* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
Download STTH30L06
Thermal runaway wikipedia , lookup
Switched-mode power supply wikipedia , lookup
Current source wikipedia , lookup
Surge protector wikipedia , lookup
Stray voltage wikipedia , lookup
Resistive opto-isolator wikipedia , lookup
Voltage optimisation wikipedia , lookup
Distribution management system wikipedia , lookup
Opto-isolator wikipedia , lookup
Mains electricity wikipedia , lookup
Power MOSFET wikipedia , lookup
Alternating current wikipedia , lookup
STTH30L06 Turbo 2 ultrafast high voltage rectifier Features ■ Ultrafast switching ■ Low reverse current ■ Low thermal resistance ■ K A Reduces switching and conduction losses D2PAK STTH30L06G Description The STTH30L06, which is using ST Turbo 2 600 V technology, is specially suited for use in switching power supplies, and industrial applications, as rectification and discontinuous mode PFC boost diode. September 2011 A A Table 1. Doc ID 10762 Rev 5 K DO-247 STTH30L06W Device summary Symbol Value IF(AV) 30 A VRRM 600 V Tj 175 °C VF (typ) 1.10 V trr (max) 65 ns www.bdtic.com/ST 1/8 www.st.com 8 Characteristics STTH30L06 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms voltage 50 A IF(AV) Average forward current Tc = 125 °C, δ = 0.5 30 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 300 A Tstg Storage temperature range -65 to + 175 °C 175 °C Value (max) Unit 1.1 °C/W Tj Table 3. Maximum operating junction temperature Thermal resistance Symbol Rth(j-c) Table 4. Symbol Parameter Junction to case Static electrical characteristics Parameter IR (1) Reverse leakage current VF (2) Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C Min. Typ. Max. Unit 25 VR = VRRM µA 80 800 1.55 IF = 30 A V 1.0 1.25 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.95 x IF(AV) + 0.010 IF2(RMS) Table 5. Symbol trr 2/8 Dynamic Characteristics Parameter Reverse recovery time Test conditions Tj = 25 °C Min. Typ. IF = 0.5 A, Irr = 0.25 A, IR =1 A IF = 1 A, dIF/dt = 50 A/µs, VR =30 V IRM Reverse recovery current Tj = 125 °C IF = 30 A, VR = 400 V, dIF/dt = 100 A/µs tfr Forward recovery time Tj = 25 °C IF = 30 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax VFP Forward recovery voltage Tj = 25 °C IF = 30 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax Doc ID 10762 Rev 5 Max. Unit 65 ns 65 90 11.5 16 A 500 ns 2.5 www.bdtic.com/ST V STTH30L06 Figure 1. Characteristics Conduction losses versus average Figure 2. forward current P(W) Forward voltage drop versus forward current IFM(A) 100 50 45 90 δ = 0.5 δ = 0.2 40 35 Tj=150°C (maximum values) 80 δ = 0.1 70 δ = 0.05 δ=1 30 60 Tj=150°C (typical values) 50 25 40 20 15 Tj=25°C (maximum values) 30 T 20 10 5 δ=tp/T IF(AV)(A) 10 tp VFM(V) 0 0 0 5 Figure 3. 10 15 20 25 30 35 0.00 40 0.25 Relative variation of thermal Figure 4. impedance junction to case versus pulse duration 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 Peak reverse recovery current versus dI F /dt (typical values) IRM(A) Zth(j-c)/Rth(j-c) 1.0 45 0.9 40 0.8 35 VR=400V Tj=125°C IF=2 x IF(AV) IF=IF(AV) 0.7 30 IF=0.5 x IF(AV) 0.6 25 0.5 20 0.4 15 0.3 10 0.2 Single pulse 0.1 5 tp(s) 0.0 dIF/dt(A/µs) 0 1.E-03 1.E-02 Figure 5. 1.E-01 1.E+00 0 50 Reverse recovery time versus dIF/dt Figure 6. (typical values) trr(ns) 100 150 200 250 300 350 400 450 500 Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) 3500 800 750 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 VR=400V Tj=125°C VR=400V Tj=125°C 3000 IF=2 x IF(AV) 2500 IF=2 x IF(AV) IF=IF(AV) 2000 IF=IF(AV) IF=0.5 x IF(AV) 1500 IF=0.5 x IF(AV) 1000 500 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 0 Doc ID 10762 Rev 5 100 200 300 www.bdtic.com/ST 400 500 3/8 Characteristics Figure 7. STTH30L06 Reverse recovery softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature S factor 1.4 1.6 IF< 2 x IF(AV) VR=400V Tj=125°C 1.4 S factor 1.2 1.2 1.0 1.0 0.8 QRR 0.8 0.6 0.6 IF=IF(AV) VR=400V Reference: Tj=125°C trr IRM 0.4 0.4 0.2 Tj(°C) 0.2 dIF/dt(A/µs) 0.0 0.0 25 0 50 Figure 9. 100 150 200 250 300 350 400 450 75 100 125 500 Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) VFP(V) 500 10 IF=IF(AV) Tj=125°C 9 50 8 400 7 350 6 300 5 250 4 200 3 150 2 IF=IF(AV) VFR=1.1 x VF max. Tj=125°C 2 D PAK 450 100 1 50 dIF/dt(A/µs) 0 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 0 100 200 300 400 500 Figure 12. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) C(pF) 80 1000 F=1MHz VOSC=30mVRMS Tj=25°C 2 D PAK 70 Printed circuit board FR4, copper thickness: 35 µm 60 50 40 100 30 20 10 VR(V) SCU(cm²) 10 0 1 4/8 10 100 1000 0 Doc ID 10762 Rev 5 5 10 15 20 www.bdtic.com/ST 25 30 35 40 STTH30L06 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. D2PAK dimensions Dimensions Ref. A E C2 L2 D L B2 Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R C B G A2 M * Inches Min. L3 A1 Millimeters V2 * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0° 0.016 typ. 8° 0° 8° Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 Doc ID 10762 Rev 5 3.70 www.bdtic.com/ST 5/8 Package information STTH30L06 Table 7. DO247 dimensions Dimensions Ref. Millimeters Min. V Typ. Inches Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 Dia V F2 2.00 0.078 A H F3 2.00 G 2.40 0.078 10.90 0.094 0.429 L5 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.169 L L2 L4 F2 L3 L1 L2 F3 D V2 L3 F G M E 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 6/8 0.145 Doc ID 10762 Rev 5 3.55 3.65 www.bdtic.com/ST 0.139 0.143 STTH30L06 3 Ordering information Ordering information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STTH30L06G STTH30L06G D2PAK 1.48 g 50 Tube STTH30L06G-TR STTH30L06G D 2PAK 1.48 g 1000 Tape and reel STTH30L06W STTH30L06W DO-247 4.40 g 30 Tube Revision history Table 9. Document revision history Date Revision Changes 07-Sep-2004 1 First issue. 21-Oct-2004 2 DOP3I package added. 11-Jan-06 3 On page 2: – IF(RMS) corrected from 30 A to 50 A – IF(AV) corrected from 50 A to 30 A 10-Aug-2006 4 Reformatted to current standards. SOD-93 package removed. 06-Sep-2011 5 Updated IFSM from 160 A to 300 A. Removed TO-220 and DOP3l. Doc ID 10762 Rev 5 www.bdtic.com/ST 7/8 STTH30L06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Doc ID 10762 Rev 5 www.bdtic.com/ST