary Side Copper
Figure 109. Secondary Side Copper
Figure 112. Component Side Silkscreen
Rev. F | Page 47 of 60
AD8331/AD8332/AD8334
AD8332 BILL OF MATERIALS
Table 13.
Qty
8
2
4
4
2
18
1
2
1
2
6
2
4
4
1
5
1
Reference Designator
L1, L2, L3, L4, L5, L6, L7, L8
RFB1, RFB2
R13, R14, R15, R16
R5, R6, R7, R8
CFB1, CFB2
C1, C2, C3, C4, C6, C7, C10, C11, C12, C13,
C14, C15, C16, C17, C18, C19, C20, C22
C8
CSH1, CSH2
C25
T1, T2
W6VO2, W7VO1, W10, W11, W12, W13
W4, W5
LNA1, LNA2, VOH1, VOH2
VCM1, VCM2, GAIN, CLAMP
+5 V
GND, GND1, GND2, GND3, GND4
DUT
Description
Ferrite Bead, 120 nH, 0603 inductor
SM, 274 Ω, 1%, 1/10 W, 0603 resistor
SM, 237 Ω, 1%, 1/10 W, 0603 resistor
SM, 100 Ω, 1%, 1/10 W, 0603 resistor
SM, 18 nF, 10%, 50 V, 0603 capacitor
SM, 0.1 μF, 10%, 0603 capacitor
Manufacturer
Murata
Panasonic
Panasonic
Panasonic
Panasonic
Kemet
Manufacturer
Part Number
BLM18BA750SN1D
ERJ-3EKF2740V
ERJ-3EKF2370V
ERJ-3EKF1000V
ECJ-1VB1E183K
C0603C104K4RAC
SM, 1 nF, 50 V, 0603 capacitor
SM, 22 pF, 50 V, 0603 capacitor
SM, 10 μF, 10 V Tantalum capacitor
RF, 0.015 MHz to 300 MHz transformer
2-pin header/connector
3-pin header/connector
SMA, right angle PC mount/connector
0.125” diameter purple loop test point
0.125” red loop test point
0.125” black loop test point
Integrated circuit, dual channel variable
gain amplifier
Panasonic
Panasonic
Nichicon
Mini-Circuits
Molex
Molex
Amphenol
Components Corp.
Components Corp.
Components Corp.
Analog Devices
ECJ-1VB2A102K
ECJ-1VC1H220J
F931A106MAA
T1-6T KK81
22-10-2021
22-10-2031
901-143-6RFX
TP104-01-07
TP104-01-02
TP104-01-00
AD8332ARUZ
www.BDTIC.com/ADI
Rev. F | Page 48 of 60
AD8331/AD8332/AD8334
AD8334 EVALUATION BOARD
GENERAL DESCRIPTION
The AD8334-EVALZ is a platform for the testing and evaluation of the AD8334 variable gain amplifier (VGA). The board is
shipped assembled and tested, and users need only connect the
signal and VGAIN sources and a single 5 V power supply.
Figure 113 is a photograph of the board. The AD8334-EVALZ is
lead free and RoHS compliant.
03199-104
www.BDTIC.com/ADI
Figure 113. AD8334-EVALZ Top View
Rev. F | Page 49 of 60
AD8331/AD8332/AD8334
CONFIGURING THE INPUT IMPEDANCE
The board is built and tested using the components shown
in black in Figure 114. Provisions are made for optional
components (shown in gray) that can be installed at user
discretion. As shipped, the input impedances of the low noise
amplifiers (LNAs) are configured for 50 Ω to match the output
impedances of most signal generators and network analyzers.
Input impedances up to 6 kΩ can be realized by changing the
values of the feedback resistors, RFB1, RFB2, RFB3, RFB4, and shunt
capacitors, C6, C8, C10, and C12. For reference, Table 14 lists
standard values of 1% resistors for some typical values of input
impedance. Of course, if the user has determined that the
source impedance falls between these values, the feedback
resistor value can be calculated accordingly. Note that the board is
designed to accept standard surface-mount, size 0603 components.
least effect on the performance of the device of any detection
method tried. The probe can also be used for monitoring input
signals at IN1, IN2, IN3, or IN4. It can be used for probing
other circuit nodes; however, be aware that the 200 kΩ input
impedance can affect certain circuits.
Differential-to-single-ended transformers are provided for
single-ended output connections. Note that series resistors are
provided to protect against accidental output overload should a
50 Ω load be connected to the connector. Of course, the effect
of these resistors is to limit the bandwidth. If the load connected
to the SMA is >500 Ω, the 237 Ω series resistors, RX1, RX2, RX3,
RX4, RX5, RX6, RX7, and RX8, can be replaced with 0 Ω values.
Table 14. LNA External Component Values for Common
Source Impedances
RIN (Ω)
50
75
100
200
500
6k
RFB1, RFB2, RFB3, RFB4 (Ω, ±1%)
274
412
562
1.13 k
3.01 k
No resistor
C6, C8, C10, C12 (pF)
22
12
8
1.2
No capacitor
No capacitor
www.BDTIC.com/ADI
Driving the VGA from an External Source or Using the
LNA to Drive an External Load
Provisions are made for surface-mount SMA connectors that
can be used for driving from either direction. If the LNA is not
used, it is recommended that the capacitors, C16, C17, C21,
C22, C26, C27, C31, and C32, be carefully removed to avoid
driving the outputs of the LNAs.
03199-105
Appropriate components can be installed if the user wants to
drive the VGA directly from an external source or to evaluate
the LNA output. If the LNA is used to drive off-board loads
or cables, small value series resistors (47 Ω to 100 Ω) are
recommended for LNA decoupling. These can be installed
in the R10, R11, R14, R15, R18, R19, R22, and R23 spaces.
Figure 114. AD8334-EVALZ Assembly
MEASUREMENT SETUP
The basic board connections for measuring bandwidth are
shown in Figure 116. A 5 V, 200 mA (minimum) power supply
is required, and a low noise voltage reference supply is required
for VGAIN.
Using the Clamp Circuit
BOARD LAYOUT
The board is shipped with no resistors installed in the spaces
provided for clamp-circuit operation. Note that each pair of
channels shares a clamp resistor. If the output clamping is
desired, the resistors are installed in R49 and R50. The peak-topeak clamping level is application dependent.
The evaluation board circuitry uses four conductor layers. The
two inner layers are ground, and all interconnecting circuitry is
located on the outer layers. Figure 117 to Figure 120 illustrate
the copper patterns, and Table 15 lists the evaluation board
parts.
Viewing Signals
The preferred signal detector is a high impedance differential
probe, such as the Tektronix P6247, 1 GHz differential probe,
connected to the 2-pin headers (VO1, VO2, VO3, or VO4), as
shown in Figure 116. The low capacitance of this probe has the
Rev. F | Page 50 of 60
AD8331/AD8332/AD8334
EVALUATION BOARD SCHEMATICS
+
C14
10 µF
1
L7
120nH
CB3
1
+5V
C8
22 pF
C2
0.1µF
C21
0.1µF
1
2
3
4
5
6
7
8
9
2
IN1
CFB1
18 nF
C1
0.1 µF
INH1
L5
120 nH
C5
0.1µF
C6
22 pF
1
1
1
1
C17
0.1µF
1
CB2
LOP1
1
R11
LO1
LON1
CB1
1
R10
RFB1
274Ω
C16
0.1µF
1
R49
GAIN
12
C82
1 nF
54
+5V
L1
120 nH
C67
0.1µF
55
53
EN12
C53
0.1µF
52
R501
C13 C80 C55
0.1µF 1 nF 0.1µF
GAIN34
E
D
51
EN34
56
VCM4
+5V
E
EN34
D
50
49
42
43
44
45
46
47
48
C57
0.1µF
COM12
VOH1
VOL1
VPSV2
VOL2
VOH2
COM12
3
34
35
36
37
38
39
40
MO DE 41
NC
32
C62
0.1µF
COM34 33
VOH4
VOL4
VPS34
VOL3
VOH3
COMM34
31
C64
0.1µF
LO
J12
HI +5V
30
EN12
29
HILO
57
CLMP12
58
CLMP34
59
28
GAIN12
27
GAIN34
60
26
+5V
L4
120 nH
25
AD8334
24
1
VPS1
61
23
C31
0.1µF
1
C32
0.1µF
R23
1
CB8
LOP4
VPS4
62
LO4
R22 1
1
VIN1
63
22
LOP1
64
INH2
LMD2
CO M2X
LON2
LOP2
VIP2
VIN2
VPS2
VPS3
LOP3
10
VIN3
C26
0.1µF 11
VIP3
12
LON3
CO M3X
21
LOP4
G ND1 G ND2 G ND3 G ND4 G ND5 G ND6
C7
0.1µF
CFB2
18 nF
C22
0.1µF
RFB2
274Ω
2
IN2
1
1
C71
0.1µF
C69
0.1µF
R14
1
R15
LO2
1
C27
0.1µF
13
14
LMD3
INH3
20
LMD1
19
LON1
RFB4
274Ω
C4
0.1µF
1
LON4
CB7
C59
0.1µF
J11
+5V
D
U
L9
120nH
RX1
100Ω
VO1
RX2
100Ω
L10
120nH
C75
0.1µF
L11
120nH
RX3
100Ω
J1
J2
J5
J4
J3
C34
0.1µF R26
237Ω
T1
R28
237Ω
R31
237Ω
T2
R33
237Ω
T3
R38
237Ω
+5V
C46
0.1µF
C44 R36
0.1µF 237Ω
C41
0.1µF
C39
0.1µF
+5V
C36
0.1µF
L12
120nH FB
VO2
RX4
100Ω
L13
120nH
L14
120nH
RX5
100Ω
J6
C51
0.1µF
R43
237Ω
T4
C49
0.1µF R41
237Ω
L34
120nH
J8
J7
C77
0.1µF
VO3
RX6
100Ω
L15
120nH
L16
120nH
RX7
100Ω
VO 4
RX8
100Ω
L17
120nH
VOH1
VOH2
VOH3
VOH4
Figure 115.Schematic of the AD8334 Evaluation Board
INH2
1
CB4
L2
120nH
R18
1
LO3
L3
120nH
1
1
RFB3
274Ω
15
16
18
LMD4
CFB4
18nF
1
Rev. F | Page 51 of 60
LON2
1
LOP2
+5V
1
+5V
CB5
CB6
R19
CFB3
18 nF
1
C9
0.1µF
17
C11
0.1µF
C12
22 pF
INH1
L8
120nH
COM1X
COM4X
VCM1
VCM3
LOP3
1
L6
120nH
C10
22 pF
C3
0.1µF
2
COM1
COM4
VCM2
NC
3
LO N3
INH3
IN32
IN4
INH4
LON4
VIN4
NOTES:
1. COMPONENTS IN GRAY ARE OPTIONAL USER SUPPLIED.
2. IN1 TO IN4 ARE OPEN HOLES TO BE USED TO ANCHOR A SCOPE PROBE.
3. NC = NO CONNECT.
03199-106
www.BDTIC.com/ADI
VIP1
VIP4
COM2
COM3
AD8331/AD8332/AD8334
PROBE
POWER
SUPPLY
PRECISION VOLTAGE
REFERENCE (FOR VGAIN)
GAIN
CONTROL
VOLTAGE
GND
NETWORK ANALYZER
DIFFERENTIAL
PROBE
+5V
SIGNAL
INPUT
POWER SUPPLY
www.BDTIC.com/ADI
Figure 116. AD8334—Typical Board Test Connections (One Channel Shown)
Rev. F | Page 52 of 60
03199-107
GND
AD8331/AD8332/AD8334
Figure 117. Component Side Copper
03199-110
03199-108
AD8334 EVALUATION BOARD PCB LAYERS
Figure 119. Inner Layer 1
Figure 118. Wiring Side Copper
03199-111
03199-109
www.BDTIC.com/ADI
Figure 120. Inner Layer 2
Rev. F | Page 53 of 60
03199-112
AD8331/AD8332/AD8334
Figure 121. Component Side Silkscreen
AD8334 BILL OF MATERIALS
Table 15.
Qty
1
6
2
36
4
2
4
12
8
18
8
4
8
4
4
1
4
12
1
1
Reference Designator
+5 V
GND1 to GND6
GAIN12, GAIN34
C1, C2, C3, C4, C5, C7, C9, C11, C13, C16,
C17, C21, C22, C26, C27, C31, C32, C34,
C36, C39, C41, C44, C46, C49, C51, C53,
C55, C57, C59, C62, C64, C67, C69, C71,
C75, C77
C6, C8, C10, C12
C80, C82
CFB1, CFB2, CFB3, CFB4
J1, J2, J3, J4, J5, J6, J7, J8, VO1, VO2, VO3, VO4
INHI1 to INHI4, VOH1 to VOH4
L1, L2, L3, L4, L5, L6, L7, L8, L9, L10, L11,
L12, L13, L14, L15, L16, L17, L34
R26, R28, R31, R33, R36, R38, R41, R43
RFB1, RFB2, RFB3, RFB4
RX1, RX2, RX3, RX4, RX5, RX6, RX7, RX8
EN12, EN34, J11, J12
T1, T2, T3, T4
U1
Four corners
Description
0.125” diameter, red loop test point
0.125” diameter, black loop test point
0.125” diameter, purple loop test point
0.1 μF, 16 V, 0603 capacitor
Manufacturer
Components Corp.
Components Corp.
Components Corp.
Kemet
Manufacturer
Part Number
TP-104-01-02
TP-104-01-00
TP-104-01-07
C0603C104K4RAC
22 pF, 5%, 50 V, 0603 capacitor
1 nF, 10%, 100 V, 0603 capacitor
18 nF, 0603 capacitor
0.1” 2-pin header
SMA, right angle PC mount/connector
Ferrite bead, 120 nH, 0603 inductor
Panasonic
Panasonic
Panasonic
FCI
Amphenol
Murata
ECJ-1VC1H220J
ECJ-1VB2A102K
ECJ-1VB1E183K
69157-102
901-143-6RFX
BLM18BA750SN1D
237 Ω, 1%, 1/10W, 0603 resistor
274 Ω, 1%, 1/10W, 0603 resistor
100 Ω, 1%, 1/10W, 0603 resistor
0.1” 3-pin header/connector
RF, 0.015 MHz to 300 MHz transformer
Integrated circuit, quad VGA
Bumper foot, mounted to wiring side of
the board
Mini-jump jumper/shunt
Panasonic
Panasonic
Panasonic
Molex
Mini-Circuits
Analog Devices
3M
ERJ-3EKF2370V
ERJ-3EKF2740V
ERJ-3EKF1000V
22-10-2031
T1-6T KK81
AD8334ACPZ
SJ-67A11
FCI1
65474-001
10 μF, 10 V, A size tantalum capacitor
Nichicon
F931A106MAA
www.BDTIC.com/ADI
J1 to J8, J11 (up), J12 (high), EN12 (lower
position), EN34 (lower position)
C14
FCI = Framatome Connectors International
Rev. F | Page 54 of 60
AD8331/AD8332/AD8334
OUTLINE DIMENSIONS
9.80
9.70
9.60
28
15
4.50
4.40
4.30
6.40 BSC
1
14
PIN 1
0.65
BSC
1.20 MAX
0.15
0.05
COPLANARITY
0.10
0.30
0.19
SEATING
PLANE
8°
0°
0.20
0.09
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AE
Figure 122. 28-Lead Thin Shrink Small Outline Package (TSSOP)
(RU-28)
Dimensions shown in millimeters
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
www.BDTIC.com/ADI
20
11
1
10
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
0.010 (0.25)
0.006 (0.15)
0.069 (1.75)
0.053 (1.35)
0.065 (1.65)
0.049 (1.25)
0.025 (0.64)
BSC
SEATING
PLANE
0.012 (0.30)
0.008 (0.20)
8°
0°
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
0.041 (1.04)
REF
COMPLIANT TO JEDEC STANDARDS MO-137-AD
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 123. 20-Lead Shrink Small Outline Package (QSOP)
(RQ-20)
Dimensions shown in Inches and (millimeters
Rev. F | Page 55 of 60
012808-A
0.010 (0.25)
0.004 (0.10)
COPLANARITY
0.004 (0.10)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
AD8331/AD8332/AD8334
0.60 MAX
5.00
BSC SQ
0.60 MAX
25
24
PIN 1
INDICATOR
0.50
BSC
4.75
BSC SQ
0.50
0.40
0.30
1.00
0.85
0.80
3.25
3.10 SQ
2.95
EXPOSED
PAD
(BOTTOM VIEW)
17
16
9
8
0.25 MIN
0.80 MAX
0.65 TYP
12° MAX
PIN 1
INDICATOR
1
3.50 REF
THE EXPOSED PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
0.05 MAX
0.02 NOM
0.30
0.23
0.18
SEATING
PLANE
COPLANARITY
0.08
0.20 REF
041806-A
TOP
VIEW
32
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 124. 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
9.00
BSC SQ
0.30
0.25
0.18
0.60 MAX
0.60 MAX
64
49
48
PIN 1
INDICATOR
1
PIN 1
INDICATOR
*4.85
4.70 SQ
4.55
www.BDTIC.com/ADI
8.75
BSC SQ
EXPOSED PAD
(BOTTOM VIEW)
0.50
0.40
0.30
1.00
0.85
0.80
12° MAX
SEATING
PLANE
33
32
16
17
7.50
REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.50 BSC
THE EXPOSED PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
0.20 REF
*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 125. 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
9 mm × 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
Rev. F | Page 56 of 60
063006-B
TOP
VIEW
AD8331/AD8332/AD8334
ORDERING GUIDE
Model
AD8331ARQ
AD8331ARQ-REEL
AD8331ARQ-REEL7
AD8331ARQZ1
AD8331ARQZ-RL1
AD8331ARQZ-R71
AD8331-EVALZ1
AD8332ACP-R2
AD8332ACP-REEL
AD8332ACP-REEL7
AD8332ACPZ-R21
AD8332ACPZ-R71
AD8332ACPZ-RL1
AD8332ARU
AD8332ARU-REEL
AD8332ARU-REEL7
AD8332ARUZ1
AD8332ARUZ-R71
AD8332ARUZ-RL1
AD8332-EVALZ1
AD8334ACPZ1
AD8334ACPZ-REEL1
AD8334ACPZ-REEL71
AD8334-EVALZ1
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
Evaluation Board with AD8331ARQ
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
Evaluation Board with AD8332ARU
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board with AD8334ACP
Package Option
RQ-20
RQ-20
RQ-20
RQ-20
RQ-20
RQ-20
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
CP-64-1
CP-64-1
CP-64-1
www.BDTIC.com/ADI
Z = RoHS Compliant Part.
Rev. F | Page 57 of 60
AD8331/AD8332/AD8334
NOTES
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Rev. F | Page 58 of 60
AD8331/AD8332/AD8334
NOTES
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Rev. F | Page 59 of 60
AD8331/AD8332/AD8334
NOTES
www.BDTIC.com/ADI
©2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03199-0-4/08(F)
Rev. F | Page 60 of 60