Download BD81002MUV

Datasheet
Power supply IC for TFT-LCD Panels
For Large Current Load
7CH System Power Supply IC
BD81002MUV
●Description
The BD81002MUV is a system power supply IC that provides control 6 power supply channels and 1 VCOM channel
required for TFT-LCD panels on a single chip. Output voltage and start-up sequence is variable. In addition, this IC
incorporates Power Good output function.
●Features
1)
2)
3)
4)
5)
6)
7)
8)
9)
10)
Synchronous rectification type Step-up DC/DC converter with built-in 4A FET
Synchronous rectification type Step-down DC/DC converter with built-in 3A FET
Synchronous rectification type Step-down DC/DC controller
Positive/ Negative charge pumps
HVLDO
VCOM amplifier
All output shut-down function
Controllable sequence・Power Good function
Frequency fixed (500kHz)
Protection circuits：Under-voltage lockout protection circuit
Thermal shutdown circuit
Timer latch type short-circuit protection circuit
Over Current Protection circuit（VDD2・AVDD Load Switch）
11) VQFN048V7070 package
●Applications
TFT-LCD Panels power supplies
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Power Supply voltage1
VCC・PVCC
20
V
Power Supply voltage2
HVCC
20
V
SW3 pin voltage
VSW3
30
V
Maximum junction temperature
Tjmax
150
℃
Pd
4826（*1）
mW
Operating temperature rage
Topr
-25 to 105
℃
Storage temperature range
Tstg
-55 to 150
℃
Power dissipation
（*1）To use the IC at temperature over Ta=25℃, derate power ratings by 38.6mW/℃
When mounted on a four-layer glass epoxy board measuring 74.2×74.2×1.6mm（all copper foil area: 5505mm2）
●Operating Conditions (Ta=-25℃ to +105℃)
Parameter
Power Supply voltage1
Power Supply voltage2
SW3 pin voltage
SW2 pin current
SW3 pin current
Power Good pull-up voltage
EN pin voltage
（*2）Not exceeds Pd.
○Product structure：Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
Symbol
MIN
MAX
Unit
VCC・PVCC
HVCC
VSW3
ISW2
ISW3
VPG
VEN
10
10
-
18
18
28
5（*2）
4（*2）
5.5
5.5
V
V
V
A
A
V
V
○This product is not designed protection against radioactive rays
1/17
TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
●Electrical Characteristics（Unless otherwise noted, Ta=25℃，VCC=12V，HVCC=15.6V）
Limits
Parameter
Symbol
Unit
MIN
TYP
MAX
【CH1 VDD1】Synchronous rectification type Step-down DC/DC controller
Error amplifier reference voltage
REF1
0.491
0.500
0.509
Soft start time 85%
SOFT1
2.0
EN1 ON voltage
EN1ON
2.5
-5.5
EN1 OFF voltage
EN1OFF
0.4
Power Good 1 ON voltage
PGH1
80
Power Good 1 OFF voltage
PGL1
50
【CH2 VDD2】Synchronous rectification type Step-down DC/DC
Error amplifier reference voltage
REF2
0.491
0.500
0.509
SW2 H side MOS ON resistance
RON2H
0.16
SW2 L side MOS ON resistance
RON2L
0.15
Soft start time 85%
SOFT2
2.0
EN2 ON voltage
EN2ON
2.5
-5.5
EN2 OFF voltage
EN2OFF
0.4
Power Good 2 ON voltage
PGH2
80
Power Good 2 OFF voltage
PGL2
50
Over Current Limit
OCP2
3.0
4.25
5.5
【CH3 AVDD】Synchronous rectification type Step-up DC/DC
Error amplifier reference voltage
REF3
0.982
1.000
1.018
SW3 H side MOS ON resistance
RON3H
0.18
SW3 L side MOS ON resistance
RON3L
0.21
MAX Duty
MDT
61
85
99
Output voltage Soft start time 85%
SOFT3
15.7
EN3 ON voltage
EN3ON
2.5
-5.5
EN3 OFF voltage
EN3OFF
0.4
Over Voltage Protection
OVP3
18
19
20
Over Current Protection
OCP3
0.09
0.13
0.17
【CH4 HVLDO】High Voltage LDO
Error amplifier reference voltage
REF4
0.982
1.000
1.018
I/O voltage difference
VIO
0.2
0.5
【CH5 VGH】Positive Charge Pump
Error amplifier reference voltage
REF5
0.980
1.000
1.020
H side MOS ON resistance
RON5H
1.8
L side MOS ON resistance
RON5L
2.5
Power Good CP ON voltage
PGHCP
80
Power Good CP OFF voltage
PGLCP
25
Over Voltage Protection
OVPCP
【CH6 VGL】Negative Charge Pump
Error amplifier reference voltage
REF6
H side MOS ON resistance
RON6H
L side MOS ON resistance
RON6L
VREF reference voltage
VREF
【VCOM】Operation Amplifier
Input offset voltage
VOFF
Input bias current
IBAMP
VCOM output current capability
ICOM
Slew rate
SRCOM
Load stability
⊿Vo
Maximum output voltage
VOH
Minimum output voltage
VOL
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Conditions
V
mS
V
V
%
%
-25<Ta<105[℃]
2.35[mS]@100[%]（typ）
-25<Ta<105[℃]
-25<Ta<105[℃]
V
Ω
Ω
mS
V
V
%
%
A
-25<Ta<105[℃]
Io=10[mA]
Io=10[mA]
2.35[mS]@100[%]（typ）
-25<Ta<105[℃]
-25<Ta<105[℃]
V
Ω
Ω
%
mS
V
V
V
V
-25<Ta<105[℃]
Io=10[mA]
Io=10[mA]
18.5[mS]@100[%]（typ）
-25<Ta<105[℃]
-25<Ta<105[℃]
-25<Ta<105[℃]
V
V
-25<Ta<105[℃]
HVCC=15[V] Io=50[mA]
V
Ω
Ω
%
%
-25<Ta<105[℃]
-25<Ta<105[℃]
（VGH=35[V] setting）
36.5
-
39.5
V
0.490
1.764
0.500
3.7
4.8
1.800
0.510
1.836
V
Ω
Ω
V
-15
-1.2
50
-15
150
15
0
15
1.2
15
mV
uA
mA
V/uS
mV
-
V
Io=-1[mA],INP=14[V] INN=0[V]
0.2
V
Io=1[mA], INP=0[V] INN=14[V]
HVCC-1.0 HVCC-0.8
-
0.1
2/17
-25<Ta<105[℃]
-25<Ta<105[℃]
-25<Ta<105[℃]
Io=-1[mA] to +1[mA]
TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
●Electrical Characteristics（Unless otherwise noted, Ta=25℃，VCC=12V，HVCC=15.6V）
Limits
Parameter
Symbol
Unit
MIN
TYP
MAX
【Overall】
Oscillating frequency1
SAW1
400
500
600
KHz
Oscillating frequency2
SAW2
300
500
700
KHz
VCC Under-Voltage Lockout protection
UVLO1
7.6
8.0
8.4
V
REG output voltage
VREG
4.7
5.0
5.3
V
SCP source current
SCPSO
1.8
4.5
7.2
uA
SCP threshold voltage
VSCP
1.10
1.20
1.30
V
Stand-by VCC consumption current
STBICC
1.05
2.10
3.15
mA
VCC consumption current 1
ICC1
1.75
3.50
5.25
mA
VCC consumption current 2
ICC2
2.15
4.30
6.45
mA
Conditions
-25<Ta<105[℃]
-25<Ta<105[℃]
-25<Ta<105[℃]
EN*=L
FB1=FB2=FB4=FBN=0[V]
FB3=FBP=1.2[V] , SCP=GND
FB1=FB2=FB4=FBN=0.6[V]
FB3=FBP=0.8[V], SCP=GND
●Pin configuration and Pin function
36
35
34
33
32
31
30
29
28
27
26
25
37
24
38
23
39
22
40
21
41
20
42
19
43
18
44
17
45
16
46
15
47
14
48
13
1
2
3
4
5
6
7
8
9
10
11
12
Fig.1 PIN configuration (TOP VIEW)
PIN No.
PIN name
Function
1
COMP
AVDD phase compensatioin I/O terminal
2
SCP
3
VREF
4
PIN name
Function
25
HVCC2
VGH・VGL power supply terminal
Short circuit protection output terminal
VGL reference voltage output terminal
26
LSO
SWCPP
VGH load switch output terminal
27
FB4
PG2
HVLDO feedback input terminal
VDD2 power good output terminal
28
CPGND1
VGH switching output terminal
VGH power GND terminal
29
FBP
VGH feedback input terminal
AVDD over current detection input terminal
30
FB2
7
LS_S
PGATE3
AVDD load switch gate signal output terminal
31
FB1
VDD2 feedback input terminal
VDD1 feedback input terminal
8
HVLDO
HVLDO output terminal
32
PVCC2
VDD2 power supply terminal
5
6
PIN No.
9
AVDD
AVDD output terminal
33
PVCC2
VDD2 power supply terminal
10
AVDD
34
PGCP
VGH power good output terminal
11
35
SW2
VDD2 switching output terminal
12
SW3
SW3
AVDD output terminal
AVDD switching output terminal
AVDD switching output terminal
36
SW2
VDD2 switching output terminal
13
-
PGND2
VDD2 power GND terminal
PGND3
N.C.(None Connection)
AVDD power GND terminal
37
14
38
PGND2
VDD2 power GND terminal
15
PGND3
AVDD power GND terminal
39
NGATE1
VDD1 external FET gate signal output terminal
16
OUT
VCOM output terminal
40
EN3
AVDD enable input terminal
17
HVCC1
VCOM power supply terminal
41
PGATE1
VDD1 external FET gate signal output terminal
18
GND
GND terminal
42
PVCC1
19
VCOM+ input terminal
43
PG1
20
INP
INN
44
REG
VDD1 power good output terminal
Inner power supply output terminal
21
EN2
VCOM- input terminal
VDD2 enable input terminal
45
EN1
VDD1 enable input terminal
22
FBN
VGL feedback input terminal
46
VCC
Power supply terminal
23
CPGND2
VGL power GND terminal
47
SEL
AVDD operation select input terminal
24
SWCPN
VGL switching output terminal
48
FB3
AVDD feedback input terminal
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3/17
VDD1 external H SIDE FET power supply
input terminal
TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
z PHYSICAL DIMENSION AND PACKAGE OUTLINE (VQFN048V7070)
BD81002
BM81205
LOT NO.
Fig.2 7mm×7mm
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
QFN Package (0.5mm Pitch)
4/17
TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
●Block diagram
VCC
VCC
External FET drives when SEL=H
VCC
33 32
46
2
3
44
1
47
7
6
AVDD
CH2（VDD2）
9
10
VREF
VDD 2
3.3V
SW2
35
36
PGND2
37
38
11
12
Step-down
Converter
PROTECT
Step-up
Converter
OSC
30
CH3（AVDD）
PGND3
14
15
48
FB2
AVDD
( HVCC)
SW3
40
FB3
EN3
PG2
REG
REG
REG
PG 2
EN3
EN2
PG1
CH5（VGH）
5
PGCP
34
21
FBP
29
Positive
Charge pump
VCC
CH1（VDD1）
PVCC1
CPGND1
28
VGH
42
SWCPP
27
VDD 1
1.8V
41
PGATE1
NGATE1
26
Step-down
Converter
39
25
LSO
HVCC2
AVDD
24
SWCPN
FB1
Negative
Charge pump
31
REG
VGL
CPGND2
23
CH6（VGL）
22
EN2
External input
PG1
EN1
FBN
43
VREF
45
AVDD
AVDD
HVCC1
17
CH4（HVLDO）
HVLDO
15.2V
CH7（VCOM)
HV LDO
INP
HVLDO
19
8
FB4
20
OUT
4
From Calibrator
INN
VCOM
16
18
Fig. 3 Block diagram/ Application diagram
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TSZ22111・15・001
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TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
●Sequence chart
・While PG1=EN2 PG2=EN3 operation
Fig.4 Sequence chart
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TSZ22111・15・001
6/17
TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
●Description of Operation of Each Block and Procedure for selecting Application Components
【CH1】VDD1
This is a Step-down synchronous DC/DC controller to drive external Power MOSFET.
When High Signal is input to EN1 pin, the switching will operate by soft-start.
VDD1
R13
C13
R11
VCC
PVCC1
R14
FB1
C12
PGATE1
R12
PRE
DRIVER
0.5[V]
VDD1
NGATE1
L11
M11
R15
SAW
C11
・Recommended External parts（1.2[V]・1.8[V] output setting）
PIN name
Value
Company
Product No.
R11
Refer to the right table
ROHM
-
R12
Refer to the right table
ROHM
-
R13
0[Ω]
-
-
R14
100[kΩ]
ROHM
-
R15
100[kΩ]
ROHM
-
C11
22[uF]×2
TAIYO YUDEN
JMK316BJ226KL
C12
10[uF]
TAIYO YUDEN
TMK316BJ106KL
C13
18[pF]
TAIYO YUDEN
UMK105CH180JV-F
L11
10[uH]
M11
PMOS・NMOS
TOKO
#919AS-100M
TAIYO YUDEN
NR10050T100M
ROHM
SH8M12
Setting external
VDD1
R11
R12
1.2[V]
1.8[V]
270+10[KΩ]
200[KΩ]
240+20[KΩ]
100 [KΩ]
VDD1 output voltage setting equation is shown below.
R
VDD1 [V] =
+R
11
12
× 0.5[V]
R
12
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
7/17
TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
【CH2】VDD2
This is a Step-down DC/DC converter, operating in MOSFET inside IC.
When High Signal is input to EN2 pin, the switching will operate by soft-start.
VDD2
R23
C23
R21
VCC
PVCC2
C22
FB2
R22
PRE
DRIVER
0.5[V]
SW2
VDD2
L21
C21
PGND2
SAW
・Recommended External parts（3.3[V] output setting）
PIN name
Value
Company
Product No.
R21
100[KΩ]+ 12[KΩ]
ROHM
-
R22
20[KΩ]
ROHM
-
R23
-
-
C21
22[uF]
TAIYO YUDEN
JMK316BJ226KL
C22
10[uF]
TAIYO YUDEN
TMK316BJ106KL
C23
39[pF]
TAIYO YUDEN
UMK105CH390JV
TOKO
#B952AS-100M
TAIYO YUDEN
NR8040T100M
L21
10[uH]
VDD2 output voltage setting equation is shown below.
R
VDD2 [V] =
+R
21
22
× 0.5[V]
R
22
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TSZ22111・15・001
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TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
【CH3】AVDD
While SEL pin equals to GND, it operates in step-up synchronous DC/DC converter block inside MOSFET, and when SEL
pin equals to VCC, in step-up external FET driver non-synchronous DC/DC controller. When High Signal is input to EN3
pin, the current from PGATE3 rush and load switch M31 will be ON. After that, switching will start by soft start.
＜Synchronous rectifier（SEL pin=GND）＞
AVDD
AVDD
VCC
AVDD
C31
R33
C33
R31
C311
C32
R35
LS_S
FB3
PGATE3
R32
1.0[V]
COMP
M31
SW3
PRE
DRIVER
L31
PGND3
SAW
R34
C34
・Recommended External parts（15.6[V] output setting）
PIN name
Value
Company
R31
130[KΩ]+16[KΩ]
ROHM
Product No.
-
R32
10[KΩ]
ROHM
-
R33
-
-
R34
10[KΩ]
ROHM
-
R35
20[mΩ]
ROHM
UCR10R020
C31
120[uF]
SANYO
20SVPF120M
C311
10[uF]
TAIYO YUDEN
TMK316BJ106KL
C32
10[uF]
TAIYO YUDEN
TMK316BJ106KL
C33
33[pF]
TAIYO YUDEN
UMK105CH330JV-F
TMK105BJ223KV-F
C34
L31
M31
22[nF]
TAIYO YUDEN
4.7[uH]
TOKO
FDVE1040-4R7
4.9[uH]
TAIYO YUDEN
NR10050T4R9M
PMOS
ROHM
-
AVDD output voltage setting equation is shown below.
R
AVDD [V] =
+R
31
32
× 1.0[V]
R
32
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TSZ22111・15・001
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TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
＜Non-synchronous rectifier（SEL pin=VCC）＞
AVDD
VCC
AVDD
R33
C33
R31
C32
R35
LS_S
FB3
PGATE3
R32
1.0[V]
COMP
M31
SW3
PRE
DRIVER
L31 D
31
PGND3
SAW
AVDD
M32
C31
C311
R34
C34
・Recommended External parts（15.6[V] output setting）
PIN name
Value
Company
R31
130[KΩ]+16[KΩ]
ROHM
Product No.
-
R32
10[KΩ]
ROHM
-
R33
-
-
R34
10[KΩ]
ROHM
-
R35
20[mΩ]
ROHM
UCR10R020
C31
120[uF]
SANYO
20SVPF120M
C311
10[uF]
TAIYO YUDEN
TMK316BJ106KL
C32
10[uF]
TAIYO YUDEN
TMK316BJ106KL
C33
33[pF]
TAIYO YUDEN
UMK105CH330JV-F
TMK105BJ103KV-F
C34
10[nF]
TAIYO YUDEN
4.7[uH]
TOKO
FDVE1040-4R7
4.9[uH]
TAIYO YUDEN
NR10050T4R9M
M31
PMOS
ROHM
-
M32
NMOS
ROHM
RSH090N03
D31
SBD
ROHM
RB095B-30
L31
【CH4】HV LDO
This is a High voltage output LDO, corresponding to output ceramic capacitor. Simultaneously activate with AVDD.
AV D D
1 .0[V]
H VLD O
H VLD O
R 41
C 43
C41
FB4
R 42
・Recommended External parts（15.2[V] output setting）
PIN name
Value
Company
R41
130[KΩ]+12[KΩ]
ROHM
-
R42
10[KΩ]
ROHM
-
C41
10[uF]
TAIYO YUDEN
TMK316BJ106KL
C43
22[pF]
TAIYO YUDEN
UMK105CH220JV-F
R
HVLDO [V] =
Product No.
+R
41
42
× 1.0[V]
R
42
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
10/17
TSZ02201-0313AAF00290-1-2
09. Nov. 2012 Rev.001
Datasheet
BD81002MUV
【CH5・CH6】VGH・VGL
VGH operates a positive charge pump, and VGL operates a negative charge pump.
First, AVDD activates, Next, VGL activates, and finally VGH will activate.
PGCP
R52
FBP
VGH
CPGND1
C54
C56
R51
VGH
SWCPP
D51
D52
D53
D54
C51
C55
LSO
C52
HVCC2
D61
C64
SWCPN
VGL
D62
VGL
CPGND2
C61
R61
FBN
R62
VREF
・Recommended External parts（VGH：35[V] VGL：-6[V] output setting）
PIN name
Value
Company
R51
330[KΩ]+10[KΩ]
ROHM
-
R52
10[KΩ]
ROHM
-
C51
2.2[uF]
TAIYO YUDEN
UMK316BJ225KD
C52
10[uF]
TAIYO YUDEN
TMK316BJ106KL
C54
0.1[uF]
TAIYO YUDEN
C55
0.1[uF]
TAIYO YUDEN
C56
0.1[uF]
TAIYO YUDEN
D51
SBD
ROHM
RB050M-30
D52
SBD
ROHM
RB050M-30
D53
SBD
ROHM
RB050M-30
D54
SBD
ROHM
RB050M-30
R61
100[KΩ]
ROHM
-
R62
20[KΩ]
ROHM
-
C61
22[uF]×2
KYOCERA
OxiCap 22uF/10V
C64
47[nF]
TAIYO YUDEN
D61
SBD
ROHM
RB050M-30
SBD
ROHM
RB050M-30
SBD
ROHM
RB552EA
D62
D61
D62
Product No.
VGH・VGL output voltage setting equation is shown below.
R
VGH [V] =
R
VGL [V] =
+R
51
52
× 1.0[V]
R
52
61
R
+R
62
R
× 0.5[V] -
62
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R
61
× 1.8[V]
62
11/17
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Datasheet
BD81002MUV
【CH7】VCOM
The common amplifiers operate in the range of 0.1V to HVCC-0.8V(TYP).
Normally, use the amplifier as a buffer type(a) as shown below. Use PNP and the NPN transistor like (b) when you raise
the drive ability of the current. Moreover, make to the buffer type of (a) when you do not use VCOM and ground the
terminal INP.
(a)
HVCC
HVCC1
INP
From Calibrator
INN
OUT
VCOM
(b)
HVCC
HVCC1
INP
From Calibrator
INN
OUT
VCOM
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Datasheet
BD81002MUV
【Common block】
・ UVLO function
The UVLO protection function will be implemented when the UVLO pin voltage falls below VCC=8.0V(TYP)
and canceled when it exceeds VCC=9.0V(TYP).
・ SCP function
4.5[uA]
Latch
The SCP function protects against short-circuits in the outputs of the step-up DC/DC converter, Step-down DC/DC
Converter, HV_LDO, and charge pump.
When any of these outputs fall below 50% of the set voltage(VGH is 25%), it will be regarded as a short-circuit in
output, thus activating the short-circuit protection function.
If a short-circuit is detected, source current of 4.5[uA](TYP) will be output from the SCP pin. Then, delay time will be
set
with external capacitance. When the SCP pin voltage exceeds 1.2V(TYP), the state will be latched to shut down all
outputs. Once the state has been latched, it will not be canceled unless VCC restarts. The delay time setting is
obtained
by using the following equation.
TL [s] =
C02×1.2
4.5×10 -6
When each channel starts, until end of soft start, SCP operation is ignored except for VGL.
According to VGL, it isn’t ignored until 50[%] of output voltage setting.
So it needs under condition.
Time until 50 [%] of VGL output voltage setting <
Time of SCP detection
・Control and Power-Good function
When the control pin (EN1, EN2, EN3) is set to low-level input, the relevant block will stop operation. When EN1 is
High,
VDD1 will activate. When EN2 is H, VDD2 will activate. When EN3 is High, AVDD・HVLDO・VCOM・VGH・VGL will
activate. The control pin is internally pulled down to GND, whereby operating the relevant block in the open state.
The Power Good pin (PG1・PG2・PGCP) is designed in an open-drain pattern to use as the control pin of a different
block or an external power-good signal. The pull-up and use resistance between a power good terminal and the
terminal REG. It is recommended to apply a setting range of 20 to100[KΩ]. The Power Good pin outputs a low-level
signal while in the rising mode and, when the output voltage reaches 80[%] of the set voltage, will enter a high
impedance state. The Power Good pin outputs a low-level signal while VDD1/ VDD2 output voltage falls below
50[%] of the set voltage. And the Power Good pin outputs a low-level signal while VGH output voltage falls below
25[%] of the set voltage.
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Datasheet
BD81002MUV
●I/O Equivalent Circuit Diagrams
1.COMP
2.SCP
3.VREF
VCC
GND
GND
GND
4.FB4
5.PG2 34.PGCP 43.PG1
7.PGATE3
6.LS_S
8.HVLDO
9.10. AVDD
GND
11.12. SW3
16.OUT
HVCC1
AVDD
21.EN2 40.EN3 45.EN1 47.SEL
19.INP 20.INN
22.FBN 29.FBP 30.FB2
31.FB1 48.FB3
26.LSO
GND
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Datasheet
BD81002MUV
●I/O Equivalent Circuit Diagrams
24.SWCPN
27.SWCPP
35.SW2
PVCC2
39.NGATE1
41.PGATE1
PVCC1
44.REG
PVCC1
Inner
power supply
PGND2 PGND2
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Datasheet
BD81002MUV
●Operation Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a
special mode where the absolute maximum ratings may be exceeded is anticipated. When VIN voltage is near the
absolute maximum ratings, there are possibilities that the VIN voltage exceeds the limit and the IC is destroyed. So
please consider using zener diode between VIN-GND or using large input-capacitor in order not to destroy the IC.
2) GND potential
Ensure a minimum GND pin potential in all operating conditions.
3) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions.
4) Pin short and mistake fitting
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result
in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by
the presence of a foreign object may result in damage to the IC.
5) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
6) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects
the IC to stress. Always discharge capacitors after each process or step. Ground the IC during assembly
steps as an antistatic measure, and use similar caution when transporting or storing the IC. Always turn the
IC's power supply off before connecting it to a jig or fixture during the inspection process.
7) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of
parasitic elements.
For example, when the resistance and transistors are connected to the pins as shown in Fig. IC cross section , a parasitic
diode or a transistor operates by inverting the pin voltage and GND voltage.
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of
the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC
malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will
trigger the operation of parasitic elements such as by the application of voltages lower than the GND (P substrate) voltage
to input and output pins.
Resistor
Transistor (NPN)
B
～
～
(Pin B)
B
E
C
～
～
C
(Pin B)
～
～
(Pin A)
E
GND
GND
N
P+
N
N
P
P
P+
N
N
N
N
P substrate
Parasitic elements
GND
Parasitic elements
Parasitic
elements
P+
GND
(Pin A)
～
～
P
P+
Parasitic
elements
GND
8) Over current protection circuit (OCP)
The IC has a built-in over-current protection circuit for output in response to the current capability for the prevention of IC
damage in case of a short-circuit in load. However, this protection circuit is effective in preventing damage due to a sudden
accident, but is not designed to support the continuous operation of protection circuits or use while in transition. In addition,
since the current capability has negative characteristics against temperatures, pay careful attention to this point in thermal
design.
9) Thermal shutdown circuit (TSD)
This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the
specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power
dissipation limits, the attendant rise in the chip's junction temperature Tj will trigger the TSD circuit to turn off all output
power elements. Operation of the TSD circuit presumes that the IC's absolute maximum ratings have been exceeded.
Application designs should never make use of the TSD circuit.
10) DC/DC switching line wiring pattern
DC/DC converter switching line (wiring from switching pin to inductor, Nch MOS) should be connected with short and wide
wiring. If the wiring is long, ringing by switching would increase. That may cause excess voltage of absolute maximum ratings.
If the wiring is obliged to lengthen by parts location limits, please consider inserting snubber circuit.
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Datasheet
BD81002MUV
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
●Ordering Information
B
D
8
1
0
0
Part Number
2
M
U
V
-
Package
MUV: VQFN048V7070
E
2
Packaging and forming specification
E2: Embossed tape and reel (with dry pack)
VQFN048V7070
Tape and Reel information
7.0±0.1
7.0 ± 0.1
1.0MAX
1PIN MARK
Embossed carrier tape (with dry pack)
1500pcs
Direction
of feed
E2
4.7 ± 0.1
C0.2
1
12
48
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(0.22)
+0.03
0.02 -0.02
S
0.08 S
13
4.7±0.1
0.4±0.1
Tape
Quantity
37
24
36
0.75
0.5
25
+0.05
0.25 -0.04
Reel
(Unit : mm)
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1 PIN
Direction of feed
※When you order, please order in times the amount of package quantity
17/17
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
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[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
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H2S, NH3, SO2, and NO2
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[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
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5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
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responsible for it and you must exercise your own independent verification and judgment in the use of such information
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incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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Other Precaution
1.
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2.
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3.
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4.
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ROHM, its affiliated companies or third parties.
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
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