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TQP369181 DC-6 GHz Gain Block Applications • • • • • • Wireless Infrastructure CATV / SATV / MoCA Point to Point Defense & Aerospace Test & Measurement Equipment General Purpose Wireless Product Features • • • • • • • • • SOT-363 Package Functional Block Diagram DC-6000 MHz Flat, broadband frequency response 15.3 dB Gain @ 1.9 GHz 3.6 dB Noise Figure @ 1.9 GHz +29 dBm Output IP3 @ 1.9 GHz +14.4 dBm P1dB @ 1.9 GHz 50 Ohm Cascadable Gain Block Single Supply, 45 mA Current SOT-363 Package General Description Pin Configuration The TQP369181 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surfacemount package. At 1.9 GHz, the amplifier typically provides 15.3 dB gain, +29 dBm OIP3, and 3.6 dB Noise Figure while drawing 45 mA current. The device combines dependable performance with consistent quality to maintain MTTF values exceeding 100 years at mounting temperatures of +85°C. The device is housed in a lead-free/green/RoHS-compliant industry-standard SOT-363 package. Pin # Symbol 3 6 1, 2, 4, 5 RF IN RF OUT GND The TQP369181 consists of a Darlington-pair amplifier using the high reliability InGaP/GaAs HBT process technology. Only DC-blocking capacitors, a bias resistor, and an inductive RF choke are required for operation. This broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as CDMA, W-CDMA, and LTE. In addition, the TQP369181 will work for other applications within the DC to 6 GHz frequency range. Ordering Information Part No. Description TQP369181 TQP369181-PCB InGaP/GaAs HBT Gain Block 0.5-4 GHz Evaluation Board Standard T/R size = 3000 pieces on a 7” reel Data Sheet: Rev C 12/09/11 - 1 of 8 - Disclaimer: Subject to change without notice www.BDTIC.com/TriQuint/ © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® TQP369181 DC-6 GHz Gain Block Specifications Recommended Operating Conditions Absolute Maximum Ratings Parameter Rating Parameter Storage Temperature -55 to 150 oC Tcase Tj (for>106 hours MTTF) RF Input Power,CW,50 Ω,T=25ºC +27 dBm Device Voltage, Vdevice 5.2 V Min Typ -40 Max Units o +85 +160 C C o Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications Test conditions unless otherwise noted: ICC = 45 mA, TCASE = +25ºC, 50 Ω system. Parameter Conditions Operational Frequency Range Min Typical DC Test Frequency Max Units 6000 MHz 1900 Gain 13.8 15.3 MHz 16.8 dB Input Return Loss -30 dB Output Return Loss -24 dB Output P1dB Output IP3 See Note 1. +26.0 +14.6 dBm +29.0 dBm Noise Figure 3.6 Device Voltage, Vdevice 3.9 Current, Icc 45 dB 4.5 mA 226 Thermal Resistance (jnc to case) θjc V o C/W Notes: 1. OIP3 is measured with two tones at an output power of 0 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the OIP3 using 2:1 rule. 2:1 rule gives relative value with respect to fundamental tone. Data Sheet: Rev C 12/09/11 - 2 of 8 - Disclaimer: Subject to change without notice www.BDTIC.com/TriQuint/ © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® TQP369181 DC-6 GHz Gain Block Device Characterization Data S-Parameter Data Vdevice = 3.9 V (typ.), Icc = 45 mA (typ.), Tcase = +25°C Freq (MHz) 10 20 50 100 200 500 900 1000 1500 1900 2000 2500 3000 3500 4000 4500 5000 5500 6000 S11 (dB) -36.7 -35.9 -34.6 -34.1 -32.6 -30.6 -29.1 -29.1 -27.9 -26.7 -24.9 -18.2 -14.4 -13.1 -13.1 -15.0 -19.1 -20.6 -17.1 S11 (ang) -179.3 178.4 171.4 164.0 153.3 137.1 115.5 118.6 74.3 28.5 17.8 -18.4 -24.2 -26.3 -26.2 -20.5 0.7 60.7 100.0 S21 (dB) 15.9 15.9 15.9 15.9 15.9 15.8 15.6 15.6 15.3 15.1 15.0 14.6 14.2 13.8 13.5 13.3 13.1 12.9 12.6 S21 (ang) 179.7 179.3 178.5 177.2 174.6 167.0 157.3 154.9 143.1 133.6 131.3 120.4 110.1 100.4 91.2 81.7 71.2 60.7 48.8 S12 (dB) -18.8 -18.8 -18.8 -18.8 -18.9 -18.9 -19.0 -19.0 -19.1 -19.4 -19.4 -19.7 -20.2 -20.5 -20.8 -21.2 -21.7 -22.4 -23.2 S12 (ang) 0.3 -0.1 -0.3 -0.7 -0.9 -2.6 -3.8 -4.1 -6.1 -7.5 -8.0 -9.8 -11.3 -13.1 -12.4 -14.4 -15.9 -17.4 -18.4 S22 (dB) -30.2 -30.0 -30.8 -31.2 -30.7 -32.3 -33.1 -32.0 -28.2 -22.9 -21.7 -16.6 -14.0 -12.9 -13.7 -16.5 -24.0 -18.9 -13.5 S22 (ang) 14.8 5.6 0.4 -5.2 -10.9 -16.0 -59.1 -59.5 -75.7 -63.3 -64.4 -62.9 -57.5 -54.0 -50.2 -41.9 0.6 84.1 105.3 Notes: 1. Measured on TQP369181-PCB using external off-board, wide-band bias tee and DC blocks (50 Ohm system). 2. SOLT Ecal at network analyzer test cable ends. 3. Input and output reference planes extended to the device leads. Data Sheet: Rev C 12/09/11 - 3 of 8 - Disclaimer: Subject to change without notice www.BDTIC.com/TriQuint/ © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® TQP369181 DC-6 GHz Gain Block Application Circuit Configuration Notes: 1. See PC Board Layout, under Application Information section, for more information. 2. All components are of 0603 size unless otherwise stated. Bill of Material: TQP369181-PCB Reference Des. Value Description Manufacturer Part Number Q1 n/a Gain Block TriQuint TQP369181 C1 0.018 uF Cap, Chip, 0603, 16V, X7R, 10% various C2, C3 56 pF Cap, Chip, 0603, 50V, NPO, 5% various L1 39 nH Inductor, 0603, 5%, CS Series Coilcraft R1 24 Ω Res, Chip, 0805, 1/10W, 5% various Component Values for Specific Frequencies Use the component values in this table for optimal operation at specific frequencies. Reference Designator 50 500 L1 C2, C3 820 nH .018 uF 220 nH 1000 pF Frequency (MHz) 900 1900 2200 68 nH 100 pF 27 nH 68 pF 22 nH 68 pF 2500 3500 18 nH 56 pF 15 nH 39 pF Bias Resistor Values for Various Supply Voltages Select R1 to satisfy 45 mA operating current at the available supply voltage. R1 Value Size 5 6 7 Vsupply (Volts) 8 24 Ω 0805 47 Ω 1206 68 Ω 1210 91 Ω 1210 Data Sheet: Rev C 12/09/11 - 4 of 8 - 9 10 12 110 Ω 1210 130 Ω 2010 180 Ω 2010 Disclaimer: Subject to change without notice www.BDTIC.com/TriQuint/ © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® TQP369181 DC-6 GHz Gain Block Typical Performance TQP369181-PCB Test conditions unless otherwise noted: Vsupply = 5 V, Rbias = 24 Ω, Icc = 45 mA, Tcase = +25°C Frequency MHz 500 900 1900 2100 2600 Gain Input Return Loss Output Return Loss Output P1dB dB dB dB dBm 15.6 -17 -16 +15.4 15.6 -26 -24 +15.2 15.3 -30 -24 +14.6 15 -24 -20 +14.3 14.7 -17 -16 +14.0 OIP3 [1] dBm +30.6 +30.0 +29.0 +28.5 +27.7 dB 3.6 3.6 3.6 3.6 3.7 Noise Figure Notes: 1. OIP3 measured with two tones at an output power of 0 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the OIP3 using 2:1 rule. Performance Plots Test conditions unless otherwise noted: Vsupply = 5 V, Rbias = 24 Ω, Icc = 45 mA Input Return Loss (dB) Gain (dB) 15 12 +85°C +25°C −40°C 9 Input Return Loss vs. Freq over Temp 0 6 -10 -20 +85°C +25°C −40°C -30 -40 0 1000 2000 3000 4000 5000 6000 -20 +85°C +25°C −40°C -30 1000 2000 3000 4000 5000 6000 0 1000 2000 Frequency (MHz) OIP3 vs. Output Power/Tone 32 3000 4000 5000 6000 Frequency (MHz) P1dB vs. Temperature 18 +85°C +25°C −40°C Freq.=1900 MHz 1 MHz Tone Spacing 17 P1dB (dBm) OIP3 (dBm) -10 -40 0 Frequency (MHz) 30 Output Return Loss vs. Freq over Temp 0 Output Return Loss (dB) Gain vs. Freq over Temp 18 28 26 24 16 15 900 MHz 1900 MHz 14 13 22 12 -3 -2 -1 0 1 2 3 Output Power/Tone (dBm) Data Sheet: Rev C 12/09/11 -40 -15 10 35 60 85 Temperature (deg. C) - 5 of 8 - Disclaimer: Subject to change without notice www.BDTIC.com/TriQuint/ © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® TQP369181 DC-6 GHz Gain Block Pin Description Pin Symbol Description 3 RF IN 6 RF OUT 1, 2, 4, 5 GND RF input, matched to 50 ohms. External DC Block is required. RF output / DC supply, matched to 50 ohms. External DC Block, bias choke, and dropping resistor is required. Multiple vias should be employed to minimize inductance and thermal resistance; see PCB mounting pattern in Mechanical Information section. Applications Information PC Board Layout Top RF layer is .014” NELCO N4000-13, єr = 3.7 typ., 4 total layers (0.062” thick) for mechanical rigidity. Metal layers are 1-oz copper. 50 ohm Microstrip line details: width = .029”, spacing = .035” The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. For further technical information, Refer to www.TriQuint.com Data Sheet: Rev C 12/09/11 - 6 of 8 - Disclaimer: Subject to change without notice www.BDTIC.com/TriQuint/ © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® TQP369181 DC-6 GHz Gain Block Mechanical Information Package Information and Dimensions The component is marked on the top surface of the package with a “181” designator and on the bottom surface with an alphanumeric lot code. Top 1 Bottom PCB Mounting Pattern . Notes: 1. All dimensions are in millimeters (inches). Angles are in degrees 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 3. Use 1 oz. Copper minimum. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. RF trace width depends upon the PC board material and construction. Data Sheet: Rev C 12/09/11 - 7 of 8 - Disclaimer: Subject to change without notice www.BDTIC.com/TriQuint/ © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® TQP369181 DC-6 GHz Gain Block Product Compliance Information ESD Information Solderability Package lead plating: annealed matte tin over copper ESD Rating: Value: Test: Standard: Class 1C Passes ≥ 1000 V to < 2000 V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes ≥ 1000 V Charged Device Model (CDM) JEDEC Standard JESD22-C101 Compatible with both lead-free (260°C max. reflow temp.) and tin/lead (245°C max. reflow temp.) soldering processes. RoHS Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: • Lead Free • Halogen Free (Chlorine, Bromine) • Antimony Free • TBBP-A (C15H12Br402) Free • PFOS Free • SVHC Free MSL Rating The part is rated Moisture Sensitivity Level 1 at 260°C per JEDEC standard IPC/JEDEC J-STD-020. Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: [email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Data Sheet: Rev C 12/09/11 - 8 of 8 - Disclaimer: Subject to change without notice www.BDTIC.com/TriQuint/ © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network®