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SN65LVELT23
www.ti.com......................................................................................................................................................... SLLS929A – JUNE 2009 – REVISED AUGUST 2009
3.3-V Dual Differential LVPECL/LVDS Buffer to LVTTL Translator
FEATURES
1
•
•
•
•
•
•
•
•
Dual 3.3-V Differential LVPECL/LVDS to LVTTL
Buffer Translator
24-mA LVTTL Ouputs
Operating Range
– PECL VCC = 3 V to 3.6 V With
GND = 0 V
Support for Clock Frequencies to >180 MHz
2-ns Typical Propagation Delay
Internal Input Pullup and Pulldown Resistors
Built-in Temperature Compensation
Drop-In Compatible to MC100LVELT23
PINOUT ASSIGNMENT
0D
1
8 V
CC
0D
2
70Q
LCEPVL
LTTVL
1D
3
61Q
1D
4
D5NG
APPLICATIONS
•
•
Table 1. PIN DESCRIPTION
Data and Clock Transmission Over Backplane
Signaling Level Conversion for Clock or Data
DESCRIPTION
PIN
D0, D0, D1, D1
PECL inputs
Q0, Q1
TTL outputs
VCC
Positive supply
The
SN65LVELT23
is
a
low-power
dual
GND
LVPECL/LVDS to LVTTL translator device. The
device includes circuitry to maintain inputs at VCC/2
when left open. The SN65LVELT23 is housed in an
industry-standard SOIC-8 package and is also
available in a TSSOP-8 option.
ORDERING INFORMATION (1)
(1)
FUNCTION
Ground
PART NUMBER
PART MARKING
PACKAGE
LEAD FINISH
SN65LVELT23D
LVEL23
SOIC
NiPdAu
SN65LVELT23DGK
SIMI
MSOP
NiPdAu
Devices with lead (Pb)-bearing terminals not initially available; contact TI sales representative for further information.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
SN65LVELT23
SLLS929A – JUNE 2009 – REVISED AUGUST 2009......................................................................................................................................................... www.ti.com
ABSOLUTE MAXIMUM RATINGS
PARAMETER
CONDITION
VALUE
UNIT
3.8
V
0 to 3.8
V
Absolute supply voltage, VCC
GND = 0 and Vi ≤ VCC
Absolute input voltage, VI
Output current
Continuous
50
Surge
100
mA
Operating temperature range
–40 to 85
°C
Storage temperature range
–65 to 150
°C
POWER DISSIPATION RATINGS
PACKAGE
CIRCUIT-BOARD
MODEL
POWER RATING
TA < 25°C
(mW)
THERMAL RESISTANCE,
JUNCTION-TO-AMBIENT,
NO AIRFLOW
DERATING FACTOR
TA > 25°C
(mW/°C)
POWER RATING
TA = 85°C
(mW)
Low-K
719
139
7
288
High-K
840
119
8
336
Low-K
469
213
5
188
High-K
527
189
5
211
SOIC
MSOP
THERMAL CHARACTERISTICS
PARAMETER
θJB
Junction-to-board thermal resistance
θJC
Junction-to-case thermal resistance
PACKAGE
VALUE
SOIC
79
MSOP
120
SOIC
98
MSOP
74
UNIT
°C/W
°C/W
KEY ATTRIBUTES
CHARACTERISTICS
VALUE
Moisture sensitivity level
Level 1
Flammability rating (oxygen index: 28 to 34)
UL 94 V-0 at 0.125 in. (3.18 mm)
ESD human-body model
2 kV
ESD charged-device model
1.5 kV
Internal pulldown resistor
50 kΩ
Internal pullup resistor
50 kΩ
Meets or exceeds JEDEC Spec EIA/JESD78 latchup test
2
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SN65LVELT23
www.ti.com......................................................................................................................................................... SLLS929A – JUNE 2009 – REVISED AUGUST 2009
LVTTL OUTPUT DC CHARACTERISTICS (1) (VCC = 3.3 V; GND = 0 V) (2)
PARAMETER
IOS
Output short-circuit current
VOH Output high voltage (3)
IOH = –3.0 mA
VOL Output low voltage
IOL = 24 mA
(1)
(2)
(3)
–40°C
CONDITION
25°C
MIN
TYP MAX
–120
–30
MIN
85°C
TYP MAX
–120
2.4
–30
2.4
MIN
TYP
–120
MAX
–30
2.4
0.5
UNIT
mA
V
0.5
0.5
V
Device meets the specifications after thermal equilibrium has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
All values vary 1:1 with Vcc; Vcc can vary ±0.3 V
LVTTL output RL = 500 Ω to GND
LVPECL INPUT DC CHARACTERISTICS (1) (VCC = 3.3 V; GND = 0.0 V) (2)
–40°C
PARAMETER
25°C
85°C
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
10
21
25
10
21
25
10
21
25
mA
15
21
21
21
ICCH
Power-supply current (outputs set to high)
ICCL
Power-supply current (outputs set to low)
27
15
27
15
27
mA
VIH
Input high voltage (3)
2135
2420
2135
2420
2135
2420
mV
VIL
Input low voltage (3)
1490
1825
1490
1825
1490
1825
mV
VIHCMR
Input high-voltage common-mode range
(differential) (4)
1.2
VCC
1.2
VCC
1.2
VCC
V
IIH
Input high current
150
µA
IIL
Input low current
(1)
(2)
(3)
(4)
150
–150
150
–150
µA
–150
Device meets the specifications after thermal equilibrium has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
Input and output parameters vary 1:1 with VCC. VCC can vary ±0.3 V.
LVTTL output RL = 500 Ω to GND
VIHCMR minimum varies 1:1 with GND, VIHCMR maximum varies 1:1 with VCC.
AC CHARACTERISTICS (1) (VCC = 3.3 V; GND = 0.0 V) (2)
PARAMETER
(3)
–40°C
25°C
MIN
TYP MAX
MIN
TYP
180
300
1.2
85°C
MAX
MIN
TYP
180
300
1.2
MAX
UNIT
fMAX
Maximum switching frequency (4)
180
300
tPLH/tPHL
Propagation delay to output at 1.5 V
1.2
1.6
2.2
1.7
2.2
1.8
2.2
ns
tSK++
Output-to-output skew++
30
160
30
150
30
150
ps
tSK– –
Output to output skew– –
45
180
45
160
45
135
ps
tSKPP
Part- to-part skew
60
200
60
200
70
200
ps
tJITTER
Random clock jitter (RMS)
4
10
VPP
Input voltage swing
tr/tf
Output rise/fall times (0.8 V – 2 V)
(1)
(2)
(3)
(4)
(5)
(6)
(5)
(6)
MHz
4
10
4
10
ps
200
800 1000
200
800
1000
200
800
1000
mV
330
585
330
600
900
330
630
900
ps
900
Device meets the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board
with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
Input parameters vary 1:1 with VCC. VCC can vary ±0.3 V.
TTL output RL = 500 Ω to GND and CL = 20 pF to GND; see Figure 1.
fmax measured for VOL < 0.5 V and VOH > 2.4 V. See Figure 5.
Skews are measured between outputs under identical conditions.
200-mV input assured full logic swing at the output.
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3
SN65LVELT23
SLLS929A – JUNE 2009 – REVISED AUGUST 2009......................................................................................................................................................... www.ti.com
Typical Output Loading Used for Device Evaluation
noitacilppA
revieceR LTT
tseT citsiretcarahC
LR
LC*
DAOL TSET CA
erutxiF sedulcnI LC*
ecnaticapaC
DNG
Figure 1. TTL Output Loading Used for Device Evaluation
V 0.2
V 8.0
tr
tf
Figure 2. Output Rise and Fall Times
NI
NI
V 5.1
V 5.1
TUO
HLtP
LHtP
Figure 3. Output Propagation Delay
D
)xam(V
PP
)nim(V
PP
D
Figure 4. Input Voltage Swing
4
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SN65LVELT23
www.ti.com......................................................................................................................................................... SLLS929A – JUNE 2009 – REVISED AUGUST 2009
OUTPUT VOLTAGE
vs
FREQUENCY
5
VCC = 3.3 V
VOH @ TA = −40°C
PO − Output Voltage − V
4
VOH @ TA = 25°C
3
VOH @ TA = 85°C
2
VOL @ TA = −40°C
VOL @ TA = 25°C
1
VOL @ TA = 85°C
0
0
50
100
150
200
250
300
350
400
450
500
f − Frequency − MHz
G001
Figure 5.
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5
SN65LVELT23
SLLS929A – JUNE 2009 – REVISED AUGUST 2009......................................................................................................................................................... www.ti.com
REVISION HISTORY
Changes from Revision Original (June 2009) to Revision A ......................................................................................... Page
•
6
Changed MIN and MAX values for tPLH/tPHL in AC CHARACTERISTICS table..................................................................... 3
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Aug-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65LVELT23D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVELT23DGK
ACTIVE
MSOP
DGK
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVELT23DGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVELT23DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65LVELT23DGKR
MSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
SN65LVELT23DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
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Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65LVELT23DGKR
MSOP
DGK
8
2500
346.0
346.0
29.0
SN65LVELT23DR
SOIC
D
8
2500
346.0
346.0
29.0
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Pack Materials-Page 2
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