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< Power GaAs FET > MGF1451A Micro-X ceramic package DESCRIPTION The MGF1451A power GaAs MES FETis designed for use in S to Ku band amplifiers. Outline Drawing FEATURES High gain and High P1dB Glp=10.5dB , P1dB=13dBm (Typ.) @ f=12GHz APPLICATION Fig.1 S to Ku band low noise amplifiers QUALITY GRADE GG RECOMMENDED BIAS CONDITIONS VDS=3V, ID=30mA RoHS COMPLIANT MGF1451A is a RoHS compliant product. RoHS compliance is indicated by the letter “G” after the Lot Marking. ABSOLUTE MAXIMUM RATINGS Symbol VGDO Ratings Unit Gate to drain voltage -8 V MITSUBISHI Proprietary VGSO Gate to source voltage -8 V 120 mA Not to be reproduced or disclosed without permission by Mitsubishi Electric ID PT Tch Tstg Parameter (Ta=25°C ) Drain current Total power dissipation 300 mW Channel temperature 175 °C Storage temperature -55 to +125 °C ELECTRICAL CHARACTERISTICS Symbol Parameter (Ta=25°C) Test conditions Limits Unit MIN. TYP. MAX V(BR)GDO Gate to drain breakdown voltage IG=-30µA -8 -- -- V V(BR)GSO Gate to source breakdown voltage IG=-30µA -8 -- -- V IGSS Gate to source leakage current VGS=-3V,VDS=0V -- -- 10 µA IDSS Saturated drain current VGS=0V,VDS=3V 35 60 120 mA Gate to source cut-off voltage VDS=3V,ID=300µA -0.3 -1.4 -3.5 V Linear power gain VDS=3V, 9.0 10.5 -- dB Output power at 1dB gain compression ID=30mA, f=12GHz 11.0 13.0 -- dB -- -- -- 420 ℃/W VGS(off) Glp P1dB. Rt Thermal resistance Publication Date : Apr., 2011 1 < Power GaAs FET > MGF1451A Micro-X ceramic package TYPICAL CHARACTERISTICS ID vs. VDS 80 Ta=25℃ VDS=3V 70 DRAIN CURRENT ID(mA) VGS=0V 60 50 40 30 20 10 0 60 50 40 30 20 10 0 0 1 2 3 4 5 DRAIN TO SOURCE VOLTAGE VDS(V) -2.0 Pout,Glp vs. Pin 25 30 20 25 15 20 10 15 5 10 0 -10.0 -5.0 0.0 Pin(dBm) 5.0 Glp(dB) f=12GHz VDS=3V IDS=30mA Pout Glp Pout(dBm) ID VS. VDS 80 Ta=25℃ VGS=-0.2V/STEP 70 DRAIN CURRENT ID(mA) (Ta=25°C) 5 10.0 Publication Date : Apr., 2011 2 -1.0 0.0 GATE TO SOURCE VOLTAGE VGS(V) < Power GaAs FET > MGF1451A Micro-X ceramic package S PARAMETERS (Conditions:VDS=3V,IDS=30mA,Ta=25deg.C) freq (GHz) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 S11 Mag. 0.986 0.953 0.921 0.886 0.850 0.810 0.784 0.748 0.714 0.667 0.606 0.521 0.447 0.386 0.382 0.460 0.578 0.688 0.767 0.794 S21 Angle -21.3 -41.0 -58.6 -74.3 -90.2 -101.0 -111.5 -121.3 -131.5 -143.9 -157.3 -173.0 165.7 134.3 95.5 57.9 29.8 8.2 -8.0 -20.5 Mag. 4.089 3.848 3.570 3.274 3.054 2.823 2.686 2.588 2.542 2.541 2.562 2.586 2.653 2.686 2.674 2.619 2.445 2.224 1.979 1.736 S12 Angle 159.6 140.9 124.1 109.1 93.5 80.9 68.9 57.3 45.4 33.2 19.6 5.6 -9.6 -26.7 -45.2 -65.5 -86.0 -106.6 -126.1 -145.0 Mag. 0.016 0.029 0.039 0.046 0.052 0.054 0.055 0.055 0.057 0.062 0.067 0.069 0.073 0.076 0.078 0.080 0.080 0.077 0.075 0.077 S22 Angle 75.2 61.4 50.8 41.7 31.2 24.8 19.3 15.5 13.5 11.2 4.4 -4.9 -13.3 -23.5 -37.5 -54.5 -73.9 -95.0 -117.1 -140.2 Mag. 0.542 0.544 0.542 0.539 0.528 0.531 0.541 0.547 0.552 0.560 0.556 0.544 0.526 0.496 0.451 0.379 0.282 0.169 0.060 0.083 K Angle -15.9 -31.0 -43.3 -52.9 -64.5 -72.5 -79.2 -85.4 -91.2 -96.6 -103.4 -109.9 -117.9 -125.7 -135.0 -144.3 -154.0 -157.6 -138.7 -42.8 0.17 0.30 0.40 0.51 0.64 0.82 0.93 1.08 1.17 1.18 1.27 1.46 1.52 1.58 1.60 1.57 1.54 1.51 1.46 1.48 MSG/MAG (dB) 24.1 21.2 19.6 18.5 17.7 17.2 16.9 14.9 14.0 13.5 12.7 11.7 11.4 11.0 10.8 10.7 10.5 10.4 10.2 9.4 GaAs FET Bottom view (MGF1451A) ① Calibration point Gate 1.0mm Microstrip line (Z0=50Ω) Drain GND Calibration point Substrate (Ceramics) εr=9.8 MetalMetal carrier carrier Calibration point ② ② ③ ①Gate ②Source ③Drain Calibration point 1.1mm Note We are ready to provide nonlinear model for ADS and MWO users. If you are interested, please contact our sales offices. Publication Date : Apr., 2011 3 < Power GaAs FET > MGF1451A Micro-X ceramic package Keep safety first in your circuit designs! • Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire ore property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. 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Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. • The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole ore in part these materials. • If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. • Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. © 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED. Publication Date : Apr., 2011 4