Download Go Wireless with Redpine and Renesas Wi-Fi Solutions

ID 216C: Go Wireless with Redpine and
Renesas Wi-Fi Solutions
Rohan Joginpalli
Product Manager
Redpine Signals, Inc.
13 October 2010
Version: 1.2
Rohan Joginpalli
 Product Manager
Redpine Signals, Inc.
 Responsible for Redpine’s Connect-io-n™ product family
 8 years of Engineering and Management experience in
– Wireless semiconductor design
– Wireless system level product development
– Product Management
– Program Management
 Graduate of the Indian Institute of Technology, Guwahati
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Renesas Technology and Solution Portfolio
Microcontrollers
& Microprocessors
#1 Market share
worldwide *
ASIC, ASSP
& Memory
Advanced and
proven technologies
Solutions
for
Innovation
Analog and
Power Devices
#1 Market share
in low-voltage
MOSFET**
* MCU: 31% revenue
basis from Gartner
"Semiconductor
Applications Worldwide
Annual Market Share:
Database" 25
March 2010
** Power MOSFET: 17.1%
on unit basis from
Marketing Eye 2009
(17.1% on unit basis).
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Renesas Technology and Solution Portfolio
Microcontrollers
& Microprocessors
#1 Market share
worldwide *
Solutions
for
Innovation
ASIC, ASSP
& Memory
Advanced and
proven technologies
Analog and
Power Devices
#1 Market share
in low-voltage
MOSFET**
* MCU: 31% revenue
basis from Gartner
"Semiconductor
Applications Worldwide
Annual Market Share:
Database" 25
March 2010
** Power MOSFET: 17.1%
on unit basis from
Marketing Eye 2009
(17.1% on unit basis).
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Microcontroller and Microprocessor Line-up
Superscalar, MMU, Multimedia
High Performance CPU, Low Power
High Performance CPU, FPU, DSC
 Up to 1200 DMIPS, 45, 65 & 90nm process
 Video and audio processing on Linux
 Server, Industrial & Automotive
 Up to 500 DMIPS, 150 & 90nm process
 600uA/MHz, 1.5 uA standby
 Medical, Automotive & Industrial
 Up to 165 DMIPS, 90nm process
 500uA/MHz, 2.5 uA standby
 Ethernet, CAN, USB, Motor Control, TFT Display
 Legacy Cores
 Next-generation migration to RX
General Purpose
 Up to 10 DMIPS, 130nm process
 350 uA/MHz, 1uA standby
 Capacitive touch
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Ultra Low Power
Embedded Security
 Up to 25 DMIPS, 150nm process  Up to 25 DMIPS, 180, 90nm process
 190 uA/MHz, 0.3uA standby
 1mA/MHz, 100uA standby
 Application-specific integration  Crypto engine, Hardware security
Microcontroller and Microprocessor Line-up
Superscalar, MMU, Multimedia
High Performance CPU, Low Power
High Performance CPU, FPU, DSC
 Up to 1200 DMIPS, 45, 65 & 90nm process
 Video and audio processing on Linux
 Server, Industrial & Automotive
 Up to 500 DMIPS, 150 & 90nm process
 600uA/MHz, 1.5 uA standby
 Medical, Automotive & Industrial
 Up to 165 DMIPS, 90nm process
 500uA/MHz, 2.5 uA standby
 Ethernet, CAN, USB, Motor Control, TFT Display
 Legacy Cores
 Next-generation migration to RX
General Purpose
 Up to 10 DMIPS, 130nm process
 350 uA/MHz, 1uA standby
 Capacitive touch
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Ultra Low Power
Embedded Security
 Up to 25 DMIPS, 150nm process  Up to 25 DMIPS, 180, 90nm process
 190 uA/MHz, 0.3uA standby
 1mA/MHz, 100uA standby
 Application-specific integration  Crypto engine, Hardware security
Innovation – Wi-Fi for Smart Energy
High-Energy
Applicances
Circuit
Breaker
Water
Meter
Energy Meter
Also an AP/ Gateway
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In-home Display
And Control
Agenda
 Redpine Signals – Company and Products
 Wi-Fi in Embedded Systems
 The Benefits of 802.11n
 Integrating Wi-Fi into Embedded Systems
 Redpine + Renesas Solutions
 Wireless Demo
 Q&A
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Key Takeaways
By the end of this session you will be able to:
 Understand the key concepts in integrating Wi-Fi into
Embedded Systems
 Understand why 802.11n is the choice of wireless
connectivity in current and future designs
 Understand the applicable Redpine and Renesas products for
wireless applications
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Redpine Signals – Company Overview
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Founded: 2001
Corporate Headquarters: San Jose, CA
R&D Locations: San Jose, CA; Hyderabad, India
Employees: 100+
Significant Emerging Wireless Patent Portfolio
Redpine Signals –
Best New Company
e-clips – Jason McDonald
 18 awarded; 35 pending; over 50 in pipeline
 OFDM, MIMO, Low Power, Multi-thread Processing, CMOS
RF/PA
 Chipset Manufacturers – TSMC, ASE
 Module Manufacturers – OSE, Aztech
 Worldwide sales and distribution
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Redpine Wi-Fi Products - Summary
Part
Product
RS9110/1
RS9115/6/7/8
RS9330
Highlights
•
•
•
•
SDIO, SPI, EBI
Ultra-low-power
World’s 1st Wi-Fi Certified 1x1 802.11n
On-chip DC-DC, RTC
•
•
•
•
PCI, SDIO, SPI
Ultra-low-cost, integrated PA, Balun
1x1 – 150Mbps 11n,
11p – Vehicular (RS9119)
• PCI-e, USB, PCI
• 450Mbps, 3x3 802.11n
• High Performance: ML, ABF
(Reference Design Shown)
•
•
•
•
Modules as small as 7.5mm x 9.5mm
Up to 35Mbps SDIO throughputs
WMM-PS, WPA2-Enterprise, Voice
Certifications: Wi-Fi, FCC, IC, CE
RS9110-N-11-2x
•
•
•
•
Plug and Play 802.11n Serial Modules
Supplicant resides on Lite-Fi®
TCP-IP Offload, Host Driver
Certifications: Wi-Fi, FCC, IC, CE
RS9110-N-11-61
•
•
•
•
World’s first 802.11n RTLS tag
CCX Certified
> 5 years battery life
Low-cost
RS9110-N-11-0x
Modules Offered with Renesas Electronics Platforms
Certifications:
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Why Wi-Fi in Embedded Systems?
 Use of available infrastructure and network planning
 Wi-Fi is largely present in most enterprise, industrial, and home
environments
 Access Point location and frequency planning already taken care
of
 Easy addition of devices
 Enterprise class security
 AES based WPA2
 Optional 802.1x based authentication
 Throughput and Range
 1 Mbps to 600 Mbps data rate
 Up to 500 meters range
 Power Consumption
 Focus on ‘low energy’ as opposed to ‘low power’
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Why 802.11n?
 802.11n is lower power energy than 802.11b or 802.11b/g
 Minimal MAC overhead
 Higher PHY throughput
 Single-stream 802.11n is same cost at 802.11b
 Higher throughput at range
 Aggregation
 STBC
 Increases network capacity
 Mixed mode protection mechanisms waste bandwidth
 Wi-Fi infrastructure is increasingly 802.11n
Energy Consumption for 10 MB of Received
Data
1,400
Energy in mJ
1,200
1,000
800
11g
11n
600
400
200
0
A
13
B
C
Location of Client
D
The Network Advantage of 802.11n
 (Unnecessary) Protection Mechanisms take up plenty of air
time
 Just the presence of a 11g node in an 11n network reduces
overall network throughput by 30% or more
Mixed Network
11n Network
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Questions
Question 1:
What functional procedure, developed by Joan Daemen and
Vincent Rijmen, was standardized by NIST after a 5-year
process involving 15 competing mechanisms, and is now a
core feature of the WPA2 certification from the Wi-Fi
Alliance?
Answer 1:
AES, or the Advanced Encryption Standard
Question 2:
Which standard in the 802.11 alphabet soup describes the
use of a modulation scheme based on Complementary
Codes, first introduced by Golay.
Answer 2:
802.11b (which describes CCK)
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Applications for Wi-Fi in Embedded Systems
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
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
Camera,
E-readers,
Multimedia Players,
Vo-WiFi Phone,
Wireless Speakers,
Set-top-boxes,
Gaming Adapters,
POS terminals,
Gaming Consoles,
Projectors,
Info Kiosks,
Patient Monitoring
Headphones,
► Printer,
► PC-Input Devices
(Mouse, Keyboard, etc)
► Wireless Sensor Nodes,
► Industrial Control,
► Data Acquisition,
► Home Automation,
► Thermostats,
► Smart Meters,
► Real Time Asset Tracking
►
►
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MANY MORE …
Universal IP Based Connectivity
 Wi-Fi fits directly into the Network
Payload
802.11 Frame
802.11 TCP
Microcontroller
Serial
I/F
T
C
P
/
I
P
IP
Trailer
M
A
C
BB
/
R
F
Embedded System
LAN
Wireless
Link
TCP/IP Stack
WLAN
WLAN Subsystem
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Wireless
Router
Payload
Server
Other Wireless Standards…
 The Networking Stack of Zigbee and Bluetooth
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Integration of Wi-Fi into an
Embedded System
 The benefits of a self-contained module
 Integrated RF and Antenna
– Layout considerations taken care of
– Stable frequency reference included for predictable performance
 Single power-supply with built-in power management
 Modular certification for FCC
 Pre-tested and pre-calibrated for high yield on main system
Peripheral
Interfaces
SPI
UART
Host
Interface
MAC
Memory
BBP
AFE
RF Transceiver,
PA, Front-end
WLAN System-on-Chip
3.3V
PMU
Internal
Voltages
WLAN Module
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Frequency
Reference
22 x 28 mm
Renesas + Redpine Signals Advantages
1. Ready-made, functional
HW & SW
Example Demo
Redpine Driver
Performance
UART/SPI
Features
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2. Wide range of MCU
choices from Renesas
3. Choice of Redpine Wi-Fi
Products based on
application
Renesas + Redpine Standard
Wi-Fi Solutions
Low Power 802.11a/b/g/n Wi-Fi for RX/R8C MCU
• 32-bit CISC Flash MCU
• Up to 165DMIPS @ 100MHz
• FPU, Ethernet, USB, CAN
• 8-bit CISC Flash MCU
• 20MHz
• CAN, ADC, Serial, Timers
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SPI
UART
•
•
•
•
802.11bgn or 802.11 a/b/g/n
Plug & Play Serial-to-Wi-Fi module
Integrated TCP/IP Stack
Module variants available with
option of TCP-IP on
microprocessor
Renesas + Redpine Custom
Wi-Fi Solutions
High-Performance, Ultra Low Power
Wi-Fi module on SH MPU
• 32-bit RISC Flash MCU
• Up to 400DMIPS @ 200MHZ
• 32/64-bit FPU, Ethernet, USB, CAN
SDIO
RS9110-N-11-02
802.11bgn
module
RS9110-N-11-03
802.11abgn
module
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Questions
Question 3:
Name three possible factors that influence performance of a
wireless hardware subsystem.
Answer 3:
Board layout, frequency reference, power supply.
Question 4:
Which two host interfaces does Redpine use to connect to
Renesas MCUs in its standard kit offerings?
Answer 4:
SPI and UART.
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Software Architecture and Partitioning
WLAN
Configuration
Utility
TCP/IP Stack
Management
Interface
Data
Interface
SME
Application
Network Applications
Network Interface
WLAN Host Driver
HAL
Operating System
802.1X
Supplicant
RS9110-N-11-2x
Microcontroller
Operating System
Microcontroller
RS9110-N-11-0x
HTTP
Other
Applications
WLAN Config
FTP
Utility
Socket Interface
TCP
TCP/IP
DHCP
UDP
ARP
HAL
SPI
SDIO/SPI
ICMP
UART
SPI/UART
21/23/25/26
Common
IPSec
802.11 MAC
Management
Power
Save
Upper MAC
Roaming
Encryption/ Lower MAC MPDU/MSDU
Auto Rate
Aggregation
Decryption
BBP/RF
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WMM
Connect-io-nTM
N-LinkTM
Host Interface Module
HTTP
FTP
TELNET
SNMP
TCP/IP
TCP
SME
UDP
WEP/WPA
/WPA2
DHCP
ARP
WLAN
Power
Save
Auto
Rate
ICMP
802.1x
Supplicant
22/24/26/28
How is Renesas + Redpine Solution Unique?
Works on MCUs ranging from 20MHz to 200MHz
As small as 2KB of Program Memory Required
Support for 802.11 b/g/n & a/b/g/n
Low Power (Down to 30mW) & High Performance (Up to 35Mbps)
Modules with & without TCP/IP Stack
May be used with or without RTOS
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Program Memory Requirements – W-iFi
2KB+
>9KB+
100KB+
Wi-Fi Code Size Vs Throughputs Vs Renesas
MCUs
+
• 32-bit RISC Flash MCU
• Up to 400DMIPS @ 200MHZ
• 32/64-bit FPU, Ethernet,
USB, CAN
+
• 32-bit CISC Flash MCU
• Up to 165DMIPS @ 100MHz
• FPU, Ethernet, USB, CAN
+
• 8-bit CISC Flash MCU
• 20MHz
• CAN, ADC, Serial, Timers
+
Throughput, System Performance
Up to 100kbps
Upto 5-8Mbps
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Up to 35Mbps
Redpine Signals RS9110 - Key Differentiations
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Metric
Comment
Chipset Maturity
RS9110®: The World’s first 1x1 802.11n Low-Power Chip
(Taped out in Q4 2007 and Wi-Fi Certified in Jan 2008)
Module Maturity
Redpine Controls Module Manufacturing
FCC, IC, CE certified 802.11n modules with >98% Yield
Redpine announced single-stream 802.11n module when nearest competition announced chipsets!
Cost
Low System Cost due to high silicon integration (integrated CMOS DC-DC, calibrated 32kHz RC
oscillator, PA and Balun integrated RF)
Power
Consumption
Current Consumption of RS9110-N-11-02 Modules on single 3.3V input supply
<1uA Deep Sleep
<1.1mA Connected to AP
<8mA VoIP call
<15mA @ Low Throughputs (e.g., serial interface with 115K Baud)
140mA – Peak Rx throughput of 35Mbps
Performance
Tx Output Power
Rx Sensitivity
Rx Multipath
Innovation
Large Patent Portfolio (8 years of Wi-Fi experience). Multiple patents related to Power-save, OFDM
signal processing, Multi-threaded processor architectures
18 US Patents granted, 35 more US patents pending approval
Support
Comprehensive support during evaluation, design-in and production
Redpine owns the chipsets, modules and software – eliminating delays caused due to multiple
vendor involvement!
Redpine provides turnkey product customizations, software porting and qualification services to key
customers
: 17.5dBm
: -97.5dBm (1Mbps), -75.5dBm (54Mbps)
: -68dBm for 10% PER in ETSI-C for 54Mbps:
Low-Power Technology in Wi-Fi eNbedded™
 Highly Integrated Baseband SoC
 Integrated Dual-threaded processor
– Smaller Footprint code => Lesser
Power -> ThreadArch®
– Optimized Wi-Fi Supplicant and TCP/IP
that runs on Baseband chip => Faster
wakeup from shutdown
 Integrated CMOS DC-DC and 32KHz calibrated RC
oscillator
 Intelligent Power-Management
 Fast Protocol based Power-save
 Performance based power-control of individual
blocks (e.g., lesser ADC bitwidth/sample-rate in
inter-packet)
 Silicon Techniques
 HVT Cells and Memories
 Power Islanding
 DVFS
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 0.01mW DeepSleep
 <3mW Standby Associated
 <20mW for VoIP Call
 <30mW for Low-throughputs
(e.g., 115Kbps SPI/UART)
 2KB Driver Footprint (9KB for SPI)
 17 US Patents Granted
(37 More Pending)
• ~50% related to Low-Power
Demonstration of Connect-io-n (-24) + R8C25
R8C
Peripherals
Demo App
6 KB Program
1.5 KB RAM
Connect-io-n
UART Driver
TCP
UDP
ARP
DHCP
WEP
WPA/
WPA2
Power
Save
IBSS
iPod Touch
 (R8C + RS9110-24) Connects to
Access Point
 Connect iPod Touch to Access Point
 Control Light Stack from iPod Touch
Access Point
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Summary
Through this presentation, we (hopefully) understood:
 The key concepts in integrating Wi-Fi into Embedded
Systems
 Why 802.11n is the choice of wireless connectivity in current
and future designs
 What Redpine and Renesas product combinations are
available for wireless applications, and how they are made
available to embedded device developers.
30
Questions?
31
Innovation – Wi-Fi for Smart Energy
High-Energy
Applicances
Circuit
Breaker
Water
Meter
Energy Meter
Also an AP/ Gateway
32
In-home Display
And Control
Thank You!
33